Bus duct connection mechanism

Abstract

This utility model relates to the field of busbar trunking technology and discloses a busbar trunking connection mechanism, including a busbar body. Two vertical busbar protective shell plates are provided on the outer surface of the busbar body. Four grooves are formed on the opposite surfaces of the two vertical busbar protective shell plates. A heat dissipation mechanism is provided on the two vertical busbar protective shell plates, including heat dissipation fins, a horizontal busbar protective shell plate, a semiconductor cooling chip, a cooling fin, a cooling fan, and a cooling fan. The heat dissipation fins are fixedly installed on the opposite surfaces of the two vertical busbar protective shell plates. The two horizontal busbar protective shell plates are located on the opposite surfaces of the two vertical busbar protective shell plates. This busbar trunking connection mechanism enables rapid connection of busbar trunking protection through a snap-fit ​​method. Compared to traditional busbar trunking protection fixed with bolts, this fixing method not only eliminates the need for tools during actual use but also offers high disassembly and assembly efficiency, facilitating the maintenance and repair of the busbar.

Description

Technical Field

[0001] This utility model relates to the field of busbar technology, specifically a busbar connection mechanism. Background Technology

[0002] Busbar trunking is a closed metal device made of copper or aluminum busbar columns. It is used to distribute large power to various components of a distributed system. In indoor low-voltage power transmission trunk line projects, it has increasingly replaced wires and cables. It is a new type of conductor that uses copper or aluminum as conductor, is supported by non-alkaline insulation, and is then installed in a metal trunking. Today, it has become an indispensable wiring method in electrical equipment and power systems in high-rise buildings, factories, etc.

[0003] In existing busbar trunking systems, multiple bolts are used to lock and fix the busbars of two busbar trunking systems together. This requires tools to operate the bolts, which is time-consuming, labor-intensive, and inefficient. The existing busbar trunking systems dissipate heat through side plates installed on both sides of the cover plate. However, since the busbar trunking reaches a very high temperature when energized, the side plates alone are insufficient to achieve effective heat dissipation. This is especially true for dense busbar systems, where the heat of the busbar located in the middle is difficult to transfer and dissipate through the side plates. Therefore, a new busbar trunking connection mechanism is proposed. Utility Model Content

[0004] (a) Technical problems to be solved

[0005] To address the shortcomings of existing technologies, this utility model provides a busbar trunking connection mechanism that solves the problem of poor connection effect of busbar trunking protective shells.

[0006] (II) Technical Solution

[0007] To achieve the above-mentioned goal of improving the heat dissipation effect of the busbar trunking protective shell, the present invention provides the following technical solution: a busbar trunking connection mechanism, including a busbar body, two busbar protective shell vertical plates are provided on the outer surface of the busbar body, and four grooves are opened on the opposite surfaces of the two busbar protective shell vertical plates;

[0008] The two busbar protective shell vertical plates are equipped with heat dissipation mechanisms, which include heat dissipation fins, busbar protective shell horizontal plates, semiconductor cooling chips, heat conduction chips, heat dissipation fans, and heat conduction fans.

[0009] Preferably, the heat dissipation fins are fixedly installed on opposite sides of the two busbar protective shell vertical plates;

[0010] Two horizontal busbar protective shell plates are set on the opposite sides of two vertical busbar protective shell plates, and eight locking holes are respectively opened on the opposite sides of the two horizontal busbar protective shell plates.

[0011] Preferably, the thermoelectric cooler is fixedly installed in the inner wall of the busbar protective shell horizontal plate, the cooling plate is fixedly installed on the lower surface of the thermoelectric cooler, and the cooling fan is fixedly installed on the lower surface of the cooling plate.

[0012] The cooling fan is fixedly mounted on the upper surface of the semiconductor cooling chip.

[0013] Preferably, four sliding holes are respectively opened on the opposite sides of the two busbar protective shell vertical plates, and spring grooves are opened on the inner walls of the eight sliding holes.

[0014] Preferably, eight fixed rods are slidably sleeved in the inner walls of the eight sliding holes, and pull rings are fixedly installed at the upper ends of the eight fixed rods respectively;

[0015] Each of the eight fixed rods has a locking block fixedly installed at its lower end, and the inclined surfaces of the eight locking blocks are all set at an angle.

[0016] Preferably, each of the eight fixed rods has a ring fixedly fitted on its outer surface, and eight springs are fixedly installed on the upper surface of the rings, with the upper ends of the eight springs fixedly installed in the inner wall of the eight spring grooves.

[0017] (III) Beneficial Effects

[0018] Compared with the prior art, the present invention provides a busbar trunking connection mechanism, which has the following advantages:

[0019] 1. The busbar trunking connection mechanism can quickly connect the busbar trunking protection through a snap-fit ​​method. Compared with the traditional busbar trunking protection which is fixed by bolt structure, this fixing method not only does not require the use of tools in actual use, but also has high disassembly and assembly efficiency, and facilitates the maintenance and repair of the busbar.

[0020] 2. The busbar connection mechanism can absorb most of the heat generated during the operation of the busbar by means of heat dissipation fins fixedly installed on the outer surface of the busbar protective shell vertical plate, thereby cooling it down. It can also generate cold air through semiconductor cooling chips and transport the cold air to the surface of the busbar body through cooling plates and cooling fans for cooling treatment. Attached Figure Description

[0021] Figure 1 This is a schematic diagram of a busbar trunking connection mechanism according to the present invention;

[0022] Figure 2 This is a schematic diagram of the internal structure of the horizontal plate of the busbar protective shell of this utility model;

[0023] Figure 3 This is a schematic diagram of the horizontal plate structure of the busbar protective shell of this utility model;

[0024] Figure 4 This utility model Figure 2 Enlarged view of the structure at point A in the middle.

[0025] In the diagram: 1. Busbar body; 2. Busbar protective shell vertical plate; 3. Heat dissipation fins; 4. Groove; 5. Busbar protective shell horizontal plate; 6. Semiconductor cooling chip; 7. Cooling fin; 8. Cooling fan; 9. Cooling fan; 10. Clip hole; 11. Sliding hole; 12. Spring groove; 13. Fixing rod; 14. Pull ring; 15. Locking block; 16. Ring; 17. Spring. Detailed Implementation

[0026] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0027] Please see Figure 1-4 This utility model provides a new technical solution: a busbar trunking connection mechanism, including a busbar body 1, two busbar protective shell vertical plates 2 are provided on the outer surface of the busbar body 1, and four grooves 4 are opened on the opposite surfaces of the two busbar protective shell vertical plates 2.

[0028] Among them, the two busbar protective shell vertical plates 2 are equipped with heat dissipation mechanisms, which include heat dissipation fins 3, busbar protective shell horizontal plates 5, semiconductor cooling chips 6, heat conduction plates 7, heat dissipation fans 8 and heat conduction fans 9.

[0029] Furthermore, the heat dissipation fins 3 are fixedly installed on the opposite sides of the two busbar protective shell vertical plates 2;

[0030] Among them, two busbar protective shell horizontal plates 5 are set on the opposite sides of two busbar protective shell vertical plates 2, and eight locking holes 10 are respectively opened on the opposite sides of the two busbar protective shell horizontal plates 5.

[0031] Furthermore, the semiconductor cooling chip 6 is fixedly installed in the inner wall of the busbar protective shell horizontal plate 5, the cooling plate 7 is fixedly installed on the lower surface of the semiconductor cooling chip 6, and the cooling fan 9 is fixedly installed on the lower surface of the cooling plate 7.

[0032] The cooling fan 8 is fixedly mounted on the upper surface of the semiconductor cooling chip 6.

[0033] Furthermore, four sliding holes 11 are respectively opened on the opposite sides of the two busbar protective shell vertical plates 2, and spring grooves 12 are opened on the inner walls of the eight sliding holes 11.

[0034] Furthermore, eight fixed rods 13 are slidably sleeved in the inner walls of the eight sliding holes 11, and pull rings 14 are fixedly installed at the upper ends of the eight fixed rods 13 respectively.

[0035] The lower ends of the eight fixed rods 13 are respectively fixedly installed with locking blocks 15, and the inclined surfaces of the eight locking blocks 15 are all set at an angle.

[0036] Furthermore, each of the eight fixed rods 13 has a ring 16 fixedly fitted on its outer surface, and each of the eight rings 16 has a spring 17 fixedly installed on its upper surface, with the upper ends of each of the eight springs 17 fixedly installed in the inner wall of the eight spring grooves 12.

[0037] When the busbar trunking connection mechanism is in use, the heat dissipation fins 3 fixedly installed on opposite sides of the two busbar protective shell vertical plates 2 can absorb the heat generated by the busbar body 1 itself. At this time, the semiconductor cooling chip 6 is powered, and this power supply is connected to the power supply of the busbar body 1, both transmitted through wires. The semiconductor cooling chip 6 cools by operating, and this part of the cold air is transferred to the busbar body 1 for cooling through the cooling plate 7 and the cooling fan 9. The electricity generated on the back of the semiconductor cooling chip 6 is discharged through the cooling fan 8. When the busbar trunking protective shell is installed, the busbar protective shell horizontal plate 5 is inserted into the groove 4 opened on the right surface of the busbar protective shell vertical plate 2. At this time, one side of the busbar protective shell horizontal plate 5 hits the inclined surface of the locking block 15 and applies an upward pushing force to the inclined surface of the locking block 15, causing it to move upward. At the same time, the locking block 15 applies an upward pushing force to the fixing rod 13 fixedly installed on the upper surface, causing it to move upward. As 13 moves upward, it drives the ring 16 fixedly mounted on the outer surface to move upward. At this time, the ring 16 applies pressure to the spring 17 fixedly mounted on the upper surface, causing it to contract. Then, the horizontal plate 5 of the busbar protective shell is inserted into the groove 4 opened on the right surface of the vertical plate 2 of the busbar protective shell. At this time, the locking block 15 passes through the locking hole 10 opened on the upper surface of the horizontal plate 5 of the busbar protective shell. At this time, the locking block 15 is no longer subjected to the squeezing force of the horizontal plate 5 of the busbar protective shell, and the spring 17 is no longer under force. At this time, the spring 17 expands and applies pressure to the ring 16 fixedly mounted on the lower surface, causing the ring 16 to drive the fixing rod 13 fixedly mounted on the inner surface to move downward. At the same time, the fixing rod 13 pushes the locking block 15 fixedly mounted at the lower end to move downward, so that it is locked into the locking hole 10 opened on the upper surface of the horizontal plate 5 of the busbar protective shell for fixation. The locking holes 10 opened on the upper surface of the horizontal plate 5 of the busbar protective shell are fixed in sequence to complete the installation of the protective shell.

[0038] This busbar trunking connection mechanism uses heat dissipation fins fixedly installed on the outer surface of the busbar protective shell vertical plate to absorb most of the heat generated during busbar operation, thus cooling it down. It also generates cool air through a semiconductor cooling chip, which is then transported to the surface of the busbar body via a cooling fin and a cooling fan for further cooling. Furthermore, the busbar trunking connection mechanism allows for quick connection of the busbar trunking protection via a snap-fit ​​method. Compared to traditional busbar trunking protection that is fixed with bolts, this fixing method not only eliminates the need for tools during actual use but also offers high assembly and disassembly efficiency, facilitating busbar maintenance and repair.

[0039] Structural Description:

[0040] Busbar body 1: This is the core component of the busbar trunking connection mechanism, used to transmit electrical energy and serving as the main path for current.

[0041] Busbar protective shell vertical plate 2: Located on the outer surface of the busbar body 1, it serves to protect the busbar body from external physical damage, dust contamination and possible electrical interference, while providing installation positions for other components.

[0042] Heat dissipation fins 3: Fixedly installed on the opposite sides of the two busbar protective shell vertical plates 2. Their function is to increase the heat dissipation area, accelerate the heat dissipation speed of the busbar trunking connection mechanism, and quickly dissipate the heat generated by the busbar body during operation to the surrounding environment, preventing the equipment from being affected or damaged due to overheating.

[0043] Groove 4: It is formed on the opposite side of the vertical plates 2 of the two busbar protective shells. It may be used to install other related components or to reduce the weight of the protective shell and enhance the structural stability. The specific purpose needs to be determined according to the overall design and the usage scenario.

[0044] Busbar protective shell horizontal plate 5: It is set on the opposite side of the two busbar protective shell vertical plates 2, and together with the busbar protective shell vertical plates, it forms a closed protective structure to further protect the busbar body, and at the same time provides installation support for components such as semiconductor cooling chips.

[0045] Semiconductor cooling chip 6: It is fixedly installed in the inner wall of the busbar protective shell horizontal plate 5. Through the semiconductor cooling principle, it absorbs the heat inside the busbar trunking and transfers it to the other side, achieving the effect of cooling and reducing the working temperature of the busbar body, thereby improving its working efficiency and safety.

[0046] Cooling plate 7: Fixedly installed on the lower surface of the semiconductor cooling plate 6, it can quickly conduct the cold energy generated by the semiconductor cooling plate to the part that needs to be cooled, making the cooling effect more uniform and efficient.

[0047] Cooling fan 8: Fixedly installed on the upper surface of the thermoelectric cooler 6, its function is to accelerate the airflow on the upper surface of the thermoelectric cooler, remove the heat dissipated by the thermoelectric cooler in time, improve the heat dissipation efficiency, and ensure that the thermoelectric cooler can work continuously and stably.

[0048] Cooling fan 9: Fixedly installed on the lower surface of cooling plate 7, it blows air to make the cold energy conducted by the cooling plate diffuse better inside the busbar trunking, improves the cooling effect, and ensures that the busbar body operates at a lower temperature.

[0049] Sliding hole 11: It is opened on the opposite side of the two busbar protective shell vertical plates 2 to provide a sliding channel for the fixing rod 13, so that the fixing rod 13 can move up and down in it to achieve the corresponding fixing or unlocking function.

[0050] Spring groove 12: Located on the inner wall of sliding hole 11, it is used to install spring 17, providing installation space and fixing point for spring, so that spring can provide elastic force when fixed rod 13 moves.

[0051] Fixed rod 13: It is slidably sleeved in the inner wall of the sliding hole 11. Its up and down movement can drive the locking block 15 to move, thereby fixing or loosening other parts. It is a key component in the connection mechanism to achieve mechanical fixation.

[0052] Pull ring 14: Fixedly installed on the upper end of the eight fixed rods 13, making it convenient for the operator to manually pull the fixed rods 13. By applying external force through the pull ring, the fixed rods 13 overcome the elastic force of the spring 17 and move upward, thereby releasing the fixing effect of the locking block 15.

[0053] Locking block 15: It is fixedly installed at the lower end of the eight fixing rods 13. Its inclined design makes it easy to cooperate with other components during installation. When the fixing rods 13 move downward, the locking block 15 can lock the corresponding components to achieve a tight connection and prevent the components from loosening or falling off.

[0054] Ring 16: It is fixedly sleeved on the outer surface of the eight fixed rods 13, used to fix the lower end of the spring 17, so that the spring can be installed around the fixed rods 13, and plays a positioning and support role when the spring extends or retracts.

[0055] Spring 17: The upper end is fixedly installed in the inner wall of the spring groove 12, and the lower end is connected to the ring 16 to provide elastic force for the fixing rod 13. When the external force is removed, the elastic force of the spring causes the fixing rod 13 to automatically reset, driving the locking block 15 back to the fixed state, ensuring the reliability of the connection.

[0056] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A busbar trunking connection mechanism, comprising a busbar body (1), wherein two busbar protective shell vertical plates (2) are provided on the outer surface of the busbar body (1), characterized in that: Four grooves (4) are provided on the opposite surfaces of the two busbar protective shell vertical plates (2); Among them, the two busbar protective shell vertical plates (2) are equipped with heat dissipation mechanisms, which include heat dissipation fins (3), busbar protective shell horizontal plates (5), semiconductor cooling plates (6), cooling plates (7), heat dissipation fans (8), cooling fans (9) and card holes (10). The heat dissipation fins (3) are fixedly installed on opposite sides of the two busbar protective shell vertical plates (2); Among them, two busbar protective shell horizontal plates (5) are set on the opposite sides of two busbar protective shell vertical plates (2), and eight card holes (10) are respectively opened on the opposite sides of the two busbar protective shell horizontal plates (5); The semiconductor cooling chip (6) is fixedly installed in the inner wall of the busbar protective shell horizontal plate (5), the cooling plate (7) is fixedly installed on the lower surface of the semiconductor cooling chip (6), and the cooling fan (9) is fixedly installed on the lower surface of the cooling plate (7). The cooling fan (8) is fixedly installed on the upper surface of the semiconductor cooling chip (6); The two busbar protective shell vertical plates (2) are respectively provided with four sliding holes (11) on their opposite sides, and spring grooves (12) are provided on the inner walls of the eight sliding holes (11). Eight fixed rods (13) are slidably sleeved in the inner walls of the eight sliding holes (11), and pull rings (14) are fixedly installed at the upper ends of the eight fixed rods (13). Among them, the lower ends of the eight fixed rods (13) are respectively fixedly installed with a locking block (15), and the inclined surfaces of the eight locking blocks (15) are all set as inclined surfaces; The outer surfaces of the eight fixed rods (13) are all fixedly fitted with rings (16), and the upper surfaces of the rings (16) are respectively fixedly installed with eight springs (17), and the upper ends of the eight springs (17) are all fixedly installed in the inner walls of the eight spring grooves (12).

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