charger

Abstract

The application discloses a charger, wherein the charger comprises a shell, a circuit board and a heat dissipation assembly; the shell is provided with a mounting cavity, a cavity wall of the mounting cavity is concave to form a mounting groove; the circuit board is accommodated in the mounting cavity, the circuit board comprises a circuit substrate, and an edge of the circuit substrate is embedded in the mounting groove; the heat dissipation assembly is accommodated in the mounting cavity and is in contact with the circuit board; and a gap exists between a surface of the heat dissipation assembly away from the circuit board and the cavity wall of the mounting cavity. The technical scheme can reduce the shell temperature of the charger in a charging state.

Description

Technical Field

[0001] This application relates to the field of charging device technology, and in particular to a charger. Background Technology

[0002] Nowadays, the number of smart devices that need charging in our daily lives is increasing. Smartphones, laptops, tablets, and other smart devices, as well as power tools and car vacuum cleaners, all require chargers. A charger is a static converter that uses power semiconductor devices to convert alternating current (AC) with a fixed voltage and frequency into direct current (DC).

[0003] In related technologies, the circuit board inside the charger generates heat during charging, causing the outer casing to become hot and requiring timely heat dissipation. Chargers typically use potting compound or dispensing compound along with heat sinks and graphene insulation films for heat dissipation, but the outer casing temperature remains high, resulting in a poor user experience. Utility Model Content

[0004] This application provides a charger that can reduce the casing temperature of the charger during charging.

[0005] This application provides a charger, which includes a housing, a circuit board, and a heat dissipation assembly. The housing has a mounting cavity, and the cavity wall of the mounting cavity is recessed to form a mounting groove. The circuit board is housed in the mounting cavity, and the circuit board includes a circuit board substrate, the edge of which is embedded in the mounting groove. The heat dissipation assembly is housed in the mounting cavity and contacts the circuit board. A gap exists between the surface of the heat dissipation assembly facing away from the circuit board and the cavity wall of the mounting cavity.

[0006] The charger based on the embodiments of this application has a housing with a mounting cavity, a circuit board housed in the mounting cavity, and a heat dissipation component housed in the mounting cavity and in contact with the circuit board. When the charger is working, the heat dissipation component can absorb the heat generated by the circuit board and conduct it to itself, preventing heat from accumulating locally on the circuit board, avoiding performance degradation, damage or safety hazards of components due to excessive temperature, and ensuring stable operation of the circuit board.

[0007] There is a gap between the surface of the heat dissipation component facing away from the circuit board and the cavity wall of the mounting cavity. This gap forms an air insulation layer. The heat is hindered by the air during the conduction process from the circuit board to the cavity wall, which can effectively slow down the conduction speed of heat from the heat dissipation component to the cavity wall of the mounting cavity, thereby reducing the rise in housing temperature, effectively insulating and reducing housing temperature, and thus improving the user experience.

[0008] Furthermore, the cavity wall of the mounting cavity is recessed to form a mounting groove. The circuit board includes a circuit board, and the edge of the circuit board is embedded in the mounting groove. This effectively prevents the circuit board from shifting relative to the housing, ensuring the existence of the gap between the heat dissipation component and the housing. This gap will not shrink or even disappear due to the displacement of the circuit board, thus ensuring that the housing does not directly contact the heat-generating circuit board. The gap between the housing and the circuit board provides thermal insulation, preventing heat from accumulating on the surface of the housing and avoiding the problem of localized heat concentration that may result from direct and close contact between the heat dissipation component and the housing. Attached Figure Description

[0009] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0010] Figure 1 This is a schematic diagram of the structure of a charger according to an embodiment of this application;

[0011] Figure 2 for Figure 1 The exploded view of the charger is shown in the figure.

[0012] Figure 3 for Figure 1 The diagram shows a cross-sectional view of the charger along point AA.

[0013] Figure 4 for Figure 2 The diagram shows the structural schematic of the shell body.

[0014] Figure 5 for Figure 4 The enlarged structural diagram at point B is shown in the image;

[0015] Figure 6 for Figure 2 The diagram shows a first-view structural schematic of the charger's circuit board;

[0016] Figure 7 for Figure 6 The diagram shows a second-view structural schematic of the circuit board.

[0017] Figure 8 for Figure 2 The diagram shows the structure of the second heat sink.

[0018] Explanation of icon numbers:

[0019] 1. Charger; 10. Housing; 101. Mounting cavity; 102. Gap; 103. Rib; 1031. Guide slope; 11. First sidewall; 12. Second sidewall; 13. Housing body; 131. Receiving groove; 132. Mounting groove; 14. Cover; 20. Circuit board; 21. First substrate; 211. First capacitor; 212. Transformer; 213. Third capacitor; 22. Second substrate; 221. Second capacitor; 23. Third substrate; 24. Fourth substrate; 241. Output interface; 30. Heat dissipation assembly; 31. First heat sink; 32. Second heat sink; 321. Main body; 322. Extension; 33. First heat conductor; 34. Second heat conductor; 40. Pin assembly; 41. Pin shell; 42. Pin; 50. Decorative assembly; 51. Decorative ring; 52. Decorative cover;

[0020] D1, First Direction; D2, Second Direction; D3, Third Direction.

[0021] The realization of the purpose, functional features and advantages of this application will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0022] To make the objectives, technical solutions, and advantages of this application clearer, the embodiments of this application will be described in further detail below with reference to the accompanying drawings.

[0023] Where the following description relates to the accompanying drawings, unless otherwise indicated, the same numbers in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this application. Rather, they are merely examples of apparatuses and methods consistent with some aspects of this application as detailed in the appended claims.

[0024] In the description of this application, it should be understood that the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances. Furthermore, in the description of this application, unless otherwise stated, "multiple" refers to two or more. "And / or" describes the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, or B existing alone. The character " / " generally indicates that the preceding and following related objects are in an "or" relationship.

[0025] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of this application. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0026] Nowadays, the number of smart devices that need charging in our daily lives is increasing. Smartphones, laptops, tablets, and other smart devices, as well as power tools and car vacuum cleaners, all require chargers. A charger is a static converter that uses power semiconductor devices to convert alternating current (AC) with a fixed voltage and frequency into direct current (DC).

[0027] When the charger is charging, the internal electronic components operate at high power and generate a certain amount of heat. In order to ensure the stable operation of the charger and avoid the casing temperature from getting too high and causing a bad user experience, the charger needs to dissipate heat in a timely manner.

[0028] In related technologies, chargers typically use a whole-device potting method, which involves filling the entire inside of the charger with glue. After the glue cures, it forms a sealed heat dissipation layer. The heat inside is transferred to the outer shell through the thermal conductivity of the glue, and then dissipated by the outer shell. Alternatively, glue is usually applied to key heat-generating components or parts of the circuit board to enhance heat dissipation in these areas. At the same time, heat sinks are placed on the back or around the circuit board to further dissipate heat. Finally, a graphene heat insulation film is applied to the inner surface of the outer shell for heat insulation.

[0029] However, the chargers treated with the above two heat dissipation methods are bulky, not portable, inconvenient for users to carry and use, and cannot be repaired, resulting in high material and repair costs. Furthermore, the whole-device potting increases the overall weight of the product. The solution of applying adhesive + heat sink + graphene heat insulation film to the outer shell also increases the weight due to the addition of heat sinks and heat insulation films, causing inconvenience to users. Despite these heat dissipation measures, the charger's outer shell temperature still approaches the legally mandated 77 degrees Celsius under full load, easily exceeding regulatory requirements, failing to effectively reduce the outer shell temperature and thus failing to meet consumers' demand for a low-temperature user experience.

[0030] To resolve the above issues, please refer to [link / reference]. Figures 1 to 3 This application proposes a charger 1. The charger 1 can be of various types; for example, it can be a universal serial bus charger 1, a wireless charger 1, a portable charger 1, a car charger 1, and a solar charger 1, etc. In the embodiments of this application, the charger 1 includes a housing 10, a circuit board 20, and a heat dissipation assembly 30.

[0031] The housing 10 can be made of plastic or metal; specifically, it can be made of plastic. This makes the housing 10 lighter, making it easier for users to carry and use the charger 1. Furthermore, plastic has insulating properties, reducing the risk of electric shock. The plastic material is primarily made of polycarbonate, polystyrene, polypropylene, polyethylene, and polyvinyl chloride, all of which possess good mechanical strength, stability, hardness, and weather resistance. The housing 10 can be integrally injection molded, giving it high structural strength and making it less prone to damage. This protects other components within the housing 10, thus extending the charger 1's service life.

[0032] The housing 10 has a mounting cavity 101, within which the circuit board 20 is housed. The housing 10 protects the circuit board 20 from exposure to air. This application's technical solution incorporates a heat dissipation component 30, housed within the mounting cavity 101 and in contact with the circuit board 20. When the charger 1 is operating, the heat dissipation component 30 absorbs the heat generated by the circuit board 20 and conducts it to itself, preventing localized heat accumulation on the circuit board 20. This avoids performance degradation, damage, or safety hazards caused by excessively high temperatures, ensuring stable operation of the circuit board 20.

[0033] like Figure 2 and Figure 3 As shown, there is a gap 102 between the surface of the heat dissipation component 30 facing away from the circuit board 20 and the cavity wall of the mounting cavity 101. This gap 102 forms an air insulation layer. During the heat conduction from the circuit board 20 to the cavity wall, the air obstructs the heat, which can effectively slow down the heat conduction speed from the heat dissipation component 30 to the cavity wall of the mounting cavity 101. This reduces the temperature rise of the housing 10, effectively insulates the heat and lowers the temperature of the housing 10, making it lower than the national standard requirements and improving the user experience.

[0034] Furthermore, the cavity wall of the mounting cavity 101 is recessed to form a mounting groove 132. The circuit board 20 includes a circuit board, and the edge of the circuit board is embedded in the mounting groove 132. This effectively prevents the circuit board from shifting relative to the housing 10, ensuring the existence of the gap 102 between the heat dissipation component 30 and the housing. This gap will not shrink or even disappear due to the displacement of the circuit board, thus ensuring that the housing 10 does not directly contact the heated circuit board 20. The gap 102 provides thermal insulation between the housing 10 and the circuit board 20, preventing heat accumulation on the surface of the housing 10. This avoids the problem of local heat concentration that may occur if the heat dissipation component 30 and the housing 10 are in direct contact. If the two are in direct contact, local high temperature points may form in the contact area. The gap 102 can disperse the heat, making the heat more evenly distributed and reducing the risk of local overheating.

[0035] When the temperature of the housing 10 is too high, its insulation performance will decrease, increasing the risk of electric shock. Lowering the temperature of the housing 10 helps maintain the good insulation performance of the housing material, improving the safety of the product and enhancing the stability and reliability of the charger 1.

[0036] Furthermore, the aforementioned structural design enables effective heat dissipation and insulation within a limited space. The heat dissipation component 30 is in close contact with the circuit board 20 to ensure heat dissipation. Simultaneously, the gap 102 between the component and the cavity wall allows for the compactness of the internal components of the charger 1, making full use of the limited space and achieving miniaturization and high performance. At the same time, by eliminating the potting and dispensing steps, production and maintenance costs are significantly reduced, and the overall weight of the charger 1 is reduced, making it more portable and convenient for users to carry and use.

[0037] Please refer to Figures 2 to 5 In some embodiments, the housing 10 includes two first sidewalls 11 and two second sidewalls 12 for forming a mounting cavity 101. The two first sidewalls 11 are disposed opposite each other and connected between the two second sidewalls 12. The circuit board 20 has a heat dissipation assembly 30 at least on the side facing the first sidewall 11. The inner surface area of ​​the first sidewall 11 is larger than the inner surface area of ​​the second sidewall 12. When there is a gap 102 between the two first sidewalls 11 and the heat dissipation assembly 30, the heat dissipation assembly 30 can come into contact with more surrounding air, which is equivalent to expanding the effective heat insulation area and enabling heat to be fully conducted to the two walls with a relatively larger heat insulation area.

[0038] The inner surface area of ​​the first sidewall 11 is larger than that of the second sidewall 12. With the same spacing, this results in a larger gap 102, providing better heat insulation and buffering, and slowing the heat transfer rate from the heat dissipation component 30 to the first sidewall 11. Even if the heat dissipation component 30 is hot, some heat will dissipate in the gap 102 during its transfer to the first sidewall 11, thus lowering the temperature of the first sidewall 11 and enhancing the heat insulation effect of the housing 10. This makes it easier to control the temperature of the housing 10 within a safe range. Heat can also be more widely transferred to the surrounding environment through the two first sidewalls 11, which helps to reduce the temperature of the charger housing 10, maintaining it at around 67 degrees Celsius, complying with regulations and providing a more comfortable user experience.

[0039] The charger 1 also includes a rib 103 protruding from the cavity wall of the mounting cavity 101. The rib 103 is located on the side of the heat dissipation assembly 30 facing away from the circuit board 20. The rib 103 can be supported on the surface of the heat dissipation assembly 30 facing away from the circuit board 20, or it can be spaced apart from the surface of the heat dissipation assembly 30 facing away from the circuit board 20.

[0040] When the rib 103 comes into contact with the heat dissipation assembly 30, heat can be quickly conducted from the heat dissipation assembly 30 to the cavity wall of the housing 10 through the rib 103. The rib 103 effectively establishes a more direct heat conduction path between the heat dissipation assembly 30 and the housing 10, allowing heat to be dissipated more efficiently to the surrounding environment, further improving the thermal insulation efficiency. The heat on the heat dissipation assembly 30 can be transferred to the housing 10 and dissipated in a timely manner through the rib 103, reducing the possibility of heat accumulation in the gap 102, effectively reducing the temperature of the heat dissipation assembly 30 and the area near the circuit board 20, and protecting the electronic components on the circuit board 20 from high temperatures.

[0041] Furthermore, the support frame 103 supports the heat dissipation component 30, ensuring that the heat dissipation component 30 does not directly contact the housing 10. This guarantees the existence of the gap 102 between the heat dissipation component 30 and the housing 10, ensuring a stable heat insulation layer is formed between them. When the charger 1 is subjected to vibration or impact, the support frame 103 prevents the heat dissipation component 30 from contacting the housing 10 and causing the gap 102 to disappear, thus ensuring the continuous stability of the heat insulation effect. The support frame 103 also provides additional physical support and protection for the heat dissipation component 30, reducing the risk of damage caused by external impacts, vibrations, and other factors, and extending the service life of the heat dissipation component 30.

[0042] When the bone position 103 and the heat dissipation component 30 are spaced apart and do not contact each other, the path of heat conduction directly to the housing 10 through the bone position 103 is avoided, thereby reducing the amount of heat transferred from the heat dissipation component 30 to the housing 10, playing a good heat insulation role, reducing the temperature rise of the housing 10, helping to maintain a lower temperature of the housing 10, avoiding overheating of the housing 10, and thus bringing a good user experience.

[0043] Two first sidewalls 11 are arranged at intervals relative to each other along a first direction D1, and two second sidewalls 12 are arranged at intervals relative to each other along a second direction D2. The first direction D1 and the second direction D2 can be perpendicular to each other. The surface areas of the first sidewalls 11 and the second sidewalls 12 are different, so that the shell 10 has a cuboid structure. The connection between the two first sidewalls 11 and the two second sidewalls 12 can be an arc transition or a right angle. Of course, the shell 10 can also be a cube or other structural forms, and this application does not limit this.

[0044] The housing 10 includes a main body 13 and a cover 14. The main body 13 has a receiving groove 131 and an opening on one side. The cover 14 is connected to the main body 13 and covers the opening, thus forming an installation cavity 101 with the main body 13. The cover 14 is connected to the main body 13 and is spaced apart from the bottom wall of the receiving groove 131 along a third direction D3. The first direction D1, the second direction D2, and the third direction D3 are perpendicular to each other, so that the housing 10 is constructed into the aforementioned cuboid structure.

[0045] A rib 103 is provided on the inner surface of the first sidewall 11. One or more ribs 103 may be provided; specifically, multiple ribs 103 are spaced apart on the first sidewall 11. When the ribs 103 support the surface of the heat dissipation assembly 30 facing away from the circuit board 20, the multiple ribs 103 can more evenly support the heat dissipation assembly 30, ensuring a uniform gap 102 between it and the housing 10. This helps ensure a uniform air layer thickness between the heat dissipation assembly 30 and the housing 10, achieving more stable heat insulation, reducing the temperature of the housing 10 of the charger 1 during charging, and thus improving the user experience.

[0046] Multiple support ribs 103 provide stronger support than a single support rib 103, ensuring that the heat dissipation component 30 will not shift or deform under external force or vibration, thereby improving the stability of the entire internal structure of the charger 1. The spaced-apart support ribs 103 can be flexibly adjusted according to the shape and size of the heat dissipation component 30 to adapt to different heat dissipation needs and design requirements. The number and position of the support ribs 103 can be increased or decreased as needed to achieve optimal heat insulation.

[0047] Specifically, the support 103 is elongated and extends from the bottom of the receiving groove 131 towards the opening, that is, the support 103 extends along the third direction D3. Multiple supports 103 provide stable support for the heat dissipation assembly 30 throughout the depth of the receiving groove 131, preventing displacement or movement of the heat dissipation assembly 30 within the mounting cavity 101, ensuring close contact with the circuit board 20 and stable heat dissipation. The elongated support 103 extending along the third direction D3 helps guide airflow along the surface of the support 103 within the mounting cavity 101, forming a more regular air circulation path, promoting heat dissipation, improving heat insulation efficiency, and reducing the temperature of the casing 10 of the charger 1 during charging, thereby improving the user experience.

[0048] The rib 103 extends along the third direction D3, making full use of the depth space of the mounting cavity 101. Without increasing the volume of the housing 10, it enhances heat dissipation and support functions, achieving efficient space utilization. It should be noted that the end of the rib 103 facing the slot also forms a guide slope 1031. During the installation of the heat dissipation component 30 and the circuit board 20 as an integral structure within the mounting cavity 101, the guide slope 1031 guides the heat dissipation component 30 and the circuit board 20 to slide more easily into the mounting cavity 101, reducing installation difficulties caused by sharp corners of the components. The elongated rib 103 provides a clear installation guide for the heat dissipation component 30, facilitating accurate installation and improving assembly efficiency and accuracy. If it is necessary to adjust the position or angle of the heat dissipation component 30 and the circuit board 20, the elongated rib 103 provides a certain amount of sliding space, facilitating fine-tuning to achieve optimal heat dissipation.

[0049] The guide slope 1031 can also guide air to flow more smoothly within the mounting cavity 101, avoiding airflow obstruction or turbulence caused by the sharp angle of the rib 103. This optimized airflow path helps improve heat insulation efficiency, promotes heat dissipation, and reduces the temperature of the casing 10 of the charger 1 during charging, thereby improving the user experience.

[0050] In addition, the elongated rib 103 is equivalent to adding reinforcing ribs inside the shell body 13, which improves the overall structural strength of the shell 10, making it more able to withstand external pressure and impact, preventing the shell 10 from deforming, and protecting the internal components.

[0051] It is understood that the bone position 103 can also be wavy and extend from the bottom of the receiving groove 131 toward the opening of the groove. Of course, it can also be multiple sub-bone positions 103 discontinuously arranged along the third direction D3. This application does not limit this.

[0052] In some embodiments, the circuit board 20 includes a circuit substrate, which may be a PCB (Printed Circuit Board) substrate, a ceramic substrate, a pre-mold substrate, etc. The housing body 13 has mounting grooves 132 recessed into the wall of the receiving groove 131. There may be two mounting grooves 132, with elongated walls extending along the depth direction of the receiving groove 131, thus fully utilizing the space in the depth direction of the receiving groove 131 and optimizing space utilization.

[0053] Specifically, two mounting slots 132 are formed on the inner walls of two opposite second sidewalls 12 and extend along the third direction D3. The edge of the circuit board can slide into the mounting slot 132 from the third direction D3, so that the edge of the circuit board is embedded in the mounting slot 132, making the installation convenient and quick, and providing precise positioning and installation for the circuit board. Stable installation can prevent unnecessary contact between the circuit board and the housing 10 or other components, reduce the risk of short circuit or electrical interference, and ensure the stable electrical performance of the charger 1.

[0054] Embedded mounting can also reduce the loosening of the circuit board caused by vibration during use of the charger 1, improving the reliability of the product. Especially in portable devices, it can reduce the impact of daily bumps and impacts on the electronic components on the circuit board.

[0055] Please refer to Figures 4 to 7 In one embodiment of this application, the charger 1 includes a plug assembly 40 and at least two output interfaces 241, both connected to the housing 10. The plug assembly 40 introduces external alternating current (AC) into the charger 1 and connects to the circuit board 20 through metal contacts, providing energy input for subsequent rectification and transformation. The output interfaces 241 are connected in parallel and are all electrically connected to the circuit board 20. When an external device is connected to any output interface 241, the circuit board 20 charges the external device through the output interface 241 connected to the external device.

[0056] It should be noted that the external device can be a mobile phone, tablet computer, or laptop computer, etc., which require charging. This application embodiment does not specifically limit this. The output interface 241 may include at least one of a USB-A output interface 241, a USB-C output interface 241, a Lightning output interface 241, and a MicroUSB output interface 241. This application embodiment does not specifically limit this either.

[0057] The interface types of any two output ports 241 can be different. In this case, the charger 1 can be adapted to multiple types of external devices, avoiding the situation where a charger 1 can only be adapted to one type of external device. That is, users do not need to buy a new charger 1 to be compatible with the charging cable interface, thus saving users the cost of purchasing materials. Furthermore, the different interface types of any two output ports 241 enable the charger 1 to be adapted to different types of external devices.

[0058] The pin assembly 40 includes a pin housing 41 and two pin pieces 42. The two pin pieces 42 are inserted into the housing. The pin housing 41 is connected to the circuit board. The cover 14 has an opening for the pin pieces 42 to extend out. The pin pieces 42 are fixedly connected to the pin housing 41. Alternatively, the pin pieces 42 can rotate relative to the opening to switch between a folded state and an upright state. For example, the pin pieces 42 are connected to the housing 10 via a pivot (usually made of metal or high-strength POM material). The pivot has a built-in spring or damping structure to ensure smooth rotation and positioning accuracy. At the same time, a mechanical limit (such as a 90° or 180° locking point) is set at the opening to ensure that the pin pieces 42 are stably locked in the folded or upright state, preventing accidental loosening.

[0059] The circuit board 20 of charger 1 typically includes an AC-DC converter module, a protocol chip, a buck-boost module, and a switching module. The AC-DC converter module is electrically connected to the mains power supply and converts the input AC voltage into a stable DC voltage through rectification and filtering. The commonly used mains power is 220 volts, and the AC-DC converter module can power the protocol chip, buck-boost module, and switching module.

[0060] Furthermore, a protocol chip refers to a module that integrates logic control circuitry and charging protocol programs. The charging protocols supported by the protocol chip include USB PD (Power Delivery) charging.

[0061] The protocol chip supports at least one of the following: electric charging protocol, QC (Quick Charge) charging protocol, FCP (Fast Charge Protocol) protocol, SCP (Super Charge Protocol) protocol, and Mi Turbo Charge protocol; of course, the charging protocols supported by the protocol chip are not limited to those mentioned above, and this application does not make any specific limitation in this regard.

[0062] The step-up / step-down module refers to the module that adjusts the output voltage. Specifically, both the protocol chip and the step-up / step-down module are electrically connected to the AC-DC converter module, so that the AC-DC converter module supplies power to the protocol chip and the step-up / step-down module; the switch module is electrically connected to the output interface 241 and the step-up / step-down module, and the switch module also realizes bidirectional signal communication with the protocol chip; the output interface 241 can realize signal communication with external devices and the protocol chip.

[0063] The specific working principle of charger 1 is as follows: the AC-DC converter module converts AC mains power into stable DC power to power the protocol chip, buck-boost module, and switching module; when an external device is electrically connected to any output interface 241, the protocol chip communicates with the external device through the output interface 241 to identify that the external device is connected to any output interface 241; the protocol chip controls the buck-boost module to adjust the output voltage to match the output voltage of the external device; and since the switching module and the protocol chip communicate bidirectionally, the protocol chip can control the switching module to turn on. That is, after the protocol chip recognizes that the output voltage of the buck-boost module conforms to the charging protocol of the external device, the protocol chip controls the switching module to turn on so that charger 1 can charge the external device.

[0064] It should be noted that the switching module may include one switching element (not shown in the figure), or the switching module may include multiple switching elements. This application embodiment does not specifically limit the number of switching elements. For example, when the switching module may include one switching element, and any output interface 241 is connected to an external device, and the protocol chip recognizes that the output voltage of the buck-boost module conforms to the charging protocol of the external device, the protocol chip will control the corresponding switching element to conduct, so that the charger 1 can charge the external device. For example, when the switching module may include multiple switching elements, the number of switching elements may correspond to the number of output interfaces 241, that is, one switching element is electrically connected to one output interface 241.

[0065] An external device is electrically connected to any output interface 241, and the protocol chip recognizes that the output voltage of the buck-boost module conforms to the charging protocol of the external device. The protocol chip can control the switching element corresponding to the output interface 241 connected to the external device to be turned on, so that the charger 1 can charge the external device. Furthermore, when the protocol chip controls the corresponding switching element to be turned on, the protocol chip also controls the other switching elements to be turned off, so that the charger 1 cannot charge the external device through the other output interfaces 241, thereby reducing the probability of short circuit in the charger 1 and ensuring the charging safety of the charger 1.

[0066] In other embodiments, if multiple external devices are simultaneously connected to the output interface 241, the protocol chip communicates with the external devices via the output interface 241 to identify that multiple external devices are connected simultaneously. In this case, the protocol chip controls one or more switching elements to simultaneously turn off, preventing the charger 1 from charging multiple external devices at the same time, thus ensuring the charging safety of the charger 1. It should be noted that the number of switching elements corresponds to the number of buck-boost modules. That is, one switching element is electrically connected to one buck-boost module. After the protocol chip identifies that the output voltage of the buck-boost module conforms to the charging protocol of the external device, the protocol chip can control the corresponding switching element to turn on, so that the charger 1 can charge the external device.

[0067] The switching element can be a MOSFET (Metal-Oxide-Semiconductor), a bipolar junction transistor (BJT), or a relay, or other devices or circuits with switching functions. This application does not specifically limit the specific switching element.

[0068] In some embodiments, the circuit board includes a first substrate 21 and a second substrate 22 that are spaced apart and electrically connected. In addition, the circuit board also includes a third substrate 23 and a fourth substrate 24 that are electrically connected. An AC-DC conversion module is disposed on the first substrate 21 and the third substrate 23. A protocol chip is disposed on the second substrate 22. A buck-boost module is also disposed on the first substrate 21. At least two output interfaces 241 are disposed on the fourth substrate 24 and exposed on the bottom wall of the receiving groove 131.

[0069] Specifically, the pin 42 is electrically connected to the third substrate 23 for inputting external AC power into the charger 1. The third substrate 23 is provided with a rectifier to convert the input high-voltage AC power into pulsating DC power. The circuit board 20 also includes a first capacitor 211, a second capacitor 221, and a third capacitor 213. The first capacitor 211 and the second capacitor 221 are respectively disposed on the first substrate 21 and the second substrate 22, and the third capacitor 213 is also disposed on the first substrate 21. The first capacitor 211 and the third capacitor 213 are used to smooth the pulsating voltage after rectification to provide stable high-voltage DC power.

[0070] A resistor is also provided on the third substrate 23 to divide the high-voltage DC power after rectification and filtering, supplying power to the protocol chip. The protocol chip is located on the second substrate 22. The protocol chip generates drive signals to control the switching transistors in the switching module, adjusting the duty cycle to stabilize the output voltage. The transformer 212 isolates and transforms the high-frequency pulse voltage output from the switching transistors, ensuring the output voltage reaches the required level, while also achieving electrical isolation between the input and output to guarantee safety. The second capacitor 221 further smooths the output current, ensuring its stability.

[0071] Furthermore, two transformers 212 are disposed on the first substrate 21, and a first capacitor 211 and a second capacitor 221 are respectively disposed on the first substrate 21 and the second substrate 22, with the first capacitor 211 and the second capacitor 221 arranged around the two transformers 212 between the first substrate 21 and the second substrate 22. This compact layout effectively utilizes the limited space within the housing 10, improves the integration of the circuit board 20, further reduces the size of the charger 1, allows it to accommodate more electronic components, and enables higher power output.

[0072] By splitting a single transformer 212 into two smaller transformers 212, the two smaller transformers 212 can be smaller in size than a single high-power transformer 212. Alternatively, a more flexible layout can be used to achieve a more compact circuit design within a limited space, helping to reduce the overall size of the charger 1 and making it more portable. The smaller transformers 212 are also generally lighter in weight. Using two smaller transformers 212 instead of one larger transformer 212 can reduce the weight of the charger 1 to some extent and improve the user experience.

[0073] The two transformers 212 can share the load, with each transformer 212 handling a portion of the power. Compared to a single transformer 212 handling all the power, this reduces the workload of each transformer 212 under the same total power output, allowing it to operate in a more efficient range. This improves the overall power conversion efficiency and reduces energy loss. Furthermore, based on actual power requirements, more suitable magnetic cores can be selected for each transformer 212, increasing core utilization, reducing core saturation, and further enhancing the operating efficiency and stability of the transformer 212.

[0074] A single transformer 212 generates a significant amount of heat during operation. If only one transformer 212 is used, the heat will concentrate in one place, leading to excessively high local temperatures. However, by using two transformers 212, the heat can be distributed to two different locations, reducing the local temperature and making it easier to dissipate heat, thus improving the heat dissipation performance of the charger 1.

[0075] Two transformers 212, serving as the main heat sources, are arranged around the first capacitor 211 and the second capacitor 221 between the first substrate 21 and the second substrate 22. This helps to disperse heat to the surrounding area and prevent heat from concentrating in one place, which could lead to localized overheating. At the same time, the reasonable layout of the third substrate 23 and the fourth substrate 24 also helps to optimize the heat source distribution and improve the heat dissipation uniformity of the entire circuit board 20.

[0076] Furthermore, the arrangement of the first capacitor 211 and the second capacitor 221 around the transformer 212 can shorten the critical signal path, reduce the parasitic inductance and resistance of the line, improve the high-frequency performance and efficiency of the circuit, and help to achieve efficient energy conversion of the charger 1, thereby improving charging speed and performance.

[0077] In one embodiment of this application, the first substrate 21 is arranged parallel to the first sidewall 11, and the edge of the first substrate 21 is embedded in the mounting groove 132. The second substrate 22 is also arranged parallel to the first sidewall 11, so that the first substrate 21 and the second substrate 22 are parallel to each other and spaced apart in the first direction D1. The third substrate 23 is arranged parallel to the second sidewall 12, and the fourth substrate 24 is arranged parallel to the bottom wall of the receiving groove 131. The third substrate 23 is disposed between the first substrate 21 and the second substrate 22, and is located on one side opposite to the first substrate 21 and the second substrate 22. The fourth substrate 24 is located between the two transformers 212 and the second capacitor 221.

[0078] Thus, the first substrate 21, the second substrate 22, the third substrate 23 and the fourth substrate 24 are electrically connected to each other to achieve circuit connection, and together they form a cuboid-like structure that is adapted to the shape of the inner wall of the receiving groove 131, making the entire circuit board 20 compact, reducing space waste, and providing strong support for the miniaturization of the charger 1, making it easier to integrate into various small electronic devices or use as a portable charging device.

[0079] The first substrate 21 is provided with electronic components such as a transformer 212 and a first capacitor 211, which generate a large amount of heat when charging. By setting the first substrate 21 facing the first sidewall 11 with the largest inner surface area, it is easy to conduct heat to the first sidewall 11. Then, the heat is insulated by the gap 102 between the first sidewall 11 and the heat dissipation component 30, thereby reducing the temperature of the housing 10 and improving the user experience.

[0080] The second capacitor 221 and the third capacitor 213 are both located on the side of the fourth substrate 24 facing away from the two transformers 212. The second capacitor 221 and the third capacitor 213 are arranged at intervals between at least two output ports 241. This layout provides a certain degree of heat insulation protection. The fourth substrate 24 can block or slow down the transfer of heat from heat sources such as the transformers 212 to the second capacitor 221, the third capacitor 213, and the output ports 241, reducing the temperature at the output ports 241 and providing a better charging experience for users. Furthermore, the second capacitor 221 and the third capacitor 213 can be rationally arranged using the spacing between multiple output ports 241, achieving efficient space utilization within a limited space. This reduces the size of the circuit board 20, further reducing the overall size of the charger 1, achieving miniaturization and portability, and improving the user experience.

[0081] Please refer to Figure 2 , Figures 6 to 8 In some embodiments, the heat dissipation component 30 includes a heat dissipation element and a heat conduction element. The heat dissipation element can be a metal material such as copper; the heat conduction element can be a thermally conductive silicone pad, which has good thermal conductivity and flexibility, and can closely fit the surfaces of the first substrate 21 and the second substrate 22, serving as an interface material to fill the gap between the heat dissipation element and the circuit board 20, thereby improving the heat conduction efficiency.

[0082] Specifically, the heat dissipation components include a first heat dissipation component 31 and a second heat dissipation component 32, and the heat conduction components include a first heat conduction component 33 and a second heat conduction component 34, which are respectively attached to the side of the first substrate 21 and the second substrate 22 away from the transformer 212 to insulate the main heat-generating components on the first substrate 21 and the second substrate 22. The opposite side of the first heat dissipation component 31 is attached to the side of the first heat conduction component 33 away from the first substrate 21, and there is a gap 102 between the other opposite side of the first heat dissipation component 31 and one of the first sidewalls 11; the opposite side of the second heat dissipation component 32 is attached to the side of the second heat conduction component 34 away from the second substrate 22, and there is also a gap 102 between the other opposite side of the second heat dissipation component 32 and the other first sidewall 11.

[0083] The gap 102 between the first heat sink 31 and the second heat sink 32 and the first sidewall 11 forms a heat insulation layer, which slows down the conduction speed of heat from the heat sink to the housing 10, reduces the temperature of the housing 10, and makes it easier to control the temperature of the housing 10 within a safe range, thus improving the user experience. In the small-volume, high-power charger 1, the heat dissipation component 30 can achieve efficient heat dissipation within a limited space, meeting the heat dissipation requirements of the high-power circuit board 20 and ensuring the stability and reliability of the product during high-power operation. The close fit design of the heat sink and the heat conductor, as well as the setting of the gap 102 with the housing 10, achieve good heat dissipation and heat insulation effects without increasing the volume excessively, which helps to achieve the miniaturization and high performance of the charger 1.

[0084] Furthermore, since the first substrate 21 has a number of heating elements and the edge of the first substrate 21 is embedded in the mounting groove 132, the second heat sink 32 may also include a main body 321 and two extensions 322 on opposite sides of the main body 321 in the second direction D2. The main body 321 is used to contact the second heat conductor 34 for heat dissipation and to contact the tops of the two transformers 212 and the first capacitor 211 to increase heat dissipation efficiency and prevent the heating elements from being directly exposed in the receiving groove 131, causing heat dissipation. In addition, the two extensions 322 extend along the first direction D1, which can isolate the heating elements from the two second sidewalls 12 in the second direction D2, achieving heat insulation and preventing heat from dissipating to the two second sidewalls 12, thereby further reducing the temperature of the casing 10 of the charger 1 in the charging state and providing a comfortable user experience.

[0085] It should be noted that the connection between the first heat sink 31 and the second heat sink 32 and the circuit board can be, but is not limited to, screw connection, spring contact connection, snap-fit ​​connection, solder connection, etc. For example, the spring contact uses elastic pressure to press the first heat sink 31 and the second heat sink 32 onto the circuit board respectively, ensuring good thermal contact. The advantages of spring contact connection are compact structure, convenient installation, and space saving; alternatively, the first heat sink 31 and the second heat sink 32 are provided with buckles on their sides, and the circuit board is provided with slots on its sides. The buckles and slots engage to connect the first heat sink 31 and the second heat sink 32 to the circuit board, which is convenient for installation and maintenance.

[0086] In some embodiments, please refer again Figure 2 and Figure 7The charger 1 also includes a decorative component 50, which includes a decorative cover 52 and a decorative ring 51. The decorative ring 51 surrounds and is connected to the edge of the housing 10 opposite to the groove of the mounting slot 132, which can prevent the edge of the housing 10 from scratching the user when the charger 1 is plugged in or unplugged. The decorative cover 52 is connected to the decorative ring 51 and is provided on the side opposite to the bottom wall of the receiving groove 131. The decorative cover 52 has a through hole corresponding to the output interface 241 so that the output interface 241 can be exposed.

[0087] The decorative cover 52 clearly highlights the location of the output interface 241, enabling users to quickly and accurately locate and use the interface, thus improving convenience and efficiency. The decorative cover 52 and decorative ring 51 can feature unique shapes, colors, or textures that complement the overall appearance of the charger 1, enhancing its visual appeal and design, and giving the charger 1 a more stylish and technological feel. The decorative cover 52 can also display compatibility information for the charger 1 and the interface type of the output interface 241, such as supported device types and charging protocols, helping users quickly identify and select the appropriate charger 1, improving the user experience.

[0088] In the accompanying drawings of this embodiment, the same or similar reference numerals correspond to the same or similar components. In the description of this application, it should be understood that if terms such as "upper," "lower," "left," "right," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, they are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, the terms used to describe positional relationships in the drawings are only for illustrative purposes and should not be construed as limiting this application. For those skilled in the art, the specific meaning of the above terms can be understood according to the specific circumstances.

[0089] The above are merely preferred embodiments of this application and are not intended to limit this application. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A charger characterized by comprising: include: The housing has a mounting cavity, the cavity wall of which is recessed to form a mounting groove; A circuit board is housed within the mounting cavity, the circuit board including a circuit board substrate, the edge of the circuit board being embedded in the mounting groove; as well as A heat dissipation component is housed in the mounting cavity and contacts the circuit board; There is a gap between the surface of the heat dissipation component facing away from the circuit board and the cavity wall of the mounting cavity.

2. The charger as described in claim 1, characterized in that, It also includes a rib protruding from the cavity wall of the mounting cavity, the rib being located on the side of the heat dissipation assembly facing away from the circuit board.

3. The charger of claim 2, wherein The housing includes two first sidewalls and two second sidewalls for forming the mounting cavity, the two first sidewalls being disposed opposite to each other and respectively connected between the two second sidewalls; The circuit board has the heat dissipation component on at least one side facing the first sidewall, wherein the inner surface area of ​​the first sidewall is larger than the inner surface area of ​​the second sidewall, and the bone position is provided on the inner surface of the first sidewall.

4. The charger of claim 3, wherein Multiple bone spacers are provided on the first sidewall.

5. The charger of any one of claims 2 to 4, wherein, The housing includes a housing body and a cover. The housing body has a receiving groove inside and a slot on one side. The cover is connected to the housing body and covers the slot, thus forming the mounting cavity with the housing body. The bone is elongated and extends from the bottom of the receiving groove toward the opening of the groove.

6. The charger of claim 5, wherein, The end of the bone facing the groove also forms a guide slope.

7. The charger of claim 5, wherein The shell body has the mounting groove recessed in the groove wall of the receiving groove.

8. The charger of claim 7, wherein, The circuit board includes a first substrate and a second substrate that are spaced apart and electrically connected. Two transformers are disposed on the first substrate. The circuit board also includes a first capacitor and a second capacitor. The first capacitor and the second capacitor are respectively disposed on the first substrate and the second substrate, and are arranged around the two transformers between the first substrate and the second substrate.

9. The charger of claim 8, wherein, The circuit board further includes a third board and a fourth board that are electrically connected. A third capacitor is also disposed on the first board. The third board is disposed between the first board and the second board and is located on one side opposite to the first board and the second board. The fourth board is located between the two transformers and the second capacitor. The second capacitor and the third capacitor are both located on the side of the fourth substrate facing away from the two transformers.

10. The charger of claim 9, wherein, The fourth substrate has at least two output interfaces exposed on the bottom wall of the receiving groove, and the second capacitor and the third capacitor are arranged at intervals between the at least two output interfaces.

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