A heat dissipation module for a test box

Abstract

The utility model relates to automatic equipment technical field discloses a kind of heat dissipation module for test box, water cooling plate is set in the inside of test box, the opposite surface of water cooling plate is used to fix the integrated circuit board to be tested, and the integrated circuit board is cooled;Circulation pipeline is set in the inside of test box, is located at the bottom of water cooling plate, and is communicated with the water cooling plate;Water cooling tank is set in the outside of test box, and is communicated with circulation pipeline, to inject coolant into water cooling plate in circulation.This utility model provides double-function water cooling plate, i.

Description

Technical Field

[0001] This utility model relates to the field of automation equipment technology, and in particular to a heat dissipation module for a test box. Background Technology

[0002] An integrated circuit board, often simply called an IC board, is a highly precise micro-circuit structure. Its characteristic is that it tightly integrates many electronic components, including but not limited to transistors, diodes, and resistors, into one unit. These components work together to achieve specific electronic functions.

[0003] Currently, a significant problem has emerged in the process of testing integrated circuit boards using test chambers: due to the large amount of heat generated by the integrated circuit boards during testing, coupled with the lack of effective heat dissipation measures in existing test chambers, the components on the circuit board surface often suffer a certain degree of thermal stress damage. This problem not only seriously threatens the factory quality of integrated circuit boards, creating hidden dangers for potential performance defects, but also greatly restricts the applicability and versatility of test chambers in various application scenarios. Furthermore, the relatively small internal space of the test chamber undoubtedly adds extra complexity and challenges to the design of the heat dissipation module.

[0004] Therefore, developing a heat dissipation module that can ensure both high-efficiency heat dissipation and compact structure has become a critical issue that urgently needs to be addressed, and its importance is self-evident. Utility Model Content

[0005] This invention provides a heat dissipation module for a test chamber to solve the problems existing in the prior art.

[0006] To achieve the above objectives, this utility model provides the following technical solution:

[0007] A heat dissipation module for a test chamber includes a water-cooled plate, circulation piping, and a water-cooled chamber;

[0008] The water-cooled plate is disposed inside the test chamber. The two opposite surfaces of the water-cooled plate are used to fix the integrated circuit board to be tested and to dissipate heat from the integrated circuit board.

[0009] The circulation pipeline is located inside the test chamber, at the bottom of the water-cooled plate, and is connected to the water-cooled plate.

[0010] The water-cooled box is located outside the test chamber and is connected to the circulation pipeline to inject coolant into the water-cooled plate and to recover the coolant.

[0011] Furthermore, in the heat dissipation module for the test chamber, the water-cooled plate is provided with an inlet and an outlet, and the inlet and the outlet are respectively located at opposite ends of the water-cooled plate;

[0012] The water-cooled plate has several sequentially distributed liquid channels inside, which are connected end to end to form a meandering shape.

[0013] The liquid flow channel located on the outermost side is connected to the water inlet;

[0014] The liquid channel located on the other outermost side is connected to the outlet.

[0015] Furthermore, the heat dissipation module for the test chamber also includes an air-cooling component;

[0016] The air-cooled component is located inside the test chamber and at the bottom of the water-cooled plate.

[0017] Furthermore, in the heat dissipation module for the test chamber, hooks are provided on the opposite sides of the water-cooled plate;

[0018] The test box has a buckle groove on the inner wall corresponding to the hook component;

[0019] The hook can be fastened in the buckle groove to fix the water-cooled plate to the test box.

[0020] Furthermore, in the heat dissipation module for the test chamber, the hook component has a pivot hole;

[0021] A rotating shaft is inserted through the rotating shaft hole;

[0022] The hook is rotatably hinged to the water-cooling plate through the pivot hole and the pivot.

[0023] The hook is equipped with a handle for easy operation.

[0024] Furthermore, in the heat dissipation module for the test chamber, the buckle groove is provided with anti-slip texture or locking device.

[0025] Furthermore, in the heat dissipation module of the test chamber, the water-cooled box is equipped with a level gauge and / or a temperature gauge.

[0026] Furthermore, in the heat dissipation module of the test chamber, the water-cooled box is a variable frequency water-cooled box.

[0027] Furthermore, in the heat dissipation module of the test chamber, the water-cooled plate is made of a material with high thermal conductivity;

[0028] The surface of the water-cooled plate is coated with a heat-conducting medium and / or an anti-corrosion coating.

[0029] Furthermore, in the heat dissipation module for the test chamber, inside the water-cooled plate, the density of the liquid flow channels arranged corresponding to the high heat generation area of ​​the integrated circuit board is large, and the density of the liquid flow channels arranged corresponding to the low heat generation area of ​​the integrated circuit board is small.

[0030] Compared with the prior art, the present invention has the following beneficial effects:

[0031] This utility model provides a heat dissipation module for a test chamber. By providing a water-cooled plate and designing the water-cooled plate to have dual functions, namely, fixing the integrated circuit board to be tested and dissipating heat from the integrated circuit board, the water-cooled plate and the circulation pipe located at the bottom of the water-cooled plate are placed inside the test chamber without occupying too much extra space. This achieves full and rational utilization of the internal space of the test chamber. At the same time, it can also add efficient heat dissipation measures to the test chamber, preventing excessive heat accumulation from damaging the integrated circuit board, which is conducive to its widespread application.

[0032] This invention has other features and advantages that will be apparent from or will be set forth in detail in the accompanying drawings and the following detailed description, which together serve to explain the particular principles of this invention. Attached Figure Description

[0033] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0034] Figure 1 This is one of the structural schematic diagrams of a heat dissipation module for a test chamber provided in this embodiment of the present invention;

[0035] Figure 2 This is a second schematic diagram of the structure of a heat dissipation module for a test chamber provided in this embodiment of the present invention;

[0036] Figure 3 This is a schematic diagram of the structure of the water-cooled plate provided in this embodiment of the utility model;

[0037] Figure 4 This is a schematic diagram of the structure of several water-cooled plates and circulation pipelines provided in the embodiments of this utility model;

[0038] Figure 5 This is a schematic diagram of the structure of the circulation pipeline provided in this embodiment of the utility model;

[0039] Figure 6 This is a schematic diagram of the structure of the water-cooled box provided in this embodiment of the utility model;

[0040] Figure 7 This is a schematic diagram of the structure of the air-cooled component provided in this embodiment of the utility model;

[0041] Figure 8 This is one of the structural schematic diagrams of the water-cooled plate, hook, and buckle groove provided in this utility model embodiment;

[0042] Figure 9 This is the second structural schematic diagram of the water-cooled plate, hook, and buckle groove provided in this embodiment of the utility model.

[0043] Figure label:

[0044] 1. Water-cooled plate, 2. Circulation pipeline, 3. Water-cooled box, 4. Water inlet, 5. Water outlet, 6. Liquid flow channel, 7. Air-cooled assembly, 8. Hook, 9. Clip groove, 10. Shaft, 11. Handle, 12. Test box, 13. Integrated circuit board. Detailed Implementation

[0045] Please refer to Figure 1-6 This utility model provides a heat dissipation module for a test chamber, including a water-cooled plate 1, a circulation pipeline 2, and a water-cooled box 3;

[0046] Specifically, the water-cooled plate 1 is arranged in the internal space of the test chamber 12, and its two opposing surfaces are given two important responsibilities: first, to securely install and clamp the integrated circuit board 13 to be tested, ensuring its stability and safety during the test process; second, to effectively dissipate the heat generated by the integrated circuit board 13 during operation through an efficient heat conduction mechanism, preventing it from overheating.

[0047] Next, the circulation pipe 2 is installed inside the test chamber 12, located at the bottom of the water-cooled plate 1, establishing a smooth liquid flow path between them. This design ensures that the coolant can circulate freely between the water-cooled plate 1 and the circulation pipe 2, thereby effectively improving heat dissipation efficiency.

[0048] Furthermore, the water-cooled enclosure 3 is located outside the test chamber 12 and does not occupy the internal space of the test chamber 12. It is connected to the circulation pipe 2 through a precise connection structure. The water-cooled enclosure 3 is not only responsible for injecting an appropriate amount of coolant into the circulation pipe 2 and the water-cooling plate 1, but also undertakes the important task of recovering and recycling this coolant, thus forming a complete, closed-loop heat dissipation circulation system.

[0049] The innovation of this embodiment lies in the introduction of a water-cooled plate 1 with dual functions: serving as both a mounting device for the integrated circuit board 13 and a primary means of heat dissipation. This significantly optimizes the internal space layout of the test chamber 12. Integrating the water-cooled plate 1 and its bottom circulation pipes 2 into the test chamber 12 not only avoids excessive encroachment on the internal space but also maximizes the utilization of space resources. Furthermore, this design provides the test chamber 12 with an efficient and reliable heat dissipation solution, effectively avoiding the risk of potential damage to the integrated circuit board due to heat accumulation, thus laying a solid foundation for the widespread promotion and application of the product.

[0050] Please refer to this again. Figure 3 To gain a deeper understanding of a specific implementation method in this embodiment, the water-cooled plate 1 is designed with two key interfaces: an inlet 4 and an outlet 5. These are respectively located at opposite ends of the water-cooled plate 1, ensuring smooth inflow and outflow of coolant. This layout not only helps improve heat dissipation efficiency but also facilitates connection and management in actual operation.

[0051] Furthermore, the internal structure of the water-cooled plate 1 is equally ingenious. It features several liquid flow channels 6, which are not simply arranged in straight lines, but rather employ a winding, interconnected design. This design not only significantly increases the contact area between the coolant and the interior of the water-cooled plate, thereby improving heat exchange efficiency, but also helps ensure that the coolant maintains a uniform flow rate and temperature distribution as it flows through the entire water-cooled plate, avoiding problems such as localized overheating or uneven cooling.

[0052] It is worth noting that the outermost channel among the several meandering liquid flow channels 6 is specifically designed to connect with the inlet 4, responsible for guiding the coolant into the water-cooled plate. The other outermost channel connects to the outlet 5, responsible for draining the coolant after heat exchange. This design not only ensures smooth coolant circulation but also makes the entire heat dissipation process more efficient and orderly.

[0053] In summary, this embodiment, through the design of the layout and direction of the water inlet 4, water outlet 5, and internal liquid flow channel 6 of the water-cooled plate 1, not only achieves efficient heat dissipation of the integrated circuit board, but also greatly optimizes the internal space utilization and heat dissipation performance of the test chamber, providing a solid guarantee for the stable operation and widespread application of the product.

[0054] Please refer to this again. Figure 2 and in conjunction with references Figure 7 To gain a more comprehensive understanding, this embodiment proposes a more complete heat dissipation solution, which specifically introduces an additional heat dissipation component, namely the air-cooling component 7.

[0055] In this embodiment, the air-cooling component 7 is disposed inside the test chamber 12 and positioned at the bottom of the water-cooled plate 1. This layout aims to fully utilize the advantages of combining air cooling and water cooling to form a more powerful and comprehensive heat dissipation system. The air-cooling component 7, through its internal fan or other airflow generating device, can continuously provide cooling airflow to the bottom of the water-cooled plate 1 and its surrounding environment, thereby effectively accelerating heat dissipation and further improving heat dissipation efficiency.

[0056] It is worth noting that the introduction of the air-cooling component 7 did not sacrifice the rationality of the internal space of the test chamber 12. On the contrary, through precise design and layout, the bottom space of the water-cooling plate 1 was made reasonable use. The air-cooling component 7 and the water-cooling plate 1 formed a harmonious coexistence relationship, jointly providing stable and efficient heat dissipation support for the integrated circuit boards inside the test chamber.

[0057] Furthermore, the operating status of the air-cooling component 7 can be intelligently adjusted according to actual needs. For example, when the integrated circuit board is in the initial stage of operation or under low load, the air-cooling component 7 can maintain a low speed to reduce noise and energy consumption; while under high load or during long-term operation, it can automatically increase the speed to meet higher heat dissipation requirements.

[0058] In summary, this embodiment introduces the air-cooled component 7 and combines it with heat dissipation components such as the water-cooled plate 1 to jointly construct an efficient, intelligent, and highly adaptable heat dissipation system, providing a more comprehensive and reliable heat dissipation guarantee for the integrated circuit boards inside the test chamber.

[0059] Please refer to Figure 8-9 This allows for a deeper understanding of an innovative fixing method in this embodiment. In this embodiment, the opposite side edges of the water-cooled plate 1 are specially designed with hooks 8. These hooks 8 are not only rationally shaped but also made of robust material, possessing excellent durability and reliability.

[0060] Meanwhile, on the inner wall of the test chamber 12, at the positions corresponding to the hook parts 8, there are snap-fit ​​grooves 9. The shape of these snap-fit ​​grooves 9 perfectly matches the hook parts 8, ensuring a tight fit and stable connection between the two.

[0061] During actual installation, the operator only needs to place the water-cooled plate 1 into the predetermined position inside the test chamber 12, and then gently push or rotate the latch 8 to allow it to smoothly engage with the latching groove 9. This process is not only simple and easy, but also greatly saves installation time and labor costs. More importantly, once the latch 8 is successfully engaged in the latching groove 9, the water-cooled plate 1 is firmly fixed inside the test chamber 12 without the need for additional fasteners or adhesives, thus effectively avoiding reduced heat dissipation performance or safety hazards caused by loosening or falling off.

[0062] Furthermore, the fastening method of this hook 8 and the latching slot 9 also provides excellent detachability. When it is necessary to replace or repair the water-cooled plate 1, or to remove the integrated circuit board 13 after testing, the operator can easily remove it from the latching slot 9 by simply unlocking the hook 8, without causing any damage to the test chamber 12 or the water-cooled plate 1.

[0063] In summary, this embodiment, by introducing the innovative fixing method of hook 8 and buckle groove 9, not only achieves rapid and stable installation of water-cooled plate 1 in test chamber 12, but also greatly improves the maintainability and flexibility of heat dissipation module.

[0064] Please observe carefully again. Figure 8-9 This allows for a deeper understanding of another innovative design regarding the hook component 8 in this embodiment. In this embodiment, the hook component 8 is not only designed to be fastened within the buckle groove 9 of the test chamber 12 to achieve a stable fixation of the water-cooled plate 1, but it also has a pivot hole.

[0065] The design of this pivot hole provides a flexible rotation mechanism for the hook component 8. Specifically, the pivot 10 is inserted into the pivot hole, allowing the hook component 8 to rotate around the pivot 10 at a certain angle. This rotatable hinge not only makes the hook component 8 more flexible and convenient during fastening and releasing, but also greatly improves the convenience of installation and user experience.

[0066] Even more thoughtfully, the hook component 8 is equipped with a convenient handle 11. The shape and size of this handle 11 have been carefully considered to ensure that the operator can easily grip and apply force, thereby smoothly completing the rotation and locking actions of the hook component 8. At the same time, the surface of the handle 11 is also designed with a non-slip surface, further improving the safety and stability of operation.

[0067] In practical applications, operators only need to gently grasp the handle 11 and apply appropriate force to rotate the hook 8 around the pivot 10 to easily install and remove the water-cooled plate 1 inside the test chamber 12. This process is not only simple and easy to perform, but also greatly saves time and effort, providing significant convenience for the maintenance and upgrading of the test chamber.

[0068] In summary, this embodiment, through the innovative design of introducing a pivot hole, a pivot 10, and an easy-to-operate handle 11, not only makes the rotation and fastening process of the hook 8 more flexible and convenient, but also greatly improves the convenience of installing the water-cooled plate 1 in the test chamber 12 and the user experience.

[0069] In one specific embodiment of this example, in order to further enhance the connection stability and safety between the water-cooled plate 1 and the test chamber 12, anti-slip textures or locking devices are specially provided in the buckle groove 9.

[0070] The anti-slip texture is inspired by natural patterns. It is engraved or printed on the inner wall of the snap-fit ​​groove 9, forming a series of tiny, dense bumps or grooves. These anti-slip textures not only increase the friction between the snap hook 8 and the snap-fit ​​groove 9, preventing accidental detachment due to vibration or external force, but also provide clear visual guidance for installation, helping operators to more accurately perform the snap-fit ​​action of the snap hook 8.

[0071] The locking device is a more advanced fixing method. It typically includes a movable latch or pin. When the hook 8 is successfully engaged with the latch slot 9, the latch or pin will automatically or manually move to the locking position, thus firmly securing the hook 8 and preventing it from accidentally loosening or falling off. This locking device not only provides higher connection stability but also allows for easy unlocking and release of the hook 8 when needed, greatly facilitating the maintenance and replacement of the water-cooled plate 1.

[0072] In summary, by incorporating anti-slip textures or locking devices within the snap-fit ​​groove 9, this embodiment not only significantly improves the connection stability and safety between the water-cooled plate 1 and the test chamber 12, but also provides strong assurance for the overall performance and reliability of the test chamber 12. This design undoubtedly lays a solid foundation for the efficient operation and long-term stability of the test chamber 12.

[0073] In one specific embodiment of this example, in order to more accurately monitor and manage the state of the coolant in the water-cooled tank 3, a level gauge and / or a temperature gauge are installed on the water-cooled tank 3.

[0074] The level gauge is designed to monitor the coolant level in the water-cooled tank 3 in real time. It typically employs float, capacitive, or ultrasonic principles to accurately reflect the height or volume of the coolant in the tank. Through the level gauge, operators can visually understand the remaining coolant level and replenish it promptly, preventing decreased heat dissipation performance or equipment damage due to low levels.

[0075] The temperature gauge is used to monitor the temperature of the coolant inside the water-cooled chamber 3. It typically uses sensing technologies such as thermistors, thermocouples, or infrared to measure and display the coolant temperature in real time. Through the temperature gauge, operators can accurately assess the coolant's heat dissipation effect and determine whether adjustments to the cooling system's operating parameters are necessary to ensure that the integrated circuit board 13 inside the test chamber 12 remains within a suitable operating temperature range.

[0076] It is worth noting that the water-cooled tank 3 in this embodiment can be equipped with a level gauge or a temperature gauge alone, or both, to meet the monitoring needs of different application scenarios. Furthermore, these monitoring devices can be connected to the control system of the test chamber 12 to achieve remote monitoring and automated control, further improving the intelligence level and operating efficiency of the test chamber 12.

[0077] In summary, by installing a level gauge and / or temperature gauge on the water-cooled tank 3, this embodiment not only provides operators with more intuitive and accurate information on the coolant status, but also provides a strong guarantee for the efficient operation and long-term stability of the test chamber 12.

[0078] In one specific embodiment of this invention, a variable frequency water-cooled box is used as one of the core components of the heat dissipation system. This innovative design not only improves the flexibility and efficiency of the heat dissipation system but also further reduces energy consumption and operating costs.

[0079] The core of the variable frequency water-cooled chamber lies in its built-in variable frequency drive. Compared with traditional fixed frequency water-cooled chambers, the variable frequency water-cooled chamber can automatically adjust the circulation speed of the coolant and the power output of the pump according to the actual heat dissipation requirements inside the test chamber 12. When the integrated circuit board 13 inside the test chamber 12 is under low load or in standby mode, the variable frequency water-cooled chamber will reduce the circulation speed of the coolant and the power of the pump to reduce energy consumption and noise; while when the integrated circuit board 13 is under high load or in operation, the variable frequency water-cooled chamber will rapidly increase the circulation speed of the coolant and the power of the pump to ensure that the heat dissipation system can remove heat in a timely and effective manner, preventing the integrated circuit board 13 from overheating.

[0080] Furthermore, variable frequency water-cooled boxes possess excellent stability and durability. Their built-in variable frequency drives typically employ advanced control algorithms and high-quality electronic components, ensuring stable performance output during prolonged, high-load operation. Simultaneously, variable frequency water-cooled boxes feature multiple protection mechanisms against overheating, overcurrent, and overvoltage, enabling timely shutdown in case of abnormal conditions to prevent equipment damage and safety accidents.

[0081] In summary, by using a variable frequency water-cooled box as the core component of the heat dissipation system, this embodiment not only improves the flexibility and efficiency of the heat dissipation system, but also further reduces energy consumption and operating costs.

[0082] In one specific embodiment of this example, the material selection and surface treatment of the water-cooled plate 1 were designed and optimized to further improve its heat dissipation performance and durability.

[0083] First, the water-cooled plate 1 is made of a material with high thermal conductivity. High thermal conductivity materials have excellent heat transfer properties, enabling them to quickly transfer the heat generated by the integrated circuit board 13 to the coolant, thus achieving efficient heat dissipation. Common high thermal conductivity materials include copper, aluminum, and their alloys. These materials not only have excellent thermal conductivity but also good mechanical and processing properties, meeting the needs of different application scenarios.

[0084] Secondly, to further improve the heat dissipation effect of the water-cooled plate 1, a thermally conductive medium is coated on its surface. A thermally conductive medium is a substance that can accelerate heat transfer; it typically has low thermal resistance and high thermal conductivity. By coating the surface of the water-cooled plate 1 with a thermally conductive medium, the thermal resistance during heat transfer can be further reduced, improving heat dissipation efficiency. Simultaneously, the thermally conductive medium also protects the surface of the water-cooled plate 1, preventing oxidation or corrosion due to prolonged exposure to high-temperature environments.

[0085] In addition, to extend the service life of the water-cooled plate 1 and prevent corrosion from the coolant, an anti-corrosion coating is applied to its surface. This anti-corrosion coating is typically made of materials with excellent corrosion resistance, such as epoxy resin or polytetrafluoroethylene. These materials effectively isolate the coolant from direct contact with the surface of the water-cooled plate 1, thus preventing corrosion. Simultaneously, the anti-corrosion coating also enhances the wear resistance and scratch resistance of the water-cooled plate 1 surface, improving its overall durability.

[0086] In summary, by using a material with high thermal conductivity to make the water-cooled plate 1 and coating its surface with a thermally conductive medium and / or an anti-corrosion coating, this embodiment significantly improves the heat dissipation performance and durability of the water-cooled plate 1.

[0087] In one specific embodiment of this invention, particular attention is paid to the layout design of the liquid flow channels 6 inside the water-cooled plate 1, aiming to achieve more precise and efficient heat dissipation. To achieve this goal, the density of the liquid flow channels 6 is optimized according to the heat generation conditions in different areas of the integrated circuit board 13.

[0088] Specifically, the density of the liquid flow channels 6 is increased in the high-heat areas of the integrated circuit board 13. This means that in the high-heat areas, the coolant will have more channels and a larger contact area to absorb and remove heat. This design ensures that the high-heat areas can be cooled in a timely and effective manner under high load or long-term operation, thereby preventing the integrated circuit board 13 from malfunctioning or experiencing performance degradation due to overheating.

[0089] Conversely, the density of the liquid flow channels 6 is reduced in the low-heat areas of the integrated circuit board 13. This reduces the flow resistance and energy consumption of the coolant in these areas while still meeting basic heat dissipation requirements. By optimizing the layout of the liquid flow channels 6, a balance between heat dissipation performance and energy consumption can be achieved, further improving the overall efficiency of the test chamber.

[0090] Furthermore, this design, which optimizes the density of the liquid flow channel 6 based on heat generation, can also provide customized heat dissipation solutions for different integrated circuit boards within the test chamber. Different integrated circuit boards may have different heat generation patterns and heat distribution characteristics. By adjusting the layout of the liquid flow channel 6, these differences can be better accommodated, achieving more precise and efficient heat dissipation.

[0091] In summary, by optimizing the layout design of the liquid flow channel 6 inside the water-cooled plate 1 according to the heat generation of the integrated circuit board 13, this embodiment improves the accuracy and efficiency of the heat dissipation system.

[0092] This utility model provides a heat dissipation module for a test chamber. By providing a water-cooled plate and designing the water-cooled plate to have dual functions, namely, fixing the integrated circuit board to be tested and dissipating heat from the integrated circuit board, the water-cooled plate and the circulation pipe located at the bottom of the water-cooled plate are placed inside the test chamber without occupying too much extra space. This achieves full and reasonable utilization of the internal space of the test chamber. At the same time, it can also add efficient heat dissipation measures to the test chamber, preventing excessive heat accumulation from damaging the integrated circuit board, which is conducive to its widespread application.

Claims

1. A heat dissipation module for a test chamber, characterized in that, It includes a water-cooled plate (1), a circulation pipeline (2), and a water-cooled box (3); The water-cooled plate (1) is disposed inside the test chamber (12). The two opposite surfaces of the water-cooled plate (1) are used to fix the integrated circuit board (13) to be tested and to dissipate heat from the integrated circuit board (13). The circulation pipeline (2) is located inside the test chamber (12), at the bottom of the water-cooled plate (1), and is connected to the water-cooled plate (1); The water-cooled box (3) is located outside the test box (12) and is connected to the circulation pipeline (2) to inject coolant into the water-cooled plate (1) and to recover the coolant.

2. The heat dissipation module for the test chamber according to claim 1, characterized in that, The water-cooled plate (1) is provided with an inlet (4) and an outlet (5), and the inlet (4) and the outlet (5) are located at opposite ends of the water-cooled plate (1); The water-cooled plate (1) has several liquid channels (6) arranged in sequence inside, and the several liquid channels (6) are connected end to end to form a meandering shape; The liquid flow channel (6) located on one of the outermost sides is connected to the water inlet (4); The liquid flow channel (6) located on the other outermost side is connected to the outlet (5).

3. The heat dissipation module for the test chamber according to claim 1, characterized in that, It also includes air-cooled components (7); The air-cooled component (7) is disposed inside the test chamber (12) and located at the bottom of the water-cooled plate (1).

4. The heat dissipation module for the test chamber according to claim 1, characterized in that, The water-cooled plate (1) is provided with hooks (8) on its opposite sides. The test box (12) has a buckle groove (9) on the inner wall corresponding to the hook (8); The hook (8) can be fastened in the buckle groove (9) to fix the water-cooled plate (1) to the test box (12).

5. The heat dissipation module for the test chamber according to claim 4, characterized in that, The hook (8) is provided with a pivot hole; A rotating shaft (10) is inserted through the rotating shaft hole. The hook (8) is rotatably hinged to the water-cooled plate (1) through the pivot hole and the pivot (10); The hook (8) is provided with a handle (11) for easy operation.

6. The heat dissipation module for the test chamber according to claim 4, characterized in that, The buckle groove (9) is provided with anti-slip texture or locking device.

7. The heat dissipation module for the test chamber according to claim 1, characterized in that, The water-cooled box (3) is equipped with a level gauge and / or a temperature gauge.

8. The heat dissipation module for the test chamber according to claim 1, characterized in that, The water-cooled box (3) is a variable frequency water-cooled box.

9. The heat dissipation module for the test chamber according to claim 1, characterized in that, The water-cooled plate (1) is made of a material with high thermal conductivity; The surface of the water-cooled plate (1) is coated with a heat-conducting medium and / or an anti-corrosion coating.

10. The heat dissipation module for the test chamber according to claim 2, characterized in that, Inside the water-cooled plate (1), the density of the liquid flow channels (6) arranged corresponding to the high heat generation area of ​​the integrated circuit board (13) is large, and the density of the liquid flow channels (6) arranged corresponding to the low heat generation area of ​​the integrated circuit board (13) is small.

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