A loudspeaker module

Abstract

The utility model discloses a kind of loudspeaker module, including loudspeaker single body and FPC board, and the basin frame of loudspeaker single body is equipped with exposed pad and hot melt column, exposed pad has the first perforation for hot melt column to pass through;FPC board has the second perforation for hot melt column to pass through and the contact pad for contact with exposed pad contact conduction;FPC board is fixed with basin frame by hot melt hot melt column hot melt.This loudspeaker module structure is novel, different from the practice of FPC board and exposed pad welding conduction in prior art, in this loudspeaker module, loudspeaker single body has the hot melt column of through exposed pad, FPC board is fixedly connected with basin frame by hot melt mode, so that the contact pad on FPC board and exposed pad on basin frame realize surface contact and electrically conductive, prevent the problem such as false welding, tin bead caused by welding, improve yield, reduce manufacturing cost;Compared with welding, hot melt connection is more convenient loudspeaker module assembly production, is conducive to improving the production efficiency of loudspeaker module.

Description

Technical Field

[0001] This utility model relates to the field of electroacoustic converter technology, and in particular to a loudspeaker module. Background Technology

[0002] A speaker module includes a module housing and a speaker unit housed within the module housing. The speaker unit's frame has exposed pads electrically connected to the voice coil. In the prior art, speaker modules are generally connected to an external power supply via an FPC board. The FPC board is soldered to the exposed pads for conductivity. However, during the soldering of the FPC board to the exposed pads, problems such as cold solder joints and solder ball explosions occur. Cold solder joints sometimes show no connection abnormalities during factory testing, but open circuits only appear during customer use, leading to customer complaints. Furthermore, solder balls of varying sizes are generally produced during soldering, a phenomenon that has been difficult to completely eliminate. If these scattered solder balls enter the speaker unit, they can cause noise, resulting in yield loss or customer complaints. Utility Model Content

[0003] The technical problem solved by this utility model is to provide a speaker module with a high production yield.

[0004] To solve the above-mentioned technical problems, the technical solution adopted by this utility model is: a loudspeaker module, comprising:

[0005] A loudspeaker unit, wherein the speaker unit has exposed pads and hot melt pillars on its frame, and the exposed pads have a first through hole through which the hot melt pillars pass;

[0006] The FPC board has a second through hole for the hot melt pillar to pass through and contact pads for making contact with the exposed pads;

[0007] The FPC board and the basin frame are fixed together by hot-melt column.

[0008] In one embodiment, the second perforation extends through the contact pad.

[0009] In one embodiment, the first through hole is located near the center of the exposed pad; or, the first through hole is located at the center of the exposed pad.

[0010] In one embodiment, the second through hole is disposed near the center of the contact pad; or, the second through hole is disposed at the center of the contact pad.

[0011] In one embodiment, the basin rack has a retaining wall disposed near the exposed pads, and a receiving gap is formed between the retaining wall and the FPC board.

[0012] In one embodiment, the top surface of the retaining wall is positioned below the top surface of the hot-melt column.

[0013] In one embodiment, the retaining wall is disposed along the edge of the exposed pad.

[0014] In one embodiment, the retaining wall and the basin stand are integrally formed into a single structure.

[0015] In one embodiment, the system further includes a module housing, which includes a module upper shell. The speaker unit is installed inside the module upper shell. The module upper shell has a plurality of positioning posts, and the FPC board has positioning holes that mate with the positioning posts.

[0016] In one embodiment, the module housing further includes a lower module housing that is fixedly connected to the upper module housing.

[0017] The beneficial effects of this utility model are as follows: This speaker module has a novel structure, which is different from the existing technology of welding the FPC board to the exposed pads for conduction. In this speaker module, the speaker unit has a hot melt pillar that penetrates the exposed pads. The FPC board is fixedly connected to the frame by hot melting, so that the contact pads on the FPC board and the exposed pads on the frame can make surface contact and conduct electricity. This effectively eliminates problems such as cold solder joints and solder balls caused by welding, which helps to improve production yield and reduce manufacturing costs. Moreover, compared with welding, hot melting connection is more convenient for the assembly and production of speaker modules, which helps to improve the production efficiency of speaker modules. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0019] Figure 1 This is a schematic diagram of the speaker module according to Embodiment 1 of this utility model;

[0020] Figure 2 This is a cross-sectional view of the speaker module according to Embodiment 1 of this utility model;

[0021] Figure 3 for Figure 2 Enlarged view of point A in the middle.

[0022] Explanation of icon numbers:

[0023] 1. Module upper shell; 11. Positioning pins;

[0024] 2. Speaker driver; 21. Speaker frame; 211. Retaining wall; 212. Receiving gap; 22. Exposed solder pad; 221. First through hole; 23. Hot melt pillar; 231. Mushroom head;

[0025] 3. FPC board; 31. Positioning hole; 32. Second through hole. Detailed Implementation

[0026] The purpose, features, and advantages of this utility model will be further explained in conjunction with the embodiments and with reference to the accompanying drawings.

[0027] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0028] It should be noted that if the embodiments of this utility model involve directional indicators such as up, down, left, right, front, back, etc., the directional indicators are only used to explain the relative positional relationship and movement of the components in a specific posture as shown in the attached figure. If the specific posture changes, the directional indicators will also change accordingly.

[0029] Furthermore, if the embodiments of this utility model involve descriptions such as "first" or "second," such descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features.

[0030] Furthermore, if the meaning of "and / or" appears throughout the text, it refers to three parallel solutions. For example, "and / or" includes solution 1, solution 2, and solution 3, which simultaneously satisfy the above conditions. Additionally, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this utility model.

[0031] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0032] Example 1

[0033] Please refer to Figures 1 to 3 One embodiment of this utility model is as follows: a speaker module includes a module housing, a speaker unit 2, and an FPC board 3. The module housing includes an upper module shell 1, and the speaker unit 2 is installed inside the upper module shell 1. When the speaker module is a semi-cavity module, the entire module housing is the upper module shell 1. When the speaker module is a full-cavity module, the module housing also includes a lower module shell (not shown in the figure) fixedly connected to the upper module shell 1. The lower module shell, the speaker unit 2, and the upper module shell 1 together form the rear sound cavity of the module.

[0034] To facilitate the positioning and installation of the FPC board 3 and the module housing, in this embodiment, the upper housing 1 of the module is provided with a plurality of positioning posts 11, and the FPC board 3 is provided with positioning holes 31 that cooperate with the positioning posts 11.

[0035] The loudspeaker unit 2 includes a frame 21 and a vibrating assembly and a magnetic circuit assembly respectively connected to the frame 21. The vibrating assembly includes a voice coil and a diaphragm assembly connecting the voice coil and the frame 21. The magnetic circuit assembly has a magnetic gap for the voice coil to move. The frame 21 is provided with an exposed solder pad 22 and a hot-melt post 23. The exposed solder pad 22 is electrically connected to the voice coil. The exposed solder pad 22 has a first through hole 221 for the hot-melt post 23 to pass through. The FPC board 3 has a second through hole 32 for the hot-melt post 23 to pass through. And contact pads (not shown in the figure) for contacting and communicating with the exposed pads 22; the FPC board 3 and the frame 21 are fixed by hot-melting the hot-melt pillars 23. Specifically, after the hot-melt pillars 23 are hot-melted, a mushroom head 231 is formed on the side of the FPC board 3 away from the exposed pads 22. The mushroom head 231 limits the FPC board 3, thereby ensuring that the contact pads on the FPC board 3 and the exposed pads 22 on the frame 21 are inseparable, thereby ensuring that the FPC board 3 can achieve stable electrical communication with the voice coil.

[0036] The second perforation 32 penetrates the contact pad, which allows the mushroom head 231 to apply force to the contact pad better, improves the contact pad lifting phenomenon, and helps to improve the stability of electrical conduction between the FPC board 3 and the speaker unit 2.

[0037] In a preferred embodiment, the first through-hole 221 is disposed near the center of the exposed pad 22; or, the first through-hole 221 is disposed at the center of the exposed pad 22. The second through-hole 32 is disposed near the center of the contact pad; or, the second through-hole 32 is disposed at the center of the contact pad.

[0038] The frame 21 has a baffle 211 located near the exposed solder pad 22. A receiving gap 212 is formed between the baffle 211 and the FPC board 3. The receiving gap 212 can contain the excess liquid material generated when the hot melt column 23 is hot melted, thereby ensuring that the liquid material does not flow into the speaker unit 2 and cause noise when the speaker unit 2 is working, which helps to ensure the production yield of the speaker module to a greater extent.

[0039] Preferably, the top surface of the retaining wall 211 is lower than the top surface of the hot-melt column 23, which can effectively prevent the retaining wall 211 from interfering with the hot-melt gun head. In other embodiments, the top surface of the retaining wall 211 may be higher than or flush with the top surface of the hot-melt gun.

[0040] Optional. The retaining wall 211 is provided along the edge of the exposed pad 22.

[0041] To facilitate the processing and manufacturing of the speaker unit 2, it is preferable that the baffle 211 and the frame 21 are integrally formed as a single structure.

[0042] The above are merely optional embodiments of this utility model and do not limit the patent scope of this utility model. Any equivalent structural transformations made based on the inventive concept of this utility model and the contents of this utility model specification and drawings, or direct / indirect applications in other related technical fields, are included within the patent protection scope of this utility model.

Claims

1. A speaker module, characterized in that: include A loudspeaker unit, wherein the speaker unit has exposed pads and hot melt pillars on its frame, and the exposed pads have a first through hole through which the hot melt pillars pass; The FPC board has a second through hole for the hot melt pillar to pass through and contact pads for making contact with the exposed pads; The FPC board and the basin frame are fixed together by hot-melt column.

2. The speaker module according to claim 1, characterized in that: The second perforation extends through the contact pad.

3. The speaker module according to claim 1, characterized in that: The first through hole is located near the center of the exposed pad; or, the first through hole is located at the center of the exposed pad.

4. The speaker module according to claim 1, characterized in that: The second through hole is located near the center of the contact pad; or, the second through hole is located at the center of the contact pad.

5. The speaker module according to claim 1, characterized in that: The basin frame has a retaining wall positioned near the exposed pads, and a receiving gap is formed between the retaining wall and the FPC board.

6. The speaker module according to claim 5, characterized in that: The top surface of the retaining wall is set lower than the top surface of the hot-melt column.

7. The speaker module according to claim 5, characterized in that: The retaining wall is provided along the edge of the exposed pad.

8. The speaker module according to claim 5, characterized in that: The retaining wall and the basin stand are integrally formed into a single structure.

9. The speaker module according to claim 1, characterized in that: It also includes a module housing, which includes a module upper shell. The speaker unit is installed inside the module upper shell. The module upper shell is provided with a plurality of positioning posts, and the FPC board is provided with positioning holes that cooperate with the positioning posts.

10. The speaker module according to claim 9, characterized in that: The module housing also includes a lower module housing that is fixedly connected to the upper module housing.

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