IGBT module shock absorption and buffering transportation structure
By employing a multi-layered shock absorption mechanism and clamping limit protection, the problem of damage during IGBT module transportation is solved, achieving stable transportation and protection of IGBT modules, extending service life, and improving system reliability and safety.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- JIANGSU JIJI MICRO SEMICON CO LTD
- Filing Date
- 2025-07-07
- Publication Date
- 2026-06-19
AI Technical Summary
The existing IGBT module transport structure has insufficient shock absorption capacity under high-frequency vibration and low-frequency large-amplitude impact, which cannot effectively protect the internal structure and cannot be closely adapted to modules of different specifications, resulting in damage and displacement during transportation.
A multi-layered damping mechanism is adopted, including dampers and damping springs in conjunction with connecting rods and springs, combined with threaded rods and clamping plates, to protect the IGBT module through clamping and limiting, and rubber protective pads are used to prevent friction damage.
It effectively dampens the impact force during transportation, prevents IGBT module shaking and wear, ensures the stability and integrity of the module during transportation, extends service life, and improves system reliability and safety.
Smart Images
Figure CN224376502U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of IGBT module transportation technology, and in particular to an IGBT module shockproof and buffer transportation structure. Background Technology
[0002] IGBT (Insulated Gate Bipolar Transistor) modules, as core power devices in modern power electronic equipment, have a precise and complex structure, containing critical components such as fragile silicon chips, delicate solder joints, and ceramic substrates. During transportation, especially over long distances or in poor road conditions, the continuous vibration, bumps, and occasional severe impacts generated by the transport vehicle can easily be transmitted to the module's interior through the packaging. This mechanical stress can lead to irreversible damage such as solder joint detachment, silicon chip breakage, or microcracks in the substrate. This can range from affecting module performance parameters to causing module failure, resulting in significant economic losses and threatening the reliability and safety of the entire power electronic system.
[0003] Currently, common IGBT module transportation structures often employ simple foam filling, corrugated cardboard partitions, or a single shock-absorbing pad. These methods have significant shortcomings. Their shock absorption capacity is limited and singular. Single-layer shock absorption structures (such as using only foam or ordinary springs) are ineffective in absorbing and attenuating high-frequency vibrations and low-frequency large-amplitude impacts. They are unable to effectively filter and disperse the multi-frequency and multi-intensity mechanical energy transmitted under complex transportation conditions, and cannot provide sufficient and multi-layered buffer protection for the fragile IGBT modules. At the same time, traditional fixed-size fillers or simple limiting blocks often cannot tightly fit IGBT modules of different specifications. During transportation bumps, the modules are prone to displacement and shaking inside the packaging box, causing their outer walls to collide and rub against the rigid packaging box or other components, resulting in scratches, deformation, or even damage to the internal structure.
[0004] To address this, a shock-resistant and buffered transport structure for IGBT modules is proposed. Utility Model Content
[0005] Given that the above-mentioned conventional devices are not effective in absorbing and attenuating high-frequency vibrations and low-frequency large-amplitude impacts, this utility model is proposed.
[0006] To solve the above technical problems, this utility model provides the following technical solution: an IGBT module shockproof and buffer transportation structure, including a housing, two pull-out plates, a shock-absorbing component, and a clamping component. The two pull-out plates are disposed inside the housing. The shock-absorbing component is disposed on the upper surface of the pull-out plates. The clamping component is disposed on the shock-absorbing component. The shock-absorbing component includes two placement plates, which are respectively disposed on the upper end of the pull-out plates. Multiple first connecting plates are fixedly connected to the upper surface of each pull-out plate, and multiple second connecting plates are fixedly connected to the lower surface of each placement plate. Dampers are fixedly connected to both sides of the upper surface of each of the first connecting plates. Shock-absorbing springs are sleeved on the outside of each damper. The upper end of each damper is fixedly connected to the second connecting plate, and the lower end of each shock-absorbing spring is tightly fitted to the first connecting plate. The upper end of each shock-absorbing spring is tightly fitted to the second connecting plate.
[0007] As a preferred embodiment of the IGBT module shockproof and buffer transportation structure of this utility model, the upper surface of the first connecting plate near both sides and the lower surface of the second connecting plate near both sides are hinged to connecting rods, and one end of each connecting rod is hinged to a connecting spring. The four corners of the upper surface of the pull-out plate are fixedly connected to limit rods, and the four corners of the limit rods are all sleeved inside the four corners of the placement plate.
[0008] As a preferred embodiment of the shockproof and buffered transportation structure for IGBT modules described in this utility model, the clamping assembly includes two mounting blocks, which are respectively fixedly connected to the rear end of the upper surface of the placement plate. A sliding groove is provided in the middle of the outer wall of the front end of each mounting block, and a threaded rod is rotatably connected inside the sliding groove. The thread on the outer wall of the threaded rod is multi-segmented, and multiple threaded sleeves are fitted on the outer wall of the threaded rod.
[0009] As a preferred embodiment of the shockproof and buffered transportation structure for IGBT modules described in this utility model, wherein: a clamping plate is fixedly connected to the outer wall of the front end of the threaded sleeve, a rubber protective pad is fixedly connected to the outer wall of the clamping plate on the side near the clamping, a through groove is opened at the upper and lower ends of the outer wall of one side of the housing, one side of the threaded rod passes through the through groove to the outside of the housing, a rotating plate is fixedly connected to the outer wall of the threaded rod on the side near the through groove, a limiting plate is fixedly connected to the front end of the upper surface of the placement plate, and the front end of the clamping plate slides inside the limiting plate.
[0010] As a preferred embodiment of the shockproof and buffered transportation structure for IGBT modules described in this utility model, a placement box is fixedly connected to the upper and lower ends of one side of the inner wall of the box, and multiple through holes are opened on the upper surface of the placement box, and a placement drawer is slidably connected inside the placement box.
[0011] As a preferred embodiment of the shockproof and buffered transport structure for IGBT modules described in this utility model, the front end of the housing is hinged to a door, a transparent observation window is provided in the middle of the door, a second handle is fixedly connected to the middle of one side of the front outer wall of the door, and an anti-slip rubber pad is fixedly connected to the lower surface of the housing.
[0012] The beneficial effects of this utility model's shockproof and buffer transport structure for IGBT modules are as follows:
[0013] 1. Through the careful design and configuration of dampers and shock-absorbing springs, these two components work together with the connecting rod and connecting spring to form a synergistic shock absorption effect, which can further and effectively attenuate the impact force transmitted from the bottom of the housing. This multi-layered shock absorption mechanism can not only significantly reduce the negative impact caused by vibration during transportation, but also specifically reduce the potential damage of vibration to the IGBT module, thereby achieving effective protection of the IGBT module, ensuring that it maintains a stable working state during transportation, extending its service life, and thus improving the reliability and safety of the overall system.
[0014] 2. By rotating the threaded rod, relative displacement between two adjacent threaded sleeves can be achieved. This allows the clamping plate to effectively clamp and limit the two sides of the IGBT module, preventing the IGBT module from impacting the inside of the housing due to shaking during transportation and thus avoiding damage to the outer wall of the IGBT module. In addition, by installing a rubber protective pad between the clamping plate and the IGBT module, direct contact between the two can be effectively avoided, preventing wear on the outer wall of the IGBT module due to friction. This further enhances the protection effect of the outer wall of the IGBT module and ensures its safety and integrity during transportation. Attached Figure Description
[0015] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort. Among them:
[0016] Figure 1 This is a schematic diagram of the overall structure of this utility model.
[0017] Figure 2 This is a schematic diagram of the internal structure of the box in this utility model.
[0018] Figure 3 This is a structural schematic diagram of the front view of the box body of this utility model.
[0019] Figure 4This is a schematic diagram of the clamping assembly of this utility model.
[0020] Figure 5 for Figure 3 A magnified structural diagram of point A in the middle.
[0021] Explanation of reference numerals in the attached figures:
[0022] 1. Box body; 2. Pull-out panel; 3. Shock-absorbing assembly; 31. Placement plate; 32. First connecting plate; 33. Second connecting plate; 34. Damper; 35. Shock-absorbing spring; 36. Connecting rod; 37. Connecting spring; 38. Limiting rod; 4. Clamping assembly; 41. Mounting block; 42. Slide groove; 43. Threaded rod; 44. Threaded sleeve; 45. Clamping plate; 46. Rubber protective pad; 47. Through groove; 48. Rotating plate; 49. Limiting plate; 5. Placement box; 6. Through hole; 7. Placement drawer; 8. Box door; 9. Transparent observation window; 10. Second handle; 11. Anti-slip rubber pad. Detailed Implementation
[0023] To make the above-mentioned objectives, features and advantages of this utility model more apparent and understandable, the specific embodiments of this utility model will be described in detail below with reference to the accompanying drawings.
[0024] Example 1
[0025] Reference Figure 1-5 This is the first embodiment of the present invention, providing a shock-absorbing and buffering transport structure for IGBT modules, including a housing 1, two pull-out plates 2, a shock-absorbing component 3, and a clamping component 4. The two pull-out plates 2 are disposed inside the housing 1, the shock-absorbing component 3 is disposed on the upper surface of the pull-out plates 2, and the clamping component 4 is disposed on the shock-absorbing component 3. The shock-absorbing component 3 includes two placement plates 31, which are respectively disposed on the upper end of the pull-out plates 2. Multiple first connecting plates 32 are fixedly connected to the upper surface of each pull-out plate 2, and multiple second connecting plates 33 are fixedly connected to the lower surface of each placement plate 31. Both sides of the upper surface of the first connecting plates 32 are fixedly connected to... A damper 34 is connected, and a shock-absorbing spring 35 is fitted on the outside of each damper 34. The upper end of each damper 34 is fixedly connected to the second connecting plate 33. The lower end of each shock-absorbing spring 35 is tightly fitted to the first connecting plate 32. The upper end of each shock-absorbing spring 35 is tightly fitted to the second connecting plate 33. Connecting rods 36 are hinged to the upper surfaces of the first connecting plate 32 near both sides and the lower surfaces of the second connecting plate 33 near both sides. Connecting springs 37 are hinged to one end of each connecting rod 36. Limiting rods 38 are fixedly connected to the four corners of the upper surface of the pull-out plate 2. The four corners of the limiting rods 38 are fitted inside the four corners of the placement plate 31.
[0026] Furthermore, through the careful design and configuration of the damper 34 and the shock-absorbing spring 35, which work together with the connecting rod 36 and the connecting spring 37 to form a synergistic shock-absorbing effect, the impact force transmitted from the bottom of the housing 1 can be further effectively attenuated. This multi-layered shock-absorbing mechanism can not only significantly reduce the negative impact caused by vibration during transportation, but also specifically reduce the potential damage of vibration to the IGBT module, thereby achieving effective protection of the IGBT module, ensuring that it maintains a stable working state during transportation, extending its service life, and thus improving the reliability and safety of the overall system.
[0027] Example 2
[0028] Reference Figure 1-5 This is the second embodiment of the present invention, which differs from the first embodiment in that:
[0029] The clamping assembly 4 includes two mounting blocks 41, which are fixedly connected to the rear end of the upper surface of the placement plate 31. Each mounting block 41 has a groove 42 in the middle of its front outer wall. A threaded rod 43 is rotatably connected inside each groove 42. The thread on the outer wall of the threaded rod 43 is multi-segmented. Multiple threaded sleeves 44 are fitted onto the outer wall of the threaded rod 43. A clamping plate 45 is fixedly connected to the outer wall of each threaded sleeve 44. A rubber protective pad 46 is fixedly connected to the outer wall of the clamping plate 45 on the side closest to the clamping point. A through groove 47 is provided at the upper and lower ends of one side of the outer wall of the housing 1. One side of the threaded rod 43 passes through the through groove 47 to the housing 1. Externally, rotating plates 48 are fixedly connected to the outer wall of the threaded rod 43 near the through groove 47. Limiting plates 49 are fixedly connected to the front end of the upper surface of the placement plate 31. The front end of the clamping plate 45 slides inside the limiting plate 49. Placement boxes 5 are fixedly connected to the upper and lower ends of one side of the inner wall of the box body 1. Multiple through holes 6 are opened on the upper surface of the placement box 5. Placement drawers 7 are slidably connected inside the placement box 5. Box door 8 is hinged to the front end of the box body 1. A transparent observation window 9 is provided in the middle of the box door 8. A second handle 10 is fixedly connected to the middle of one side of the outer wall of the front end of the box door 8. Anti-slip rubber pads 11 are fixedly connected to the lower surface of the box body 1.
[0030] Furthermore, by rotating the threaded rod 43, relative displacement between two adjacent threaded sleeves 44 can be achieved. This allows the clamping plate 45 to effectively clamp and limit the two sides of the IGBT module, preventing the IGBT module from impacting the inside of the housing 1 due to shaking during transportation and thus avoiding damage to the outer wall of the IGBT module. In addition, by installing a rubber protective pad 46 between the clamping plate 45 and the IGBT module, direct contact between the two can be effectively avoided, preventing wear on the outer wall of the IGBT module due to friction. This further enhances the protection effect of the outer wall of the IGBT module and ensures its safety and integrity during transportation.
[0031] The remaining structure is the same as that in Example 1.
[0032] The specific operating principle of this utility model is as follows:
[0033] By opening the box door 8, the IGBT module is placed between the clamping plates 45 on the upper surface of the placement plate 31. By rotating the threaded rod 43, the relative displacement between two adjacent threaded sleeves 44 can be achieved. The clamping plates 45 effectively clamp and limit the two sides of the IGBT module, thereby preventing the IGBT module from impacting the inside of the box 1 due to shaking during transportation, thus avoiding damage to the outer wall of the IGBT module. In addition, by installing a rubber protective pad 46 between the clamping plate 45 and the IGBT module, direct contact between the two can be effectively avoided, preventing wear on the outer wall of the IGBT module due to friction, further improving the protection effect of the outer wall of the IGBT module, and ensuring its safety and integrity during transportation.
[0034] Then, place a desiccant bag inside drawer 7 to prevent sea transport or extremely humid environments from affecting the IGBT modules inside the enclosure 1;
[0035] During transportation, the carefully designed and configured damper 34 and shock-absorbing spring 35 work together with the connecting rod 36 and connecting spring 37 to form a synergistic shock absorption effect, which can further effectively attenuate the impact force transmitted from the bottom of the housing 1. This multi-layered shock absorption mechanism can not only significantly reduce the negative impact caused by vibration during transportation, but also specifically reduce the potential damage of vibration to the IGBT module, thereby achieving effective protection of the IGBT module, ensuring that it maintains a stable working state during transportation, extending its service life, and thus improving the reliability and safety of the overall system.
[0036] It should be noted that the above embodiments are only used to illustrate the technical solution of this utility model and are not intended to limit it. Although this utility model has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solution of this utility model without departing from the spirit and scope of the technical solution of this utility model, and all such modifications or substitutions should be covered within the scope of the claims of this utility model.
Claims
1. A shockproof and buffered transport structure for IGBT modules, characterized in that, The device includes a housing (1), two pull-out panels (2), a shock-absorbing assembly (3), and a clamping assembly (4). The two pull-out panels (2) are located inside the housing (1). The shock-absorbing assembly (3) is located on the upper surface of the pull-out panels (2). The clamping assembly (4) is located on the shock-absorbing assembly (3). The shock-absorbing assembly (3) includes two placement plates (31), which are respectively located at the upper end of the pull-out panels (2). Multiple first connecting plates (32) are fixedly connected to the upper surface of each pull-out panel (2). The lower surface of the placement plate (31) is fixedly connected with a plurality of second connecting plates (33). The upper surface of the first connecting plate (32) is fixedly connected with dampers (34) on both sides. The dampers (34) are all fitted with shock-absorbing springs (35). The upper end of the dampers (34) is fixedly connected to the second connecting plate (33). The lower end of the shock-absorbing springs (35) is tightly fitted to the first connecting plate (32). The upper end of the shock-absorbing springs (35) is tightly fitted to the second connecting plate (33).
2. The shock-absorbing and buffering transport structure for an IGBT module according to claim 1, characterized in that... The upper surfaces of the first connecting plate (32) and the lower surfaces of the second connecting plate (33) near both sides are hinged to connecting rods (36). One end of each connecting rod (36) is hinged to a connecting spring (37). The four corners of the upper surface of the pull plate (2) are fixedly connected to limit rods (38). The four corners of the limit rods (38) are fitted inside the four corners of the placement plate (31).
3. The shock-absorbing and buffering transport structure for IGBT modules according to claim 1, characterized in that... The clamping assembly (4) includes two mounting blocks (41), which are fixedly connected to the rear end of the upper surface of the placement plate (31). Each mounting block (41) has a groove (42) in the middle of the outer wall of its front end. Each groove (42) is rotatably connected to a threaded rod (43). The thread on the outer wall of the threaded rod (43) is multi-segmented, and multiple threaded sleeves (44) are fitted on the outer wall of the threaded rod (43).
4. The IGBT module shockproof and buffer transport structure according to claim 3, characterized in that... The outer wall of the front end of the threaded sleeve (44) is fixedly connected to a clamping plate (45). The outer wall of the clamping plate (45) near the clamping side is fixedly connected to a rubber protective pad (46). The upper and lower ends of the outer wall of the box body (1) are provided with through grooves (47). One side of the threaded rod (43) passes through the through groove (47) to the outside of the box body (1). The outer wall of the threaded rod (43) near the through groove (47) is fixedly connected to a rotating plate (48). The front end of the upper surface of the placement plate (31) is fixedly connected to a limiting plate (49). The front end of the clamping plate (45) slides inside the limiting plate (49).
5. The shockproof and buffering transport structure for an IGBT module according to claim 1, characterized in that... The upper and lower ends of the inner wall of the box (1) are fixedly connected to a placement box (5). The upper surface of the placement box (5) is provided with multiple through holes (6). The interior of the placement box (5) is slidably connected with a placement drawer (7).
6. The shock-absorbing and buffering transport structure for an IGBT module according to claim 1, characterized in that... The front end of the box (1) is hinged to a door (8), a transparent observation window (9) is provided in the middle of the door (8), a second handle (10) is fixedly connected to the middle of one side of the front outer wall of the door (8), and an anti-slip rubber pad (11) is fixedly connected to the lower surface of the box (1).