PCB micro-spacing capacitance self-adaptive adjusting mechanism
By designing a screw-driven arc plate on the PCB board to push a sliding block to adjust the component spacing, the low efficiency problem caused by multiple soldering tests in the existing technology is solved, and efficient measurement of component spacing tolerance is achieved.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- KUNSHAN XINGLIANDA ELECTRICAL CO LTD
- Filing Date
- 2025-05-19
- Publication Date
- 2026-06-05
AI Technical Summary
The existing technology for adjusting the spacing tolerance of PCB board components requires multiple soldering tests, resulting in low measurement efficiency.
The PCB micro-pitch tolerance adaptive adjustment mechanism is adopted. The screw drives the arc plate to push the sliding block and components to move, realizing real-time adjustment and measurement of component pitch, avoiding multiple soldering.
It improves the efficiency of component spacing capacitance measurement, reduces the number of soldering tests, and enhances measurement efficiency.
Smart Images

Figure CN224329632U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of PCB board technology, and in particular to a PCB micro-pitch capacitance adaptive adjustment mechanism. Background Technology
[0002] PCB, or Printed Circuit Board, is an important electronic component. It serves as the support for electronic components and the carrier for their electrical interconnection. Because it is manufactured using electronic printing technology, it is called a "printed" circuit board.
[0003] Multiple components are mounted on the surface of a PCB board by soldering. The spacing between these components must be carefully controlled. Therefore, it is necessary to adjust the appropriate spacing tolerance to prevent the components from being too close together, which could lead to problems such as signal crosstalk, electrical interference, or short circuits.
[0004] Existing methods for adjusting pitch tolerance involve repeatedly soldering two components on a test PCB to check for issues such as signal crosstalk, electrical interference, or short circuits. However, repeated soldering leads to low measurement efficiency. Therefore, this application proposes an adaptive pitch tolerance adjustment mechanism for PCBs. Utility Model Content
[0005] The purpose of this invention is to address the problem that in the prior art, adjusting the pitch tolerance value involves repeatedly soldering two components on a test PCB board to test for signal crosstalk, electrical interference, or short circuits. However, repeated soldering leads to low measurement efficiency. Therefore, this invention proposes a PCB micro-pitch tolerance value adaptive adjustment mechanism.
[0006] The technical solution of this utility model is as follows: A PCB micro-pitch tolerance adaptive adjustment mechanism includes a PCB board. A sliding groove is formed on the top of the PCB board. The sliding groove is symmetrically arranged. There are multiple sets of symmetrical sliding grooves arranged in a rectangular array on the top of the PCB board. Connecting feet are slidably connected inside the PCB board. There are four sets of connecting feet arranged in a rectangular array. A sliding block is fixedly connected to the side of the connecting foot away from the sliding groove. Components are embedded inside the sliding block. There are two sets of sliding blocks arranged symmetrically. A pushing component is provided on the opposite side of the sliding block.
[0007] Optionally, the pushing component includes an arc-shaped plate that abuts against the top of the PCB board, and a screw is threadedly connected inside the arc-shaped plate, the screw being rotatably connected to the top of the PCB board.
[0008] Optionally, baffles are slidably connected to both sides of the arc-shaped plate, and the baffles are fixedly connected to the top of the PCB board.
[0009] Optionally, a sliding plate is fixedly connected to the side of the sliding block away from the arc plate, the sliding plate is slidably connected to the top of the PCB board, and a positioning plate is provided on the side of the sliding plate away from the sliding block, the positioning plate being fixedly connected to the top of the PCB board.
[0010] Optionally, the sliding plate and the positioning plate are provided with a fitting groove on opposite sides, and a spring is fitted inside the fitting groove, with both ends of the spring abutting against the fitting groove provided in the sliding plate and the positioning plate.
[0011] Optionally, the PCB board has mounting holes on its top, which penetrate the PCB board. There are multiple mounting holes arranged in a rectangular array on the top of the PCB board.
[0012] Optionally, a sleeve plate is fixedly connected inside the fitting groove of the sliding plate. The sleeve plate is hollow inside, and a limiting component is provided inside the sleeve plate away from the sliding plate.
[0013] Optionally, the limiting component includes a limiting plate, which is slidably connected inside the sleeve plate, and the end of the limiting plate away from the sleeve plate is fixedly connected inside the fitting groove opened in the positioning plate.
[0014] Compared with the prior art, this application includes at least one of the following beneficial technical effects: The device rotates on the top of the PCB board by a screw, allowing the arc plate to move downward along the outside of the screw. This makes the arc structure of the arc plate tend to be flat, so the arc plate will push the two sliding blocks and the components inside the sliding blocks to move to both sides. When the sliding blocks move, the electrical signal can still be conducted to the components inside the sliding blocks along the sliding groove and connecting pin, avoiding the problem of low measurement efficiency caused by the need for multiple soldering tests in the past, and improving the efficiency of measuring the tolerance value of component spacing. Attached Figure Description
[0015] Figure 1 A schematic diagram of the overall structure of a PCB micro-pitch capacitance adaptive adjustment mechanism;
[0016] Figure 2 A schematic diagram of a PCB board cross-section structure for a PCB micro-pitch capacitance adaptive adjustment mechanism;
[0017] Figure 3 This is a schematic diagram of a baffle structure for a PCB micro-pitch capacitance adaptive adjustment mechanism;
[0018] Figure 4 A schematic diagram of the cross-sectional structure of a sliding block in a PCB micro-pitch capacitance adaptive adjustment mechanism;
[0019] Figure 5 for Figure 4 Enlarged structural diagram at point A in the middle;
[0020] Figure 6 A schematic diagram of the cross-sectional structure of an arc-shaped plate for a PCB micro-pitch capacitance adaptive adjustment mechanism;
[0021] Figure 7 for Figure 6 Enlarged structural diagram at point B.
[0022] Reference numerals in the attached diagram: 1. PCB board; 2. Sliding groove; 3. Sliding block; 4. Connecting foot; 5. Component; 6. Curved plate; 7. Screw; 8. Baffle plate; 9. Sliding plate; 10. Spring; 11. Positioning plate; 12. Sleeve plate; 13. Limiting plate; 14. Mounting hole; 15. Fitting groove. Detailed Implementation
[0023] The technical solution of this utility model will be further described below with reference to the accompanying drawings and specific embodiments.
[0024] Example 1
[0025] like Figure 1 , Figure 4 and Figure 5 As shown, the present invention proposes a PCB micro-pitch capacitance adaptive adjustment mechanism, including a PCB board 1. A sliding groove 2 is provided on the top of the PCB board 1. The sliding grooves 2 are arranged symmetrically. There are multiple sets of symmetrical sliding grooves 2 arranged in a rectangular array on the top of the PCB board 1. Connecting feet 4 are slidably connected inside the PCB board 1. There are four sets of connecting feet 4 arranged in a rectangular array. A sliding block 3 is fixedly connected to the side of the connecting feet 4 away from the sliding groove 2. The sliding block 3 can conduct electrical signals along the sliding groove 2 to the connecting feet 4 and the sliding block 3 by sliding inside the sliding groove 2 through the connecting feet 4. Components 5 are embedded inside the sliding block 3. The embedded components 5 facilitate the adjustment of the components 5 during testing. There are two sets of sliding blocks 3 arranged symmetrically. A pushing component is provided on the opposite side of the sliding block 3.
[0026] like Figure 2 , Figure 6 and Figure 7 As shown, the pushing component includes an arc-shaped plate 6, which is made of flexible material. The arc-shaped plate 6 abuts against the top of the PCB board 1. A screw 7 is threaded inside the arc-shaped plate 6. The screw 7 is rotatably connected to the top of the PCB board 1. By rotating the screw 7, the arc-shaped plate 6 can be driven to flatten. Baffle plates 8 are slidably connected to both sides of the arc-shaped plate 6. The baffle plates 8 are fixedly connected to the top of the PCB board 1.
[0027] like Figures 2 to 5As shown, a sliding plate 9 is fixedly connected to the side of the sliding block 3 away from the arc plate 6. The sliding plate 9 is slidably connected to the top of the PCB board 1. The sliding plate 9 can slide with the adjustment of the sliding block 3. A positioning plate 11 is provided on the side of the sliding plate 9 away from the sliding block 3. The positioning plate 11 is fixedly connected to the top of the PCB board 1. A fitting groove 15 is opened on the opposite side of the sliding plate 9 and the positioning plate 11. A spring 10 is fitted inside the fitting groove 15. The fitting groove 15 is embedded in the spring 10 to prevent the spring 10 from popping out when it contracts and bends. The two ends of the spring 10 abut against the inside of the fitting groove 15 opened by the sliding plate 9 and the positioning plate 11. The spring 10 can provide a clamping force to the sliding block 3 to prevent the sliding block 3 from falling off the top of the PCB board 1. A mounting hole 14 is opened on the top of the PCB board 1. The mounting hole 14 is set through the PCB board 1. The mounting hole 14 facilitates the installation of the PCB board 1. There are multiple mounting holes 14 arranged in a rectangular array on the top of the PCB board 1.
[0028] In this embodiment, when it is necessary to measure and adjust the pitch tolerance of newly produced components, two components 5 can be inserted into the sliding block 3 first. Then, the PCB board 1 is installed in the test position through the mounting hole 14. The PCB board 1 is then powered on for testing. The current will be conducted along the PCB board 1 and the sliding groove 2 to the connecting pin 4, so that the connecting pin 4 can conduct the electrical signal to the component 5 inside the sliding block 3.
[0029] When interference signals are generated between the two components 5, the screw 7 is rotated. The rotating structure of the screw 7 and the PCB board 1 does not move, but the arc structure of the arc plate 6 connected to the external thread of the screw 7 will tend to flatten along the thread of the screw 7. When the arc plate 6 tends to flatten, it will push the sliding block 3 to move to both sides. In this way, the distance between the two components 5 fixed inside the sliding block 3 can be increased. When the distance between the components 5 is increased, the electrical signal can still be conducted along the sliding block 3 and the connecting pin 4 to the components 5 inside the sliding block 3. The signal between the components 5 is measured in real time when the components 5 move.
[0030] When the signals between components 5 do not interfere with each other, the sliding plate 9 stops rotating, and the spring 10 will push the fitting groove 15 inside the positioning plate 11. The spring 10 will push the sliding plate 9 and the sliding block 3 to move towards the position of the arc plate 6, so that the arc plate 6 and the spring 10 determine the position of the sliding block 3 and the components 5. At this time, the distance between the two components 5 can be measured, so that the spacing tolerance between the two components can be known.
[0031] It should be noted that this device rotates the screw 7 on the top of the PCB board 1, causing the arc-shaped plate 6 to move downwards along the outside of the screw 7. This makes the arc-shaped structure of the arc-shaped plate 6 more flat, which in turn pushes the two sliding blocks 3 and the components 5 inside the sliding blocks 3 to move to both sides. While the sliding blocks 3 are moving, the electrical signal can still be conducted along the sliding groove 2 and the connecting pin 4 to the components 5 inside the sliding blocks 3. This avoids the problem of low measurement efficiency caused by the need for multiple soldering tests in the past, and improves the efficiency of measuring the capacitance value between components.
[0032] Example 2
[0033] like Figure 4 and Figure 5 As shown, based on Embodiment 1, a sleeve plate 12 is fixedly connected inside the fitting groove 15 of the sliding plate 9. The sleeve plate 12 is hollow, and the hollow structure of the sleeve plate 12 facilitates the sliding of the limiting plate 13 inside it. A limiting component is provided inside the sleeve plate 12 away from the sliding plate 9. The limiting component includes the limiting plate 13, which is slidably connected inside the sleeve plate 12. The way the limiting plate 13 slides inside the sleeve plate 12 can limit the movement of the sliding plate 9. The end of the limiting plate 13 away from the sleeve plate 12 is fixedly connected inside the fitting groove 15 of the positioning plate 11.
[0034] In this embodiment, when the spring 10 is compressed, the limiting plate 13 slides inside the sleeve 12 to prevent the spring 10 from popping out of the fitting groove 15, thereby improving the stability of the extension and retraction of the spring 10.
[0035] It should also be noted that the device uses the sliding plate 12 to slide inside the limiting plate 13 to restrict the movement of the sliding plate 9, and also protects the extension and retraction of the spring 10 embedded inside the fitting groove 15.
[0036] The above specific embodiments are merely several optional embodiments of this utility model. Based on the technical solution of this utility model and the relevant teachings of the above embodiments, those skilled in the art can make various alternative improvements and combinations to the above specific embodiments.
Claims
1. A PCB micro-pitch capacitance adaptive adjustment mechanism, comprising a PCB board (1), characterized in that: The PCB board (1) has a sliding groove (2) on its top. The sliding groove (2) is arranged symmetrically. There are multiple sets of the symmetrical sliding groove (2) arranged in a rectangular array on the top of the PCB board (1). The PCB board (1) has a connecting foot (4) that is slidably connected inside. There are four sets of the connecting foot (4) arranged in a rectangular array. A sliding block (3) is fixedly connected to the side of the connecting foot (4) away from the sliding groove (2). The sliding block (3) has a component (5) embedded inside. There are two sets of the sliding block (3) arranged symmetrically. A pushing component is provided on the opposite side of the sliding block (3).
2. The PCB micro-pitch capacitance adaptive adjustment mechanism according to claim 1, characterized in that, The pushing component includes an arc plate (6) that abuts against the top of the PCB board (1). The arc plate (6) is internally threaded with a screw (7) that is rotatably connected to the top of the PCB board (1).
3. The PCB micro-pitch capacitance adaptive adjustment mechanism according to claim 2, characterized in that, The arc plate (6) is slidably connected to two sides of a baffle plate (8), and the baffle plate (8) is fixedly connected to the top of the PCB board (1).
4. The PCB micro-pitch capacitance adaptive adjustment mechanism according to claim 1, characterized in that, The sliding block (3) is fixedly connected to a sliding plate (9) on the side away from the arc plate (6). The sliding plate (9) is slidably connected to the top of the PCB board (1). A positioning plate (11) is provided on the side of the sliding plate (9) away from the sliding block (3). The positioning plate (11) is fixedly connected to the top of the PCB board (1).
5. The PCB micro-pitch capacitance adaptive adjustment mechanism according to claim 4, characterized in that, The sliding plate (9) and the positioning plate (11) have a fitting groove (15) on opposite sides. A spring (10) is fitted inside the fitting groove (15). The two ends of the spring (10) abut against the fitting groove (15) opened by the sliding plate (9) and the positioning plate (11).
6. The PCB micro-pitch capacitance adaptive adjustment mechanism according to claim 1, characterized in that, The PCB board (1) has mounting holes (14) on its top. The mounting holes (14) penetrate the PCB board (1) and there are multiple mounting holes (14) arranged in a rectangular array on the top of the PCB board (1).
7. The PCB micro-pitch capacitance adaptive adjustment mechanism according to claim 4, characterized in that, A sleeve plate (12) is fixedly connected inside the fitting groove (15) of the sliding plate (9). The sleeve plate (12) is hollow inside, and a limiting component is provided inside the sleeve plate (12) away from the sliding plate (9).
8. The PCB micro-pitch capacitance adaptive adjustment mechanism according to claim 7, characterized in that, The limiting component includes a limiting plate (13), which is slidably connected inside the sleeve plate (12), and the end of the limiting plate (13) away from the sleeve plate (12) is fixedly connected inside the fitting groove (15) opened in the positioning plate (11).