Circuit board structure and water purifier

Abstract

This application relates to the field of water purification equipment. This application discloses a circuit board structure and a water purifier. The circuit board structure includes an electronic control board, a silicon controlled rectifier (SCR) element, and a heat dissipation assembly. The SCR element is disposed on the electronic control board. The heat dissipation assembly includes a heat dissipation plate body, liquid cooling pipes, and a heat conduction plate. The heat dissipation plate body is provided with liquid cooling pipes, and the liquid cooling pipes are provided with heat exchange chambers. The heat exchange chambers are provided with openings. The heat conduction plate covers and is fixed to the openings, and the heat conduction plate is attached to at least part of the SCR element. It is attached to the controller through heat dissipation fins, which helps to conduct the heat generated on the SCR to the heat conduction plate. The inner side of the heat conduction plate can contact the liquid flow passing through the chamber to exchange heat, thereby reducing the temperature of the SCR and maintaining the relative stability of the internal temperature of the water purifier. At the same time, the overall structure of the heat dissipation assembly is compact, effectively saving the assembly space inside the water purifier.

Description

Technical Field

[0001] This application relates to the field of water purification equipment, and in particular to a circuit board structure and a water purifier. Background Technology

[0002] Current kitchen water purifiers produce purified and concentrated water through staged filtration. The purifier integrates core components such as filter cartridges, pumps, and control boards. The control board houses a silicon controlled rectifier (SCR) element, which precisely adjusts voltage based on sensor signals, ensuring stable operation and reducing energy consumption. However, the SCR generates significant heat during high-frequency operation, causing internal temperatures to rise. Poor heat dissipation can easily lead to overheating. Existing water purifiers, limited by internal space, primarily use air cooling or heat sinks for heat dissipation. Adding a fan would occupy considerable internal space, hindering miniaturization; while heat sinks have limited cooling capacity, and prolonged overheating could shorten the lifespan of the SCR element. Therefore, optimized heat dissipation design is urgently needed. Utility Model Content

[0003] This application aims to improve at least one technical problem in the prior art. Therefore, one objective of this application is to optimize the heat dissipation design of silicon controlled rectifier (SCR) devices.

[0004] The first aspect of this application provides a circuit board structure, which includes an electronic control board, a silicon controlled rectifier (SCR) element, and a heat dissipation assembly; the SCR element is disposed on the electronic control board; the heat dissipation assembly includes a heat sink body, liquid cooling pipes, and a heat-conducting plate, wherein the heat sink body has liquid cooling pipes, the liquid cooling pipes have heat exchange chambers, the heat exchange chambers have openings, the heat-conducting plate covers and is fixed to the openings, and the heat-conducting plate is in contact with at least a portion of the SCR element.

[0005] According to some technical solutions of this application, the liquid cooling pipeline includes an inlet pipe and an outlet pipe, both of which are disposed on the heat dissipation plate. The two ends of the heat exchange cavity are respectively connected to the inlet pipe and the outlet pipe. One end of the inlet pipe is connected to the heat exchange cavity, and the other end is used to connect to the outlet end of the filter element. One end of the outlet pipe is connected to the heat exchange cavity, and the other end is used to connect to the inlet interface of the water circuit board.

[0006] According to some technical solutions of this application, the heat exchange cavity is cylindrical, and the heat exchange cavity, the water inlet pipe, and the water outlet pipe are integrally injection molded.

[0007] According to some technical solutions of this application, the diameter of the liquid cooling pipeline is smaller than the cross-sectional width of the heat exchange cavity.

[0008] According to some technical solutions of this application, the circuit board structure further includes an electrical control box, which is connected to the heat sink. The electrical control board and the thyristor are both disposed in the electrical control box. The electrical control box has a through hole, and the extension end of the heat-conducting plate passes through the through hole and is attached to the thyristor.

[0009] According to some technical solutions of this application, the heat dissipation assembly further includes heat dissipation fins, which are attached and fixed to the side of the heat-conducting plate away from the heat exchange cavity.

[0010] According to some technical solutions of this application, the outer edge of the heat exchange cavity is provided with a plurality of strip columns along the circumferential direction, and a first threaded hole is provided on each of the plurality of strip columns. The heat dissipation fins are provided with a plurality of second mounting holes and a plurality of first screws. The first threaded holes and the second mounting holes correspond to each other, and one end of the first screw passes through the second mounting hole and is fixed to the first threaded hole.

[0011] According to some technical solutions of this application, the thyristor element is fixed to the heat-conducting plate by a second screw.

[0012] According to some technical solutions of this application, the heat-conducting plate is made of stainless steel.

[0013] A second aspect of this application provides a water purifier that includes a circuit board structure as described in any of the preceding technical solutions.

[0014] The circuit board structure provided in this application has at least the following beneficial effects: by attaching the thyristor element to the heat-conducting plate, it helps to conduct the heat generated on the thyristor to the heat-conducting plate. The inner side of the heat-conducting plate comes into contact with the liquid flowing through the cavity and exchanges heat, thereby reducing the temperature of the thyristor and thus maintaining the relative stability of the internal temperature of the water purifier. At the same time, the heat dissipation component has a compact structure, which effectively saves the assembly space inside the water purifier. Attached Figure Description

[0015] Figure 1 A three-dimensional structural diagram of the circuit board structure provided in the embodiments of this application;

[0016] Figure 2 A structural diagram of a circuit board structure provided in an embodiment of this application;

[0017] Figure 3 This is a three-dimensional structural diagram of the circuit board structure provided in the embodiments of this application;

[0018] Figure 4 This is a structural diagram of the circuit board structure provided in an embodiment of this application from another perspective;

[0019] Figure 5 This is a three-dimensional structural diagram of a water purifier provided in an embodiment of this application.

[0020] In the attached diagram: 100 - Electrical control board; 200 - Silicon control unit; 300 - Heat dissipation assembly; 310 - Heat dissipation plate; 400 - Electrical control box; 320 - Liquid cooling pipeline; 321 - Water inlet pipe; 322 - Water outlet pipe; 330 - Heat conduction plate; 350 - Heat dissipation fins; 351 - Second mounting hole; 360 - Heat exchange chamber; 370 - Strip column; 401 - Through hole. Detailed Implementation

[0021] The embodiments of this application are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application.

[0022] In the description of this application, it should be understood that the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Regarding directional descriptions, such as "up," "down," "front," "back," "left," and "right," the directions or positional relationships indicated are based on the directions or positional relationships shown in the accompanying drawings and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation; therefore, they should not be construed as limitations on this application. In the description of this utility model, unless otherwise expressly limited, terms such as "set," "install," and "connect" should be interpreted broadly, and those skilled in the art can reasonably determine the specific meaning of the above terms in this utility model in conjunction with the specific content of the technical solution.

[0023] The following is combined Figures 1 to 5 The embodiments of this utility model are described below.

[0024] The first aspect of this application provides a circuit board structure, which includes an electronic control board 100, a silicon controlled rectifier (SCR) element 200 and a heat dissipation assembly 300, wherein the SCR element 200 is fixedly disposed on the electronic control board 100.

[0025] The heat dissipation assembly 300 includes a heat sink 310, a liquid cooling pipe 320, and a heat conduction plate 330. The heat sink 310 is provided with a liquid cooling pipe 320, and a heat exchange chamber 360 is provided on the liquid cooling pipe 320. The heat exchange chamber 360 has an opening, and the heat conduction plate 330 covers and seals the opening. The heat conduction plate 330 is in contact with at least a portion of the thyristor element 200, and the heat conduction plate 330 directly contacts the thyristor element 200, thus shortening the heat conduction path.

[0026] Therefore, by closely attaching the heat dissipation fins to the controller, the heat generated on the SCR is effectively conducted to the heat conduction plate 330. The inner side of the heat conduction plate 330 can come into contact with the liquid flowing through the cavity, exchanging heat and thus reducing the temperature of the SCR, thereby maintaining a relatively stable internal temperature of the water purifier. At the same time, the overall structure of the heat dissipation component 300 is compact, effectively saving assembly space inside the water purifier.

[0027] Specifically, the liquid cooling pipeline 320 includes an inlet pipe 321 and an outlet pipe 322, both of which are mounted on the heat dissipation plate 310. The two ends of the heat exchange cavity 360 are connected to the inlet pipe 321 and the outlet pipe 322, respectively. When the thyristor element 200 operates, it generates heat. This heat is conducted through the heat-conducting plate 330 in close contact with the liquid, and then transferred to the heat exchange cavity 360. The flowing liquid in the inlet pipe 321 absorbs heat through the heat exchange cavity 360, undergoes heat exchange within the cavity, and is then discharged from the outlet pipe 322, achieving the effect of heat exchange using liquid flow. In actual assembly, one end of the inlet pipe 321 is connected to the heat exchange cavity 360, and the other end is connected to the outlet end of the filter element; one end of the outlet pipe 322 is connected to the heat exchange cavity 360, and the other end is connected to the inlet interface of the water circuit board. This allows for the introduction of filtered water pipes without the need for additional liquid cooling pipes 320 or a coolant system, further saving internal space in the water purifier.

[0028] In some embodiments, the heat exchange chamber 360 is cylindrical. Liquid flows into the cylindrical heat exchange chamber 360 from the inlet pipe 321, flows evenly along the annular path, absorbs the heat transferred by the heat-conducting plate 330, and then flows out from the outlet pipe 322. Furthermore, the heat exchange chamber 360, the inlet pipe 321, and the outlet pipe 322 are integrally injection molded, resulting in good overall sealing of the heat sink body 310, avoiding the need for a multi-pipe split structure to occupy internal space and preventing liquid leakage at the joints.

[0029] Due to the limited internal space of the water purifier, in some embodiments, the diameter of the liquid cooling pipe 320 is smaller than the cross-sectional width of the heat exchange chamber 360, so that after absorbing heat, it flows out through the narrower outlet pipe 322. This increases the contact area between the liquid and the heat-conducting plate 330 through the larger cross-section heat exchange chamber 360, prolongs the residence time of the liquid in the heat exchange chamber 360, makes the heat exchange more complete, and further enhances the heat exchange efficiency.

[0030] In some embodiments, the circuit board structure further includes an electrical control box 400, which is connected to the heat sink 310. Both the electrical control board 100 and the silicon controlled rectifier (SCR) element 200 are housed within the electrical control box 400, protecting the components from interference from the external environment or other parts. The electrical control box 400 has a through-hole 401, through which the extension end of the heat-conducting plate 330 passes and is attached to the SCR element 200. Thus, the heat generated by the SCR element 200 during operation within the electrical control box 400 is directly conducted to the heat dissipation assembly 300 via the extension end of the heat-conducting plate 330 passing through the through-hole 401 in the electrical control board 100. The heat is then dissipated through the liquid cooling pipe 320 or the heat dissipation fins 350. Simultaneously, the integrated design of the heat dissipation assembly 300 and the electrical control board 100 saves internal space in the water purifier and facilitates initial assembly and subsequent maintenance.

[0031] To further improve heat dissipation, in some embodiments, the heat dissipation assembly 300 further includes heat dissipation fins 350, which are attached and fixed to the side of the heat-conducting plate 330 away from the heat exchange cavity 360. The heat-conducting plate 330 conducts heat from the thyristor to the heat dissipation fins 350, exchanging heat with the liquid cooling pipe 320 on one side, and further dissipating heat through air convection via the heat dissipation fins 350 on the other side, thus forming a dual heat dissipation path and further improving heat dissipation efficiency.

[0032] Furthermore, the outer edge of the heat exchange cavity 360 is provided with multiple strip-shaped pillars 370 along the circumferential direction. Each of the strip-shaped pillars 370 has a first threaded hole. The heat dissipation fins 350 have multiple second mounting holes 351 and multiple first screws. The first threaded holes and second mounting holes 351 correspond to each other. One end of the first screw passes through the second mounting hole 351 and is fixed to the first threaded hole. The heat dissipation fins 350 are fixed to the first threaded holes on the strip-shaped pillars 370 by screws passing through the second mounting holes 351, ensuring a tight fit between the fins and the heat-conducting plate 330, reducing contact gaps, and allowing heat to be smoothly conducted to the heat dissipation fins 350 through the contact surface.

[0033] Traditional pressing or gluing methods may loosen and detach over time, leading to poor contact between the SCR element 200 and the heat-conducting plate 330, thus affecting heat dissipation. Therefore, in some embodiments, the SCR element 200 and the heat-conducting plate 330 are provided with corresponding mounting holes to allow for screw fixation. Screw fixation ensures tight contact between the SCR element 200 and the heat-conducting plate 330, preventing displacement of the SCR element 200 due to vibration and thus ensuring heat dissipation stability; it also facilitates assembly and disassembly. Furthermore, thermal grease can be filled between the SCR element 200 and the heat-conducting plate 330 to further improve thermal conductivity.

[0034] Optionally, the heat-conducting plate 330 is made of stainless steel. The stainless steel heat-conducting plate 330 quickly absorbs the heat from the silicon controlled rectifier and conducts it to the liquid cooling pipes 320 and the heat sink fins 350, while also preventing liquid corrosion during long-term use.

[0035] This application also provides a water purifier that includes the circuit board structure described above. Figure 5 In the water purifier shown, the circuit board structure is installed inside the water purifier. The circuit board structure realizes the functions of the circuit board. By utilizing the structural characteristics of the circuit board structure, the heat dissipation component 300 and the electronic control board 100 are integrated into the design, which not only improves the heat dissipation efficiency of the thyristor element 200, but also saves the internal assembly space of the water purifier.

[0036] Furthermore, certain terms in this specification have been used to describe embodiments of this specification. For example, "an embodiment," "an embodiment," and / or "some embodiments" mean that a particular feature, structure, or characteristic described in connection with that embodiment may be included in at least one embodiment of this specification. Therefore, it is to be emphasized and understood that two or more references to "an embodiment" or "an embodiment" in various parts of this specification do not necessarily refer to the same embodiment. Moreover, specific features, structures, or characteristics may be appropriately combined in one or more embodiments of this specification.

[0037] The preferred embodiments of this application have been described in detail above, but this application is not limited to the embodiments described. Without departing from the spirit and scope of this specification, those skilled in the art can make equivalent modifications or alternative configurations based on the embodiments in this specification to implement the application in this specification. These equivalent modifications or alternatives are all included within the scope defined by the claims of this application.

Claims

1. A circuit board structure, characterized in that: include: Electronic control board (100); A silicon controlled rectifier (SCR) element (200) is disposed on the electronic control board (100); A heat dissipation assembly (300) includes a heat sink body (310), a liquid cooling pipe (320), and a heat-conducting plate (330). The heat sink body (310) is provided with a liquid cooling pipe (320), and a heat exchange chamber (360) is provided on the liquid cooling pipe (320). The heat exchange chamber (360) is provided with an opening, and the heat-conducting plate (330) covers and is fixed on the opening. The heat-conducting plate (330) is in contact with at least a portion of the thyristor element (200).

2. The circuit board structure according to claim 1, characterized in that: The liquid cooling pipeline (320) includes an inlet pipe (321) and an outlet pipe (322). Both the inlet pipe (321) and the outlet pipe (322) are located on the heat dissipation plate (310). One end of the inlet pipe (321) is connected to the heat exchange chamber (360), and the other end is connected to the outlet end of the filter element. One end of the outlet pipe (322) is connected to the heat exchange chamber (360), and the other end is connected to the inlet interface of the water circuit board.

3. The circuit board structure according to claim 2, characterized in that: The heat exchange chamber (360) is cylindrical, and the heat exchange chamber (360), the water inlet pipe (321), and the water outlet pipe (322) are integrally injection molded.

4. The circuit board structure according to claim 1, characterized in that: The diameter of the liquid cooling pipe (320) is smaller than the cross-sectional width of the heat exchange cavity (360).

5. The circuit board structure according to claim 1, characterized in that: It also includes an electrical control box (400), which is connected to the heat sink (310). The electrical control board (100) and the thyristor element (200) are both disposed in the electrical control box (400). The electrical control box (400) has a through hole (401), and the extension end of the heat-conducting plate (330) passes through the through hole (401) and is attached to the thyristor element (200).

6. The circuit board structure according to claim 1, characterized in that: The heat dissipation assembly (300) further includes heat dissipation fins (350), which are attached and fixed to the side of the heat-conducting plate (330) away from the heat exchange cavity (360).

7. The circuit board structure according to claim 6, characterized in that: The heat exchange cavity (360) has a plurality of strip columns (370) arranged circumferentially on its outer edge. Each of the plurality of strip columns (370) has a first threaded hole. The heat dissipation fins (350) have a plurality of second mounting holes (351) and a plurality of first screws. The first threaded holes and the second mounting holes (351) correspond to each other. One end of the first screw passes through the second mounting hole (351) and is fixed to the first threaded hole.

8. The circuit board structure according to claim 1, characterized in that: The thyristor element (200) is fixed to the heat-conducting plate (330) by a second screw.

9. The circuit board structure according to claim 1, characterized in that: The heat-conducting plate (330) is made of stainless steel.

10. A water purifier, characterized in that: It includes the circuit board structure as described in any one of claims 1-9.

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