Heat dissipation device, electronic module and energy storage device

The integrated heat-conducting component solves the problems of high thermal resistance and high cost in the heat dissipation structure of the circuit board, achieving more efficient heat dissipation and lower production costs.

CN224356525UActive Publication Date: 2026-06-12ECOFLOW INC
View PDF 0 Cites 0 Cited by

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
ECOFLOW INC
Filing Date
2025-07-04
Publication Date
2026-06-12

AI Technical Summary

⚠Technical Problem

The existing heat dissipation structure of the circuit board consists of two metal blocks of different materials. The connection has high thermal resistance, poor heat dissipation efficiency and high production cost.

⚗Method used

The heat-conducting component is integrally molded and includes a first heat-conducting part and a second heat-conducting part, both of which have circular cross-sections. The first heat-conducting part passes through the circuit board and is thermally connected to the electronic components. The second heat-conducting part is fixed to the circuit board and does not require additional medium connection. The heat-conducting component can be fixed to the heat sink in various ways.

🎯Benefits of technology

It improves thermal conductivity, simplifies the processing technology, reduces production costs, and achieves better heat dissipation.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure CN224356525U_ABST
    Figure CN224356525U_ABST
Patent Text Reader

Abstract

The application provides a heat dissipation device, an electronic module and an energy storage device. The heat dissipation device comprises a heat conduction member, the heat conduction member is integrally formed with a first heat conduction part and a second heat conduction part; the cross sections of the first heat conduction part and the second heat conduction part are circular in a direction perpendicular to a circuit board, and the diameter of the first heat conduction part is smaller than that of the second heat conduction part; the first heat conduction part is arranged in a through hole and is in heat conduction connection with an electronic device; and the second heat conduction part is fixedly connected to the circuit board. The heat conduction member is integrally formed, the heat conduction efficiency is better, the heat dissipation effect is better, the turning processing is easier, the processing mode is simpler, the production manufacturing cost is reduced, and the production benefit is improved.
Need to check novelty before this filing date? Find Prior Art