A waterproof PCB

Abstract

This utility model relates to the field of PCB board technology and discloses a waterproof PCB board, including a bottom shell, a top shell on the top surface of the bottom shell, a circuit board body inside the bottom shell, a sealing structure for protecting the circuit board body on the top surface of the bottom shell, and a heat dissipation structure for dissipating heat from the circuit board body on the bottom surface of the bottom shell. The sealing structure includes a sealing groove on the top surface of the bottom shell. This utility model achieves efficient waterproofing, dustproofing, and heat dissipation of the circuit board through the sealing and heat dissipation structures. The sealing ring and sealing gasket form a multiple seal, providing IPX-level or higher protection, effectively preventing moisture and dust intrusion. The heat-conducting pillars quickly transfer heat from the circuit board to the heat dissipation fins on the outside of the bottom shell, combined with air convection to achieve efficient heat dissipation, ensuring stable operation of components in high-temperature or humid environments, significantly extending equipment lifespan, and is suitable for outdoor and industrial control scenarios.

Description

Technical Field

[0001] This utility model relates to the field of PCB board technology, and in particular to a waterproof PCB board. Background Technology

[0002] Printed circuit boards (PCBs) are the core carriers of electronic devices. They form conductive lines on an insulating substrate through etching processes to achieve electrical interconnection and mechanical fixation of electronic components. They are widely used in communication equipment, industrial control, automotive electronics, and consumer electronics. As electronic devices penetrate into outdoor, automotive, and humid environments, PCBs face severe threats from liquid environments.

[0003] An existing waterproof PCB circuit board (publication number: CN219499811U) has at least the following drawbacks: Although the above-mentioned device protects the circuit board inside the mounting frame with a waterproof shell and uses graphite heat sinks to dissipate heat from the circuit board inside the shell, there is a gap between the protective shell and the mounting frame after installation, resulting in poor sealing. Furthermore, heat accumulates on the graphite heat sinks inside the sealed frame, causing a combined deterioration in waterproof and heat dissipation performance. As a result, the waterproof and heat dissipation effect of the device is poor. Therefore, we propose this utility model. Utility Model Content

[0004] The purpose of this invention is to address the shortcomings of existing technologies by proposing a waterproof PCB board.

[0005] To achieve the above objectives, the present invention adopts the following technical solution:

[0006] A waterproof PCB board includes a bottom shell, a top shell on the top surface of the bottom shell, a circuit board body inside the bottom shell, a sealing structure for protecting the circuit board body on the top surface of the bottom shell, and a heat dissipation structure for dissipating heat from the circuit board body on the bottom surface of the bottom shell. The sealing structure includes a sealing groove on the top surface of the bottom shell, a plurality of first sealing rings fixed inside the sealing groove, the plurality of first sealing rings being evenly distributed along the depth direction of the sealing groove, a frame plate fixed to the bottom surface of the top shell, the frame plate being slidably inserted into the interior of the sealing groove, and the plurality of first sealing rings respectively abutting against the inner and outer walls of the frame plate.

[0007] As a further embodiment of this utility model, a second sealing ring is fixed to the bottom surface of the top shell, the second sealing ring abuts against the top surface of the bottom shell, a fixing seat is fixed to each of the four inner corners of the bottom shell, and a countersunk hole is opened at each of the four corners of the top surface of the top shell. A screw is threaded into the inside of the countersunk hole, the screw is threaded into the fixing seat, and a sealing washer is fitted on the outer circular wall of the screw, the bottom surface of the sealing washer abuts against the countersunk hole.

[0008] As a further embodiment of this utility model, the heat dissipation structure includes a fixing groove formed inside the bottom surface of the bottom shell, a heat sink fixed inside the bottom surface of the fixing groove, the circuit board body being fixed to the inside of the fixing groove by bolts, the top surface of the heat sink being in contact with the bottom surface of the circuit board body, a plurality of heat-conducting pillars being fixed to the bottom surface of the heat sink, the bottom ends of the plurality of heat-conducting pillars all penetrating the inside bottom surface of the bottom shell and extending to the outside, a plurality of heat dissipation fins being fixed to the bottom surface of the bottom shell, the plurality of heat dissipation fins being arranged in parallel and fixed to the heat-conducting pillars.

[0009] As a further embodiment of this utility model, a mounting shell is fixed to the bottom surface of the bottom shell. The mounting shell is U-shaped, and the heat dissipation fins are located inside the mounting shell.

[0010] As a further embodiment of this utility model, the bottom surface of the bottom shell is fixed with two mounting seats, which are L-shaped.

[0011] As a further embodiment of this utility model, the bottom surface of the bottom shell is fixed with two mounting seats, which are L-shaped.

[0012] Compared with the prior art, the present invention has the following beneficial effects:

[0013] This PCB board achieves efficient waterproofing, dustproofing, and heat dissipation through its sealed and heat dissipation structures. Multiple seals, formed by sealing rings and gaskets, provide IPX-level or higher protection, effectively preventing moisture and dust intrusion. Heat-conducting pillars rapidly transfer heat from the circuit board to the external heat dissipation fins of the base shell, combined with air convection for efficient heat dissipation. This ensures stable operation of components in high-temperature or humid environments, significantly extending equipment lifespan. It is suitable for outdoor and industrial control applications. Attached Figure Description

[0014] Figure 1 This is a structural schematic diagram of a waterproof PCB board proposed in this utility model;

[0015] Figure 2 This is a schematic diagram showing the disassembled structure of a waterproof PCB board proposed in this utility model;

[0016] Figure 3 This is a schematic diagram of the disassembled structure of the top shell of a waterproof PCB board proposed in this utility model;

[0017] Figure 4 This is a schematic diagram showing the disassembled structure of the heat sink of a waterproof PCB board proposed in this utility model.

[0018] Figure 5 This is a schematic diagram showing the disassembled structure of the bottom shell of a waterproof PCB board proposed in this utility model.

[0019] In the diagram: 1. Bottom shell; 2. Top shell; 201. Sealing groove; 202. First sealing ring; 203. Frame plate; 204. Second sealing ring; 205. Fixing base; 206. Countersunk hole; 207. Screw; 208. Sealing gasket; 3. Circuit board body; 301. Heat sink; 302. Heat conduction column; 303. Heat dissipation fins; 304. Fixing groove; 4. Mounting shell; 5. Mounting base; 6. Sealing plug. Detailed Implementation

[0020] To make the technical means, creative features, objectives and effects of this utility model easier to understand, the present utility model will be further described below in conjunction with specific embodiments.

[0021] In the description of this utility model, it should be noted that the terms "upper," "lower," "inner," "outer," "front end," "rear end," "both ends," "one end," and "the other end," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. In addition, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0022] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installed," "equipped with," and "connected," etc., should be interpreted broadly. For example, "connected" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be a connection within two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0023] Reference Figures 1-5 A waterproof PCB board includes a bottom shell 1, a top shell 2 on the top surface of the bottom shell 1, a circuit board body 3 inside the bottom shell 1, a sealing structure for protecting the circuit board body 3 on the top surface of the bottom shell 1, and a heat dissipation structure for dissipating heat from the circuit board body 3 on the bottom surface of the bottom shell 1. The sealing structure includes a sealing groove 201 on the top surface of the bottom shell 1, a plurality of first sealing rings 202 fixed inside the sealing groove 201, the plurality of first sealing rings 202 being evenly distributed along the depth direction of the sealing groove 201, a frame plate 203 fixed on the bottom surface of the top shell 2, the frame plate 203 being slidably inserted into the interior of the sealing groove 201, and the plurality of first sealing rings 202 respectively abutting against the inner and outer walls of the frame plate 203, the first sealing rings 202 being made of rubber.

[0024] In this embodiment, a second sealing ring 204 is fixed to the bottom surface of the top shell 2, and the second sealing ring 204 abuts against the top surface of the bottom shell 1. A fixing seat 205 is fixed to each of the four corners inside the bottom shell 1. A countersunk hole 206 is opened at each of the four corners of the top surface of the top shell 2. A screw 207 is threaded inside the countersunk hole 206. The screw 207 is threaded to the fixing seat 205. A sealing washer 208 is fitted on the outer circular wall of the screw 207. The bottom surface of the sealing washer 208 abuts against the countersunk hole 206.

[0025] In this embodiment, the heat dissipation structure includes a fixing groove 304 formed in the inner bottom surface of the bottom shell 1. A heat sink 301 is fixed to the inner bottom surface of the fixing groove 304. The circuit board body 3 is fixed to the inside of the fixing groove 304 by bolts. The top surface of the heat sink 301 is in contact with the bottom surface of the circuit board body 3. A plurality of heat-conducting pillars 302 are fixed to the bottom surface of the heat sink 301. The bottom ends of the plurality of heat-conducting pillars 302 penetrate the inner bottom surface of the bottom shell 1 and extend to the outside. A plurality of heat dissipation fins 303 are fixed to the bottom surface of the bottom shell 1. The plurality of heat dissipation fins 303 are arranged in parallel and fixed to the heat-conducting pillars 302. The heat dissipation fins 303 and All heat sinks 301 are existing technologies. Through the setting of the sealing structure and heat dissipation structure, the user fixes the circuit board body 3 in the fixing groove 304, so that the top surface of the heat sink 301 is in contact with the bottom surface of the circuit board body 3. To ensure close contact, silicone grease can be applied to the top surface of the heat sink 301. Then the user covers the top shell 2 on the bottom shell 1, so that the frame plate 203 is inserted into the sealing groove 201. Several first sealing rings 202 are in close contact with the inner and outer walls of the frame plate 203, forming a multi-point contact labyrinth sealing path, improving the sealing performance and preventing moisture or dust from seeping in. Then the user fixes the circuit board body 3 by screws 207 and screws 207. The mounting bracket 205 secures the top shell 2 and the bottom shell 1, causing the second sealing ring 204 on the bottom surface of the top shell 2 to abut against the top surface of the bottom shell 1. The second sealing ring 204 and the top surface of the bottom shell 1 form an auxiliary seal, which, together with the sealing washer 208 on the fixing screw 207, seals off all possible water leakage gaps, ensuring that the overall structure has a waterproof performance of IPX level or higher. At the same time, the bottom of the circuit board body 3 is connected to multiple heat conduction pillars 302 through heat sink 301. The heat conduction pillars 302 quickly conduct heat to the heat dissipation fins 303 on the outside of the bottom shell 1. The fin structure increases the heat dissipation area and utilizes airflow to improve convection. Thermal efficiency ensures that the internal components maintain a reasonable temperature range during long-term operation, preventing component aging or failure due to excessive temperature. High-efficiency heat dissipation is achieved through a combination of internal and external heat conduction and air convection. The heat conduction pillar 302 penetrates the bottom shell at point 1 and can be sealed by pouring epoxy resin. This waterproof PCB board achieves excellent waterproof, dustproof and high-efficiency heat dissipation performance, and is particularly suitable for outdoor electronic devices, industrial control equipment in humid or high-heat environments and other scenarios. The device can extend the service life of electronic equipment while ensuring the safety and stable performance of the circuit board, and has good practical value and promotion prospects.

[0026] In this embodiment, a mounting shell 4 is fixed to the bottom surface of the bottom shell 1. The mounting shell 4 is U-shaped, and the heat dissipation fins 303 are located inside the mounting shell 4. The heat dissipation fins 303 can be protected by the mounting shell 4.

[0027] In this embodiment, two mounting bases 5 are fixed on the bottom surface of the bottom shell 1. The mounting bases 5 are L-shaped, and the user can use bolts to fix the device in the installation area through the mounting bases 5.

[0028] In this embodiment, a sealing plug 6 is slidably inserted inside the countersunk hole 206. The sealing plug 6 is made of rubber, and the sealing performance of the countersunk hole 206 can be improved by using the sealing plug 6.

[0029] Working principle: In use, the user fixes the circuit board body 3 in the fixing groove 304, so that the top surface of the heat sink 301 is in contact with the bottom surface of the circuit board body 3. To ensure a close fit, silicone grease can be applied to the top surface of the heat sink 301. Then, the user covers the top shell 2 onto the bottom shell 1, so that the frame plate 203 is inserted into the sealing groove 201. Several first sealing rings 202 are in close contact with the inner and outer walls of the frame plate 203, forming a multi-point contact labyrinth-like sealing path, improving sealing performance and preventing moisture or dust from seeping in. Then, the user fixes the top shell 2 and the bottom shell 1 with screws 207 and fixing base 205, so that the second sealing ring 204 on the bottom surface of the top shell 2 abuts against the top surface of the bottom shell 1. The second sealing ring 204 and the top surface of the bottom shell 1 form an auxiliary seal. With the sealing washer 208 on the fixing screw 207, all possible water seepage gaps are sealed, ensuring that the overall structure has a waterproof performance of IPX level or above. At the same time, the bottom of the circuit board body 3 is connected to multiple heat conduction pillars 302 through the heat sink 301. The heat conduction pillars 302 quickly conduct heat to the heat dissipation fins 303 on the outside of the bottom shell 1. The fin structure increases the heat dissipation area and improves the convective heat transfer efficiency by utilizing air flow, ensuring that the internal components maintain the temperature within a reasonable range during long-term operation, preventing component aging or failure due to excessive temperature. Efficient heat dissipation is achieved through the combination of internal and external heat conduction and air convection. The heat conduction pillars 302 can be sealed by pouring epoxy resin through the bottom shell 1. The heat dissipation fins 303 can be protected by the mounting shell 4. Users can fix the device in the installation area by bolts using the mounting base 5. The sealing plug 6 can improve the sealing of the countersunk hole 206.

[0030] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of this utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claimed utility model.

Claims

1. A waterproof PCB board, comprising a bottom shell (1), characterized in that: The top surface of the bottom shell (1) is provided with a top shell (2), the inside of the bottom shell (1) is provided with a circuit board body (3), the top surface of the bottom shell (1) is provided with a sealing structure for protecting the circuit board body (3), the bottom surface of the bottom shell (1) is provided with a heat dissipation structure for dissipating heat from the circuit board body (3), the sealing structure includes a sealing groove (201) on the top surface of the bottom shell (1), a plurality of first sealing rings (202) are fixed inside the sealing groove (201), the plurality of first sealing rings (202) are evenly distributed along the depth direction of the sealing groove (201), the bottom surface of the top shell (2) is fixed with a frame plate (203), the frame plate (203) is slidably inserted into the inside of the sealing groove (201), and the plurality of first sealing rings (202) respectively abut against the inner and outer walls of the frame plate (203).

2. A waterproof PCB board according to claim 1, characterized in that, The bottom surface of the top shell (2) is fixed with a second sealing ring (204), which abuts against the top surface of the bottom shell (1). The bottom shell (1) is fixed with a fixing seat (205) at each of the four corners inside. The top surface of the top shell (2) is provided with a countersunk hole (206) at each of the four corners inside. The countersunk hole (206) is threaded with a screw (207), which is threaded with the fixing seat (205). The outer circular wall of the screw (207) is fitted with a sealing washer (208), and the bottom surface of the sealing washer (208) abuts against the countersunk hole (206).

3. A waterproof PCB board according to claim 2, characterized in that, The heat dissipation structure includes a fixing groove (304) opened on the bottom surface inside the bottom shell (1). A heat sink (301) is fixed on the bottom surface inside the fixing groove (304). The circuit board body (3) is fixed to the inside of the fixing groove (304) by bolts. The top surface of the heat sink (301) is attached to the bottom surface of the circuit board body (3). Several heat conduction pillars (302) are fixed on the bottom surface of the heat sink (301). The bottom ends of the several heat conduction pillars (302) all penetrate the bottom surface inside the bottom shell (1) and extend to the outside. Several heat dissipation fins (303) are fixed on the bottom surface of the bottom shell (1). The several heat dissipation fins (303) are arranged in parallel and fixed to the heat conduction pillars (302).

4. A waterproof PCB board according to claim 3, characterized in that, The bottom surface of the bottom shell (1) is fixed with a mounting shell (4), which is U-shaped, and the heat dissipation fins (303) are located inside the mounting shell (4).

5. A waterproof PCB board according to claim 4, characterized in that, The bottom surface of the bottom shell (1) is fixed with two mounting seats (5), which are L-shaped.

6. A waterproof PCB board according to claim 5, characterized in that, The bottom surface of the bottom shell (1) is fixed with two mounting seats (5), which are L-shaped.

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