Rotary device for chips

By combining a vacuum adsorption platform with multiple structures, the vibration and swaying problems of the chip rotation device during operation were solved, achieving higher rotational stability and processing quality.

CN224339419UActive Publication Date: 2026-06-09SUZHOU ASEN SEMICON CO LTD

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
SUZHOU ASEN SEMICON CO LTD
Filing Date
2025-07-19
Publication Date
2026-06-09

AI Technical Summary

Technical Problem

Existing chip rotating devices vibrate and sway during operation, affecting product quality and efficiency, and lack effective vibration reduction structures.

Method used

The device employs a multi-layered structure including a vacuum adsorption platform, a rotating ring, a fixed block, support feet, a sandwich structure, a counterweight sleeve, and a damping ring. It achieves rotational stability through stable adsorption via the vacuum adsorption platform, guidance and support via the rotating ring, vibration reduction via the support feet, shock absorption via the sandwich structure, balance of the center of gravity via the counterweight sleeve, and vibration absorption via the damping ring.

Benefits of technology

Significantly improves rotational stability, reduces the effects of wobbling and vibration, and ensures processing quality and efficiency.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model relates to the technical field of semiconductor chip processing discloses a rotary device for chip, including bottom plate, the top of bottom plate is provided with workstation, is provided with vacuum adsorption platform on the workstation, the inside of bottom plate is provided with motor, and the output of motor is connected with main shaft, and the main shaft is connected in the pivot of the bottom of upper vacuum adsorption platform through the shaft coupling, and motor drives vacuum adsorption platform rotation. The utility model through multiple structure cooperation promotes rotation stability, and the guiding support of rotating ring and fixed block reduces the shaking, and the counterweight sleeve and counterweight block balance the gravity center, and the damping ring absorbs the spindle vibration, and the interlayer foam aluminum and support foot weaken the overall vibration, and the multilink inhibits vibration and centrifugal deviation, improves rotation stability, and vacuum adsorption platform stable adsorption reduces the influence of shaking or vibration.
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Description

Technical Field

[0001] This utility model relates to the field of semiconductor chip processing technology, specifically a chip rotating device. Background Technology

[0002] In the chip manufacturing process, rotating devices are indispensable key equipment, widely used in many core processes such as photolithography, cleaning, etching, ion implantation, diffusion, and thin film deposition. Among them, uniform coating of photoresist is a prerequisite for the photolithography process, which often requires the use of chip rotating devices. Many devices will vibrate or shake during operation, affecting product quality and work efficiency.

[0003] A search revealed existing technology (application number: CN201010551944.X) for a chip rotating device and method, which describes a device as follows: "It includes a base, a rotating base, a transmission assembly, and a positioning assembly. The rotating base is pivotally mounted to the base and has a chip slot suitable for placing a chip. The transmission assembly is disposed between the base and the rotating base and is adapted to convert externally applied motion into rotation of the rotating base relative to the base. The positioning assembly is disposed between the base and the rotating base to fix the rotating base in one of a plurality of preset positions relative to the base." This invention is capable of clamping and rotating a chip.

[0004] However, while existing technologies can clamp and rotate chips, they still have some shortcomings: they lack vibration damping structures, the vibration damping effect is generally poor, and it is difficult to offset the impact of vibration and shaking of the device on the processing during rotation. Utility Model Content

[0005] The purpose of this invention is to address the shortcomings of existing technologies by proposing a chip rotation device.

[0006] To achieve the above objectives, the present invention adopts the following technical solution: a chip rotating device, including a base plate, a worktable arranged above the base plate, and a vacuum adsorption platform arranged on the worktable; a motor is arranged inside the base plate, the output end of the motor is connected to a main shaft, and the main shaft is connected to a rotating shaft at the bottom of the vacuum adsorption platform above through a coupling, and the motor drives the vacuum adsorption platform to rotate.

[0007] As a further description of the above technical solution:

[0008] A placement slot is provided at the center of the vacuum adsorption platform.

[0009] As a further description of the above technical solution:

[0010] The vacuum adsorption platform is provided with a rotating ring on its outer periphery and a fixed block on the top of the worktable. The rotating ring is slidably connected to the fixed block.

[0011] As a further description of the above technical solution:

[0012] The bottom of the base plate is provided with support feet.

[0013] As a further description of the above technical solution:

[0014] The base plate has an internal interlayer filled with aluminum foam for shock absorption.

[0015] As a further description of the above technical solution:

[0016] The bottom end of the rotating shaft is provided with a counterweight sleeve, and multiple sets of mounting slots are provided on the counterweight sleeve, with counterweight blocks installed inside the mounting slots.

[0017] As a further description of the above technical solution:

[0018] A damping ring is provided at the top of the spindle.

[0019] This utility model has the following beneficial effects:

[0020] 1. The rotational stability is improved through the synergistic effect of multiple structures: the rotating ring and fixed block guide support reduce swaying, the counterweight sleeve and counterweight block balance the center of gravity, the damping ring absorbs the vibration of the main shaft, and the sandwiched foam aluminum and support feet weaken the overall vibration. Multiple links suppress vibration and centrifugal offset, greatly improving rotational stability.

[0021] 2. Stable adsorption is achieved through a vacuum adsorption platform, which, combined with the spindle rotation drive, ensures stable operation, reduces the impact of shaking or vibration, and guarantees processing quality. Attached Figure Description

[0022] Figure 1 This is a schematic diagram of the overall structure of a chip rotating device proposed in this utility model;

[0023] Figure 2 This is a cross-sectional view of the worktable of a chip rotating device proposed in this utility model;

[0024] Figure 3 This is a cross-sectional view of the base plate of a chip rotating device proposed in this utility model;

[0025] Figure 4 This is a schematic diagram of the vacuum adsorption platform and counterweight sleeve structure of a chip rotating device proposed in this utility model.

[0026] Legend: 1. Base plate; 2. Workbench; 3. Vacuum adsorption platform; 4. Placement slot; 5. Fixing block; 6. Motor; 7. Spindle; 8. Damping ring; 9. Support foot; 10. Counterweight sleeve; 11. Counterweight block; 12. Rotating ring; 13. Interlayer; 14. Mounting slot; 15. Rotating shaft. Detailed Implementation

[0027] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0028] Example 1:

[0029] like Figures 1 to 4 As shown, this embodiment provides a chip rotation device, including: a base plate 1, a worktable 2 above the base plate 1, and a vacuum adsorption platform 3 on the worktable 2; a motor 6 is installed inside the base plate 1, the output end of the motor 6 is connected to a spindle 7, and the spindle 7 is connected to a rotating shaft 15 at the bottom of the vacuum adsorption platform 3 via a coupling, and the motor 6 drives the vacuum adsorption platform 3 to rotate.

[0030] In this embodiment, the worktable 2 and the vacuum adsorption platform 3 constitute a chip rotation device according to this application, thus realizing a chip rotation device.

[0031] In this embodiment, the vacuum adsorption platform 3 uses atmospheric pressure as the force to form a sealed volume between the suction cup and the object. A certain amount of gas molecules are extracted by a vacuum source to reduce the pressure, creating a pressure difference between the inside and outside of the suction cup. Under the action of this pressure difference, the object is adsorbed and thus fixed. This is common knowledge in the field, and we are only using it without modifying it. Therefore, the control method and circuit connection will not be described in detail.

[0032] It should be noted that the motor 6 drives the rotating shaft 15 to rotate through the main shaft 7 and the coupling, thereby driving the vacuum adsorption platform 3 to rotate and realize the chip rotation.

[0033] Specifically, a placement slot 4 is provided at the center of the vacuum adsorption platform 3.

[0034] In this embodiment, the placement groove 4 has multiple sets of through holes to facilitate stable adsorption.

[0035] Specifically, a rotating ring 12 is provided on the outer periphery of the vacuum adsorption platform 3, and a fixed block 5 is provided on the top of the worktable 2. The rotating ring 12 is slidably connected to the fixed block 5.

[0036] As a preferred implementation, the vacuum adsorption platform 3 rotates, causing the rotating ring 12 to slide on the fixed block 5, which serves as a guide and radial support, reducing rotational sway and enhancing the stability of the device during operation.

[0037] Example 2:

[0038] Based on Embodiment 1, in order to reduce vibration and enhance the working stability of the device, a support foot 9 is provided at the bottom of the base plate 1;

[0039] Specifically, the bottom of the base plate 1 is provided with support feet 9.

[0040] It should be noted that the support foot 9 supports the base plate 1. The support foot 9 adopts a damping rod and spring structure, which effectively reduces vibration and enhances the working stability of the device.

[0041] Specifically, the base plate 1 has an internal interlayer 13, which is filled with aluminum foam and is used for shock absorption.

[0042] In a preferred embodiment, the vibration of the motor 6 is transmitted to the interlayer 13 via the base plate 1, and the aluminum foam absorbs the vibration energy, reducing the overall vibration of the device.

[0043] Example 3:

[0044] Based on Example 2, in order to reduce centrifugal vibration and improve rotational stability, a counterweight sleeve 10 is provided at the bottom end of the rotating shaft 15;

[0045] Specifically, a counterweight sleeve 10 is provided at the bottom of the rotating shaft 15. Multiple sets of mounting slots 14 are provided on the counterweight sleeve 10, and counterweight blocks 11 are provided inside the mounting slots 14.

[0046] It should be noted that the counterweight 11 is a tungsten block. Adding or removing the counterweight 11 adjusts the mass of the counterweight sleeve 10, balances the center of gravity of rotation, reduces centrifugal vibration, and improves rotational stability.

[0047] Specifically, a damping ring 8 is provided at the top of the main shaft 7.

[0048] In this embodiment, the damping ring 8 at the top of the spindle 7 is an annular rubber ring, which is sleeved on the outer periphery of the top of the spindle 7 and is interference-fitted with the spindle 7. The damping ring 8 absorbs the radial and axial vibrations when the spindle 7 rotates through elastic deformation, reduces vibration transmission, and enhances the rotational stability of the spindle 7.

[0049] When in use, the operator places the device in a suitable position. The support foot 9 under the base plate 1 directly contacts the bottom and has a vibration damping effect. The interlayer 13 inside the base plate 1 can assist in vibration damping. The counterweight sleeve 10 set on the rotating shaft 15 under the vacuum adsorption platform 3 is detachable. The number of counterweights 11 can be adjusted according to the actual situation. Together with the damping ring on the main shaft 7, it enhances the stability during rotation.

[0050] It should be noted that all electrical components mentioned in this article are connected to an external main controller and 220V AC mains power. The main controller can be a conventional known device that can be controlled by a computer or other means. The detailed description of known functions and known components is omitted in the specific implementation of this disclosure. In order to ensure the compatibility of the device, the operating methods used are consistent with the parameters of commercially available instruments.

[0051] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A chip rotating device, characterized in that: Includes a base plate (1), a workbench (2) is provided above the base plate (1), and a vacuum adsorption platform (3) is provided on the workbench (2); The base plate (1) is equipped with a motor (6), and the output end of the motor (6) is connected to a main shaft (7). The main shaft (7) is connected to the rotating shaft (15) at the bottom of the upper vacuum adsorption platform (3) through a coupling. The motor (6) drives the vacuum adsorption platform (3) to rotate.

2. The chip rotating device according to claim 1, characterized in that: A placement slot (4) is provided at the center of the vacuum adsorption platform (3).

3. The chip rotating device according to claim 2, characterized in that: The vacuum adsorption platform (3) is provided with a rotating ring (12) on its outer periphery, and a fixed block (5) is provided on the top of the workbench (2). The rotating ring (12) is slidably connected to the fixed block (5).

4. The chip rotating device according to claim 1, characterized in that: The bottom of the base plate (1) is provided with support feet (9).

5. A chip rotating device according to claim 4, characterized in that: The base plate (1) has an internal interlayer (13) filled with aluminum foam, which is used for shock absorption.

6. A chip rotating device according to claim 1, characterized in that: The bottom end of the rotating shaft (15) is provided with a counterweight sleeve (10), and multiple sets of mounting slots (14) are provided on the counterweight sleeve (10), and a counterweight block (11) is provided inside the mounting slot (14).

7. A chip rotating device according to claim 1, characterized in that: A damping ring (8) is provided at the top of the main shaft (7).