Wafer material box and wafer transfer device

Abstract

This application relates to a wafer material box and a wafer handling device. The wafer material box includes: a box body with a support groove, the first end of which has a pick-and-place opening; a blocking member disposed on the box body, the blocking member having multiple vertically distributed stops, and a clearance groove formed between adjacent stops, the two ends of the clearance groove being through; the blocking member is disposed on the box body and can move relative to the box body along the height direction of the box body, at least a portion of the blocking member can protrude from the bottom of the box body and can retract when supported by the working surface, so that the multiple stops or clearance grooves can be directly aligned with the pick-and-place opening. The above-mentioned wafer material box effectively improves the problem of high labor costs caused by multiple round trips during wafer frame transfer, improves the stability of the wafer transfer process, and ensures high efficiency of the wafer transfer process, thereby meeting the higher requirements of the semiconductor processing process.

Description

Technical Field

[0001] This application relates to the field of semiconductor processing technology, and in particular to a wafer material box and wafer handling device. Background Technology

[0002] With the continuous advancement of semiconductor processing technology and the diversification of semiconductor product applications, the requirements for semiconductor processing are becoming increasingly stringent. Wafers are formed after the ingot is separated from the wafer. These wafers are typically fixed to a wafer frame, which provides a gripping surface for workers or clamping mechanisms. This prevents direct contact with the wafer surface and avoids abrasion during wafer transfer.

[0003] In existing technologies, the wafer frame with the wafer fixed is usually moved from the unloading position of the previous process to the next process, and only one wafer can be picked up at a time. This requires multiple round trips to pick up the wafer, resulting in high labor costs. Utility Model Content

[0004] Therefore, it is necessary to provide a wafer material box and a wafer handling device to address the above-mentioned technical problems.

[0005] A wafer material box, comprising:

[0006] The box body is provided with a support groove, and the first end of the support groove is provided with a pick-up and put-out opening;

[0007] The blocking component is provided with multiple vertically distributed stop portions, and a relief groove is formed between adjacent stop portions, with both ends of the relief groove being open.

[0008] The blocking component is disposed on the box body and can move relative to the box body along the height direction of the box body. At least a portion of the blocking component can be exposed at the bottom of the box body and can retract when supported by the working surface, so that the plurality of the stop portions or the relief grooves can be directly opposite the pick-up and put-out port.

[0009] In one embodiment, the wafer material box further includes an elastic element, one end of which is connected to the top of the blocking member, and the other end of which is able to abut against the top of the box body along the height direction of the box body when the blocking member is subjected to the supporting force of the working surface.

[0010] In one embodiment, the housing includes:

[0011] Main body;

[0012] A support member is disposed at the bottom of the main body and can abut against at least a portion of the blocking member.

[0013] At least a portion of the blocking member can be exposed from the supporting member.

[0014] In one embodiment, the housing includes:

[0015] Main body;

[0016] A side limiting member is located on one side of the main body and limits at least a portion of the blocking member between the main body and the side limiting member in the width direction of the box.

[0017] In one embodiment, when the blocking member is not supported by the working surface, the height of the blocking member protruding from the bottom of the box is equal to the height of the opening of the relief groove.

[0018] In one embodiment, the opening height of the support groove is equal to the opening height of the relief groove.

[0019] In one embodiment, there are multiple support grooves, and a support isolation portion is formed between adjacent support grooves. The vertical height of the support isolation portion is equal to the vertical height of the stop portion.

[0020] In one embodiment, the second end of the support groove is a horizontal limiting portion, and the first end and the second end are located on opposite sides of the support groove.

[0021] In one embodiment, the second end of the support groove is also provided with a pick-up and put-out port. The blocking component includes a first blocking component and a second blocking component. The first blocking component is disposed near the first end of the support groove, and the second blocking component is disposed near the second end of the support groove. The first end and the second end are located on opposite sides of the support groove.

[0022] A wafer handling device, comprising:

[0023] Such as the wafer material box mentioned above;

[0024] A clamping mechanism capable of clamping the wafer material box.

[0025] The technical effects of the embodiments provided in this application are as follows:

[0026] In the aforementioned wafer material cassette, during the transfer of wafer frames containing wafers, the wafer material cassette is placed on a worktable. At least a portion of the blocking components located within the cassette, protruding from the bottom of the cassette, retracts under the support force of the working surface on the worktable and moves relative to the cassette along its height. This causes multiple vertically distributed stops or through-holes formed between adjacent stops to follow the movement until the through-holes align with the pick-and-place opening at the first end of the support groove in the cassette, i.e., the pick-and-place opening is open. Multiple wafer frames enter the storage cavity through the pick-and-place opening. When the wafer material cassette carrying the wafer frames is lifted... Then, at least the portion of the blocking component exposed at the bottom of the box moves relative to the box along the height direction of the box under its own gravity until the multiple stops in the blocking component are directly opposite the pick-up and drop-off port opened at the first end of the support groove in the box, i.e. the pick-up and drop-off port is in a closed state. Compared with the method of workers or clamping mechanisms transferring and fixing wafer frames one by one, this effectively improves the problem of high labor costs caused by multiple round trips during the wafer frame transfer process. While improving the stability of the wafer transfer process, it also ensures the high efficiency of the wafer transfer process, thereby meeting the higher requirements of the semiconductor processing process. Attached Figure Description

[0027] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0028] Figure 1 This is a schematic diagram of the structure of a wafer material box in one embodiment;

[0029] Figure 2 This is a rear-view structural diagram of a wafer material box in one embodiment;

[0030] Figure 3 This is a cross-sectional view of a wafer material box in one embodiment;

[0031] Figure 4 This is a schematic diagram of the structure of a wafer material box in one embodiment;

[0032] Figure 5 This is a partial structural schematic diagram of a wafer material box in one embodiment. Detailed Implementation

[0033] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application.

[0034] It should be noted that when a component is referred to as being "fixed to" or "set on" another component, it can be directly on or indirectly on that other component. When a component is referred to as being "connected to" another component, it can be directly connected to or indirectly connected to that other component.

[0035] It should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0036] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0037] Figures 1 to 3 This is a schematic diagram of the structure of a wafer material box in one embodiment.

[0038] In this embodiment, as Figures 1 to 3 As shown, the wafer material box is used to accommodate a wafer frame with wafers fixed on it and to constrain the position of the wafer frame. The wafer material box includes a box body 10, a blocking component 20, an elastic component 30, and a material box gripping component 40. The material box gripping component 40 is disposed on the top of the box body 10.

[0039] The box body 10 is provided with a support groove 110, and the first end of the support groove 110 is provided with a pick-up and put-out opening.

[0040] The housing 10 can be a main structure connected to the blocking member 20 and the cassette gripping member 40, providing support for the blocking member 20 and the cassette gripping member 40, providing accommodating space for the wafer cassette with the wafers fixed, and limiting the position of the blocking member 20. The support grooves 110 can be horizontally distributed along the inner surface of the housing 10 at vertical intervals, providing horizontal support for both sides of the wafer cassette with the wafers fixed, allowing multiple wafer cassettes to be horizontally placed within the housing 10. The cassette gripping member 40 can be a cassette gripping plate or a cassette gripping frame, etc.

[0041] like Figure 3 As shown, the box body 10 also includes a main body 120, a support member 130, and a side limiting member 140. The support member 130 is disposed at the bottom of the main body 120 and can abut against at least a portion of the blocking member 20. At least a portion of the blocking member 20 can be exposed in the support member 130. The side limiting member 140 is located on one side of the main body 120 and limits at least a portion of the blocking member 20 between the main body 120 and the side limiting member 140 in the width direction of the box body 10.

[0042] The main body 120 can be a functional structure connected to the blocking member 20 and the cassette gripping member 40, providing support for the blocking member 20 and the cassette gripping member 40 and providing accommodating space for the wafer frame on which the wafer is fixed. The support member 130 can be a functional structure connected to the bottom of the blocking member 20, the main body 120, and the side limiting member 140, providing support for the blocking member 20, the main body 120, and the side limiting member 140, and allowing at least a portion of the blocking member 20 to be exposed or retracted through the support member 130. The side limiting member 140 can be a functional structure disposed inside the main body 120 and connected to at least a portion of the blocking member 20, and capable of limiting at least a portion of the blocking member 20 along the width direction of the housing 10. Optionally, the main body 120 can be a storage cavity. The support member 130 can be a support base plate with through holes to allow at least a portion of the blocking member 20 to be exposed or retracted through the support member 130. The side limiting component 140 can be a limiting block or a limiting baffle.

[0043] Optionally, the main body 120 includes a material box top plate 1210, a first material box side plate 1220, and a second material box side plate 1230. The first material box side plate 1220 and the second material box side plate 1230 are arranged opposite to each other. The inner walls of the first material box side plate 1220, the second material box side plate 1230, and the material box top plate 1210 are connected to form a storage cavity. The number of support grooves 110 on the first material box side plate 1220 and the second material box side plate 1230 are the same and they are arranged at the same height. A hollow structure is provided between the first material box side plate 1220 and the second material box side plate 1230. The second end of the support groove 110 is a horizontal limiting part, and the first end and the second end are located on opposite sides of the support groove 110.

[0044] Through the combined action of the top plate 1210 of the material box, the first side plate 1220 of the material box, and the second side plate 1230 of the material box in the box body 10, a storage cavity capable of accommodating the wafer frame fixed thereon is formed in the box body 10, while effectively reducing the weight of the box body 10 and achieving a lightweight design of the box body 10. In addition, with the pick-up and drop-out port and the horizontal limiting end in the support groove 110, the wafer frame fixed thereon is put into the box body 10 and its position is constrained, which effectively improves the problem of the wafer frame falling due to uneven force on the box body 10 during the wafer transfer process, thereby improving the stability of the wafer transfer process.

[0045] like Figures 4 to 5 As shown, a blocking member 20 is disposed on the housing 10. The blocking member 20 has multiple vertically distributed stops 210, and a clearance groove 220 is formed between adjacent stops 210, with both ends of the clearance groove 220 being through. The blocking member 20 can move relative to the housing 10 along the height direction. At least a portion of the blocking member 20 can protrude from the bottom of the housing 10 and can retract when supported by the working surface, so that the multiple stops 210 or clearance grooves 220 can be directly aligned with the pick-up / drop-off port. One end of the elastic member 30 is connected to the top of the blocking member 20, and the other end of the elastic member 30 can abut against the top of the housing 10 along the height direction when the blocking member 20 is supported by the working surface.

[0046] The blocking component 20 can be a functional structure connected to the box body 10 and the elastic member 30, capable of smoothly moving relative to the box body 10 along its height direction with the assistance of the elastic member 30, and capable of driving multiple vertically distributed stops 210 or clearance grooves 220 to face the pick-up and put-out opening to adjust the opening and closing state of the pick-up and put-out opening of the support groove 110. The elastic member 30 can be an elastic structure connected to the top plate 1210 of the material box and the blocking component 20, capable of elastically extending and retracting vertically between the top plate 1210 of the material box and the blocking component 20. Optionally, the elastic member 30 can be a spring.

[0047] When the wafer material box is placed on the worktable, at least a portion of the blocking member 20 exposed on the support member 130 abuts against the working surface of the worktable. Under the support of the working surface and the cooperation of the side limiting member 140, the portion of the blocking member 20 located inside the box body 10 and exposed on the support member 130 retracts along the height direction of the box body 10 and moves relative to the box body 10. At the same time, it drives the blocking member 20 connected to one end of the support member 130 to move along with it until multiple vertically distributed stops in the blocking member 20 are reached. The clearance groove 220 between the baffles 210 is directly opposite the pick-and-place port opened at the first end of the support groove 110 provided in the housing 10, that is, the pick-and-place port is in the open state, and multiple wafer frames enter the storage cavity through the pick-and-place port; in addition, when the top of the blocking member 20 is close to the top of the housing 10, one end of the elastic member 30 is subjected to pressure from the blocking member 20, thereby driving the elastic member 30 to perform a compression movement, making the movement of the blocking member 20 along the height direction of the housing 10 smoother and reducing the surface roughness requirements of the housing 10.

[0048] When the wafer material box is lifted, as the support member 130 moves away from the worktable, at least a portion of the blocking member 20, which is retracted into the box body 10, falls along the height direction of the box body 10 under the force of the blocking member 20 and its own weight, and moves relative to the box body 10. That is, at least a portion of the blocking member 20, which is retracted into the box body 10, is exposed again in the support member 130. At the same time, the blocking member 20 connected to one end of the support member 130 moves along with it until the multiple vertically distributed stops 210 in the blocking member 20 are directly opposite the pick-up and drop-off port opened at the first end of the support groove 110 in the box body 10. That is, the pick-up and drop-off port is in a closed state. In addition, when the top of the blocking member 20 moves away from the top of the box body 10, one end of the elastic member 30 is pulled by the blocking member 20, thereby driving the elastic member 30 to extend. This makes the movement of the blocking member 20 along the height direction of the box body 10 smoother and reduces the surface roughness requirements of the box body 10.

[0049] In some application scenarios, the second end of the support groove 110 is also provided with a pick-up and drop-off port. The blocking component 20 includes a first blocking component 20 and a second blocking component 20. The first blocking component 20 is located near the first end of the support groove 110, and the second blocking component 20 is located near the second end of the support groove 110. The first end and the second end are located on opposite sides of the support groove 110. That is, the wafer frame with the wafer fixed can be entered into the housing 10 through the first end of the support groove 110 and the opposite second end. The first blocking component 20 and the second blocking component 20 respectively located near the first end and the second end are used to constrain the position of the wafer frame with the wafer fixed after entering the housing 10. This also effectively improves the problem of the wafer frame falling due to uneven force on the housing 10 during the wafer transfer process, thereby improving the stability of the wafer transfer process.

[0050] It should be noted that the opening height of the relief groove 220 is generally the same as the opening height of the support groove 110. There are multiple support grooves 110, and a support isolation part 150 is formed between adjacent support grooves 110. The vertical height of the support isolation part 150 is equal to the vertical height of the stop part 210. That is, the distance between adjacent relief grooves 220 is the same as the distance between adjacent support grooves 110. However, in some application scenarios, the opening height of the relief groove 220 can be slightly greater than the opening height of the support groove 110, and the height of the stop part 210 can be slightly less than the distance between adjacent support grooves 110, so as to ensure that the wafer frame with the wafer fixed can smoothly enter the housing 10 through the pick-and-place port of the support groove 110.

[0051] This application also provides a wafer handling device, which includes the wafer material box and clamping mechanism in the above embodiments. The clamping mechanism can clamp the wafer material box and drive the wafer material box to move in different processes.

[0052] The division of the various modules in the wafer material box described above is only for illustrative purposes. In other embodiments, the wafer material box can be divided into different modules as needed to complete all or part of the functions of the wafer material box described above.

[0053] The wafer material box and wafer handling device provided in the above embodiments, when transferring wafer frames that fix wafers, the wafer material box is placed on the worktable. At least a portion of the blocking member provided in the box body that is exposed at the bottom of the box body retracts after being supported by the working surface on the worktable and moves relative to the box body along the height direction of the box body. This causes multiple vertically distributed stops provided on the blocking member or clearance grooves formed between adjacent stops and passing through both ends to move along with it until the clearance grooves are directly opposite the pick-and-place port opened at the first end of the support groove provided in the box body, that is, the pick-and-place port is in the open state. Multiple wafer frames enter the storage cavity through the pick-and-place port. When the wafer material box carrying the wafer frames is lifted, At least a portion of the blocking component located at the bottom of the housing moves relative to the housing along its height under its own weight until multiple stops in the blocking component are aligned with the pick-up and drop-off port at the first end of the support groove in the housing, i.e., the pick-up and drop-off port is closed. Compared to the method of workers or clamping mechanisms transferring wafer frames with wafers fixed one by one, this method effectively improves the problem of high labor costs caused by multiple round trips during wafer frame transfer. It improves the stability of the wafer transfer process while ensuring high efficiency, thereby meeting the higher requirements of semiconductor processing. It has significant economic value and practical application value.

[0054] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0055] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A wafer material box, characterized in that, include: The box body is provided with a support groove, and the first end of the support groove is provided with a pick-up and put-out opening; The blocking component is provided with multiple vertically distributed stop portions, and a relief groove is formed between adjacent stop portions, with both ends of the relief groove being open. The blocking member is disposed on the box body and can move relative to the box body along the height direction of the box body. At least a portion of the blocking member can be exposed at the bottom of the box body and can retract when supported by the working surface, so that the plurality of the stop parts or the relief groove can be directly opposite the pick-up and put-out port. An elastic element, one end of which is connected to the top of the blocking component, and the other end of which can abut against the top of the box body along the height direction of the box body when the blocking component is supported by the working surface. When the blocking component is not supported by the working surface, the height of the blocking component protruding from the bottom of the box is equal to the height of the opening of the relief groove.

2. The wafer material box according to claim 1, characterized in that, The housing includes: Main body; A support member is disposed at the bottom of the main body and can abut against at least a portion of the blocking member. At least a portion of the blocking member can be exposed from the supporting member.

3. The wafer material box according to claim 1, characterized in that, The housing includes: Main body; A side limiting member is located on one side of the main body and limits at least a portion of the blocking member between the main body and the side limiting member in the width direction of the box.

4. The wafer material box according to claim 1, characterized in that, The height of the support groove opening is equal to the height of the relief groove opening.

5. The wafer material box according to claim 1, characterized in that, The number of support grooves is multiple, and a support isolation part is formed between adjacent support grooves. The vertical height of the support isolation part is equal to the vertical height of the stop part.

6. The wafer material box according to claim 1, characterized in that, The second end of the support groove is a horizontal limiting part, and the first end and the second end are located on opposite sides of the support groove.

7. The wafer material box according to claim 1, characterized in that, The second end of the support groove is also provided with a pick-up and put-out port. The blocking component includes a first blocking component and a second blocking component. The first blocking component is disposed near the first end of the support groove, and the second blocking component is disposed near the second end of the support groove. The first end and the second end are located on opposite sides of the support groove.

8. A wafer handling device, characterized in that, include: The wafer material box as described in any one of claims 1 to 7; A clamping mechanism capable of clamping the wafer material box.

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