A shielding cover considering radio frequency signal isolation and chip heat dissipation

Abstract

This utility model discloses a shielding cover that combines radio frequency signal isolation and chip heat dissipation, applicable in the field of shielding covers. It includes a lower shielding cover, with an upper shielding cover on top of the lower shielding cover. An radio frequency board is positioned between the lower and upper shielding covers, and a radio frequency interface is mounted on the surface of the radio frequency board. This utility model utilizes both the upper and lower shielding covers as metal materials. The upper shielding cover is designed with heat-conducting protrusions based on the location and size of the heat-generating chip, which contact the chip to conduct heat to the shielding cover for heat dissipation. This achieves good heat dissipation, ensuring chip stability. The structure is simple and easy to use. By pressing the pressing head, the pressing rod moves the trapezoidal groove, causing a steel ball to enter the groove and disengage from the locking slot, opening the shielding cover. This facilitates the disassembly and assembly of the upper and lower shielding covers, making maintenance convenient.

Description

Technical Field

[0001] This utility model relates to the field of shielding covers, and in particular to a shielding cover that combines radio frequency signal isolation and chip heat dissipation. Background Technology

[0002] A search of Chinese patents revealed publication number CN212064680U, which describes a heat dissipation shield and electronic device. The heat dissipation shield includes a first shielding member, a support member connecting the first shielding member, a coolant, and a second shielding member. The first shielding member has a first receiving groove along its axial direction for containing the coolant. The support member is disposed along the periphery of the first shielding member and extends along its axial direction. The second shielding member connects to the first shielding member and seals the first receiving groove. This heat dissipation shield integrates shielding and heat dissipation functions by having a first receiving groove in the first shielding member for containing the coolant, and a second shielding member sealing the first receiving groove, thus reducing space occupation. Furthermore, it reduces the impact of contact gaps between different media on heat dissipation, improving heat dissipation efficiency.

[0003] Existing shielding covers have poor heat dissipation performance. Similar products on the market are separate radio frequency signal isolation cavities, with the chip dissipating heat through air conduction or other means. These structures are complex and inconvenient to use. To solve the above problems, we propose a shielding cover that combines radio frequency signal isolation and chip heat dissipation. Utility Model Content

[0004] The purpose of this invention is to provide a shielding cover that combines radio frequency signal isolation and chip heat dissipation. Its advantages are good heat dissipation and simple structure.

[0005] The above-mentioned technical objective of this utility model is achieved through the following technical solution: a shielding cover that takes into account both radio frequency signal isolation and chip heat dissipation, including a lower shielding cover, an upper shielding cover being provided on the top of the lower shielding cover, an radio frequency board being provided between the lower shielding cover and the lower shielding cover, a radio frequency interface being installed on the surface of the radio frequency board, a copper strip being provided on the surface of the radio frequency board, a heat-conducting protrusion being integrally formed on the inner wall of the upper shielding cover, and a shielding cavity being provided on the inner wall of the upper shielding cover.

[0006] By adopting the above technical solution, both the upper and lower shields are made of metal. The upper shield is designed with heat-conducting protrusions according to the location and size of the heat-generating chip, and these protrusions contact the chip to conduct the heat from the chip to the shield for heat dissipation. This method can achieve good heat dissipation, ensure the stability of the chip, and is simple in structure and easy to use.

[0007] The present invention is further configured such that: a fixing pin is provided through the inner wall of the upper shield and the lower shield; a pressing rod is slidably sleeved on the inner wall of the fixing pin; a spring is provided between one end of the pressing rod and the inner wall of the fixing pin; a trapezoidal groove is provided on the surface of the pressing rod; a steel ball is provided on the inner wall of the fixing pin; and a snap-fit ​​groove is provided on the inner wall of the lower shield, and the snap-fit ​​groove snaps into the steel ball.

[0008] Using the above technical solution, pressing the pressing head causes the pressing rod to move the trapezoidal groove. The movement of the trapezoidal groove causes the steel ball to enter the trapezoidal groove and disengage from the locking groove, opening the shielding cover. This facilitates the disassembly and assembly of the upper and lower shielding covers and makes maintenance convenient.

[0009] The present invention is further configured such that: a snap-fit ​​rod is bolted to the inner wall of the upper shielding cover, and a fixing groove is bolted to the surface of the radio frequency board, and the snap-fit ​​rod is snapped into the fixing groove.

[0010] By adopting the above technical solution, and by setting up the card connector and fixing slot, the chip on the RF board is made in close contact with the heat-conducting protrusion, thus ensuring the heat dissipation effect.

[0011] The present invention is further configured such that: a male fixing rod is bolted to the inner wall of the upper shielding cover, and a female fixing rod is bolted to the inner wall of the lower shielding cover, and the female fixing rod is through the radio frequency board, and the female fixing rod and the male fixing rod are slidably sleeved together.

[0012] By adopting the above technical solution, the RF board is fixed by setting male and female fixing rods to prevent it from shifting and improve stability.

[0013] The present invention is further provided with sealing gaskets on the surface of the copper strip and the bottom of the radio frequency board.

[0014] By adopting the above technical solution, the sealing performance is improved by setting a sealing gasket.

[0015] The present invention is further configured such that: heat dissipation fins are integrally formed on the surface of the upper shielding cover.

[0016] By adopting the above technical solution and setting heat dissipation fins, the heat dissipation effect is improved.

[0017] The present invention is further configured such that: a pressing head is bolted to the top of the pressing rod, and the pressing head is slidably sleeved with the inner wall of the fixing pin.

[0018] By adopting the above technical solution, the pressing head is set to facilitate the movement of the pressing rod.

[0019] The present invention is further configured such that thermal grease is disposed between the thermally conductive protrusion and the chip on the radio frequency board.

[0020] By adopting the above technical solution, the heat transfer efficiency between the chip and the thermal bumps is improved by applying thermal grease, thereby enhancing the heat dissipation effect.

[0021] In summary, this utility model has the following beneficial effects:

[0022] 1. This utility model uses metal for both the upper and lower shielding covers. The upper shielding cover is designed with heat-conducting protrusions according to the position and size of the heat-generating chip, and contacts the chip to conduct the heat of the chip to the shielding cover for heat dissipation. This method can achieve good heat dissipation, ensure the stability of the chip, and has a simple structure that is easy to use.

[0023] 2. This utility model uses the pressing head to move the pressing rod, which in turn moves the trapezoidal groove. The movement of the trapezoidal groove causes the steel ball to enter the trapezoidal groove and disengage from the locking groove, thus opening the shielding cover. This facilitates the disassembly and assembly of the upper and lower shielding covers and makes maintenance convenient. Attached Figure Description

[0024] Figure 1 This is a three-dimensional structural view of the present invention;

[0025] Figure 2 This is a cross-sectional view of the structure of this utility model;

[0026] Figure 3 This is a partial three-dimensional structural view of the present invention;

[0027] Figure 4 This is a partial three-dimensional structural view of the present invention;

[0028] Figure 5 This is a utility model Figure 2 Enlarged view of the structure at point A in the middle.

[0029] Reference numerals: 1. Lower shielding cover; 2. Upper shielding cover; 3. RF board; 4. RF interface; 5. Copper strip; 6. Thermally conductive protrusion; 7. Fixing pin; 8. Pressing rod; 9. Spring; 10. Trapezoidal groove; 11. Steel ball; 12. Snap-fit ​​groove; 13. Snap-fit ​​rod; 14. Fixing groove; 15. Male fixing rod; 16. Female fixing rod; 17. Sealing gasket; 18. Heat dissipation fins; 19. Pressing head; 20. Thermal grease; 21. Shielding cavity. Detailed Implementation

[0030] The present invention will be further described in detail below with reference to the accompanying drawings. Example 1:

[0031] refer to Figure 1 , Figure 2 , Figure 3 and Figure 4A shielding cover that combines radio frequency signal isolation and chip heat dissipation includes a lower shielding cover 1, an upper shielding cover 2 on top of the lower shielding cover 1, an radio frequency board 3 between the lower shielding cover 1 and the upper shielding cover 2, a radio frequency interface 4 mounted on the surface of the radio frequency board 3, a copper strip 5 on the surface of the radio frequency board 3, and a thermally conductive protrusion 6 integrally formed on the inner wall of the upper shielding cover 2. The inner wall of the upper shielding cover 2 is provided with a shielding cavity 21. Since both the upper shielding cover 2 and the lower shielding cover 1 are made of metal, and the upper shielding cover 2 is designed with thermally conductive protrusions 6 according to the position and size of the heat-generating chip, and contacts the chip, the heat of the chip is conducted to the shielding cover for heat dissipation. This method can achieve good heat dissipation effect, ensure chip stability, and has a simple structure and is easy to use.

[0032] refer to Figure 2 , Figure 3 and Figure 4 The inner wall of the upper shield 2 is bolted with a snap-fit ​​rod 13, and the surface of the RF board 3 is bolted with a fixing groove 14, and the snap-fit ​​rod 13 is snapped into the fixing groove 14. By setting the snap-fit ​​rod 13 and the fixing groove 14, the chip on the RF board 3 is made to be in close contact with the heat-conducting protrusion 6, so as to ensure the heat dissipation effect.

[0033] refer to Figure 2 , Figure 3 and Figure 4 The inner wall of the upper shield 2 is bolted with a male fixing rod 15, and the inner wall of the lower shield 1 is bolted with a female fixing rod 16. The female fixing rod 16 is inserted through the RF board 3, and the female fixing rod 16 and the male fixing rod 15 are slidably sleeved together. By setting the male fixing rod 15 and the female fixing rod 16, the RF board 3 is fixed to prevent it from shifting and improve stability.

[0034] refer to Figure 1 and Figure 2 The surface of the upper shield 2 is integrally formed with heat dissipation fins 18, which improves the heat dissipation effect.

[0035] refer to Figure 2 Thermal grease 20 is provided between the thermal protrusion 6 and the chip on the RF board 3. By providing thermal grease 20, the heat transfer efficiency between the chip and the thermal protrusion 6 is improved, thereby enhancing the heat dissipation effect. Example 2:

[0036] refer to Figure 1 and Figure 5A fixing pin 7 is provided through the inner wall of the upper shield 2 and the lower shield 1. A pressing rod 8 is slidably sleeved on the inner wall of the fixing pin 7. A spring 9 is provided between one end of the pressing rod 8 and the inner wall of the fixing pin 7. A trapezoidal groove 10 is opened on the surface of the pressing rod 8. A steel ball 11 is provided on the inner wall of the fixing pin 7. A snap-fit ​​groove 12 is opened on the inner wall of the lower shield 1, and the snap-fit ​​groove 12 snaps with the steel ball 11. By pressing the pressing head 19, the pressing rod 8 moves the trapezoidal groove 10. The movement of the trapezoidal groove 10 causes the steel ball 11 to enter the trapezoidal groove 10 and disengage from the snap-fit ​​groove 12, opening the shield. This facilitates the disassembly and assembly of the upper and lower shields 1 and makes maintenance convenient.

[0037] refer to Figure 5 Both the surface of the copper strip 5 and the bottom of the RF board 3 are provided with sealing gaskets 17, which improves the sealing performance.

[0038] refer to Figure 5 A pressing head 19 is bolted to the top of the pressing rod 8, and the pressing head 19 is slidably sleeved with the inner wall of the fixing pin 7. By setting the pressing head 19, it is easy to move the pressing rod 8.

[0039] Brief description of usage: The shielding cover is made of metal and completely covers the entire RF board 3. The shielding cover is effectively grounded through copper strips 5 to reduce external signal interference. The upper shielding cover 2 is designed with shielding cavities 21 according to the position of the RF channels. The shielding structure makes effective contact with the copper strips 5 of the RF board 3, ensuring that the space around each RF channel is surrounded by ground signals, reducing signal interference between channels. The upper shielding cover 2 has thermal protrusions 6 made according to the position and size of the heat-generating chip on the RF board 3. The heat generated by the chip is transferred to the upper shielding cover 2 through the thermal protrusions 6, and then dissipated by the larger metal shielding cover. This achieves good heat dissipation. Pressing the pressing head 19 moves the pressing rod 8, which in turn moves the trapezoidal groove 10. The movement of the trapezoidal groove 10 causes the steel ball 11 to enter the trapezoidal groove 10 and disengage from the locking groove 12. The fixing pin 7 is then pulled out, and the upper shielding cover 2 is opened for maintenance. After maintenance, the upper shielding cover 2 is closed again. Pressing the pressing head 19, the fixing pin 7 is inserted. Once inserted, the pressing head 19 is released, and the pressing rod 8, under the action of the spring 9, causes the trapezoidal groove 10 to return to its original position, allowing the steel ball 11 to engage with the locking groove 12 and secure it. This completes the maintenance, thus facilitating disassembly and assembly and making maintenance convenient.

[0040] This specific embodiment is merely an explanation of the present utility model and is not intended to limit the present utility model. After reading this specification, those skilled in the art can make modifications to this embodiment without contributing any inventive step, but as long as they are within the scope of the claims of the present utility model, they are protected by patent law.

Claims

1. A shielding cover that combines radio frequency signal isolation and chip heat dissipation, comprising a lower shielding cover (1), characterized in that, The top of the lower shield (1) is provided with an upper shield (2), and an RF board (3) is provided between the lower shield (1) and the upper shield (2). An RF interface (4) is installed on the surface of the RF board (3), and a copper strip (5) is provided on the surface of the RF board (3). A heat-conducting protrusion (6) is integrally formed on the inner wall of the upper shield (2), and a shielding cavity (21) is provided on the inner wall of the upper shield (2).

2. The shielding cover that combines radio frequency signal isolation and chip heat dissipation according to claim 1, characterized in that, The inner walls of the upper shield (2) and the lower shield (1) are provided with a fixing pin (7). The inner wall of the fixing pin (7) is slidably sleeved with a pressing rod (8). A spring (9) is provided between one end of the pressing rod (8) and the inner wall of the fixing pin (7). A trapezoidal groove (10) is opened on the surface of the pressing rod (8). A steel ball (11) is provided on the inner wall of the fixing pin (7). A snap-fit ​​groove (12) is opened on the inner wall of the lower shield (1), and the snap-fit ​​groove (12) snaps with the steel ball (11).

3. The shielding cover that combines radio frequency signal isolation and chip heat dissipation according to claim 1, characterized in that, The inner wall of the upper shield (2) is bolted with a snap-fit ​​rod (13), and the surface of the radio frequency board (3) is bolted with a fixing groove (14), and the snap-fit ​​rod (13) is snapped into the fixing groove (14).

4. A shielding cover that combines radio frequency signal isolation and chip heat dissipation according to claim 1, characterized in that, The inner wall of the upper shield (2) is bolted with a male fixing rod (15), and the inner wall of the lower shield (1) is bolted with a female fixing rod (16). The female fixing rod (16) is connected through the radio frequency board (3), and the female fixing rod (16) and the male fixing rod (15) are slidably connected.

5. A shielding cover that combines radio frequency signal isolation and chip heat dissipation according to claim 1, characterized in that, Sealing gaskets (17) are provided on the surface of the copper strip (5) and the bottom of the radio frequency board (3).

6. A shielding cover that combines radio frequency signal isolation and chip heat dissipation according to claim 1, characterized in that, The surface of the upper shield (2) is integrally formed with heat dissipation fins (18).

7. A shielding cover that combines radio frequency signal isolation and chip heat dissipation according to claim 2, characterized in that, The top of the pressing rod (8) is bolted with a pressing head (19), and the pressing head (19) is slidably sleeved with the inner wall of the fixing pin (7).

8. A shielding cover that combines radio frequency signal isolation and chip heat dissipation according to claim 1, characterized in that, Thermal grease (20) is provided between the thermally conductive protrusion (6) and the chip on the radio frequency board (3).

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