A precise positioning bonding device for piezoelectric ceramics
By using a combination of grooves and adjusting rods in the piezoelectric ceramic bonding device, precise positioning and all-round fixation of piezoelectric ceramic specimens are achieved, solving the problems of large positioning deviation and poor stability in the existing technology, and improving bonding strength and production efficiency.
CN224339297UActive Publication Date: 2026-06-09SHANDONG ZHIDA MICRO TECHNOLOGY CO LTD
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SHANDONG ZHIDA MICRO TECHNOLOGY CO LTD
- Filing Date
- 2026-05-08
- Publication Date
- 2026-06-09
Smart Images
Figure CN224339297U_ABST
Abstract
This application discloses a bonding device for precise positioning of piezoelectric ceramics, belonging to the technical field of bonding equipment. The device includes a base and a top cover. A first groove is provided on the upper surface of the base. Adjustment mechanisms are fixedly connected to both ends of the base along the length of the first groove. Adjustment holes are provided on the adjustment mechanisms along the length of the first groove, and adjustment rods are installed in the adjustment holes. The length of the adjustment rods is consistent with the length of the first groove. A plurality of first fixing holes are symmetrically arranged on the base along its length. A second groove corresponding to the first groove is provided on the lower surface of the top cover. A plurality of through-holes corresponding to the plurality of first fixing holes are provided on the top cover. This device can fix stacked piezoelectric ceramic specimens from all directions, effectively preventing displacement and tilting during bonding and curing, ensuring the overall central axis alignment of the stacked piezoelectric ceramic specimens, and thus improving the consistency of product quality.
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