Power module, electronic device, and vehicle

Abstract

The utility model discloses a kind of power module, electronic equipment and vehicle, the power module includes: power device body;Phase change store, in the first direction of the power module, the phase change store is located in the side of the power device body;The storage space of the phase change store is isolated with the power device body arrangement, and the phase change store is used to accommodate phase change medium.According to the power module of the utility model, phase change store can absorb and store a large amount of heat in short time, heat conduction capacity is higher, improves the short-time overcurrent capacity of power module, reduces temperature peak value, reduces temperature fluctuation, and prolongs the service life of power module.

Description

Technical Field

[0001] This utility model relates to the field of electronic equipment technology, and in particular to a power module, electronic equipment, and vehicle. Background Technology

[0002] When power devices are working, the chip generates heat, which is transferred through the DBC board, substrate, and heat-conducting components, and dissipated in conjunction with active or passive heat dissipation.

[0003] In related technologies, encapsulating power devices with phase change materials (PCMs) can absorb and store a large amount of heat in a short time, improving the short-term overcurrent capability and lifespan of power modules. However, directly encapsulating PCMs with components such as chips, power terminals, and signal terminals of power modules requires that the PCMs themselves be insulating materials. This limits the application of some high-performance PCMs, restricting the selectivity of PCMs. Utility Model Content

[0004] The present invention aims to solve at least one of the technical problems existing in the prior art. Therefore, one objective of the present invention is to provide a power module with a phase change chamber capable of absorbing and storing a large amount of heat in a short time, exhibiting high thermal conductivity, thereby improving the short-term overcurrent capability of the power module, reducing temperature peaks, minimizing temperature fluctuations, and extending the service life of the power module.

[0005] The second objective of this invention is to provide an electronic device employing the aforementioned power module.

[0006] The third objective of this invention is to provide a vehicle that employs the aforementioned power module and electronic equipment.

[0007] A power module according to a first aspect of the present invention includes: a power device body; a phase change chamber, wherein the phase change chamber is disposed on one side of the power device body in a first direction of the power module; the storage space of the phase change chamber is isolated from the power device body, and the phase change chamber is used to contain a phase change medium.

[0008] According to the power module of this utility model embodiment, by setting up a phase change chamber containing a phase change medium, the phase change chamber can quickly function and absorb the heat generated by the chip, preventing partial overheating of the chip due to the inability to absorb heat in time, thus ensuring the working performance and stability of the power module. Moreover, it effectively shortens the heat transfer path and improves the heat exchange efficiency of the power module. Furthermore, by setting up a phase change medium in the storage space, the heat of the power module can be efficiently absorbed and stored. When the power module stops working or operates at low power, the phase change medium releases the absorbed heat, thereby delaying the peak temperature time and reducing the temperature peak, protecting the normal operation of the power module.

[0009] According to some embodiments of the present invention, the phase change chamber includes: a first substrate, which is disposed on the side of the phase change chamber near the power device body in the first direction, and the first substrate is configured as the bottom plate of the phase change chamber.

[0010] According to some embodiments of the present invention, the first substrate is a DBC board.

[0011] According to some embodiments of the present invention, the phase change chamber includes: a housing, which is disposed on the side of the first substrate away from the power device body in the first direction, and the housing is configured as the sidewall of the phase change chamber and surrounds at least a portion of the first substrate to form at least a portion of the phase change chamber.

[0012] According to some embodiments of the present invention, the two ends of the housing are open in the first direction.

[0013] According to some embodiments of the present invention, the corner of the housing has a reinforcing portion, and in the second direction of the power module, the size of the reinforcing portion is larger than the size of the remaining portion of the housing, and the second direction is perpendicular to the first direction; the remaining portion of the housing is the portion of the housing other than the reinforcing portion.

[0014] According to some embodiments of the present invention, the phase change chamber includes: at least one partition, the partition being disposed within the storage space, the partition being used to divide the storage space into multiple sub-storage spaces.

[0015] According to some embodiments of the present invention, at least two of the sub-storage spaces are interconnected.

[0016] According to some embodiments of the present invention, the phase change chamber further includes at least one heat-conducting element disposed within the storage space.

[0017] According to some embodiments of the present invention, there are multiple separators, and the heat-conducting element is provided at the intersection of two adjacent separators.

[0018] According to some embodiments of the present invention, there are multiple heat-conducting elements, and at least one separator is provided between two adjacent heat-conducting elements.

[0019] According to some embodiments of the present invention, the two ends of the separator have gaps with the adjacent components.

[0020] According to some embodiments of the present invention, the gap is D, wherein D satisfies: 0.5mm≤D≤1mm.

[0021] According to some embodiments of the present invention, the power module further includes: a first heat dissipation component, which is disposed on a first side of the phase change chamber away from the power device body.

[0022] According to some embodiments of the present invention, the first heat dissipation component includes: a first heat dissipation body, wherein in the first direction, a first side of the first heat dissipation body facing the phase change chamber can contact the phase change medium.

[0023] According to some embodiments of the present invention, the first heat dissipation component further includes: a first heat dissipation structure, the first heat dissipation structure being disposed on a second side of the first heat dissipation body away from the phase change chamber, the first heat dissipation structure being configured as a first cooling channel for the flow of cooling medium.

[0024] According to some embodiments of the present invention, the power module further includes a second heat dissipation component, which is disposed on a second side of the power device body away from the phase change chamber in the first direction.

[0025] According to some embodiments of the present invention, the second heat dissipation component includes: a second heat dissipation body, wherein in the first direction, a third side of the second heat dissipation body facing the power device body is connected to the power device body.

[0026] According to some embodiments of the present invention, the second heat dissipation component further includes: a second heat dissipation structure, the second heat dissipation structure being disposed on the fourth side of the second heat dissipation body, the second heat dissipation structure being configured as a second cooling channel for the flow of cooling medium.

[0027] According to some embodiments of the present invention, the power device body includes: a second substrate; a power chip disposed between the second substrate and the phase change chamber; and terminals connected to the second substrate and / or the power chip.

[0028] An electronic device according to a second aspect of the present invention includes the power module described in the first aspect of the present invention.

[0029] A vehicle according to a third aspect embodiment of the present invention includes a power module according to the first aspect embodiment described above, or an electronic device according to the second aspect embodiment described above.

[0030] Additional aspects and advantages of this invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0031] The above and / or additional aspects and advantages of this utility model will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which:

[0032] Figure 1 This is an exploded view of a power module according to an embodiment of the present invention;

[0033] Figure 2 This is an exploded view of the power device body of the power module according to an embodiment of the present invention;

[0034] Figure 3 This is a schematic diagram of the phase change chamber of a power module according to an embodiment of the present invention, wherein the phase change medium is not shown;

[0035] Figure 4 This is an exploded view of the phase change chamber according to an embodiment of the present invention;

[0036] Figure 5 This is a schematic diagram of the phase change medium melting and flow in the phase change chamber of a power module according to an embodiment of the present invention.

[0037] Figure 6 This is a schematic diagram of the microscopic unconstrained melting process of a phase change medium according to an embodiment of the present invention;

[0038] Figure 7 This is a schematic diagram of the overall heat conduction of the power module according to an embodiment of the present invention.

[0039] Figure label:

[0040] 100. Phase change chamber;

[0041] 1. Shell; 11. Storage space; 111. Sub-storage space; 12. Reinforcing section;

[0042] 2. Separator; 3. Phase change medium;

[0043] 4. Heat-conducting components; 5. Gap;

[0044] 200. Power module;

[0045] 201, Power device body; 201a, First side surface; 201b, Second side surface;

[0046] 201c, Third side view; 201f, Fourth side view;

[0047] 201d, First side; 201e, Second side;

[0048] 2011, First substrate; 2012, Power chip;

[0049] 2013, terminal; 2014, second substrate;

[0050] 202. First heat dissipation component; 2021. First heat dissipation body;

[0051] 2022, First heat dissipation structure; 2023, First cooling flow channel;

[0052] 203. Second heat dissipation component; 2031. Second heat dissipation body;

[0053] 2032, Second heat dissipation structure; 2033, Second cooling flow channel;

[0054] 204. Heat source; 205. Melting boundary. Detailed Implementation

[0055] The embodiments of this utility model are described in detail below. The embodiments described with reference to the accompanying drawings are exemplary. Figures 1-2 A power module 200 according to an embodiment of the present utility model is described.

[0056] According to the power module 200 of the first aspect embodiment of the present utility model, combined with Figure 1 It includes the power device body 201 and the phase change chamber 100.

[0057] Specifically, combined Figure 1 In the first direction of the power module 200 (i.e., the height direction of the power module 200, such as...) Figure 1 In the direction indicated by the middle arrow A, the phase change chamber 100 is located on one side of the power device body 201. The storage space 11 of the phase change chamber 100 is isolated from the power device body 201, and the phase change chamber 100 is used to contain the phase change medium 3.

[0058] For example, in Figure 1 In the example, the phase change chamber 100 is located in the height direction of the power device body 201 (e.g., Figure 1The upper side (in the direction indicated by the middle arrow A). When the power module 200 is in operation, the power chip 2012 generates a large amount of heat. Therefore, when components such as the power chip 2012 in the power device body 201 generate heat, the phase change chamber 100 can quickly absorb the heat generated by the power chip 2012, preventing partial overheating of the power chip 2012 due to insufficient heat absorption, thus ensuring the working performance and stability of the power module 200. Furthermore, it effectively shortens the heat transfer path and improves the heat exchange efficiency of the power module.

[0059] Reference Figure 1 A storage space 11 is formed on the phase change chamber 100, which can be used to contain the phase change medium 3. With this configuration, by placing the phase change medium 3 in the storage space 11, the phase change medium 3 has a large latent heat space during the melting (phase change) process, which can efficiently absorb and store the heat of the power module 200. When the power module 200 stops working or operates in a low power state, the phase change medium 3 releases the absorbed heat, thereby achieving the effect of delaying the peak temperature time and reducing the temperature peak, protecting the normal operation of the power module 200.

[0060] According to the embodiment of this utility model, the power module 200, by providing a phase change chamber 100 containing a phase change medium 3, can quickly function and absorb the heat generated by the power chip 2012, preventing the power chip 2012 from overheating due to insufficient heat absorption, thus ensuring the working performance and stability of the power module 200. Furthermore, it effectively shortens the heat transfer path and improves the heat exchange efficiency of the power module. In addition, by providing the phase change medium 3 in the storage space 11, the heat of the power module 200 can be efficiently absorbed and stored. When the power module 200 stops working or operates at low power, the phase change medium 3 releases the absorbed heat, thereby delaying the peak temperature time and reducing the temperature peak, protecting the power module 200 for normal operation.

[0061] According to some embodiments of this utility model, combined with Figure 1 and Figure 3 The phase change chamber 100 includes a first substrate 2011. Specifically, in the first direction (e.g., Figure 1 In the direction indicated by the middle arrow A, the first substrate 2011 is disposed on the side of the phase change chamber 100 near the power device body 201, and the first substrate 2011 is constructed as the bottom plate of the phase change chamber 100.

[0062] For example, combining Figure 1 and Figure 3The phase change chamber 100 has a first substrate 2011 at its lowest point in the first direction, serving as the base plate of the phase change chamber 100. This configuration allows the phase change chamber 100 to be directly mounted on the power device body 201 as a separate, complete component, facilitating rapid assembly and use of the power module 200. It also prevents leakage of the liquid phase change medium 3 after heat absorption, thus ensuring the performance stability of the phase change chamber 100. Furthermore, the first substrate 2011, connected to the power device body 201, acts as a heat conductor, helping to optimize the thermal performance of the phase change chamber 100 and improve the heat dissipation of the power module 200. Additionally, the first substrate 2011 also enhances the structural strength of the phase change chamber 100 and reduces the installation difficulty of the power module 200.

[0063] According to some embodiments of the present invention, the first substrate 2011 is a DBC board.

[0064] With this configuration, the ceramic layer of the DBC board (ceramic-based copper-clad laminate) has high thermal conductivity, which can quickly transfer the heat generated during the operation of the power device body 201 to the phase change chamber 100, thereby accelerating the heat dissipation of the power module 200 and contributing to its long-term stable operation. It should be noted that the first substrate 2011 can be part of the power device body 201; that is, the DBC board on the side of the power device body 201 closest to the phase change chamber 100 can serve as the first substrate 2011. Alternatively, the first substrate 2011 can be set independently as a base plate to better meet practical applications.

[0065] According to some embodiments of this utility model, combined with Figure 1 and Figure 3 The phase change chamber 100 includes a shell 1. Specifically, in the first direction (e.g., Figure 1 In the direction indicated by the middle arrow A, the housing 1 is disposed on the side of the first substrate 2011 away from the power device body 201. The housing 1 is constructed as the side wall of the phase change chamber 100 and surrounds at least a portion of the first substrate 2011 to form at least a portion of the phase change chamber 100.

[0066] For example, refer to Figure 3 The housing 1 is disposed on the upper side of the first substrate 2011, on the side of the first substrate 2011 away from the power device body 201. The housing 1 is constructed as the sidewall of the phase change chamber 100, and the housing 1 and the first substrate 2011 together define the storage space 11. This arrangement allows the housing 1 to enclose the external structure of the phase change chamber 100, facilitating the storage of the phase change medium 3. Furthermore, the phase change chamber 100 has a simple structure, making it easy to manufacture, process, and use. For example, the housing 1 can be configured as a cube.

[0067] According to some embodiments of this utility model, combined with Figure 3 and Figure 4 In the first direction (e.g.) Figure 1 In the direction indicated by the middle arrow A, both ends of the casing 1 are open.

[0068] For example, combining Figure 3 and Figure 4 The phase change chamber 100 shell 1 has open ends in the thickness direction at both the top and bottom, making it a non-closed open structure. Combined with... Figure 3 When the phase change chamber 100 is used in the power module 200, the phase change chamber 100 in the height direction (e.g., Figure 1 The upper side of the phase change chamber 100 (in the direction indicated by the middle arrow A) is connected to the first heat dissipation component 202, and the lower side is connected to the second substrate 2014 in the power device body 201 of the power module 200, together defining the storage space 11. The upper side of the housing 1 of the phase change chamber 100 is open, increasing the contact area with the first heat dissipation component 202 and effectively improving the heat dissipation effect. In addition, the lower side of the housing 1 of the phase change chamber 100 is open, and the phase change medium 3 is in direct contact with the second substrate 2014 in the power device body 201 of the power module 200, which helps to quickly conduct the heat generated by the power chip 2012 in the power module 200 to the phase change chamber 100, effectively accelerating the heat conduction rate of the phase change chamber 100, so that the power module 200 can quickly return to the normal operating temperature. In addition, the phase change chamber 100 uses the first heat dissipation component 202 and the second substrate 2014 as the upper and lower packaging, respectively, reducing the use of metal materials and effectively reducing the production cost of the phase change chamber 100.

[0069] According to some embodiments of this utility model, combined with Figure 3 The housing 1 has a reinforcing part 12 at the corner, in the second direction of the power module 200 (e.g., Figure 1 In the direction indicated by arrow B (or perpendicular to the directions indicated by arrows B and A), the size of the reinforcing part 12 is larger than the size of the remaining part of the housing 1, and the second direction is perpendicular to the first direction. The remaining part of the housing 1 is the portion of the housing 1 excluding the reinforcing part 12.

[0070] Specifically, combined Figure 3The width of the four reinforcing portions 12 gradually increases from the corners of the housing 1 towards the center of the housing 1. In other words, the four reinforcing portions 12 extend from the four corners of the housing 1 towards the center of the housing 1, and the width of the reinforcing portions 12 gradually decreases from the inside to the outside of the housing 1. Thus, the four reinforcing portions 12, together with the sidewalls of the phase change chamber 100 and the first substrate 2011, constitute the housing 1, further improving the structural strength of the phase change chamber 100. During the operation of the power module 200, certain stresses are generated inside the housing 1 due to factors such as temperature changes. The reinforcing portions 12 can disperse these stresses, reduce the occurrence of stress concentration, thereby reducing the possibility of cracks or damage to the housing 1 due to excessive stress, improving the stability and reliability of the phase change chamber 100, and extending the service life of the power module 200. In addition, the heat generation in the area of ​​the phase change chamber 100 corresponding to the housing 1 and the reinforcing portions 12 is relatively small, so the influence of the housing 1 and the reinforcing portions 12 on the heat dissipation rate can be ignored.

[0071] According to some embodiments of this utility model, combined with Figure 3 The phase change chamber 100 includes at least one partition 2. Specifically, the partition 2 is disposed within the storage space 11 and is used to divide the storage space 11 into a plurality of sub-storage spaces 111. The term "at least one" means that there is at least one partition 2 in the phase change chamber 100, and there may be multiple partitions.

[0072] For example, in Figure 3 In the example, the storage space 11 is provided with multiple partitions 2, which divide the storage space 11 into multiple sub-storage spaces 111. When there is only one partition 2, the storage space 11 can be divided into two sub-storage spaces 111. With this configuration, the partitions 2 divide the storage space 11 into multiple sub-storage spaces 111, thereby allowing the phase change medium 3 to be placed in each area of ​​the power chip 2012, which is beneficial to improving the heat conduction rate of the phase change chamber 100. In addition, the internal space of the phase change chamber 100 can be used more efficiently, and the phase change medium 3 can be placed more reasonably, thereby improving the utilization rate of the phase change medium 3.

[0073] According to some embodiments of this utility model, combined with Figure 3 At least two sub-storage spaces 111 are interconnected.

[0074] For example, in Figure 3 In the example, the storage space 11 is provided with multiple partitions 2, which divide the storage space 11 into multiple interconnected sub-storage spaces 111. When the phase change medium 3 absorbs heat, it changes from a solid to a liquid state. The liquid phase change medium 3 can flow within each sub-storage space 111, which helps to solve the problem of uneven temperature distribution in the phase change chamber 100 when different areas of the power chip 2012 generate different amounts of heat, thus ensuring the heat absorption effect of the phase change chamber 100. Combined with... Figure 5 For example, when the phase change medium 3 in the three sub-storage spaces 111 located in the lower left region of the phase change chamber 100 absorbs heat and melts into liquid, the liquid phase change medium 3 in the three sub-storage spaces 111 can flow to other areas that have not been completely dissolved in the directions indicated by arrows C, D, and E, respectively, thereby better realizing the connection between multiple sub-storage spaces 111 and making it more conducive to the performance of the phase change chamber 100.

[0075] Based on the characteristics of phase change materials (PCMs), the solid-state thermal conductivity of PCMs is several times, or even ten times, greater than that of their liquid-state counterparts. By arranging the sub-storage spaces 111 as interconnected, when the PCM 3 absorbs heat and gradually transforms from a solid to a liquid state, the liquid PCM 3 can flow and exchange heat within the multiple interconnected sub-storage spaces 111. This ensures that the solid PCM 3 remains in contact with the heat transfer surface, achieving unconstrained melting. This avoids the problem of low thermal conductivity and reduced heat transfer efficiency caused by the solid PCM 3 not being in contact with the heat transfer surface, and also prevents uneven distribution of the cooled solid PCM 3 within the sub-storage spaces 111. In other words, when the PCM 3 in one part of the sub-storage spaces 111 absorbs heat and melts into a liquid, while the PCM 3 in another part of the sub-storage spaces 111 remains in a solid state, the difference in thermal conductivity between the solid and liquid states of the PCM 3 is significant. By setting up multiple interconnected sub-storage spaces 111, the heat conduction capacity of each storage space 11 within the phase change chamber 100 can be made similar, resulting in more uniform heat transfer. This achieves more efficient heat conduction while improving the thermal conductivity of the phase change chamber 100. Moreover, the phase change chamber 100 can absorb and store a large amount of heat in a short time, thereby enhancing its performance.

[0076] Furthermore, the temperature rise and junction temperature fluctuation of the power chip 2012 are key factors affecting the lifespan of the power module 200. When the power module 200 operates at high power, its heat generation exceeds the system's heat dissipation capacity, which can cause failures such as ablation or fire. Therefore, by incorporating the phase change medium 3, the phase change material has a large latent heat space during the melting (phase change) process, which can efficiently absorb and store the heat from the power module 200. When the power module 200 stops working or operates at low power, the phase change material releases the absorbed heat, thereby delaying the peak temperature time and reducing the temperature peak, protecting the power module 200 for normal operation.

[0077] The power module 200 includes power chips 2012, such as those for temperature monitoring, communication transmission, signal conversion, and fault protection. When the phase change chamber 100 is used in the power module 200, the power chips 2012 generate a large amount of heat during operation. The phase change medium 3 within the phase change chamber 100 has a high thermal conductivity, enabling it to rapidly absorb and dissipate heat to the surrounding environment, thus allowing the power chips 2012 to quickly return to their ideal operating temperature. Furthermore, the phase change medium 3 is located within the sub-storage space 111, which corresponds to the location of each power chip 2012 in the power module 200. The phase change medium 3 can quickly absorb the heat generated by the power chips 2012, preventing partial overheating of some power chips 2012 due to insufficient heat absorption, thus ensuring the performance and stability of the power module 200.

[0078] According to some embodiments of this utility model, combined with Figure 3 The phase change chamber 100 also includes at least one heat-conducting element 4. Specifically, the heat-conducting element 4 is disposed within the storage space 11. For example, in Figure 3 In the example, a heat-conducting element 4 is also provided within the storage space 11. The housing 1, the heat-conducting element 4, and the separator 2 together define multiple sub-storage spaces 111. Thus, by providing the heat-conducting element 4, external heat can be transferred to the phase change medium 3. When the phase change chamber 100 is located within the power module 200, the heat-conducting element 4 can serve as a direct heat transfer path from the first substrate 2011 to the first heat dissipation assembly 202, which is more conducive to the heat dissipation of the power module 200. Furthermore, it improves the overall structural strength of the phase change chamber 100, thereby facilitating its long-term stable use.

[0079] According to some embodiments of this utility model, combined with Figure 3 There are multiple partitions 2, and a heat-conducting element 4 is provided at the intersection of two adjacent partitions 2.

[0080] For example, the storage space 11 is provided with multiple partitions 2, and the partitions 2 are located between the heat-conducting element 4 and the inner wall surface of the housing 1, with the heat-conducting element 4 located at the intersection of two adjacent partitions 2. This arrangement, together with the partitions 2, the heat-conducting element 4, and the inner wall surface of the housing 1, divides the storage space 11 into multiple sub-storage spaces 111, allowing the phase change medium 3 to fill the multiple sub-storage spaces 111 and distribute it more evenly. This better aligns it with the position of the power chip 2012, enabling the phase change medium 3 to absorb the heat generated by the power chip 2012 more quickly and accurately during operation, preventing the power chip 2012 from overheating and affecting its lifespan.

[0081] According to some embodiments of this utility model, combined with Figure 3There are multiple heat-conducting components 4, and at least one separator 2 is provided between two adjacent heat-conducting components 4.

[0082] For example, Figure 3 The example shows four heat-conducting elements 4, which are located in the central region of the storage space 11 within the phase change chamber 100. The four heat-conducting elements 4 are arranged in a square shape relative to the inner wall of the housing 1, corresponding to the shape of the housing 1 of the phase change chamber 100. Twelve partitions 2 are provided between the four heat-conducting elements 4, with each partition 2 connected to the heat-conducting elements 4 on both sides. The four heat-conducting elements 4 and the twelve partitions 2 further define the storage space 11 as a uniformly distributed nine-square grid storage space 11, allowing the phase change medium 3 to be filled in multiple sub-storage spaces 111 with a more uniform distribution, better corresponding to the position of the power chip 2012. The twelve partitions 2 are not connected to each other, nor are they connected to the side walls of the housing 1. The partitions 2 divide the storage space 11 within the housing 1 into interconnected sub-storage spaces 111.

[0083] Therefore, the separator 2 and the heat-conducting component 4 evenly divide the storage space 11 of the phase change chamber 100 into multiple sub-storage spaces 111, so that the phase change medium 3 corresponds to the arrangement position of the power chip 2012. The phase change medium 3 can absorb the heat generated by the power chip 2012 more quickly and accurately during operation, preventing the power chip 2012 from overheating and affecting its service life. In addition, the separator 2 and the heat-conducting component 4 are reasonably arranged. When the phase change chamber 100 is used in the power module 200, the separator 2 is opposite to the part of the power module 200 with less heat dissipation requirements. This ensures the heat conduction requirements of the phase change chamber 100 while improving the structural strength of the phase change chamber 100, which is more conducive to the long-term stable use of the phase change chamber 100. In addition, the heat-conducting component 4 has a simple structure, is easy to manufacture and process, has low production difficulty, and high production efficiency.

[0084] It should be noted that the number, placement, and shape of the separators 2 and heat-conducting components 4 can be set according to actual conditions, corresponding to the position of the power chip 2012, thereby achieving the best heat dissipation effect. For example, when the power chip 2012 is in a four-grid format, four separators 2 and one heat-conducting component 4 can be set to divide the storage space 11 into a four-grid format corresponding to the position of the power chip 2012, corresponding to the position of the power chip 2012 on the lower side of the phase change chamber 100, thereby achieving a better heat dissipation effect. It should be noted that there is no power chip 2012 in the power module 200 corresponding to the placement area of ​​the separators 2 and heat-conducting components 4 in the phase change chamber 100, therefore the placement of the separators 2 and heat-conducting components 4 will not affect the heat dissipation effect of the power chip 2012.

[0085] According to some embodiments of this utility model, combined with Figure 3The two ends of the separator 2 have a gap 5 between them and the adjacent components.

[0086] Specifically, combined Figure 3 There is no connection between the separator 2 and the inner wall of the housing 1 and the corresponding heat-conducting component 4, and there is a certain gap 5. It should be noted that the arrangement of the separator 2 is not limited to the above form. It can also be set so that both ends of the separator 2 are connected to the corresponding heat-conducting component 4 and the inner wall of the housing 1 respectively. The separator 2 is provided with through holes (not shown in the figure) to realize the communication between multiple sub-storage spaces 111.

[0087] When the phase change medium 3 absorbs heat, it changes from a solid to a liquid state. The liquid phase change medium 3 can flow within each sub-storage space 111, which helps to solve the problem of uneven temperature distribution in the phase change chamber 100 when different areas of the power chip 2012 generate different amounts of heat, thus ensuring the heat absorption effect of the phase change chamber 100. Figure 5 For example, when the phase change medium 3 in the three sub-storage spaces 111 located in the lower left region of the phase change chamber 100 absorbs heat and melts into liquid, the liquid phase change medium 3 in the three sub-storage spaces 111 can flow to other areas that have not been completely dissolved in the directions indicated by arrows C, D, and E, respectively, thereby better realizing the connection between multiple sub-storage spaces 111 and making it more conducive to the performance of the phase change chamber 100.

[0088] Combination Figure 6 In a microscopic state, when the heat source 204 transfers heat to the phase change medium 3, the part in contact with the heat source 204 begins to liquefy first. As the heat conduction time increases, the melting boundary also advances towards the solid part until the phase change medium 3 completely melts or the heat is completely carried away. When the phase change medium 3 in the sub-storage space 111 separated by the separator 2 and the heat-conducting element 4 absorbs heat and changes from solid to liquid, this part of the liquid phase change medium 3 can flow and exchange between different sub-storage spaces 111 through the gap 5, forming that the solid phase change medium 3 is always in contact with the heat transfer surface, realizing unconstrained melting and avoiding the problems of low thermal conductivity and reduced heat transfer efficiency caused by the solid phase change medium 3 not being in contact with the heat transfer surface.

[0089] According to some embodiments of this utility model, combined with Figure 1 The gap 5 is D, where D satisfies: 0.5mm≤D1≤1mm.

[0090] For example, when the gap 5 is less than 0.5 mm, the phase change medium 3 absorbs heat and transforms from a solid to a liquid state. Since the density of the liquid phase change medium 3 is slightly less than that of the solid phase change medium 3, its volume increases after transforming into a liquid state. The small margin allows for internal pressure increases due to the increased volume. This small margin also prevents uneven solid distribution after cooling, as the phase change chamber 100 cannot maintain a horizontal state under actual operating conditions. The phase change medium 3 requires sufficient space for flow and adjustment. If the gap 5 is too small, it restricts the flow of the liquid phase change medium 3 within each sub-storage space 111, resulting in a slow flow rate. This hinders heat transfer and mass exchange during the phase change process, reducing the heat dissipation effect of the power chip 2012 and causing localized heat accumulation. When the gap 5 is greater than 1 mm, it reduces the structural strength of the phase change chamber 100. Therefore, when the gap 5 is within the aforementioned range, the gap 5 is reasonably set. When the phase change medium 3 absorbs the heat generated during the operation of the power module 200 and transforms from a solid to a liquid state, the liquid phase change medium 3 can flow smoothly within the phase change chamber 100. This ensures the uniformity of heat absorption performance in each region of the phase change medium 3, improves the heat transfer efficiency of the phase change medium 3, keeps the power module 200 within its ideal operating range, and extends the service life of the power module 200. Simultaneously, it also gives the phase change chamber 100 a certain structural strength, which is beneficial for the long-term stable use of the phase change chamber 100.

[0091] According to some embodiments of this utility model, combined with Figure 1 The heat-conducting component 4 includes copper, aluminum, and aluminum alloy components.

[0092] For example, combining Figure 1 The heat-conducting component 4 is a cylindrical copper component. Copper has extremely high thermal conductivity, enabling it to quickly absorb and conduct heat. When the heat-conducting component 4 of the phase change chamber 100 is made of copper, it can rapidly transfer the heat generated by the power chip 2012 on the power module 200 to the phase change medium 3, accelerating the heat absorption process of the phase change medium 3 and efficiently dissipating the heat, thus preventing the power module 200 from experiencing performance degradation or damage due to overheating. Furthermore, the copper component helps reduce the occurrence of localized hot spots in the power module 200, making the surface temperature of the power chip 2012 more uniform, improving the stability of the power chip 2012, and extending its service life. Copper has good mechanical properties, with high strength and toughness, and can withstand certain external forces and thermal stresses, thereby improving the overall structural strength of the phase change chamber 100. During the operation of the power module 200, thermal expansion and contraction occur due to factors such as temperature changes. The copper component can adapt well to these changes, and is less prone to deformation or cracking, ensuring the integrity and stability of the heat conduction path.

[0093] Aluminum components have a high thermal conductivity, enabling them to quickly absorb the heat released or stored by the phase change medium 3, thus improving the heat transfer efficiency of the phase change chamber 100. When the heat-conducting component 4 of the phase change chamber 100 is made of aluminum, it can rapidly transfer the heat generated by the power chip 2012 on the power module 200 to the phase change medium 3, accelerating the heat absorption process of the phase change medium 3 and efficiently dissipating the heat, preventing the power module 200 from experiencing performance degradation or damage due to overheating. Furthermore, aluminum components have low interfacial thermal resistance, which enhances the fit between the phase change chamber 100 and the phase change medium 3, reducing thermal resistance at the contact points and further improving the heat transfer efficiency of the phase change chamber 100. Moreover, aluminum components have low density and are lightweight, which helps reduce the weight of the phase change chamber 100 and lower its operating costs. Alternatively, the heat-conducting component 4 can also be made of aluminum alloy, aluminum nitride (AlN), etc., but is not limited to these.

[0094] Preferably, since the thermal conductivity of copper is higher than that of aluminum or aluminum alloy parts, when copper is used as the heat-conducting component 4 of the phase change chamber 100, it can more quickly transfer the heat generated by the power chip 2012 on the power module 200 to the phase change medium 3, accelerate the heat absorption process of the phase change medium 3, and thus dissipate the heat more efficiently, avoid the power module 200 from degrading or being damaged due to overheating, and improve the performance of the phase change chamber 100.

[0095] According to some embodiments of this utility model, combined with Figure 1 The power module 200 also includes a first heat dissipation component 202. Specifically, the first heat dissipation component 202 is located on the first side 201d of the phase change chamber 100, away from the power device body 201.

[0096] For example, in Figure 1In the example, the first heat dissipation component 202 is located on the side of the phase change chamber 100 away from the power device body 201, that is, near the first side 201d of the phase change chamber 100, and is connected to the phase change chamber 100. When the first heat dissipation component 202 and the power chip 2012 in the power module 200 below the phase change chamber 100 generate heat, the phase change medium 3 can quickly absorb a large amount of heat. At the same time, the first heat dissipation component 202 is in contact with the phase change chamber 100 and can exchange heat to remove the heat from the phase change chamber 100. The first heat dissipation component 202 can also be in contact with a heat exchange fluid, such as water, so that the heat on the first heat dissipation component 202 can be removed by the flow of water. Thus, a heat exchange flow path can be formed in the power module 200 through the phase change chamber 100 and the first heat dissipation component 202. The phase change chamber 100, combined with the water-cooled circulation cooling of the first heat dissipation component 202 on its upper side, forms a collaborative heat dissipation system. This enables more efficient heat conduction, improves the short-term overcurrent capability of the power module 200, reduces temperature peaks, minimizes temperature fluctuations, and extends its service life. Furthermore, the first heat dissipation component 202 and the phase change chamber 100 are connected via reflow soldering. The solder joints formed by reflow soldering have high mechanical strength and can withstand certain external impacts and vibrations, effectively reducing problems such as solder joint cracking and detachment during the use of the power module 200, thus extending its service life.

[0097] According to some embodiments of this utility model, combined with Figure 1 The first heat dissipation component 202 includes a first heat dissipation body 2021. Specifically, in a first direction, the first side 201a of the first heat dissipation body 2021 facing the phase change chamber 100 can contact the phase change medium 3.

[0098] For example, in Figure 1 In the example, the first heat dissipation component 202 is located on its lower side in the first direction, near the phase change chamber 100, with a first heat dissipation body 2021. The lower side of the first heat dissipation body 2021 (i.e., the side of the first heat dissipation body 2021 facing the first side 201a of the phase change chamber 100) can contact the phase change medium 3. With this configuration, the first heat dissipation body 2021 contacts the phase change medium 3, and the phase change chamber 100, combined with the water-cooled circulation heat dissipation of the first heat dissipation component 202 above it, forms a coordinated heat dissipation system between the phase change chamber 100 and the first heat dissipation component 202. This achieves more efficient heat conduction, improves the short-term overcurrent capability of the power module 200, reduces temperature peaks, minimizes temperature fluctuations, and extends its service life. For example, the lower side of the first heat dissipation body 2021 can directly or indirectly contact the phase change medium 3; no specific limitation is made here.

[0099] According to some embodiments of this utility model, combined with Figure 1The first heat dissipation component 202 also includes a first heat dissipation structure 2022. Specifically, the first heat dissipation structure 2022 is disposed on the second side 201e of the first heat dissipation body 2021 away from the phase change chamber 100, and the first heat dissipation structure 2022 is configured as a first cooling channel 2023 through which the phase change medium 3 flows.

[0100] For example, refer to Figure 1 The lower ends of multiple first heat dissipation structures 2022 are connected to the upper surface of the first heat dissipation body 2021, and the multiple first heat dissipation structures 2022 together form a first cooling channel 2023 for the flow of heat exchange medium such as water. That is, the first heat dissipation body 2021 (i.e., the support structure of the pin fins) and the first heat dissipation structures 2022 (i.e., the pin fin portion) together constitute the first heat dissipation component 2022 of the pin fin heat dissipation plate structure. In other words, the first heat dissipation body 2021 provides a heat dissipation foundation for the first heat dissipation component 202, which can enhance the heat dissipation effect of the power module 200, uniformly distribute the temperature on the surface of the power chip 2012, and improve the structural strength of the first heat dissipation component 202.

[0101] The first heat dissipation structure 2022, namely the needle-fin portion of the needle-fin heat sink, typically consists of numerous needle-like or fin-like protrusions. These needle-fins can be cylindrical, square, rectangular, or other shapes, and are arranged on the substrate in a regular or irregular manner. The numerous tiny needle-like fins provide more contact surface area, significantly increasing the contact area between the heat sink and the surrounding medium. This allows heat to be rapidly transferred from the heat source 204 to the fins and diffused away through the fin surface, optimizing heat distribution and thus improving heat dissipation capacity. Simultaneously, the numerous needle-like fins refine and disperse the heat source 204, reducing the temperature gradient across the entire heat dissipation surface and preventing overheating and localized heat accumulation. This is crucial for ensuring the long-term stable operation of the equipment. The size, spacing, and height of the needle-fins are designed according to specific application requirements to achieve optimal heat dissipation. Generally, metals with good thermal conductivity, such as copper, aluminum, and their alloys, are used. The needle-fins are then firmly connected to the substrate through reflow soldering, forming an integrated heat dissipation system. When the finned heat-conducting plate comes into contact with the heat source 204, heat is transferred from the heat source 204 to the substrate of the heat dissipation component through thermal conduction. Since the fins are tightly connected to the substrate, heat is rapidly conducted from the substrate to the fins, and then dissipated to the surrounding environment through water-cooled circulation. Furthermore, the presence of the fins significantly increases the surface area of ​​the first heat dissipation component, allowing it to fully contact the surrounding heat dissipation medium (such as air, coolant, etc.), thereby accelerating the water-heat dissipation speed and preventing overheating of the power chip 2012, which could affect the performance and lifespan of the power module 200. Therefore, the finned structure can improve overall heat dissipation efficiency by increasing the heat dissipation surface area, improving thermal conduction, enhancing liquid / air flow, and reducing surface temperature gradients.

[0102] According to some embodiments of this utility model, combined with Figure 1 The power module 200 also includes a second heat dissipation component 203. Specifically, in the first direction, the second heat dissipation component 203 is disposed on the second side 201e of the power device body 201 away from the phase change chamber 100.

[0103] For example, combining Figure 1 The second heat dissipation component 203 is located in the height direction of the power module 200 (i.e., Figure 1 The lowest side (in the direction indicated by the middle arrow A) is connected to the lower second substrate 2014 via reflow soldering. Figure 1 In the example, from top to bottom, they are: first heat dissipation component 202, phase change chamber 100, power device body 201 and second heat dissipation component 203.

[0104] With this configuration, the second heat dissipation component 203 is in direct contact with the power device body 201, allowing for heat exchange and removal of heat from the power device body 201. For example, the second heat dissipation component 203 can contact a heat exchange fluid such as water, allowing the water flow to remove heat from the second heat dissipation component 203. This creates another heat exchange path for the power module 200 via the power device body 201 and the second heat dissipation component 203. In other words, the second heat dissipation component 203 forms a water-cooled circulating heat dissipation system on the lower side of the power module 200. Together with the first heat dissipation component 202, the second heat dissipation component 203 and the first heat dissipation component 202 constitute a double-sided water-cooled circulating heat dissipation system for the power module 200. When the phase change medium 3 in the phase change chamber 100 transforms into a liquid and its thermal conductivity decreases, the second heat dissipation component 203, located below the power device body 201, ensures that heat on the power device body 201 can be effectively dissipated from the lower side, effectively improving the heat dissipation performance of the power module 200. In other words, through the synergistic effect of the first heat dissipation component 202 and the second heat dissipation component 203, when the power module 200 is in operation, the heat generated by the power chip 2012 is dissipated simultaneously from both the top and bottom sides, increasing the heat dissipation area and improving the heat exchange efficiency of the power module 200. Furthermore, it also makes the temperature distribution on the power chip 2012 more uniform, reducing localized overheating and improving the stability and reliability of the power module 200. This further enhances the short-term overcurrent capability of the power module 200, reduces temperature peaks, minimizes temperature fluctuations, and extends its service life.

[0105] According to some embodiments of this utility model, combined with Figure 1 The second heat dissipation assembly 203 includes a second heat dissipation body 2031. Specifically, in the first direction, the third side 201c of the second heat dissipation body 2031 facing the power device body 201 is connected to the power device body 201.

[0106] For example, in Figure 1 In the example, the second heat dissipation body 2031 is located on the upper side of the second heat dissipation component 203 in the height direction, and the third side 201c of the second heat dissipation component 203 is connected to the power device body 201. With this configuration, the second heat dissipation component 203 is in direct contact with the power device body 201, allowing for heat exchange and removal of heat from the power device body 201. For example, the second heat dissipation component 203 can come into contact with a heat exchange fluid such as water, allowing the water flow to remove heat from the second heat dissipation component 203. Thus, another heat exchange path can be formed between the power device body 201 and the second heat dissipation component 203 in the power module 200. In other words, the second heat dissipation component 203 forms a water-cooled circulating heat dissipation system on the lower side of the power module 200. Together with the first heat dissipation component 202, the second heat dissipation component 203 constitutes a double-sided water-cooled circulating heat dissipation system for the power module 200. When the phase change medium 3 in the phase change chamber 100 transforms into a liquid and its thermal conductivity decreases, the second heat dissipation component 203, located below the power device body 201, ensures that the heat on the power device body 201 can be effectively dissipated from the lower side, effectively improving the heat dissipation performance of the power module 200. That is, through the synergistic effect of the first heat dissipation component 202 and the second heat dissipation component 203, when the power module 200 is in operation, the heat generated by the power chip 2012 is dissipated simultaneously from both the upper and lower sides, increasing the heat dissipation area and improving the heat exchange efficiency of the power module 200. Furthermore, it also makes the temperature distribution on the power chip 2012 more uniform, reducing local overheating and improving the stability and reliability of the power module 200. This further improves the short-term overcurrent capability of the power module 200, reduces temperature peaks, minimizes temperature fluctuations, and extends its service life.

[0107] According to some embodiments of this utility model, combined with Figure 1 The second heat dissipation component 203 also includes a second heat dissipation structure 2032. Specifically, the second heat dissipation structure 2032 is disposed on the fourth side 201f of the second heat dissipation body 2031 away from the power device body 201, and the second heat dissipation structure 2032 is configured as a second cooling channel 2033 through which the phase change medium 3 flows.

[0108] For example, in Figure 1In the example, the second heat dissipation component 203 has a second heat dissipation structure 2032 on the side away from the power device body 201 (i.e., the lowest side in the height direction of the power module 200). Multiple second heat dissipation structures 2032 together form a second cooling channel 2033 through which a heat exchange medium, such as water, flows. With this configuration, when the second heat dissipation component 203 comes into contact with the power device body 201, heat is transferred from the power device body 201 to the second heat dissipation body 2031 of the second heat dissipation component 203 via thermal conduction. Since the second heat dissipation structure 2032 and the second heat dissipation body 2031 are tightly connected, heat is rapidly conducted from the substrate to the second heat dissipation structure 2032, and the heat can be dissipated to the surrounding environment through water-cooled circulation. In addition, the presence of the second heat dissipation structure 2032 greatly increases the surface area of ​​the first heat dissipation component and forms a second cooling channel 2033 for the flow of the phase change medium 3, so that the second heat dissipation component 203 is in full contact with the surrounding heat dissipation medium (such as air, coolant, etc.), thereby accelerating the hydrothermal heat dissipation speed and preventing the power chip 2012 from overheating and affecting the performance and service life of the power module 200.

[0109] According to some embodiments of this utility model, combined with Figure 1 and Figure 2 The power device body 201 includes a second substrate 2014, a power chip 2012, and terminals 2013. Specifically, the power chip 2012 is disposed between the second substrate 2014 and the phase change chamber 100. The terminals 2013 are connected to the second substrate 2014 and / or the power chip 2012.

[0110] For example, in Figure 1 In the example, the power module 200 power device body 201 includes a second substrate 2014. The second substrate 2014 is located at the lowest point of the power device body 201 along the height direction of the power module 200, i.e., on the side of the power device body 201 near the second heat dissipation body 2031. The power chip 2012 is disposed between the phase change chamber 100 and the first substrate 2011, and terminals 2013 are respectively connected to the power device body 201 in a second direction (i.e.,...). Figure 1 The left and right ends (in the direction indicated by the middle arrow B).

[0111] During operation, the power module 200 generates a significant amount of heat. The copper layer of the second substrate 2014, with its excellent thermal conductivity, quickly dissipates this heat. Simultaneously, the ceramic layer also possesses thermal conductivity, assisting the copper layer in dissipating heat into the module's cooling system. The second substrate 2014 helps reduce the operating temperature of the power module 200, improves its heat dissipation efficiency, and ensures its performance and stability under high-temperature conditions. The copper and ceramic layers of the second substrate 2014 are directly soldered together. Furthermore, the first heat dissipation component 202 is located on the side of the second substrate 2014 furthest from the power chip 2012, specifically on the upper side in the height direction of the power module 200. The first heat dissipation component 202 is fixed to the phase change chamber 100 via reflow soldering, forming a robust water-cooling cycle and a coordinated heat dissipation system with the phase change chamber 100.

[0112] The power chip 2012 in the power module 200 can convert input electrical energy, such as converting DC power to AC power, or converting electrical energy of one voltage level to another. Taking an electric vehicle charging system as an example, the power chip 2012 of the phase-change power module 200 can convert the AC power input from the grid into DC power suitable for charging the electric vehicle battery, and can precisely control the charging current and voltage according to the battery's charging state and needs, achieving an efficient and safe charging process. The power chip 2012 can precisely control the output power of the power module 200 according to the actual application requirements. When electrons move under a high electric field, they collide frequently with the crystal lattice, converting electrical energy into heat energy. For example, in a high-voltage frequency converter, the power chip 2012 needs to convert low-voltage DC power into high-voltage AC power. In this process, the high-voltage change will generate a lot of heat inside the power chip 2012.

[0113] Terminal 2013 enables current transmission between the phase-change power module 200 and external circuits, allowing the power module 200 to receive input electrical energy and output the converted electrical energy to loads or other circuits. For example, in the drive system of an electric vehicle, terminal 2013 of the power module 200 introduces DC power from the battery into the module, which is then converted into AC power by components such as the power chip 2012 within the module, and finally output to the motor through terminal 2013 to provide power to the motor. It can also transmit various signals such as control signals and monitoring signals. For example, control commands from an external controller can be transmitted to the power chip 2012 inside the power module 200 to control the operating state of the power chip 2012; simultaneously, monitoring signals such as temperature and current inside the power module 200 can be transmitted through terminal 2013 to external monitoring equipment or control systems for real-time monitoring and fault diagnosis.

[0114] For example, combining Figure 2 The power device body 201 of the power module 200 is composed of a second substrate 2014, a power chip 2012, and terminals 2013, forming the core of the power module 200. The second substrate 2014, power chip 2012, and terminals 2013 form a sandwich structure along the height of the power module 200. This structure enables a tight and reliable electrical connection between the power chip 2012 and the second substrate 2014 and terminals 2013. The second substrate 2014 provides a stable electrical interconnection platform for the power chip 2012, while the terminals 2013 serve as the interface for connecting to external circuits. The tightly integrated sandwich structure ensures stable current transmission and low resistance characteristics, reduces signal loss and interference during transmission, and improves the overall electrical performance of the power module 200. The sandwich structure sandwiches the power chip 2012 in the middle, with the second substrate 2014 and terminals 2013 fixing it above and below, forming a stable overall structure. This structure effectively resists external mechanical stress and vibration, protecting the power chip 2012 from mechanical damage.

[0115] During the use of the power module 200, especially in applications with high vibration, such as electric vehicles and aerospace, the stability of this structure ensures that the connection between the power chip 2012 and other components remains secure, improving the reliability and lifespan of the power module 200. The second substrate 2014 has excellent thermal conductivity; in the sandwich structure, it acts as an effective heat transfer medium, rapidly transferring the heat generated by the power chip 2012 to the external heat dissipation device. Heat is transferred from the power chip 2012 to the second substrate 2014, then through the second substrate 2014 to the terminal 2013, and finally dissipated into the surrounding environment via the phase change chamber 100, forming an efficient heat conduction path. This helps reduce the operating temperature of the power chip 2012 and improves the heat dissipation efficiency of the power module 200. This sandwich structure is relatively simple, easy to assemble and manufacture during production, reduces complex assembly processes and technological difficulties, improves production efficiency, and lowers production costs. Alternatively, a single-sided heat dissipation method can be used to integrate the PCM chamber (referring to a chamber using phase change material technology for temperature control), making it, together with the power device body 201, constitute the power module 200.

[0116] An electronic device (not shown) according to a second aspect embodiment of the present invention includes a power module 200 according to the first aspect embodiment described above.

[0117] The electronic device according to this embodiment of the invention, by employing the aforementioned power module 200, which integrates a phase change chamber 100 and a double-sided water-cooled circulating heat dissipation system, can rapidly absorb or release a large amount of heat, exhibiting high heat dissipation efficiency. This facilitates rapid heat dissipation for the electronic device, improving its performance. For example, the electronic device can be used in electric vehicles, new energy power generation, and communication base stations.

[0118] The vehicle according to the third embodiment of the present invention (not shown) includes the power module 200 according to the first aspect embodiment or the electronic device according to the second aspect embodiment.

[0119] The vehicle according to the present invention, by employing the above-mentioned electronic equipment, achieves higher heat dissipation efficiency, thereby improving the safety and service life of the vehicle and its internal components.

[0120] The power module 200, electronic devices, and other vehicle components and operations according to embodiments of the present invention are known to those skilled in the art and will not be described in detail here.

[0121] In the description of this utility model, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.

[0122] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example.

[0123] Although embodiments of the present invention have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the claims and their equivalents.

Claims

1. A power module (200), characterized in that, include: Power device body (201); Phase change chamber (100), in the first direction of the power module (200), the phase change chamber (100) is disposed on one side of the power device body (201); The storage space (11) of the phase change chamber (100) is isolated from the power device body (201), and the phase change chamber (100) is used to contain the phase change medium (3).

2. The power module (200) according to claim 1, characterized in that, The phase change chamber (100) includes: A first substrate (2011) is disposed on the side of the phase change chamber (100) near the power device body (201) in the first direction, and the first substrate (2011) is configured as the base plate of the phase change chamber (100).

3. The power module (200) according to claim 2, characterized in that, The first substrate (2011) is a DBC board.

4. The power module (200) according to claim 2, characterized in that, The phase change chamber (100) includes: The housing (1) is disposed on the side of the first substrate (2011) away from the power device body (201) in the first direction. The housing (1) is configured as the sidewall of the phase change chamber (100) and surrounds at least a portion of the phase change chamber (100) with at least a portion of the first substrate (2011).

5. The power module (200) according to claim 4, characterized in that, In the first direction, both ends of the housing (1) are open.

6. The power module (200) according to claim 4, characterized in that, The housing (1) has a reinforcing part (12) at the corner. In the second direction of the power module (200), the size of the reinforcing part (12) is larger than the size of the remaining part of the housing (1). The second direction is perpendicular to the first direction. The remaining portion of the housing (1) is the portion of the housing (1) other than the reinforcing part (12).

7. The power module (200) according to claim 1, characterized in that, The phase change chamber (100) includes at least one partition (2) disposed within the storage space (11) and used to divide the storage space (11) into a plurality of sub-storage spaces (111).

8. The power module (200) according to claim 7, characterized in that, At least two of the sub-storage spaces (111) are interconnected.

9. The power module (200) according to claim 7, characterized in that, The phase change chamber (100) also includes: At least one heat-conducting element (4) is disposed within the storage space (11).

10. The power module (200) according to claim 9, characterized in that, There are multiple separators (2), and the heat-conducting element (4) is provided at the intersection of two adjacent separators (2).

11. The power module (200) according to claim 9, characterized in that, There are multiple heat-conducting elements (4), and at least one separator (2) is provided between two adjacent heat-conducting elements (4).

12. The power module (200) according to claim 7, characterized in that, The two ends of the separator (2) have gaps (5) between them and the adjacent components.

13. The power module (200) according to claim 12, characterized in that, The gap (5) is D, wherein D satisfies: 0.5mm≤D1≤1mm.

14. The power module (200) according to any one of claims 1-13, characterized in that, Also includes: A first heat dissipation component (202) is disposed on a first side (201d) of the phase change chamber (100) away from the power device body (201).

15. The power module (200) according to claim 14, characterized in that, The first heat dissipation component (202) includes: The first heat dissipation body (2021) has a first side (201a) facing the phase change chamber (100) in the first direction that can contact the phase change medium (3).

16. The power module (200) according to claim 15, characterized in that, The first heat dissipation component (202) further includes: The first heat dissipation structure (2022) is disposed on the second side (201b) of the first heat dissipation body (2021) away from the phase change chamber (100), and the first heat dissipation structure (2022) is configured as a first cooling channel (2023) for the flow of phase change medium (3).

17. The power module (200) according to claim 14, characterized in that, Also includes: The second heat dissipation component (203) is disposed on the second side (201e) of the power device body (201) away from the phase change chamber (100) in the first direction.

18. The power module (200) according to claim 17, characterized in that, The second heat dissipation component (203) includes: The second heat dissipation body (2031) is connected to the power device body (201) on its third side (201c) facing the power device body (201) in the first direction.

19. The power module (200) according to claim 18, characterized in that, The second heat dissipation component (203) also includes: The second heat dissipation structure (2032) is disposed on the fourth side (201f) of the second heat dissipation body (2031) away from the power device body (201), and the second heat dissipation structure (2032) is configured as a second cooling channel (2033) for the flow of phase change medium (3).

20. The power module (200) according to any one of claims 1-13, characterized in that, The power device body (201) includes: Second substrate (2014); A power chip (2012) is disposed between the second substrate (2014) and the phase change chamber (100); Terminal (2013) is connected to the second substrate (2014) and / or the power chip (2012).

21. An electronic device, characterized in that, Includes the power module (200) according to any one of claims 1-20.

22. A vehicle, characterized in that, Includes the power module (200) according to any one of claims 1-20, or the electronic device according to claim 21.

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