Micro-channel circulating heat dissipation module for gallium nitride chip packaging

Abstract

This utility model discloses a microchannel circulating heat dissipation module for gallium nitride (GaN) chip packaging. The key technical point is that it belongs to the field of semiconductor chip packaging, including a GaN chip body. A thermally conductive interface material is movably connected to the upper end of the GaN chip body, and a microchannel cooling component is fixedly connected to the outer end of the thermally conductive interface material. By setting the thermally conductive interface material and the microchannel cooling component, when the chip generates a large amount of heat, the thermally conductive interface material can conduct the heat generated by the chip to the microchannel cooling component. The microchannel cooling component, in conjunction with the internal serpentine distributed cooling water ring pipes, conveniently cools the conducted heat. Furthermore, in conjunction with the heat sink, it conducts external heat exchange gas, enabling the GaN chip body to achieve efficient cooling and heat exchange. This effectively absorbs the heat conducted from the chip, thereby quickly removing the heat and ensuring the safe and stable operation of the GaN chip body in a high power density environment, thus improving the heat dissipation effect of the GaN chip body.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor chip packaging, and in particular to a microchannel circulating heat dissipation module for gallium nitride chip packaging. Background Technology

[0002] Gallium nitride (GaN) chips are widely used in high-power electronic devices. GaN chips have high functionality, with high breakdown field strength, high thermal conductivity and high voltage operation capability. Therefore, the stable operation of GaN chips is very important.

[0003] Existing gallium nitride (GaN) chip packaging structures have certain drawbacks. First, during use, GaN chips generate a large amount of heat when operating at high power. If heat dissipation is not efficient, it will seriously affect the stability and lifespan of the device. Traditional heat sinks cannot meet the high-efficiency heat dissipation requirements of GaN chips. Therefore, we propose a microchannel circulating heat dissipation module for GaN chip packaging. Utility Model Content

[0004] To overcome the shortcomings of the existing technology, the purpose of this utility model is to provide a microchannel circulating heat dissipation module for gallium nitride chip packaging. By setting a thermally conductive interface material and a microchannel cooling component, the gallium nitride chip body can achieve efficient cooling and heat exchange, effectively absorb the heat conducted from the chip, and thus quickly remove the heat, thereby ensuring the safe and stable operation of the gallium nitride chip body in a high power density environment and improving the heat dissipation effect of the gallium nitride chip body.

[0005] The above-mentioned technical objective of this utility model is achieved through the following technical solution:

[0006] A microchannel circulating heat dissipation module for gallium nitride (GaN) chip packaging includes a GaN chip body, a thermally conductive interface material movably connected to the upper end of the GaN chip body, a microchannel cooling component fixedly connected to the outer end of the thermally conductive interface material, a cooling water ring pipe provided at the inner bottom end of the microchannel cooling component, flow guide grooves provided at both ends of the microchannel cooling component, a heat sink rotatably connected to the outer side of each flow guide groove, and a temperature sensor movably connected to the outer side of the GaN chip body.

[0007] By installing thermally conductive interface materials and microchannel cooling components, the heat dissipation effect of the gallium nitride chip body can be improved.

[0008] Furthermore, the outer end of the microchannel cooling component is fixedly connected to a sealing cap, the bottom end of the sealing cap is movably connected to a base, and both ends of the base are threadedly connected to positioning components.

[0009] By installing a positioning element, the positioning element can pass through the package cover and connect to the base, making the installation and connection between the package cover and the base convenient.

[0010] Furthermore, a protective seat is installed on the upper end of the base, and a heat-conducting plate is fixedly connected to the inner end of the protective seat.

[0011] By installing heat-conducting plates, the overall heat dissipation effect of the module can be further improved.

[0012] Furthermore, multiple heat dissipation fins are fixedly connected to the bottom end of the base.

[0013] By installing heat dissipation fins, the heat dissipation effect can be improved at the bottom of the base.

[0014] Furthermore, both ends of the encapsulation cover are provided with mounting grooves, and the inner end of the mounting groove is fixedly connected to a mounting bracket.

[0015] By setting up a mounting bracket, the radiator can be installed conveniently and its operation can be stable.

[0016] Furthermore, a storage device is fixedly connected to the top of the encapsulation cover, and a miniature circulation pump is fixedly connected to the outer end of the storage device.

[0017] By installing a storage device with a connecting cap at the top, a certain amount of coolant can be stored inside the storage device. Combined with a micro circulation pump, the transfer of coolant inside the cold water ring pipe can be made more convenient.

[0018] Furthermore, the other end of the micro circulating pump away from the storage tank is connected to a cold water ring pipe. A circulation pipe is fixedly connected to the outer end of the cold water ring pipe, and a cooler is fixedly connected to the other end of the circulation pipe away from the cold water ring pipe. The cooler is connected to the storage tank through a connecting pipe.

[0019] By installing a circulation tube and a cooler, the gallium nitride chip body can achieve efficient circulating cooling.

[0020] Furthermore, a control module is fixedly installed at the upper end of the protective base.

[0021] By installing a control module, the heat dissipation module can be made to operate more conveniently.

[0022] In summary, this utility model has the following beneficial effects:

[0023] 1. By setting a thermally conductive interface material and a microchannel cooling component, when the gallium nitride chip generates a large amount of heat during high-power operation, the thermally conductive interface material of the thermal pad can conduct the heat generated by the chip to the microchannel cooling component. At this time, the microchannel cooling component made of thermally conductive material, together with the internal serpentine distribution of cold water ring pipes, can conveniently cool the heat generated by the gallium nitride chip. In addition, the heat sink conducts external heat exchange gas. The external gas enters the interior of the microchannel cooling component through the guide channel. With the cooling of the cold water ring pipe, the gallium nitride chip can achieve efficient cooling and heat exchange, effectively absorb the heat conducted from the chip, and thus quickly remove the heat, thereby ensuring the safe and stable operation of the gallium nitride chip in a high-power density environment and improving the heat dissipation effect of the gallium nitride chip.

[0024] 2. By setting a heat-conducting sheet, a heat-conducting ceramic material is placed between the base and the gallium nitride chip body. The heat-conducting material is placed at the bottom of the gallium nitride chip body to reduce the contact thermal resistance, thereby improving the efficiency of heat conduction and ensuring that heat is quickly transferred from the chip to the microchannel cooling component, which further improves the overall heat dissipation effect of the module.

[0025] 3. By setting up a circulation pipe and a cooler, when the coolant inside the cold water loop pipe cools for a certain period of time, and the temperature sensor detects that the temperature of the gallium nitride chip body is high, the micro circulation pump is started to allow the cold water loop pipe to transfer the coolant to the cooler for cooling, and then transfer it back to the cold water loop pipe, so that the module can achieve circulating cooling and the gallium nitride chip body can achieve efficient circulating cooling. Attached Figure Description

[0026] Figure 1 This is a schematic diagram of the overall structure in this embodiment;

[0027] Figure 2 This is a structural schematic diagram of the cross-section of the encapsulation cover in this embodiment;

[0028] Figure 3 This is in this embodiment Figure 2 Enlarged structural diagram of the plane at point A in the middle;

[0029] Figure 4 This is in this embodiment Figure 2 A magnified structural diagram of the plane at point B in the middle;

[0030] Figure 5 This is a schematic diagram of the bottom cross-section of the microchannel cooling component in this embodiment.

[0031] In the diagram, 1. Gallium nitride chip body; 2. Package cover; 201. Base; 3. Positioning component; 4. Protective base; 5. Thermal conductive sheet; 6. Heat sink fins; 7. Microchannel cooling component; 8. Thermal interface material; 9. Cooling water loop; 10. Flow channel; 11. Mounting slot; 12. Mounting bracket; 13. Heat sink; 14. Storage device; 15. Micro circulation pump; 16. Circulation pipe; 17. Temperature sensor; 18. Control module; 19. Cooler. Detailed Implementation

[0032] The present invention will be further described in detail below with reference to the accompanying drawings.

[0033] Identical parts are indicated by the same reference numerals. It should be noted that the terms "front," "rear," "left," "right," "up," and "down" used in the following description refer to directions in the accompanying drawings, while the terms "bottom surface," "top surface," "inner," and "outer" refer to directions toward or away from the geometric center of a specific part, respectively.

[0034] Reference Figure 1-5 As shown, a microchannel circulating heat dissipation module for gallium nitride chip packaging is provided in a preferred embodiment of the present invention. It includes a gallium nitride chip body 1, a thermally conductive interface material 8 movably connected to the upper end of the gallium nitride chip body 1, a microchannel cooling component 7 fixedly connected to the outer end of the thermally conductive interface material 8, a cold water ring pipe 9 provided at the bottom of the inner end of the microchannel cooling component 7, a flow guide groove 10 provided at both ends of the microchannel cooling component 7, a heat sink 13 rotatably connected to the outer side of the flow guide groove 10, and a temperature sensor 17 movably connected to the outer side of the gallium nitride chip body 1.

[0035] Reference Figure 1-2 As shown, the outer end of the microchannel cooling component 7 is fixedly connected to a sealing cover 2, the bottom end of the sealing cover 2 is movably connected to a base 201, and both ends of the base 201 are threadedly connected to positioning components 3.

[0036] Reference Figure 2 and Figure 4 As shown, a protective seat 4 is further installed on the upper end of the base 201, and a heat-conducting plate 5 is fixedly connected to the inner end of the protective seat 4.

[0037] Reference Figure 1 As shown, furthermore, multiple heat dissipation fins 6 are fixedly connected to the bottom end of the base 201.

[0038] The thermal interface material 8, installed as a thermal pad, can conduct the heat generated by the chip to the microchannel cooling component 7. At this time, the microchannel cooling component 7, made of thermally conductive material, together with the internal serpentine distribution of cold water ring pipes 9, can conveniently cool the heat generated by the gallium nitride chip body 1. In addition, the heat sink 13 conducts external heat exchange gas. The external gas enters the interior of the microchannel cooling component 7 through the guide channel 10. With the cooling of the cold water ring pipes 9, the gallium nitride chip body 1 can achieve efficient cooling and heat exchange, effectively absorbing the heat conducted from the chip and thus quickly removing the heat. Furthermore, a thermally conductive ceramic sheet 5 is set between the base 201 and the gallium nitride chip body 1. The thermally conductive material at the bottom of the gallium nitride chip body 1 can reduce the contact thermal resistance, thereby improving the efficiency of heat conduction and ensuring that heat is quickly transferred from the chip to the microchannel cooling component 7, thus ensuring the safe and stable operation of the gallium nitride chip body 1 in a high power density environment.

[0039] Reference Figure 1-2 As shown, further, both ends of the encapsulation cover 2 are provided with mounting grooves 11, and the inner end of the mounting groove 11 is fixedly connected to the mounting bracket 12.

[0040] Reference Figure 1-2 As shown, a reservoir 14 is fixedly connected to the top of the encapsulation cover 2, and a micro circulation pump 15 is fixedly connected to the outer end of the reservoir 14.

[0041] Reference Figure 2-5 As shown, further, the other end of the micro circulation pump 15 away from the reservoir 14 is connected to the cold water ring pipe 9. The outer end of the cold water ring pipe 9 is fixedly connected to the circulation pipe 16. The other end of the circulation pipe 16 away from the cold water ring pipe 9 is fixedly connected to the cooler 19. The cooler 19 is connected to the reservoir 14 through a connecting pipe.

[0042] Reference Figure 2 and Figure 4 As shown, a control module 18 is further fixedly installed on the upper end of the protective base 4.

[0043] The storage device 14 has a connecting cover attached to its top. The storage device 14 can store a certain amount of coolant. With the help of the micro circulation pump 15, the coolant can be transferred more easily inside the cold water ring pipe 9. When the coolant inside the cold water ring pipe 9 has been cooled for a certain period of time, and the temperature sensor 17 senses that the temperature of the gallium nitride chip body 1 is high, the micro circulation pump 15 is started so that the coolant can be transferred from the cold water ring pipe 9 to the cooler 19 for cooling. Then, the coolant is transferred from the circulation pipe 16 to the cold water ring pipe 9, so that the module can achieve circulating cooling. When the temperature sensor 17 senses that the temperature of the gallium nitride chip body 1 exceeds the set normal value, the data is transmitted to the control module 18. The control module 18 analyzes the data and, with the help of the heat sink 13 and other heat dissipation components, makes the heat dissipation module more convenient to perform heat dissipation work.

[0044] Specific implementation process: When the gallium nitride chip body 1 generates a large amount of heat energy during high-power operation, the temperature sensor 17 senses that the temperature of the gallium nitride chip body 1 exceeds the set normal value and transmits the data to the control module 18. The control module 18 analyzes the data and then activates heat dissipation components such as the heat sink 13. At this time, the thermal interface material 8 of the thermal pad can conduct the heat energy generated by the chip to the microchannel cooling component 7. The microchannel cooling component 7, made of thermally conductive material, together with the internal serpentine distribution of cold water ring pipes 9, can conveniently cool the heat energy generated by the gallium nitride chip body 1. When the coolant inside the cold water ring pipe 9 has cooled for a certain period of time, the temperature sensor 17 senses... When the temperature of the gallium nitride chip body 1 is high, starting the micro circulation pump 15 allows the cold water ring pipe 9 to transport the cooler 19 for cooling. The cooler 19 is then transported by the circulation pipe 16 to the cold water ring pipe 9, enabling the module to achieve circulating cooling. This allows the gallium nitride chip body 1 to achieve efficient circulating cooling. In addition, the heat sink 13 conducts external heat exchange gas, which enters the microchannel cooling component 7 through the guide channel 10. Combined with the cooling of the cold water ring pipe 9, the gallium nitride chip body 1 can achieve efficient cooling and heat exchange, effectively absorbing the heat conducted from the chip and quickly removing the heat, thereby ensuring the safe and stable operation of the gallium nitride chip body 1 in a high power density environment.

[0045] Furthermore, when the gallium nitride chip body 1 is running, a thermally conductive sheet 5 made of thermally conductive ceramic material is placed between the base 201 and the gallium nitride chip body 1. The thermally conductive material placed at the bottom of the gallium nitride chip body 1 can reduce the contact thermal resistance, thereby improving the efficiency of heat conduction and ensuring that heat is quickly transferred from the chip to the microchannel cooling component 7, further improving the overall heat dissipation effect of the module.

[0046] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of this utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claims. The scope of protection of this utility model is defined by the appended claims and their equivalents.

Claims

1. A microchannel circulating heat dissipation module for gallium nitride chip packaging, characterized in that: The device includes a gallium nitride chip body (1), with a thermal interface material (8) movably connected to the upper end of the gallium nitride chip body (1), a microchannel cooling component (7) fixedly connected to the outer end of the thermal interface material (8), a cold water ring pipe (9) provided at the bottom of the inner end of the microchannel cooling component (7), a flow guide groove (10) provided at both ends of the microchannel cooling component (7), a heat sink (13) rotatably connected to the outer side of the flow guide groove (10), and a temperature sensor (17) movably connected to the outer side of the gallium nitride chip body (1).

2. The microchannel circulating heat dissipation module for gallium nitride chip packaging according to claim 1, characterized in that: The outer end of the microchannel cooling component (7) is fixedly connected to a sealing cover (2), the bottom end of the sealing cover (2) is movably connected to a base (201), and the two ends of the base (201) are threadedly connected to positioning components (3).

3. The microchannel circulating heat dissipation module for gallium nitride chip packaging according to claim 2, characterized in that: A protective seat (4) is installed on the upper end of the base (201), and a heat-conducting plate (5) is fixedly connected to the inner end of the protective seat (4).

4. The microchannel circulating heat dissipation module for gallium nitride chip packaging according to claim 3, characterized in that: The bottom end of the base (201) is fixedly connected with multiple heat dissipation fins (6).

5. A microchannel circulating heat dissipation module for gallium nitride chip packaging according to claim 2, characterized in that: The two ends of the encapsulation cover (2) are provided with mounting grooves (11), and the inner end of the mounting groove (11) is fixedly connected to the mounting bracket (12).

6. A microchannel circulating heat dissipation module for gallium nitride chip packaging according to claim 5, characterized in that: The top of the encapsulation cover (2) is fixedly connected to a reservoir (14), and the outer end of the reservoir (14) is fixedly connected to a micro circulation pump (15).

7. A microchannel circulating heat dissipation module for gallium nitride chip packaging according to claim 6, characterized in that: The other end of the micro circulation pump (15) away from the storage tank (14) is connected to the cold water ring pipe (9). The outer end of the cold water ring pipe (9) is fixedly connected to the circulation pipe (16). The other end of the circulation pipe (16) away from the cold water ring pipe (9) is fixedly connected to the cooler (19). The cooler (19) is connected to the storage tank (14) through a connecting pipe.

8. A microchannel circulating heat dissipation module for gallium nitride chip packaging according to claim 3, characterized in that: A control module (18) is fixedly installed at the upper end of the protective base (4).

Images