A semiconductor chip mounting device

Abstract

This application provides a semiconductor chip mounting apparatus, relating to the field of chip mounting technology. It includes a hollow shaft motor with a hollow shaft and a hollow connecting seat at the bottom end. A connecting tube is located at the bottom end of the hollow connecting seat, and a suction nozzle is connected to the bottom end of the connecting tube. A support member is located at the bottom end of the hollow shaft motor, and a connecting ring is connected to the support member. A ramp is formed at the bottom of the connecting ring, and several air outlets are arranged on the ramp, surrounding the suction nozzle. A cavity communicating with the air outlets is provided within the connecting ring. This application utilizes a second air pipe connector, a cavity, a connecting ring, and air outlets. The second air pipe connector is connected to an existing cooling system via a pipe. The cooling system delivers cold air to the air outlets through the second air pipe connector and the cavity. The cold air is blown from the air outlets onto the semiconductor chip to accelerate the cooling of the semiconductor chip after mounting, reducing the impact of high temperatures on the chip.

Description

Technical Field

[0001] This utility model relates to the field of chip mounting technology, and more specifically, to a semiconductor chip mounting device. Background Technology

[0002] Hot melt mounting is a relatively advanced and efficient semiconductor chip mounting process. It uses a mounting head to pick up the semiconductor chip to be mounted and transfer it onto a substrate, where the chip's leads are fixed with solder to complete the mounting. However, traditional mounting equipment lacks effective cooling methods, forcing the solder on the semiconductor chip leads to rely solely on natural cooling. This natural cooling process is time-consuming, keeping the semiconductor chip at a high temperature for an extended period, which can easily damage it. Therefore, we propose an improvement to this process, namely a semiconductor chip mounting device. Utility Model Content

[0003] This utility model provides a semiconductor chip mounting device, including a hollow shaft motor. The hollow shaft motor has a hollow shaft, and a hollow connecting seat is connected to the bottom end of the hollow shaft. A connecting tube is provided at the bottom end of the hollow connecting seat, and a suction nozzle is connected to the bottom end of the connecting tube.

[0004] A support member is provided at the bottom of the hollow shaft motor. The support member is connected to a connecting ring. A slope is provided at the bottom of the connecting ring. Several air outlets are provided on the slope. The air outlets are arranged around the suction nozzle. A cavity communicating with the air outlets is provided inside the connecting ring. A second air pipe connector connected to the cavity is provided at the top of the connecting ring.

[0005] As a preferred technical solution of this application, a plurality of the air outlets are evenly distributed along the circumferential direction of the slope.

[0006] As a preferred technical solution of this application, the support includes a base that is bolted to the bottom of the hollow shaft motor, a connecting plate that is fixedly connected to the bottom of the base, and the end of the connecting plate away from the base is connected to the top of the connecting ring.

[0007] As a preferred technical solution of this application, a mounting base is fixedly connected to one side of the base, and the mounting base is provided with a plurality of mounting holes.

[0008] As a preferred technical solution of this application, a connector is provided between the hollow connecting seat and the connecting pipe.

[0009] As a preferred technical solution of this application, the connector includes a threaded hole at the bottom of the hollow connector, and an external threaded joint is threadedly connected to the inner wall of the threaded hole. The bottom end of the external threaded joint is fixedly connected to the top end of the connecting pipe.

[0010] As a preferred technical solution of this application, a hexagonal block is fixedly sleeved on the outer surface of the external threaded connector, and the hexagonal block is located below the hollow connecting seat.

[0011] As a preferred technical solution of this application, a sealing ring is fitted on the outer surface of the external threaded connector, and the sealing ring is in contact with the bottom end of the hollow connecting seat.

[0012] As a preferred technical solution of this application, the sealing ring is made of fluororubber and has a circular cross-section.

[0013] As a preferred technical solution of this application, the top end of the hollow shaft is connected to a first air pipe connector via a sealed bearing.

[0014] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0015] In the scheme of this application:

[0016] This application incorporates a second air pipe connector, a cavity, a connecting ring, and an air outlet. The second air pipe connector is connected to an existing cooling device via a pipe. The cooling device delivers cold air to the air outlet through the second air pipe connector and the cavity. The cold air is then blown from the air outlet onto the semiconductor chip to accelerate the cooling of the semiconductor chip after mounting and reduce the impact of high temperatures on the chip. Attached Figure Description

[0017] Figure 1 A schematic diagram of the semiconductor chip mounting apparatus provided in this application;

[0018] Figure 2 A bottom view of the semiconductor chip mounting apparatus provided in this application;

[0019] Figure 3 This is a schematic diagram of the structure of the threaded hole provided in this application;

[0020] Figure 4 A schematic diagram of the air outlet provided in this application;

[0021] Figure 5 This is a schematic diagram of the sealing ring provided in this application.

[0022] The image shows:

[0023] 1. Hollow shaft motor; 101. Hollow connecting seat; 102. Threaded hole; 103. External threaded connector; 104. Connecting pipe; 105. Suction nozzle; 106. Hexagonal block; 107. Sealing ring; 108. First air pipe connector; 2. Base; 201. Connecting plate; 202. Connecting ring; 203. Second air pipe connector; 204. Ramp; 205. Air outlet; 206. Mounting seat. Detailed Implementation

[0024] To enable those skilled in the art to better understand the present invention, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort should fall within the protection scope of the present invention.

[0025] It should be noted that, unless otherwise specified, the embodiments and features and technical solutions in the present invention can be combined with each other.

[0026] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0027] For an example, please refer to... Figures 1-5 A semiconductor chip mounting device includes a hollow shaft motor 1, which has a hollow shaft and a hollow connecting seat 101 connected to the bottom end of the hollow shaft. A connecting tube 104 is provided at the bottom end of the hollow connecting seat 101, and a suction nozzle 105 is connected to the bottom end of the connecting tube 104. The hollow shaft motor 1 is an existing component, and its specific structure and principle are existing technologies, which will not be described in detail in this application.

[0028] A support member is provided at the bottom of the hollow shaft motor 1. The support member is connected to a connecting ring 202. A ramp 204 is provided at the bottom of the connecting ring 202. Several air outlets 205 are provided on the ramp 204. The air outlets 205 are arranged around the suction nozzle 105. A cavity communicating with the air outlets 205 is provided inside the connecting ring 202. A second air pipe connector 203 connected to the cavity is provided at the top of the connecting ring 202. The second air pipe connector 203 is connected to an existing air cooling device through a pipe. The air cooling device delivers cold air to the air outlets 205 through the second air pipe connector 203 and the cavity. The cold air is blown from the air outlets 205 to the semiconductor chip to accelerate the cooling of the semiconductor chip after mounting and reduce the impact of high temperature on the chip. The air cooling device can be an existing air cooler.

[0029] Furthermore, several air outlets 205 are evenly distributed along the circumference of the ramp 204 to improve the uniformity of cooling the semiconductor chip; the number of air outlets 205 is 8-12, and the aperture is 0.5-1mm; the angle between the ramp 204 and the horizontal plane is 30°-60°, so that the cold air is blown specifically towards the main body of the semiconductor chip, rather than directly onto the pins.

[0030] Furthermore, the support includes a base 2 that is bolted to the bottom of the hollow shaft motor 1. A connecting plate 201 is fixedly connected to the bottom of the base 2. The end of the connecting plate 201 away from the base 2 is connected to the top of the connecting ring 202. The connecting plate 201 and the base 2 cooperate with each other to support the connecting ring 202.

[0031] Furthermore, a mounting base 206 is fixedly connected to one side of the base 2. The mounting base 206 is provided with several mounting holes, which are used to cooperate with bolts to fix the mounting base 206 to the existing robot arm so that the robot arm can drive the present application to move.

[0032] Furthermore, a connector is provided between the hollow connector 101 and the connecting pipe 104; the connector includes a threaded hole 102 provided at the bottom end of the hollow connector 101, and an external threaded connector 103 is threadedly connected to the inner wall of the threaded hole 102. The bottom end of the external threaded connector 103 is fixedly connected to the top end of the connecting pipe 104. The connection between the hollow connector 101 and the connecting pipe 104 can be realized through the mutual cooperation of the threaded hole 102 and the external threaded connector 103.

[0033] Furthermore, a hexagonal block 106 is fixedly fitted on the outer surface of the external threaded connector 103, and the hexagonal block 106 is located below the hollow connecting seat 101. The hexagonal block 106 is designed to facilitate the rotation of the external threaded connector 103 using tools such as wrenches.

[0034] Furthermore, a sealing ring 107 is fitted on the outer surface of the external threaded connector 103, and the sealing ring 107 contacts the bottom end of the hollow connecting seat 101; the sealing ring 107 is made of fluororubber, and the cross-section of the sealing ring 107 is circular. The sealing ring 107 is used to improve the sealing performance at the connection between the threaded hole 102 and the external threaded connector 103.

[0035] Furthermore, the top of the hollow shaft is connected to a first air pipe connector 108 via a sealed bearing. The first air pipe connector 108 is used to connect to a vacuum filter, which is connected to a vacuum generator. The vacuum generator is connected to a solenoid valve, which is connected to a filter pressure reducing valve. The filter pressure reducing valve is connected to a compressor. This is prior art and will not be described in detail in this application.

[0036] The connecting plate 201 is welded to the base 2 and the connecting ring 202. The mounting base 206 is welded to the base 2. The second air pipe connector 203 is welded to the connecting ring 202. The hollow connecting seat 101 is welded to the hollow shaft. The external threaded connector 103 is welded to the connecting pipe 104 and the hexagonal block 106. The suction nozzle 105 is encapsulated at the bottom end of the connecting pipe 104 by injection molding. An annular groove is provided on the outer surface of the bottom end of the connecting pipe 104 to increase the stability of the connection with the suction nozzle 105. Adhesive is also provided at the connection between the top of the connecting pipe 104 and the suction nozzle 105 for sealing. The suction nozzle 105 is made of silicone rubber.

[0037] In use, after the mounting base 206 is fixed to the robotic arm, the application is moved by the robotic arm. The semiconductor chip is picked up by the suction nozzle 105 and moved to the mounting area for mounting. After mounting, the cooling equipment delivers cold air to the air outlet 205 through the second air pipe connector 203 and the cavity. The cold air is blown from the air outlet 205 to the semiconductor chip to accelerate the cooling of the semiconductor chip after mounting and reduce the impact of high temperature on the chip.

[0038] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection, an electrical connection, or a connection that allows communication between them; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0039] Obviously, the embodiments described above are only some embodiments of this utility model, not all embodiments. The accompanying drawings show preferred embodiments of this utility model, but do not limit the patent scope of this utility model. This utility model can be implemented in many different forms; rather, the purpose of providing these embodiments is to provide a more thorough and comprehensive understanding of the disclosure of this utility model. Although this utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing specific embodiments, or make equivalent substitutions for some of the technical features. Any equivalent structures made using the content of this utility model specification and drawings, directly or indirectly applied to other related technical fields, are similarly within the patent protection scope of this utility model.

Claims

1. A semiconductor chip mounting apparatus, characterized in that, The device includes a hollow shaft motor (1), which has a hollow shaft and a hollow connecting seat (101) connected to the bottom end of the hollow shaft. A connecting pipe (104) is provided at the bottom end of the hollow connecting seat (101), and a suction nozzle (105) is connected to the bottom end of the connecting pipe (104). The hollow shaft motor (1) is provided with a support member at its bottom end. The support member is connected to a connecting ring (202). The bottom of the connecting ring (202) is provided with a ramp (204). Several air outlets (205) are provided on the ramp (204). Several air outlets (205) are arranged around the suction nozzle (105). The connecting ring (202) is provided with a cavity communicating with the air outlets (205). The top of the connecting ring (202) is provided with a second air pipe connector (203) connected to the cavity.

2. The semiconductor chip mounting apparatus according to claim 1, characterized in that, Several of the air outlets (205) are evenly distributed along the circumference of the slope (204).

3. The semiconductor chip mounting apparatus according to claim 1, characterized in that, The support includes a base (2) that is bolted to the bottom of the hollow shaft motor (1), and a connecting plate (201) is fixedly connected to the bottom of the base (2). The end of the connecting plate (201) away from the base (2) is connected to the top of the connecting ring (202).

4. The semiconductor chip mounting apparatus according to claim 3, characterized in that, A mounting base (206) is fixedly connected to one side of the base (2), and the mounting base (206) is provided with a plurality of mounting holes.

5. The semiconductor chip mounting apparatus according to claim 1, characterized in that, A connector is provided between the hollow connector (101) and the connector (104).

6. The semiconductor chip mounting apparatus according to claim 5, characterized in that, The connector includes a threaded hole (102) at the bottom of the hollow connector (101), and an external threaded connector (103) is threaded to the inner wall of the threaded hole (102). The bottom end of the external threaded connector (103) is fixedly connected to the top end of the connecting pipe (104).

7. The semiconductor chip mounting apparatus according to claim 6, characterized in that, The outer surface of the external threaded connector (103) is fixedly fitted with a hexagonal block (106), and the hexagonal block (106) is located below the hollow connecting seat (101).

8. The semiconductor chip mounting apparatus according to claim 7, characterized in that, The outer surface of the external threaded connector (103) is fitted with a sealing ring (107), and the sealing ring (107) is in contact with the bottom end of the hollow connecting seat (101).

9. The semiconductor chip mounting apparatus according to claim 8, characterized in that, The sealing ring (107) is made of fluororubber and has a circular cross-section.

10. The semiconductor chip mounting apparatus according to claim 1, characterized in that, The top of the hollow shaft is connected to the first air pipe connector (108) via a sealed bearing.

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