Flexible circuit board, display module and electronic device

Abstract

A flexible circuit board is provided, comprising: a circuit board body portion; bonding pads located on one side of the circuit board body portion and electrically connected to the circuit board body portion; and insertion pins located on the other side of the circuit board body portion and electrically connected to the circuit board body portion, wherein the insertion pins and the bonding pads are respectively located on opposite sides of the circuit board body portion along a first direction; wherein at least one hollow structure is provided in the circuit board body portion, the hollow structure is provided through the thickness direction of the circuit board body portion, and the shape of the hollow structure is a strip extending along the first direction.

Description

Technical Field

[0001] This utility model relates to the field of display technology, and in particular to a flexible circuit board, a display module, and an electronic device. Background Technology

[0002] Currently, with the continuous development of near-eye display technologies, including Virtual Reality (VR) and Augmented Reality (AR), the related manufacturing processes for near-eye display products are gradually maturing. In actual production, flexible printed circuit boards (FPCs) are widely used in the near-eye display field due to their flexibility and lightweight characteristics. Ensuring precise interlocking of flexible circuit boards with other electronic components during the manufacturing process is one of the key concerns for display product developers.

[0003] The information disclosed in this section is only for understanding the background of the inventive concept of this utility model. Therefore, the above information may include information that does not constitute prior art. Utility Model Content

[0004] In one aspect, a flexible circuit board is provided, wherein the flexible circuit board comprises:

[0005] Circuit board body;

[0006] Bonding pads are located on one side of the main body of the circuit board and are electrically connected to the main body of the circuit board.

[0007] The connector pin is located on the other side of the main body of the circuit board and is electrically connected to the main body of the circuit board. The connector pin and the bonding pad are respectively located on opposite sides of the main body of the circuit board along the first direction.

[0008] The circuit board body has at least one hollow structure, which is provided through the thickness direction of the circuit board body and is a strip extending along the first direction.

[0009] According to some exemplary embodiments, the dimension of the cutout structure along the first direction is greater than or equal to the dimension of the plug pin along the first direction.

[0010] According to some exemplary embodiments, at least two cutout structures are provided in the main body of the circuit board, and the at least two cutout structures are arranged at intervals along a second direction, the second direction being perpendicular to the first direction.

[0011] According to some exemplary embodiments, the spacing between adjacent cutout structures along the second direction is less than or equal to half the dimension of the circuit board body along the first direction; and / or,

[0012] The spacing between adjacent perforated structures along the second direction is greater than or equal to twice the dimension of the perforated structure along the first direction; and / or,

[0013] The spacing between adjacent hollow structures along the second direction is 8mm-10mm.

[0014] According to some exemplary embodiments, the edge shape of the hollow structure at at least one end along the first direction includes an arc shape.

[0015] According to some exemplary embodiments, the shape of the hollow structure includes a rectangle.

[0016] According to some exemplary embodiments, along the first direction, the distance between the hollow structure and the plug pin is a first distance, and the distance between the hollow structure and the bonding pad is a second distance, wherein the first distance is smaller than the second distance.

[0017] In another aspect, a display module is provided, the display module including a display panel and a flexible circuit board as described in any of the preceding claims, wherein bonding pads in the flexible circuit board are electrically connected to the display panel.

[0018] On the other hand, a performance testing method for a display module is provided, applied to the display module described above, the method comprising:

[0019] A performance test circuit board is provided, including a test motherboard and at least one connector and at least one post disposed on the test motherboard, wherein the at least one connector and the at least one post are disposed on the same side of the test motherboard, and the at least one post is located on one side of the at least one connector along a first direction; and

[0020] The display module to be tested is placed on the performance test circuit board, and the hollow structure in the flexible circuit board is fitted onto the pillar of the performance test circuit board. The display module is moved along the first direction until the plug pins of the flexible circuit board are inserted into the plug interface, and the test begins.

[0021] According to some exemplary embodiments, moving the display module along the first direction until the connector pins of the flexible circuit board are inserted into the connector interface includes:

[0022] Move the display module along the first direction until the column abuts against the end of the hollow structure away from the plug pin to confirm that the plug pin of the flexible circuit board is fully inserted into the plug interface.

[0023] In another aspect, an electronic device is provided, wherein the electronic device includes a flexible circuit board as described in any of the above claims and a display module as described above. Attached Figure Description

[0024] Other objects and advantages of the present invention will become apparent from the following description of the invention with reference to the accompanying drawings, and will help to provide a comprehensive understanding of the invention.

[0025] Figure 1 A schematic plan view of a display module in the related art is shown.

[0026] Figure 2 The schematic diagram illustrates the principle of an aging test for a display module in the related technology.

[0027] Figure 3A A plan view of a flexible circuit board according to some embodiments of the present invention is shown schematically.

[0028] Figure 3B Schematic illustration along Figure 3A A cross-sectional view taken from the centerline AA'.

[0029] Figure 4 A plan view of a flexible circuit board according to some embodiments of the present invention is shown schematically.

[0030] Figure 5 A schematic plan view of a display module according to some embodiments of the present invention is shown.

[0031] Figure 6 A flowchart illustrating a performance testing method for a display module according to some embodiments of the present invention is shown schematically.

[0032] Figures 7A-7D The diagram illustrates the performance testing process of a display module according to some embodiments of the present invention.

[0033] It should be noted that, for clarity, the dimensions of layers, structures, or regions in the drawings used to describe embodiments of the present invention may be enlarged or reduced, i.e., these drawings are not drawn to actual scale. Detailed Implementation

[0034] In the following description, numerous specific details are set forth for illustrative purposes to provide a comprehensive understanding of various exemplary embodiments. However, it will be apparent that various exemplary embodiments may be implemented without these specific details or with one or more equivalent arrangements. In other instances, well-known structures and apparatuses are shown in block diagram form to avoid unnecessarily obscuring the various exemplary embodiments. Furthermore, the various exemplary embodiments may be different, but not necessarily exclusive. For example, specific shapes, configurations, and characteristics of exemplary embodiments may be used or implemented in another exemplary embodiment without departing from the inventive concept.

[0035] In the accompanying drawings, the dimensions and relative dimensions of the elements may be enlarged for clarity and / or descriptive purposes. Thus, the dimensions and relative dimensions of the individual elements are not necessarily limited to those shown in the drawings. When exemplary embodiments can be implemented differently, the specific process sequence may be performed differently than the order described. For example, two consecutively described processes may be performed substantially simultaneously or in the reverse order of description. Furthermore, the same reference numerals denote the same elements.

[0036] When an element is described as being "on" another element, "connected to" another element, or "attached to" another element, the element may be directly on, directly connected to, or directly attached to the other element, or there may be intermediate elements present. However, when an element is described as being "directly on" another element, "directly connected to" another element, or "directly attached to" another element, there are no intermediate elements. Other terms and / or expressions used to describe relationships between elements should be interpreted in a similar manner, such as "between" versus "directly between," "adjacent" versus "directly adjacent," or "on" versus "directly on," etc. Furthermore, the term "connection" can refer to a physical connection, an electrical connection, a communication connection, and / or a fluid connection. Additionally, the X-axis, Y-axis, and Z-axis are not limited to the three axes of a Cartesian coordinate system and can be interpreted in a broader sense. For example, the X-axis, Y-axis, and Z-axis may be perpendicular to each other, or may represent different directions that are not perpendicular to each other. For the purposes of this invention, "at least one of X, Y, and Z" and "at least one selected from the group consisting of X, Y, and Z" can be interpreted as only X, only Y, only Z, or any combination of two or more of X, Y, and Z such as XYZ, XY, YZ, and XZ. As used herein, the term "and / or" includes any and all combinations of one or more of the listed related items.

[0037] It should be understood that although the terms first, second, etc., may be used herein to describe different elements, these elements should not be limited by these terms. These terms are merely used to distinguish one element from another. For example, without departing from the scope of the exemplary embodiments, a first element may be named a second element, and similarly, a second element may be named a first element.

[0038] Figure 1 A schematic plan view of a display module in the related art is shown. Figure 2 The schematic diagram illustrates the principle of an aging test for a display module in the related technology.

[0039] Reference Figure 1 The display module includes a display panel 200' and a flexible circuit board 100' electrically connected to the display panel 200'. A bonding pad 120' is provided on the side of the flexible circuit board 100' closest to the display panel 200', and the bonding pad 120' is electrically connected to the display panel 200'. A connector pin 130' is provided at the end of the flexible circuit board 100' furthest from the display panel 200'.

[0040] Combined with reference Figure 1 and Figure 2 During aging tests, the display module is placed on the aging test circuit board 300', which has a connector 320'. The connector pins 130' of the flexible circuit board 100' are inserted into the connector 320' of the aging test circuit board 300'. The aging test circuit board 300' is also connected to the test equipment, and the test signals provided by the test equipment are connected to the display panel 200' through the flexible circuit board 100', thus performing the aging test.

[0041] Statistics show that functional defects such as black screens were found in every batch of test results due to burnt pins 130' on the flexible circuit board 100'. The inventors' research revealed that the cause of this defect is strongly correlated with the operator's technique during the aging test process when loading the display module onto the aging test circuit board 300'. Because the flexible circuit board 100' is flexible, during loading, the pins 130' on the flexible circuit board 100' are prone to misalignment or incomplete insertion with the interface 320' on the aging test circuit board 300', leading to burnt pins 130' on the flexible circuit board 100'.

[0042] Figure 3A A plan view of a flexible circuit board 100 according to some embodiments of the present invention is shown schematically. Figure 3B Schematic illustration along Figure 3A A cross-sectional view taken from the centerline AA'.

[0043] According to some exemplary embodiments, in conjunction with reference to Figure 3A and Figure 3B The flexible circuit board 100 includes a circuit board body 110, bonding pads 120, and connector pins 130. The circuit board body 110 includes a flexible substrate 111 and a circuit structure 112 disposed on the flexible substrate 111. The bonding pads 120 and connector pins 130 are located on both sides of the circuit structure 112 along a first direction X. The bonding pads 120 may also be disposed on the flexible substrate 111 and electrically connected to one side of the circuit structure 112 along the first direction X, and the connector pins 130 are electrically connected to the other side of the circuit structure 112 along the first direction X.

[0044] In this flexible circuit board 100, the bonding pads 120 can be used for electrical connection with the structure on the display panel to form a display module. The plug pins 130 can be used for electrical connection with the plug interface on the performance test circuit board for performance testing, such as aging testing. After the performance test is completed, the plug pins 130 on the flexible circuit board 100 can also be electrically connected to other electronic components, such as to a driver circuit board that provides display drive signals.

[0045] Combined with reference Figure 3A and Figure 3B The circuit board body 110 has at least one hollow structure 140, which extends through the thickness of the circuit board body 110 and is a strip extending in the first direction X. When the pins 130 in the flexible circuit board 100 are connected to other electronic components, the hollow structure 140 in the circuit board body 110 can be fitted onto the posts of other electronic components to assist in positioning and avoid defects caused by misalignment or incomplete connection.

[0046] For example, during aging tests, pillars can be set on the aging test circuit board. Through the cooperation between the hollow structure 140 in the flexible circuit board 100 and the pillars on the aging test circuit board, the insertion accuracy between the plug pins 130 in the flexible circuit board 100 and the plug interfaces on the aging test circuit board can be improved. For details, please refer to the following description.

[0047] According to some exemplary embodiments, in conjunction with reference to Figure 3A and Figure 3B The hollow structure 140 is disposed on the flexible substrate 111. The hollow structure 140 is disposed through the flexible substrate 111 along the thickness direction of the flexible substrate 111. The circuit structure 112 is disposed in a region of the flexible substrate 111 where the hollow structure 140 is not disposed.

[0048] For example, the flexible substrate 111 may include a polyimide (PI) film or a polyester (PET) film, and the perforated structure 140 on the flexible substrate 111 may be formed by processes such as laser cutting.

[0049] According to some exemplary embodiments, refer to Figure 3A The dimension S1 of the cutout structure 140 along the first direction X is greater than or equal to the dimension S2 of the pin 130 along the first direction X. This arrangement allows the flexible circuit board 100 to be positioned on one side of the connector interface along the first direction X without interfering with the connector interface when the post on the other electronic component is located within the cutout structure 140 closest to the pin 130, making the connector operation easier. Conversely, when the post on the other electronic component is located within the cutout structure 140 furthest from the pin 130, the pin 130 can be fully inserted into the connector interface. By setting the dimension of the cutout structure 140 along the first direction X, the accuracy of the connector pin 130 in the flexible circuit board 100 can be effectively improved when it is connected to other electronic components.

[0050] According to some exemplary embodiments, refer to Figure 3A The main body 110 of the circuit board is provided with at least two hollow structures 140, and the at least two hollow structures 140 are arranged at intervals along the second direction Y, which is perpendicular to the first direction X.

[0051] Continue to refer to Figure 3A The two hollow structures 140 have the same size along the first direction X. The ends of the two hollow structures 140 near the plug pin 130 are aligned along the second direction Y, and the ends of the two hollow structures 140 away from the plug pin 130 are aligned along the second direction Y.

[0052] According to some exemplary embodiments, refer to Figure 3A The spacing G of adjacent cutout structures 140 along the second direction Y is less than or equal to half the dimension S3 of the circuit board body 110 along the first direction X, and the spacing G of adjacent cutout structures 140 along the second direction Y is greater than or equal to twice the dimension S1 of the cutout structure 140 along the first direction X. Setting the spacing G of adjacent cutout structures 140 along the second direction Y within this range helps to ensure ease of operation and insertion accuracy.

[0053] According to some exemplary embodiments, refer to Figure 3A The spacing G between two adjacent hollow structures 140 along the second direction Y is 8mm-10mm. For example, the spacing G can be 8mm, 8.5mm, 9mm, 9.5mm or 10mm, etc.

[0054] It should be noted that, Figure 3A The diagram illustrates the use of two cutout structures 140. The number of cutout structures 140 can be set according to the size of the flexible circuit board 100 along the second direction Y. The larger the size of the flexible circuit board 100 along the second direction Y, the more cutout structures 140 can be.

[0055] According to some exemplary embodiments, refer to Figure 3A The cutout structure 140 has an edge shape at least one end along the first direction X, including an arc shape. For example, the edges of both ends of the cutout structure 140 along the first direction X include semi-circular arcs. Correspondingly, the pillars on the electronic components that are inserted into the flexible circuit board 100 are cylindrical, with the radius of the bottom surface of the cylinder matching the radius of the semi-circular arc, thereby achieving precise nesting positioning. Furthermore, the cylindrical pillars can be easily nested within the cutout structure 140, making the nesting positioning operation simpler and faster.

[0056] Figure 4 A plan view of a flexible circuit board according to some embodiments of the present invention is shown schematically.

[0057] According to some exemplary embodiments, refer to Figure 4 The hollow structure 140 has a rectangular shape, and both ends of the hollow structure 140 along the first direction X are rectangular. Correspondingly, the pillars on the electronic components that are inserted into the flexible circuit board 100 are cuboids. The dimensions of the cuboids along the second direction Y are consistent with the dimensions of the hollow structure 140 along the second direction Y, thereby achieving precise nesting and positioning. In addition, the cuboid pillars can be nested more stably within the hollow structure 140, which is more conducive to ensuring that the flexible circuit board 100 is less likely to shift during the insertion process, thereby further improving the insertion accuracy.

[0058] According to some exemplary embodiments, refer to Figure 3A Along the first direction X, the distance between the cutout structure 140 and the insertion pin 130 is a first distance D1, and the distance between the cutout structure 140 and the bonding pad 120 is a second distance D2. The first distance D1 is smaller than the second distance D2. That is, by placing the cutout structure 140 closer to the insertion pin 130, when the cutout structure 140 is nested on the pillar of the electronic component to be inserted, it can better guide the insertion pin 130 to be inserted more accurately into the insertion structure of the electronic component.

[0059] Figure 5 A schematic plan view of a display module according to some embodiments of the present invention is shown.

[0060] According to some exemplary embodiments, refer to Figure 5 The display module includes a display panel 200 and a flexible circuit board 100. The flexible circuit board 100 is the type described in the previous embodiment, wherein a strip-shaped perforated structure 140 extending along a first direction X is provided between the bonding pads 120 and the connector pins 130. The flexible circuit board 100 and the display panel 200 are connected along the first direction X, and the bonding pads 120 in the flexible circuit board 100 are electrically connected to the bonding pads in the peripheral area of ​​the display panel 200. The connector pins 130 on the side of the flexible circuit board 100 away from the display panel 200 can also be connected to a driver circuit board with display driving function.

[0061] For example, display panel 200 may include liquid crystal display panel, OLED display panel, silicon-based OLED display panel or Micro LED display panel, etc.

[0062] Figure 6 A flowchart illustrating a performance testing method for a display module according to some embodiments of the present invention is shown schematically.

[0063] According to some exemplary embodiments, a performance testing method for a display module is provided, applied to the display module described above, with reference to... Figure 6 The performance testing method may include the following steps S10-S20.

[0064] In step S10, a performance test circuit board is provided, including a test motherboard and at least one plug-in interface and at least one post disposed on the test motherboard. The at least one plug-in interface and at least one post are disposed on the same side of the test motherboard, and the at least one post is located on one side of the at least one plug-in interface along a first direction.

[0065] In step S20, the display module to be tested is placed on the performance test circuit board, and the hollow structure in the flexible circuit board is fitted onto the pillar of the performance test circuit board. The display module is moved along the first direction until the plug pins of the flexible circuit board are inserted into the plug interface, and the test begins.

[0066] According to some exemplary embodiments, moving the display module along a first direction until the connector pins of the flexible circuit board are inserted into the connector interface includes:

[0067] Move the display module along the first direction until the column and the end of the hollow structure away from the plug pins come into contact to confirm that the plug pins of the flexible circuit board are fully inserted into the plug interface.

[0068] According to some exemplary embodiments, performance testing may include aging testing. Aging testing refers to accelerating the exposure of potential defects (such as brightness decay, color shift, dead pixels, driver circuit failure, etc.) by simulating extreme environments or continuous working conditions, in order to evaluate the long-term reliability and stability of the display module. The specific test conditions for aging testing are not limited in this embodiment of the invention, but are set according to actual process requirements.

[0069] Figures 7A-7D The diagram illustrates the performance testing process of a display module according to some embodiments of the present invention.

[0070] The following combination Figures 7A-7D The performance testing process of the display module in some embodiments of this utility model is described in detail.

[0071] Reference Figure 7A An aging test circuit board 300 is provided, including a test main board 310 and at least one plug-in interface 320 and at least one pillar 330 disposed on the test main board 310. The at least one plug-in interface 320 and at least one pillar 330 are disposed on the same side of the test main board 310, and the at least one pillar 330 is located on the side of the at least one plug-in interface 320 along a first direction X. For example, the aging test circuit board 300 is provided with two plug-in interfaces 320, which are arranged at intervals along a second direction Y. Four pillars 330 are disposed on the side of the two plug-in interfaces 320 along the first direction X, and the four pillars 330 are arranged side by side along the second direction Y. In this way, the aging test circuit board 300 can simultaneously perform performance tests on two display modules 10 to improve testing efficiency.

[0072] For example, the plug interface 320 in the aging test circuit board 300 may include a zero-intermediate frequency (ZIF) socket.

[0073] For example, the aging test circuit board 300 is also electrically connected to the test equipment, which can be configured to provide test signals to the aging test circuit board 300 and acquire the relevant performance of the display module 10 during the test to obtain the aging test structure.

[0074] Reference Figure 7B The display module 10, which needs to undergo aging test, is placed above the aging test circuit board 300, such that the cutout structure 140 in the flexible circuit board 100 of the display module 10 is approximately above the pillar 330 of the aging test circuit board 300.

[0075] Reference Figure 7CThe display module 10 is placed completely on the aging test circuit board 300, with the lower surface of the display module 10 in contact with the upper surface of the aging test circuit board 300. The two hollow structures 140 in the flexible circuit board 100 of the display module 10 are respectively nested outside the two pillars 330 on the aging test circuit board 300, so that the pillars 330 are in contact with the end of the hollow structure 140 near the insertion pin 130.

[0076] The aging test circuit board 300 has a large area, and the display module 10 can be located entirely on the aging test circuit board 300. The aging test circuit board 300 supports the display module 10 during the test.

[0077] Combined with reference Figure 7C Figure 7D The display module 10 is pulled along the first direction X towards the insertion interface 320 in the aging test circuit board 300, so that the insertion pin 130 in the flexible circuit board 100 is inserted into the insertion interface 320 in the aging test circuit board 300. The movement of the display module 10 is stopped when the column 330 contacts the end of the hollow structure 140 away from the insertion pin 130. The insertion pin 130 and the insertion interface 320 are connected, and the aging test can be started.

[0078] During the movement of the display module 10, the interaction between the column 330 and the hollow structure 140 can guide the movement of the display module 10, thereby effectively preventing the insertion pins 130 of the flexible circuit board 100 from being misaligned with the insertion interface 320 of the aging test circuit board 300.

[0079] To further avoid the problem of misalignment during insertion, alignment marks can be set on the test motherboard 310 of the aging test circuit board 300. For example, a linear mark extending along the second direction Y can be set on the test motherboard 310 to guide the movement of the display module 10, thereby further avoiding the problem of misalignment between the insertion pins 130 of the flexible circuit board 100 and the insertion interface 320 of the aging test circuit board 300.

[0080] Furthermore, by setting the relative position of the pillar 330 on the aging test circuit board 300 and the position of the end of the hollow structure 140 in the flexible circuit board 100 away from the plug pin 130, when the pillar 330 and the end of the hollow structure 140 away from the plug pin 130 come into contact, the plug pin 130 can be fully inserted into the plug interface 320. This effectively avoids the problem of incomplete insertion between the plug pin 130 of the flexible circuit board 100 and the plug interface 320 of the aging test circuit board 300.

[0081] It should be noted that after the aging test is completed, the connector pins 130 of the flexible circuit board 100 are removed from the connector interface 320 in the aging test circuit board 300. In subsequent processes, the connector pins 130 of the flexible circuit board 100 can also be connected and assembled with the driver circuit board. The driver circuit board can input driving display signals into the display panel 200 to drive the display panel 200 to display a predetermined image. Depending on the requirements, the driver circuit board can also be provided with pillars that cooperate with the hollow structure 140 on the flexible circuit board 100 to ensure the accuracy of the connection between the flexible circuit board 100 and the driver circuit board and avoid display defects caused by poor connection.

[0082] At least some embodiments of the present invention also provide an electronic device comprising the flexible circuit board and / or display module as described above.

[0083] For example, electronic devices may include display devices, which may include any device or product with display functionality. For instance, the display device may be a smartphone, mobile phone, e-book reader, desktop computer (PC), laptop PC, netbook PC, personal digital assistant (PDA), portable multimedia player (PMP), digital audio player, mobile medical device, camera, wearable device (e.g., head-mounted device, electronic clothing, electronic bracelet, electronic necklace, electronic accessory, electronic tattoo, or smartwatch), television set, etc.

[0084] It should be understood that the display device according to some exemplary embodiments of the present invention has all the features and advantages of the above-described display module, which can be referred to in the above description of the display module, and will not be repeated here.

[0085] As used herein, the terms “substantially,” “approximately,” “about,” and other similar terms are used as terms of approximation rather than as terms of degree, and they are intended to account for inherent deviations in measured or calculated values ​​that would be recognized by one of ordinary skill in the art. Taking into account factors such as process variations, measurement problems, and errors associated with the measurement of a particular quantity (i.e., limitations of the measurement system), “approximately” or “about” as used herein includes the stated value and indicates that the particular value is within an acceptable range of deviation for one of ordinary skill in the art. For example, “approximately” may mean within one or more standard deviations, or within ±10% or ±5% of the stated value.

[0086] While some embodiments of the general inventive concept of this utility model have been illustrated and described, those skilled in the art will understand that changes may be made to these embodiments without departing from the principles and spirit of the general inventive concept of this utility model, the scope of which is defined by the claims and their equivalents.

Claims

1. A flexible circuit board, wherein, The flexible circuit board includes: Circuit board body; Bonding pads are located on one side of the main body of the circuit board and are electrically connected to the main body of the circuit board. The connector pin is located on the other side of the main body of the circuit board and is electrically connected to the main body of the circuit board. The connector pin and the bonding pad are respectively located on opposite sides of the main body of the circuit board along a first direction. The circuit board body has at least one hollow structure, which is provided through the circuit board body along the thickness direction of the circuit board body and is a strip shape extending along the first direction.

2. The flexible circuit board according to claim 1, wherein, The dimension of the hollow structure along the first direction is greater than or equal to the dimension of the plug pin along the first direction.

3. The flexible circuit board according to claim 1 or 2, wherein, The main body of the circuit board is provided with at least two hollow structures, and the at least two hollow structures are arranged at intervals along a second direction, which is perpendicular to the first direction.

4. The flexible circuit board according to claim 3, wherein, The spacing between adjacent cutout structures along the second direction is less than or equal to half the dimension of the circuit board body along the first direction; and / or, The spacing between adjacent perforated structures along the second direction is greater than or equal to twice the dimension of the perforated structure along the first direction; and / or, The spacing between adjacent hollow structures along the second direction is 8mm-10mm.

5. The flexible circuit board according to any one of claims 1-4, wherein, The edge shape of the hollow structure at at least one end along the first direction includes an arc shape.

6. The flexible circuit board according to any one of claims 1-4, wherein, The hollow structure includes rectangular shapes.

7. The flexible circuit board according to any one of claims 1-6, wherein, Along the first direction, the distance between the hollow structure and the plug pin is a first distance, and the distance between the hollow structure and the bonding pad is a second distance, wherein the first distance is smaller than the second distance.

8. A display module, wherein the display module comprises a display panel and a flexible circuit board according to any one of claims 1-7, wherein bonding pads in the flexible circuit board are electrically connected to the display panel.

9. An electronic device, wherein, The electronic device includes a flexible circuit board according to any one of claims 1-7 and a display module according to claim 8.

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