Space fluid circuit liquid storage device with temperature control function

Abstract

The application relates to the field of aerospace technology, in particular to a space fluid loop liquid storage device with a temperature control function, which comprises a storage tank, a supporting member, a mounting member, a semiconductor refrigerating sheet, a working medium flow pipe and a heating member, the supporting member is formed with a mounting cavity, and the storage tank is fixed in the mounting cavity; the mounting member is mounted on the supporting member, and the side close to the storage tank of the mounting member is formed with a mounting groove; the semiconductor refrigerating sheet is mounted in the mounting groove, and the cooling surface of the semiconductor refrigerating sheet is arranged close to the side of the storage tank; the working medium flow pipe is mounted on the mounting member, and the working medium flow pipe is arranged close to the heating surface of the semiconductor; and the heating member is arranged on the storage tank and used for heating the storage tank. It can be seen that the heating member and the semiconductor refrigerating sheet cooperate to adjust the temperature of the working medium in the storage tank, so that different use requirements can be met; when the semiconductor refrigerating sheet works, heat is generated on the semiconductor refrigerating sheet, the working medium flowing through the working medium flow pipe can be preheated, so that the heat can be fully utilized, and the energy-saving effect is achieved.

Description

Technical Field

[0001] This application relates to the field of aerospace technology, and in particular to a space fluid loop liquid storage device with temperature control function. Background Technology

[0002] The spacecraft thermal control system is a collection of equipment and components selected and installed on the spacecraft to ensure that its thermal parameters, such as temperature, temperature difference, and humidity, meet the overall design requirements. It is one of the many crucial systems on a spacecraft. Tanks, or storage tanks, are commonly used in spacecraft thermal control systems to store the working fluid. These tanks only have a simple storage function and lack a structure for temperature control of the heat exchange fluid within the tank. Utility Model Content

[0003] The purpose of this application is to provide a space fluid loop liquid storage device with temperature control function, which to a certain extent solves the technical problem that the tanks commonly used in spacecraft thermal control systems for storing working fluids only have a simple storage function and lack a structure for controlling the temperature of the heat exchange working fluid inside the tank.

[0004] This application provides a liquid storage device with temperature control function, including: a storage tank, a support member, a mounting member, a semiconductor refrigeration chip, a working fluid flow pipe, and a heating member; wherein, the support member forms a mounting cavity, the storage tank is fixed in the mounting cavity, and contacts the inner wall of the mounting cavity;

[0005] The mounting component is mounted on the supporting component, and a mounting groove is formed on the side of the mounting component near the storage tank. The semiconductor refrigeration chip is mounted in the mounting groove, and the cooling surface of the semiconductor refrigeration chip is disposed near the storage tank side. The working fluid flow pipe is mounted on the mounting component, and the working fluid flow pipe is disposed near the heating surface of the semiconductor. The heating component is disposed in the storage tank and is used to heat the storage tank.

[0006] In the above technical solution, the mounting component is further provided with a groove, the working fluid flow pipe is disposed in the groove, and a heat-conducting filler is disposed between the outer wall of the working fluid flow pipe and the inner wall of the groove.

[0007] In any of the above technical solutions, the supporting member further includes a first supporting member, a second supporting member, and a third supporting member; wherein the first supporting member forms a first mounting cavity, the second supporting member forms a second mounting cavity, and along the axial direction of the storage tank, one end of the storage tank is installed in the first mounting cavity of the first supporting member, and the other end of the storage tank is installed in the second mounting cavity of the second supporting member;

[0008] The third support member is installed on the side of the storage tank opposite to the first support member and the second support member, and is connected to the first support member and the second support member respectively; the mounting member is installed on the third support member.

[0009] In any of the above technical solutions, the third support member further includes a first fixed half-ring, a second fixed half-ring, and a support plate; wherein the first fixed half-ring is installed at one end of the storage tank, and the second fixed half-ring is installed at the other end of the storage tank; the support plate extends along the axial direction of the storage tank and is connected to the first fixed half-ring and the second fixed half-ring respectively, and the support plate contacts the side wall of the storage tank.

[0010] In any of the above technical solutions, the first fixed half-ring, the second fixed half-ring, and the support plate are further integrated into a single structure.

[0011] In any of the above technical solutions, a thermally conductive filler is further provided between the mounting component and the support plate.

[0012] In any of the above technical solutions, the first support member further includes a first base and a first fixing cover connected to each other; wherein, one end of the storage tank is installed inside the first fixing cover, and the first base supports the first fixing cover and one end of the storage tank; the first base has a first hollow hole.

[0013] In any of the above technical solutions, the second support member further includes a second base and a second fixing cover connected to each other; wherein, the other end of the storage tank is installed inside the second fixing cover, and the second base supports the second fixing cover and the other end of the storage tank; the second base has a second hollow hole.

[0014] In any of the above technical solutions, the third support member is further detachably connected to the first support member.

[0015] In any of the above technical solutions, the third support member is further detachably connected to the second support member.

[0016] In any of the above technical solutions, the working fluid flow tube is further U-shaped.

[0017] In any of the above technical solutions, the heating component is further disposed on the outer wall of the storage tank.

[0018] In any of the above technical solutions, the heating element is a heating plate and extends along an axis perpendicular to the storage tank.

[0019] Compared with the prior art, the beneficial effects of this application are as follows:

[0020] This application provides a novel liquid storage device with temperature control function. The heating element can heat the storage tank and the working medium inside it, and the semiconductor cooling chip can cool the storage tank and the working medium inside it, thereby adjusting the temperature of the working medium inside the storage tank to meet different usage requirements.

[0021] Furthermore, one side of the thermoelectric cooler can heat the working fluid stored in the storage tube. When the thermoelectric cooler is working, it generates heat itself, which can preheat the working fluid flowing in the working fluid circulation tube, thereby making full use of the heat and achieving energy saving, which is extremely important in the aerospace field. Attached Figure Description

[0022] To more clearly illustrate the technical solutions in the specific embodiments of this application or the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0023] Figure 1 This is a schematic diagram of the structure of a liquid storage device with temperature control function provided in an embodiment of this application;

[0024] Figure 2 Another structural schematic diagram of a liquid storage device with temperature control function provided in an embodiment of this application;

[0025] Figure 3 This is a structural schematic diagram of the support member provided in an embodiment of this application;

[0026] Figure 4 This is a schematic diagram of the structure of the mounting component provided in the embodiments of this application;

[0027] Figure 5 Another structural schematic diagram of the mounting component provided in the embodiments of this application;

[0028] Figure 6 This is a structural schematic diagram of the third support member provided in an embodiment of this application;

[0029] Figure 7 Another structural schematic diagram of the third support member provided in the embodiments of this application;

[0030] Figure 8 This is a structural schematic diagram of the first support member provided in an embodiment of this application;

[0031] Figure 9Another structural schematic diagram of the first support member provided in the embodiments of this application.

[0032] Figure label:

[0033] 1-Storage tank, 2-Supporting component, 21-First supporting component, 211-First base, 2111-First hollow hole, 212-First fixing cover, 2121-First side wall shell, 2122-First head shell, 22-Second supporting component, 221-Second base, 2211-Second hollow hole, 222-Second fixing cover, 23-Third supporting component, 231-First fixing half ring, 232-Second fixing half ring, 233-Supporting plate, 24-Mounting cavity, 3-Mounting component, 31-Groove, 32-Allowing groove, 4-Working fluid flow pipe, 5-Heating component. Detailed Implementation

[0034] The technical solutions of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are some embodiments of this application, but not all embodiments.

[0035] The components of the embodiments of this application described and shown in the accompanying drawings can typically be arranged and designed in a variety of different configurations. Therefore, the following detailed description of the embodiments of this application provided in the drawings is not intended to limit the scope of the claimed application, but merely to illustrate selected embodiments of the application.

[0036] Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0037] In the description of this application, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0038] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0039] The following reference Figures 1 to 9 This application describes a space fluid loop liquid storage device with temperature control function according to some embodiments.

[0040] See Figures 1 to 4 As shown, an embodiment of this application provides a liquid storage device with temperature control function, including: a storage tank 1, a support member 2, a mounting member 3, a semiconductor cooling chip, a working fluid flow pipe 4, and a heating member 5; wherein, the support member 2 forms a mounting cavity 24, and the storage tank 1 is fixed in the mounting cavity 24 and contacts the inner wall of the mounting cavity 24;

[0041] Mounting component 3 is mounted on supporting component 2, and a mounting groove is formed on the side of mounting component 3 near storage tank 1. The semiconductor cooling chip is mounted in the mounting groove, and the cooling surface of the semiconductor cooling chip is positioned near storage tank 1 (the semiconductor cooling chip is not shown in the figure). The working fluid flow pipe 4 is mounted on mounting component 3, and the working fluid flow pipe 4 is positioned near the heating surface of the semiconductor. The heating component 5 is disposed on the storage tank 1 and is used to heat the storage tank 1.

[0042] As can be seen from the structure described above, this application provides a novel liquid storage device with temperature control function. The heating element 5 can heat the storage tank 1 and the working medium inside it, and the semiconductor cooling chip can cool the storage tank 1 and the working medium inside it, thereby adjusting the temperature of the working medium inside the storage tank 1 to meet different usage requirements.

[0043] Furthermore, one side of the semiconductor cooling chip can heat the working fluid stored in the storage tube. When the semiconductor cooling chip is working, it generates heat itself, which can preheat the working fluid flowing in the working fluid flow tube 4, thereby making full use of the heat and playing an energy-saving role, which is extremely important in the aerospace field.

[0044] In this embodiment, preferably, as follows: Figure 5As shown, the mounting component 3 has a groove 31, and the working fluid flow pipe 4 is disposed in the groove 31. The side wall of the working fluid flow pipe 4 that contacts the groove 31 is provided with thermally conductive filler. Of course, it is not limited to this. Thermally conductive filler can also be provided on the side wall of the groove 31 or on both the side wall of the working fluid flow pipe 4 and the inner wall of the groove 31. That is to say, it is sufficient to ensure that thermally conductive filler is provided between the two. Of course, it is not limited to this. Thermally conductive filler may not be provided between the outer wall of the working fluid flow pipe 4 and the inner wall of the groove 31. The specific choice depends on the actual needs.

[0045] As can be seen from the structure described above, a groove 31 is opened on the mounting component 3, so that the working fluid flow pipe 4 is installed in the groove 31, making the assembly of the working fluid flow pipe 4 and the mounting component 3 more stable, and the contact area is larger, which helps to conduct heat and improves the heating efficiency of the working fluid in the working fluid flow pipe 4. Furthermore, the side wall of the working fluid flow pipe 4 in contact with the groove 31 is provided with heat-conducting filler to improve the heat conduction effect, that is, to improve the heating effect of the working fluid in the working fluid flow pipe 4.

[0046] Furthermore, preferably, the aforementioned thermally conductive filler material can be thermally conductive silicone grease or thermally conductive rubber. Thermally conductive rubber can be welded to the working fluid flow pipe 4, and thermally conductive silicone grease itself has a certain degree of stickiness and can also be attached to the working fluid flow pipe 4. Of course, the material of the thermally conductive filler is not limited to these and can be selected according to actual needs.

[0047] Furthermore, preferably, the groove 31 extends through the side of the mounting member 3, that is, the side of the groove 31 is provided with an opening, so that the working fluid flow pipe 4 can extend to the outside of the mounting member 3, thereby avoiding interference.

[0048] Of course, it is not limited to this. The groove 31 may not be provided on the mounting component 3. Instead, the working fluid circulation tank may be directly bonded to the surface of the mounting component 3 with thermally conductive structural adhesive, etc. The specific choice depends on the actual needs.

[0049] In this embodiment, preferably, as follows: Figure 3 , Figures 6 to 9 As shown, the support member 2 includes a first support member 21, a second support member 22, and a third support member 23; wherein, the first support member 21 forms a first mounting cavity 24, the second support member 22 forms a second mounting cavity 24, and along the axial direction of the storage tank 1, one end of the storage tank 1 is installed in the first mounting cavity 24 of the first support member 21, and the other end of the storage tank 1 is installed in the second mounting cavity 24 of the second support member 22;

[0050] The third support member 23 is installed on the side of the storage tank 1 away from the first support member 21 and the second support member 22, and is connected to the first support member 21 and the second support member 22 respectively; the mounting member 3 is installed on the third support member 23.

[0051] As can be seen from the structure described above, the first support member 21 and the second support member 22 are mainly used to support the front and rear ends of the storage tank 1, while the third support member 23 is fastened on the side of the storage tank 1 away from the first support member 21 and the second support member 22, and is connected to the first support member 21 and the second support member 22, thereby fixing the storage tank 1, making the storage tank 1 more stable as a whole and less prone to movement.

[0052] In this embodiment, preferably, as follows: Figure 6 and Figure 7 As shown, the third support member 23 includes a first fixed half-ring 231, a second fixed half-ring 232, and a support plate 233; wherein, the first fixed half-ring 231 is installed at one end of the storage tank 1, and the second fixed half-ring 232 is installed at the other end of the storage tank 1; the support plate 233 extends along the axial direction of the storage tank 1 and is connected to the first fixed half-ring 231 and the second fixed half-ring 232 respectively; the support plate 233 contacts the side wall of the storage tank 1.

[0053] As can be seen from the structure described above, along the axial direction of the storage tank 1, the front and rear ends of the third support member 23 adopt a semi-ring structure, which is more compatible with the storage tank 1 and facilitates docking with the first fixed cover 212, which is similar to a hemispherical shell as described below; the support plate 233 contacts the side wall of the storage tank 1 for heat conduction, and the support plate 233 is used to support the installation member 3 and the working fluid flow pipe 4.

[0054] Furthermore, preferably, the storage tank 1 is a cylindrical tank, that is, the storage tank 1 is a cylindrical tank with arc-shaped structures at both ends. Consequently, the side of the support plate 233 near the storage tank 1 is an arc-shaped surface, which is adapted to the cylindrical tank. Of course, it is not limited to this. The shape of the storage tank 1 is not limited to this. Correspondingly, the side of the support plate 233 near the storage tank 1 is also adaptively adjusted according to the side wall surface of the storage tank 1.

[0055] Furthermore, preferably, the side surface of the support plate 233 facing away from the storage tank 1 is flat, which facilitates its cooperation with the plate-shaped mounting component 3 and the semiconductor cooling chip.

[0056] In this embodiment, preferably, as follows: Figure 6 and Figure 7 As shown, the first fixed half-ring 231, the second fixed half-ring 232, and the support plate 233 are an integral structure.

[0057] As can be seen from the structure described above, the third support component 23 adopts an integrated structure, which avoids the formation of welding points and other structures during the assembly of split structures, thereby increasing thermal resistance and affecting the heat dissipation of the working fluid in the storage tank 1.

[0058] Of course, it is not limited to this. The first fixed half ring 231, the second fixed half ring 232 and the support plate 233 can also be a separate structure and connected by welding, bolts or buckles, depending on the actual needs.

[0059] In this embodiment, preferably, a thermally conductive filler (not shown in the figure) is provided between the mounting component 3 and the support plate 233. That is, thermally conductive filler can be provided on the mounting component 3, on the support plate 233, or on both the mounting component 3 and the support plate 233 at the same time, so as to accelerate heat conduction. Of course, it is not limited to this. Thermally conductive filler may not be provided between the mounting component and the support plate 233. The specific choice depends on the actual needs.

[0060] Furthermore, preferably, the aforementioned thermally conductive filler material can be thermally conductive silicone grease or thermally conductive rubber. Thermally conductive rubber can be welded to the working fluid flow pipe 4, and thermally conductive silicone grease itself has a certain degree of stickiness and can also be attached to the working fluid flow pipe 4. Of course, it is not limited to these, and can be selected according to actual needs.

[0061] In this embodiment, preferably, as follows: Figure 3 , Figure 8 and Figure 9 As shown, the first support member 21 includes a first base 211 and a first fixing cover 212 connected to each other; wherein, one end of the storage tank 1 is installed in the first fixing cover 212, and the first base 211 supports the first fixing cover 212 and one end of the storage tank 1; the first base 211 has a first hollow hole 2111.

[0062] As can be seen from the structure described above, the first fixed cover 212 serves to prevent the storage tank 1 from moving axially; the first hollow hole 2111 is provided on the first base 211 to reduce weight, which is extremely important in aerospace equipment.

[0063] Furthermore, preferably, the first fixed cover 212 includes a first side wall shell 2121 and a first head shell 2122 connected to each other. The first side wall shell 2121 is adapted to the side wall of the storage tank 1, and the first head shell 2122 is adapted to the end of the storage tank 1, i.e., the head, so that the first fixed cover 212 and the storage tank 1 are assembled more stably.

[0064] Furthermore, preferably, the first base 211 and the first fixing cover 212 are an integral structure with high overall structural strength, not easily damaged, and long service life.

[0065] In this embodiment, preferably, as follows: Figure 3As shown, the second support member 22 includes a second base 221 and a second fixing cover 222 connected to each other; wherein, the other end of the storage tank 1 is installed inside the second fixing cover 222, and the second base 221 supports the second fixing cover 222 and the other end of the storage tank 1; the second base 221 has a second hollow hole 2211.

[0066] As can be seen from the structure described above, the second fixed cover 222 serves to prevent the storage tank 1 from moving axially; the second hollow hole 2211 is provided on the second base 221 to reduce weight, which is extremely important in aerospace equipment.

[0067] Furthermore, preferably, the second fixing cover 222 includes a second side wall shell and a second head shell connected to each other. The second side wall shell is adapted to the side wall of the storage tank 1, and the second head shell is adapted to the end of the storage tank 1, i.e., the head, so that the second fixing cover 222 is more stably assembled with the storage tank 1.

[0068] Furthermore, preferably, the second base 221 and the second fixing cover 222 are an integrated structure with high overall structural strength, not easily damaged, and long service life.

[0069] In this embodiment, preferably, as follows: Figures 1 to 3 As shown, the third support member 23 is detachably connected to the first support member 21.

[0070] As can be seen from the structure described above, the third support member 23 and the first support member 21 are connected in a detachable manner, which facilitates the installation of the storage tank 1 between the two.

[0071] Furthermore, preferably, the third support member 23 and the first support member 21 can be connected by bolts, and preferably, both the first base 211 and the first fixing half-ring 231 are formed with mounting platforms, so that the two mounting platforms can be fitted together to facilitate the installation of bolts. Of course, it is not limited to this, and other connection methods such as snap-fit ​​or welding can also be used.

[0072] In this embodiment, preferably, as follows: Figures 1 to 3 As shown, the third support member 23 is detachably connected to the second support member 22.

[0073] As can be seen from the structure described above, the third support member 23 and the second support member 22 are connected in a detachable manner, which facilitates the installation of the storage tank 1 between the two.

[0074] Furthermore, preferably, the third support member 23 and the second support member 22 can be connected by bolts, and preferably, both the second base 221 and the second fixing half-ring 232 are formed with mounting platforms, so that the two mounting platforms can be fitted together to facilitate the installation of bolts. Of course, this is not the only option; snap-fit ​​or welding connections can also be used.

[0075] Furthermore, preferably, the sidewalls at the bottom of the first base 211 and the second base 221 are also formed with mounting platforms and have mounting through holes for fixing the second base to the target location.

[0076] In this embodiment, preferably, as follows: Figure 1 As shown, a preset gap is formed between the mounting component and the supporting component. That is, a gap is formed between the mounting component and the support plate of the aforementioned third supporting component, which can effectively prevent the cold support plate from contacting the hot mounting component.

[0077] Furthermore, preferably, the mounting component has first support blocks on both sides, and the support plate has second support blocks on both sides. The first and second support blocks abut against each other and can be connected by bolts. Furthermore, preferably, a gasket is provided between the first and second support blocks, and the aforementioned bolts pass through the gasket. This ensures that a certain gap is formed between the mounting component and the support plate. Of course, it is not limited to the above structure. The semiconductor cooling chip can also be made to protrude from the groove, which can also form a certain gap between the mounting component and the support plate. Of course, the method is not limited to this and can be selected according to actual needs.

[0078] In this embodiment, preferably, as follows: Figure 1 , Figure 2 and Figure 5 As shown, the working fluid flow pipe 4 is U-shaped.

[0079] As can be seen from the structure described above, designing the working fluid flow pipe 4 into a U-shape can increase the contact area with the mounting component 3, thereby helping to improve the heat exchange effect, that is, to help accelerate the heat dissipation of the semiconductor cooling chip and to accelerate the preheating of the working fluid flowing through the working fluid flow pipe 4.

[0080] Furthermore, preferably, the groove 31 is adapted to the aforementioned U-shaped working fluid flow pipe 4, and thus it is also U-shaped.

[0081] It should be noted that the shape of the working fluid flow tube 4 is not limited to this and can be designed according to actual needs.

[0082] In this embodiment, preferably, as follows: Figure 1As shown, the heating element 5 is installed on the outer wall of the storage tank 1, which ensures the heating effect while avoiding contact with the working fluid. Of course, it is not limited to this; the heating element 5 can also be installed inside the storage tank 1, etc., depending on the actual needs.

[0083] In this embodiment, preferably, as follows: Figure 1 As shown, the heating element 5 is a heating plate and extends along the axis perpendicular to the storage tank 1.

[0084] As can be seen from the structure described above, the use of heating elements ensures heating effect while reducing weight, which is conducive to lightweight design. Furthermore, the heating elements can be adjusted to fit the shape of the storage tank 1 to meet actual usage requirements. Of course, the structure of the heating component 5 is not limited to this and can be designed according to actual needs.

[0085] In this embodiment, preferably, as follows: Figure 4 As shown, the side wall of the mounting groove is also provided with a through clearance groove 32, which serves to avoid wires and other objects on the semiconductor cooling chip.

[0086] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. A liquid storage device with temperature control function, characterized in that, include: The package includes a storage tank, a support component, a mounting component, a semiconductor cooling chip, a working fluid flow pipe, and a heating component; wherein the support component forms a mounting cavity, the storage tank is fixed within the mounting cavity, and contacts the inner wall of the mounting cavity; The mounting component is mounted on the supporting component, and a mounting groove is formed on the side of the mounting component near the storage tank. The semiconductor refrigeration chip is mounted in the mounting groove, and the cooling surface of the semiconductor refrigeration chip is disposed near the storage tank side. The working fluid flow pipe is mounted on the mounting component, and the working fluid flow pipe is disposed near the heating surface of the semiconductor. The heating component is disposed in the storage tank and is used to heat the storage tank.

2. The liquid storage device with temperature control function according to claim 1, characterized in that, The mounting component has a groove, the working fluid flow pipe is disposed in the groove, and a heat-conducting filler is disposed between the outer wall of the working fluid flow pipe and the inner wall of the groove.

3. The liquid storage device with temperature control function according to claim 1, characterized in that, The supporting components include a first supporting component, a second supporting component, and a third supporting component; wherein, the first supporting component forms a first mounting cavity, the second supporting component forms a second mounting cavity, and along the axial direction of the storage tank, one end of the storage tank is installed in the first mounting cavity of the first supporting component, and the other end of the storage tank is installed in the second mounting cavity of the second supporting component; The third support member is installed on the side of the storage tank opposite to the first support member and the second support member, and is connected to the first support member and the second support member respectively; the mounting member is installed on the third support member.

4. The liquid storage device with temperature control function according to claim 3, characterized in that, The third support component includes a first fixed half-ring, a second fixed half-ring, and a support plate; wherein the first fixed half-ring is installed at one end of the storage tank, and the second fixed half-ring is installed at the other end of the storage tank; the support plate extends along the axial direction of the storage tank and is connected to the first fixed half-ring and the second fixed half-ring respectively, and the support plate is in contact with the side wall of the storage tank.

5. The liquid storage device with temperature control function according to claim 4, characterized in that, The first fixing half-ring, the second fixing half-ring, and the support plate are an integral structure; and / or A thermally conductive filler is provided between the mounting component and the support plate.

6. The liquid storage device with temperature control function according to claim 3, characterized in that, The first support member includes a first base and a first fixing cover connected to each other; wherein, one end of the storage tank is installed inside the first fixing cover, and the first base supports the first fixing cover and one end of the storage tank; the first base has a first hollow hole.

7. The liquid storage device with temperature control function according to claim 3, characterized in that, The second support member includes a second base and a second fixing cover connected to each other; wherein, the other end of the storage tank is installed inside the second fixing cover, and the second base supports the second fixing cover and the other end of the storage tank; the second base has a second hollow hole.

8. The liquid storage device with temperature control function according to claim 3, characterized in that, The third support member is detachably connected to the first support member; and / or The third support member is detachably connected to the second support member.

9. The liquid storage device with temperature control function according to claim 1, characterized in that, A predetermined gap is formed between the mounting component and the supporting component; and / or The working fluid flow tube is U-shaped.

10. The liquid storage device with temperature control function according to any one of claims 1 to 9, characterized in that, The heating element is disposed on the outer wall of the storage tank; and / or The heating element is a heating plate and extends along an axis perpendicular to the storage tank.

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