Capacitor assembly

By stacking and vertically interlocking capacitors and conductive plates, and using insulating film to limit solder wrapping, the problems of insufficient space utilization and solder cracking of capacitor components on the system substrate are solved, achieving higher space utilization, lower impedance, and more stable power supply.

CN224384089UActive Publication Date: 2026-06-19DELTA ELECTRONICS INC(CN)
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
DELTA ELECTRONICS INC(CN)
Filing Date
2025-05-12
Publication Date
2026-06-19

AI Technical Summary

Technical Problem

In the prior art, when the number of capacitors on the system substrate increases, it leads to insufficient space utilization, high impedance and poor heat dissipation, and the cantilever structure is prone to solder cracking, affecting the stability of power supply.

Method used

By stacking a capacitor, a first conductive plate, an insulating plate, and a second conductive plate, the capacitor pins are electrically connected to the conductive plate and are perpendicularly inserted into the system substrate through the plug-in part. Combined with the insulating film to restrict the extension direction of the solder package, the impedance is reduced and the space utilization is increased.

Benefits of technology

It improves the space utilization of capacitor components, reduces impedance and solder cracking risks, and enhances power supply stability and heat dissipation.

✦ Generated by Eureka AI based on patent content.

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Abstract

A capacitor assembly is assembled on a system substrate. The capacitor assembly includes a capacitor, a first conductive plate, an insulating plate, and a second conductive plate, which are stacked sequentially. The capacitor includes a first lead and a second lead, which are electrically connected to the first conductive plate and the second conductive plate, respectively. The first conductive plate includes a first insertion portion, and the second conductive plate includes a second insertion portion. The capacitor assembly is inserted into the system substrate through the first and second insertion portions, thereby electrically connecting the entire capacitor assembly to the system substrate. The material properties of the first and second conductive plates reduce conductivity and improve thermal conductivity, further enhancing the utilization rate of the capacitor within the capacitor assembly's area.
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