Heat dissipation device and electronic device

By introducing a liquid cooling component and a first vapor chamber into the electronic device, utilizing a drive pump to drive the coolant flow and optimizing the structural design, the heat transfer rate problem of the VC vapor chamber under high load scenarios was solved, achieving rapid heat dissipation and improved equipment reliability.

CN224329778UActive Publication Date: 2026-06-05HUAWEI TECH CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
HUAWEI TECH CO LTD
Filing Date
2025-04-23
Publication Date
2026-06-05

AI Technical Summary

Technical Problem

In high-load scenarios, the heat transfer rate of the VC vapor chamber of electronic devices is poor during instantaneous startup, leading to localized overheating and affecting performance.

Method used

A heat dissipation device including liquid cooling components and a first vapor chamber is adopted. The coolant is driven by a pump to achieve rapid heat transfer. The rapid start-up characteristics of the liquid cooling components are used to accelerate the start-up speed of the vapor chamber. Combined with the one-piece molded cover plate design, the thermal resistance is reduced, and the layout of the vapor channel and liquid suction core is optimized to improve heat dissipation efficiency.

Benefits of technology

It enables rapid heat dissipation of electronic devices, avoids localized overheating, improves device reliability and heat dissipation efficiency, and adapts to miniaturization design requirements.

✦ Generated by Eureka AI based on patent content.

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Abstract

The application provides a heat dissipation device and an electronic device. The heat dissipation device comprises a first uniform temperature plate and a liquid cooling component. The first uniform temperature plate comprises a first shell, a first cooling liquid and a first liquid absorbing core. The first cooling liquid and the first liquid absorbing core are arranged in a first accommodating cavity of the first shell. The liquid cooling component comprises a second shell, a second cooling liquid and a driving pump. The second shell surrounds a liquid flow channel, and the second cooling liquid is arranged in the liquid flow channel. The second shell comprises a liquid inlet and a liquid outlet which are arranged at intervals and are communicated with the liquid flow channel. The driving pump is fixedly connected to the second shell. The driving pump is provided with a pump liquid inlet and a pump liquid outlet. The pump liquid outlet is communicated with the liquid inlet, and the pump liquid inlet is communicated with the liquid outlet. The driving pump is used for driving the second cooling liquid to flow into the liquid flow channel through the liquid inlet and flow out of the liquid outlet. The second shell is arranged on one side of the first shell and connected to the first shell. The second shell is used for being connected to a heat source of the electronic device. The heat dissipation device and the electronic device have good heat dissipation performance.
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