An integrated temperature control structure and a controlled environment cooling module using the same

Abstract

The utility model belongs to equipment heat dissipation technical field, concretely relates to a kind of integrated temperature control structure and the environment control cooling module using the structure, in temperature control structure, heating device and piezoelectric ceramic I, temperature control module are integrally arranged on PCB board, heating device and heat transfer structure heat conduction connection, metal block I is set on heat transfer structure, piezoelectric ceramic I or pressure sensor I and temperature control module are electrically connected.Module includes module shell, PCB board, the wall body of module shell is distributed flow channel, the outer wall of module shell is arranged respectively with the flow inlet, flow outlet of flow channel both ends communication;The functional chip is set on the PCB board, and the functional chip is heat conduction connection with the inner wall of module shell, the inner wall of module shell is arranged metal block I, piezoelectric ceramic I or pressure sensor I and temperature control module are electrically connected, and temperature control module and environment control system are electrically connected.Through above-mentioned structure and module real-time automatic adjustment environment control flow, improve heat dissipation reliability, and can reduce debugging workload.

Description

Technical Field

[0001] This utility model belongs to the field of equipment heat dissipation technology, specifically relating to an integrated temperature control structure and an environmental control cooling module using the structure. Background Technology

[0002] Traditional cooling modules (boards inserted into the chassis) mainly consist of a cold plate, a back cover, a PCB board, a flow inlet, and a flow outlet, with internal flow channels. When the cooling module is working, the components on the internal PCB board generate heat. The environmental control system provides cooling air (or coolant) through the flow inlet into the flow channels within the module. The heat dissipated by the components on the PCB board is conducted to the cold plate and carried away by the cooling air (or coolant).

[0003] Existing cooling modules rely on a unified environmental control system to supply cooling air (or coolant). This results in a significant workload during flow distribution and debugging. The environmental control system provides cooling air (or coolant) flow to multiple cooling modules. While the heat dissipation of each cooling module is fixed during design, flow distribution and debugging require allocating flow to each module based on its actual heat dissipation during operation. The actual heat dissipation of a cooling module can be categorized into three states: higher than the design value, equal to the design value, and lower than the design value. Therefore, there are three corresponding flow adjustment states: increasing the air (liquid) cooling mass, maintaining the air (liquid) cooling mass, and decreasing the air (liquid) cooling mass. When multiple cooling modules operate simultaneously, with a set number of N modules, there are theoretically N3 possible adjustment conditions. This results in a large debugging workload and makes dynamic, real-time temperature adjustment of the cooling modules impossible. Utility Model Content

[0004] To improve the reliability of heat dissipation of components within the cooling module and reduce the workload of equipment debugging, this utility model provides an integrated temperature control structure and an environmental control cooling module using this structure.

[0005] The purpose of this utility model is achieved through the following technical solution. According to this utility model, an integrated temperature control structure is proposed for heat dissipation of a heating element. The heating element, piezoelectric ceramic I, and temperature control module are integrated and mounted on a PCB board. The heating element is thermally connected to a heat transfer structure. A metal block I is disposed on the heat transfer structure, which contacts the piezoelectric ceramic I or a pressure sensor I. The metal block I is thermally connected to the heat transfer structure, and the piezoelectric ceramic I or pressure sensor I is electrically connected to the temperature control module.

[0006] Compared with the prior art, the advantages of this utility model are:

[0007] This invention proposes an integrated temperature control structure. The device heats up, causing a metal block to deform, which in turn generates an electrical signal from a piezoelectric ceramic or pressure sensor. This signal is transmitted to the environmental control system via the temperature control module, enabling the system to automatically adjust the flow rate based on the temperature of the functional chip. This eliminates reliance on traditional temperature sensors, solving the installation and placement problems associated with them. Furthermore, the simple structure of the metal block, piezoelectric ceramic, or pressure sensor improves reliability, achieves miniaturization, and reduces maintenance workload. This structure allows for real-time automatic adjustment of the environmental control flow rate, improving heat dissipation reliability and reducing debugging workload.

[0008] Furthermore, an insulating block is provided on the heat transfer structure, and the insulating block is thermally connected to the heat transfer structure. A piezoelectric ceramic II or a pressure sensor II is integrated on the PCB board. The insulating block is in contact with the piezoelectric ceramic II or the pressure sensor II. The piezoelectric ceramic II or the pressure sensor II is electrically connected to the temperature control module. The metal block I and the insulating block are arranged in a group. The distance between the metal block I and the insulating block in the same group on the heat transfer structure is close so that the metal block I, the insulating block and the corresponding piezoelectric ceramic or pressure sensor will have equal or similar deformation under vibration conditions.

[0009] Compared with the prior art, the advantages of this utility model are:

[0010] When the structure operates under vibration conditions, the vibration will cause relative displacement between the metal block I and the piezoelectric ceramic I or the pressure sensor, thus affecting the contact pressure. This results in inaccurate electrical signals transmitted by the piezoelectric ceramic or pressure sensor corresponding to the metal block I. After setting up the insulation block, the insulation block will only deform due to vibration. After the electrical signal of the piezoelectric ceramic or pressure sensor corresponding to the insulation block is transmitted to the temperature control module, the temperature control module processes the electrical signals of the two piezoelectric ceramics or pressure sensors, calculates the electrical signal generated due to temperature deformation, cancels the electrical signal generated under vibration conditions, corrects the erroneous electrical signal generated under vibration conditions, and makes the temperature control more accurate.

[0011] An environmentally controlled cooling module includes a module housing and a PCB board disposed within the module housing. Flow channels are distributed within the wall of the module housing, and a flow inlet and a flow outlet are respectively connected to both ends of the flow channels on the outer wall of the module housing. The flow inlet and flow outlet are respectively connected to an environmental control system via pipelines. A functional chip is disposed on the PCB board and is thermally connected to the inner wall of the module housing. A metal block I is disposed on the inner wall of the module housing and is thermally connected to the module housing. The metal block I is in contact with a piezoelectric ceramic I or a pressure sensor I disposed on the PCB board. The piezoelectric ceramic I or the pressure sensor I is electrically connected to a temperature control module on the PCB board, and the temperature control module is electrically connected to the environmental control system.

[0012] Furthermore, the inner wall of the module housing is also provided with a heat insulation block, which is thermally connected to the module housing. The heat insulation block is in contact with the piezoelectric ceramic II or pressure sensor II on the PCB board. The piezoelectric ceramic II or pressure sensor II is electrically connected to the temperature control module. The metal block I and the heat insulation block are arranged in a group. The distance between the metal block I and the heat insulation block in the same group on the module housing is similar so that the metal block I, the heat insulation block and the corresponding piezoelectric ceramic or pressure sensor will have equal or similar deformation under vibration conditions.

[0013] Furthermore, a heat dissipation protrusion is provided on the inner wall of the module housing, and the functional chip is thermally connected to the heat dissipation protrusion through a thermally conductive pad.

[0014] Furthermore, the metal block I and the heat insulation block are mounted on the heat dissipation protrusion.

[0015] Furthermore, a module connector is provided on the PCB board, and the module connector extends out of the module housing.

[0016] Furthermore, a pull-out aid is provided on the module housing.

[0017] Furthermore, a driver is provided on the PCB board.

[0018] Furthermore, the module housing includes a cold plate and a cover plate that are mated to each other. A PCB board is disposed between the cold plate and the cover plate. The edge of the PCB board is clamped and fixed between the edge of the cold plate and the edge of the cover plate. The cavities formed by the cold plate, the cover plate and the PCB board respectively accommodate the functional chips protruding from the PCB board.

[0019] The above description is only an overview of the technical solution of this utility model. In order to better understand the technical means of this utility model and to implement it in accordance with the contents of the specification, and to make the purpose, features and advantages of this utility model more obvious and easy to understand, the following are preferred embodiments, and detailed descriptions are provided in conjunction with the accompanying drawings. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of an embodiment of the environmentally controlled cooling module of this utility model;

[0021] Figure 2 for Figure 1 A schematic diagram of the decomposition process;

[0022] Figure 3 for Figure 2 Partial cross-sectional view of the internal flow channel of the intercooler plate;

[0023] Figure 4 for Figure 1 A partial sectional three-dimensional schematic diagram;

[0024] Figure 5 for Figure 4 A partially enlarged schematic diagram of the metal block and piezoelectric ceramics in the middle;

[0025] Figure 6 for Figure 2 A schematic diagram of a cold plate;

[0026] Figure 7 for Figure 2 A schematic diagram of the PCB board assembly;

[0027] Figure 8 This is a schematic diagram illustrating the temperature control principle of an embodiment of the environmentally controlled cooling module of this utility model;

[0028] Figure 9 This is a topology diagram of the temperature control module in an embodiment of the environmentally controlled cooling module of this utility model;

[0029] Figure 10 This is a schematic diagram of the heat transfer structure in an embodiment of the environmentally controlled cooling module of this utility model;

[0030] Figure 11 for Figure 10 A schematic diagram of the structure shown when it vibrates.

[0031] Figure label:

[0032] 1-Cold plate, 101-Flow inlet, 102-Flow outlet, 103-Flow channel, 2-Cover plate, 3-PCB board, 31-Functional chip, 4-Module connector, 5-Pull-out aid, 61-Metal block I, 62-Metal block II, 71-Piezoelectric ceramic I, 72-Piezoelectric ceramic II, 8-Heat dissipation boss, 9-Thermal conductive pad, 10-Driver. Detailed Implementation

[0033] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0034] An embodiment of the environmentally controlled cooling module of this utility model includes a cold plate 1, a cover plate 2, and a PCB board 3, as shown below. Figures 2 to 7 As shown.

[0035] The cold plate 1 and the cover plate 2 are joined together to form a module housing. In this embodiment, the cold plate 1 and the cover plate 2 are fixed together by screws.

[0036] The wall of the cold plate 1 is provided with S-shaped flow channels 103 that bend back and forth. The outer wall of the cold plate 1 is provided with flow channel inlets 101 and flow channel outlets 102 that are respectively connected to the two ends of the flow channels 103. The flow channel inlets 101 and flow channel outlets 102 are connected to the environmental control system to form a loop. The environmental control system sends cooling air or cooling liquid into the flow channels 103 of the cold plate 1 through pipelines to cool the cold plate 1. Then, the cooling air or cooling liquid that has absorbed heat is returned to the environmental control system through the flow channel outlets 102 for cooling, and is recycled.

[0037] A PCB board 3 is disposed between the cold plate 1 and the cover plate 2. The edge of the PCB board 3 is clamped and fixed between the edge of the cold plate 1 and the edge of the cover plate 2. The cavity formed between the cold plate 1, the cover plate 2, and the PCB board 3 accommodates components protruding from the PCB board 3. The components protruding from the PCB board 3 include a functional chip 31 and a driver 10. A module connector 4 is disposed at the rear end of the PCB board 3. The module connector 4 extends out of the module housing and is used to mate with the backplane connector on the backplane assembly inside the chassis housing where the cold plate module is located. In this embodiment, the module connector 4 is an LRM connector or a VPX connector.

[0038] A puller 5 is provided on the front outer wall of the cold plate 1 to assist in inserting or removing the cooling module from the chassis.

[0039] The functional chip 31, as a heat-generating device, is located on the side of the PCB board 3 facing the cold plate 1.

[0040] The PCB board assembly consists of PCB board 3, module connector 4, and functional chip 31, such as Figure 7 As shown.

[0041] A thermally conductive pad 9 is bonded to the functional chip 31. Heat dissipation protrusions 8, corresponding to the positions of the functional chip 31, are distributed on the inner wall of the cold plate 1. The thermally conductive pad 9 is tightly attached to the heat dissipation protrusions 8. The heat generated by the functional chip 31 is transferred to the cold plate 1 through the thermally conductive pad 9 and the heat dissipation protrusions 8, achieving a thermally conductive connection between the functional chip 31 and the cold plate 1. In this embodiment, the heat dissipation protrusions 8 and the cold plate 1 are integrally formed.

[0042] Metal blocks I 61 and II 62 are disposed on the inner wall of the cold plate 1. The distance between metal blocks I 61 and II 62 is small, such as... Figure 4 , Figure 5 As shown. Metal block I 61 is thermally connected to cold plate 1, and a heat insulation plate is placed between metal block II 62 and cold plate 1 to prevent heat from cold plate 1 from being transferred to metal block II 62. Piezoelectric ceramics I71 and II72, corresponding to the positions of metal block I 61 and metal block II 62, are installed on PCB board 3. Metal block I 61 is in contact with piezoelectric ceramic I 71, and metal block II 62 is in contact with piezoelectric ceramic II 72.

[0043] In this embodiment, in order to reduce the volume of metal block I 61 and metal block II 62, metal block I 61 and metal block II 62 are provided on one of the heat dissipation protrusions 8, such as... Figure 4 , Figure 5 As shown.

[0044] Heat from the cold plate 1 is conducted to the metal block I 61. After the metal block I 61 is heated and expands, it can compress the corresponding piezoelectric ceramic I 71, causing the piezoelectric ceramic I 71 to generate an electrical signal.

[0045] The heat emitted by the functional chip 31 passes sequentially through the thermally conductive pad 9, the heat dissipation boss 8, the cold plate 1, the metal block I 61, and the piezoelectric ceramic I 71, forming a heat transfer structure.

[0046] A temperature control module is installed on PCB board 3. The temperature control module includes a storage module, control logic circuit, power supply, and amplification circuit, such as... Figure 9 As shown. The piezoelectric ceramic (including piezoelectric ceramic I 71 and piezoelectric ceramic II 72) is electrically connected to the temperature control module through PCB board 3, which can transmit the electrical signal generated by the piezoelectric ceramic to the temperature control module.

[0047] The power supply provides appropriate voltage (current) to components such as amplifier circuits, memory modules, and control logic circuits.

[0048] The amplifier circuit amplifies the input piezoelectric ceramic electrical signal appropriately and provides a cutoff upper limit to prevent excessive voltage (current) from damaging the environmental control system components.

[0049] The storage module mainly stores the corresponding relationships and calculation rules of parameters such as the power of the functional chip, the expansion of the metal block, the voltage (current) of the piezoelectric ceramic, and the temperature.

[0050] The control logic circuit mainly controls the amplification factor of the amplifier circuit and outputs a signal to control the control loop voltage, as well as the priority of multiple piezoelectric ceramics working simultaneously, based on the data from the storage module.

[0051] The electrical signal generated by the piezoelectric ceramic (including piezoelectric ceramic I and piezoelectric ceramic II) is input to the temperature control module. After processing by the temperature control module, a suitable environmental control voltage is output. The environmental control voltage is transmitted through the PCB board 3, module connector 4, backplane connector that mates with module connector 4, backplane assembly 6 with the backplane connector, chassis connector 5 electrically connected to the backplane assembly, and cables to the flow regulation device of the environmental control system. This controls the flow distribution of the environmental control system to the cooling module, causing the flow to vary according to the power of the functional chip 31, thereby achieving real-time adjustment of the flow distribution of the environmental control system and thus regulating the temperature of the functional chip 10. Figure 8 As shown.

[0052] Let the heat dissipation of the functional chip 10 on PCB board 8 be W, then the corresponding temperature of the cold plate be t. The relationship between t and W can be expressed as:

[0053] t = f(W) (0.1)

[0054] When the module housing temperature is t, the expansion amount Δx of the metal block I (the expansion amount, deformation amount, or displacement amount mentioned in this utility model refers to the expansion amount, deformation amount, or displacement amount generated by the interaction between the metal block and the piezoelectric ceramic in the direction of interaction) can be expressed as:

[0055] Δx=f(t)(0.2)

[0056] When the expansion of the piezoelectric ceramic I into the metal block I is Δx, the change in voltage (current) ΔV can be expressed as:

[0057] ΔV=f(Δx) (0.3)

[0058] When the voltage (current) changes by ΔV, the control voltage V of the environmental control system after adjustment by the temperature control module is:

[0059] V=f(ΔV) (0.4)

[0060] The expressions for the control voltage V and the control flow rate Q of the environmental control system are as follows:

[0061] Q = f(V) (0.5)

[0062] By combining equations 1.1 to 1.5, the relationship between the heat dissipation of functional chip 10 and the flow rate of the environmental control system can be obtained.

[0063] When the cooling module is used under vibration conditions, the structure and components inside the cooling module will deform. The deformation caused by vibration and temperature may cause the electrical signal generated by the piezoelectric ceramic to be distorted.

[0064] Ideally, the electrical signal output by the piezoelectric ceramic I is positively correlated with temperature; that is, the higher the temperature, the greater the expansion of the metal block I, and the greater the electrical signal (voltage or current) generated by the piezoelectric ceramic I. For example... Figure 10 , Figure 11As shown, under vibration conditions, the expansion of metal block I61 due to temperature is Δx1, and the deformation (i.e., displacement) of PCB board 3 at the corresponding positions of metal blocks I and II, and piezoelectric ceramics I71 and II72 on PCB board 3 due to vibration is Δx2. When the deformation directions of Δx1 and Δx2 are the same and Δx2 > Δx1, piezoelectric ceramic I71 loosens from contact with metal block I61, and the pressure on piezoelectric ceramic I71 decreases or even disappears; when the deformation directions of Δx1 and Δx2 are the same and Δx2 < Δx1, although piezoelectric ceramic I71 does not detach from contact, the deformation of Δx2 will offset part of the deformation of Δx1, resulting in a decrease in the pressure on piezoelectric ceramic I71; when the deformation directions of Δx1 and Δx2 are opposite, the contact pressure between piezoelectric ceramic I71 and metal block I61 increases, and the pressure on piezoelectric ceramic I151 increases. All of the above situations can lead to inaccurate electrical signals generated by the piezoelectric ceramic I 71 (the electrical signal may be too large or too small under different vibration conditions under the same temperature conditions).

[0065] In this embodiment, two piezoelectric ceramics and two metal blocks are provided. Metal block I 61 is in thermally conductive contact with cold plate 1, and the heat from cold plate 1 can be transferred to metal block I 61. Metal block I 61 can automatically deform and expand with temperature changes. The output electrical signal of piezoelectric ceramic I 71 can change with temperature. A heat insulation plate is provided between metal block II 62 and cold plate 1 to achieve heat insulation connection, prevent heat from being transferred to metal block II 62, and thus prevent metal block II 62 from expanding and deforming due to temperature changes.

[0066] The initial contact deformation Δx0 is set between metal block I61 and piezoelectric ceramic I71, and between metal block II62 and piezoelectric ceramic II72, under static and initial temperature conditions. This deformation causes the corresponding piezoelectric ceramic to generate a voltage V0. When the cold plate module starts working, the functional chip 31 begins to heat up. The deformation of metal block I61 is Δx1. Metal block II62 is thermally insulated from the cold plate cover I11 and will not deform due to temperature; its deformation remains Δx0. The actual deformation of metal block I61 due to temperature is Δx1 - Δx0. The voltage generated by the piezoelectric ceramic when deformation is Δx0 is V0, and the voltage generated by the piezoelectric ceramic when deformation is Δx1 is V1. There is a corresponding relationship between the deformation and the voltage generated by the piezoelectric ceramic. This relationship can be pre-stored in the storage module. The temperature control module receives the voltages generated by the two piezoelectric ceramics and calculates the difference. This difference is the voltage value corresponding to the deformation caused by temperature. Then, the calculated voltage is converted into the voltage required by the environmental control system, and the flow rate of the corresponding cooling module is adjusted to dissipate heat from the cooling module.

[0067] When the cooling module vibrates under the aforementioned temperature conditions (i.e., when metal block I 61 expands by Δx1), and the positions of metal block I 61 and metal block II 62 are close, the vibration deformation of the piezoelectric ceramics on the PCB board at corresponding positions is consistent or has a very small difference, and can be set to Δx2 for both. At this time, the total deformation of metal block I 61 and piezoelectric ceramic I 71 is Δx1 ± Δx2 (the sum of the deformation caused by temperature and the deformation caused by vibration), and the voltage generated by piezoelectric ceramic I 71 is V3. The total deformation of metal block II 62 and piezoelectric ceramic II 72 is Δx0 ± Δx2 (the deformation caused by vibration), and the voltage generated by piezoelectric ceramic II 72 is V4. Since the difference in deformation between metal block I 61 and metal block II 62 is (Δx1±Δx2)-(Δx0±Δx2)=Δx1-Δx0 (removing the deformation caused by vibration), the temperature control module receives the voltage generated by the two piezoelectric ceramics and calculates the difference. The difference between voltage V3 and voltage V4 remains unchanged compared with the difference when there is no vibration. This ensures that the environmental control voltage output by the temperature control module remains unchanged and is not affected by vibration. It can improve the erroneous signal output caused by structural deformation factors. Then, the voltage is converted into the voltage required by the environmental control system and the flow rate of the corresponding cooling module is adjusted to dissipate heat from the cooling module, thereby realizing the dynamic compensation function.

[0068] When the cooling module is working, the heat from the functional chip 31 is transferred to the cold plate 1 through the thermal pad 9. The temperature of the metal block I 61 rises, causing deformation. This deformation acts on the piezoelectric ceramic I 71, and the piezoelectric effect of the piezoelectric ceramic I 71 generates an electrical signal (voltage or current). This signal is processed and amplified by the temperature control module to form a suitable environmental control voltage. This voltage is transmitted to the environmental control system through the PCB board 3, module connector 4, backplane connector, backplane assembly, chassis connector, and cables. The environmental control system controls the flow rate of cooling air (or cooling liquid) allocated by the cooling module, further cooling the module's temperature and achieving heat dissipation and temperature control of the functional chip 31. The temperature control module corrects the electrical signal emitted by the piezoelectric ceramic I 71 under vibration conditions by receiving the electrical signal generated by the piezoelectric ceramic II 72, preventing vibration from affecting the accuracy of the electrical signal.

[0069] The environmental control system provides cooling air (or coolant) to multiple cooling modules, and is connected to each module via corresponding piping. The system controls the flow rate to each cooling module based on electrical signals received from that module.

[0070] A valve is installed on the pipeline connecting the environmental control system and the cooling module. The environmental control system controls the opening and closing degree of the valve according to the received environmental control voltage, and adjusts the supply speed of cooling air (or cooling liquid) as needed, thereby realizing the adjustment of the flow rate of cooling air (or cooling liquid) supplied to the cooling module according to the temperature of the functional chip 10.

[0071] The cooling module can be installed inside a chassis. A backplane assembly is located at the rear end of the chassis housing's insertion cavity. The backplane assembly includes a backplane connector. The module connector 4 on the cooling module mates with the backplane connector, establishing an electrical connection between the cooling module and the backplane assembly. A chassis connector is also provided on the chassis, enabling electrical connections between the inside and outside of the chassis. Electrical connections between the backplane assembly and the chassis connector can be achieved via cables or a rigid-flex printed circuit board. The chassis connector connects to the environmental control system via cables, thus establishing an electrical connection between the cooling module and the environmental control system. Connectors can be installed at both ends of the cable, mate with the chassis connector and the connector on the flow control device in the environmental control system, respectively.

[0072] The cooling module can also be directly connected to the flow regulation device via a cable. Connectors can be installed at both ends of the cable to be inserted into the module connector and the connector on the flow regulation device in the environmental control system, respectively.

[0073] This invention proposes an environmental control cooling module that can automatically adjust the flow rate of cooling air (or cooling liquid) allocated to the cooling module by the environmental control system according to the temperature of the functional chip 31. It no longer relies on traditional temperature sensors, solves the installation and layout problems of temperature sensors, improves the reliability and miniaturization design of the system, can effectively control the temperature rise of the cooling module (board), effectively improve the reliability of heat dissipation of electronic equipment, and reduce the workload of equipment debugging.

[0074] In other embodiments, to accurately measure the temperature of each functional chip 31, metal blocks I61 and II62 (close to the corresponding functional chip 31) can be provided on each heat dissipation protrusion 8, with a piezoelectric ceramic corresponding to each metal block. The heat emitted by the functional chip 31 is absorbed by the nearest metal block I, causing the metal block I to expand and generate an electrical signal in the corresponding piezoelectric ceramic. Due to the short heat transfer path, the metal block I can precisely deform according to the heat generated by the functional chip 31, allowing the piezoelectric ceramic to accurately generate an electrical signal based on the heat generated by the functional chip 31. The electrical signal generated by the piezoelectric ceramic on the same PCB board is transmitted to the temperature control module on the same PCB board. The temperature control module selects the highest value for processing and sends it to the environmental control system.

[0075] In other embodiments, the cooling module is provided with two or more sets of metal blocks (including metal block I61 and metal block II62) and piezoelectric ceramics (including piezoelectric ceramics I71 and piezoelectric ceramics II72), not limited to the number and position of the functional chip 31, for monitoring the temperature at multiple locations in the cooling module. The temperature control module on the PCB board 3 outputs an electrical signal corresponding to the maximum deformation (i.e. the highest temperature) to be transmitted to the environmental control system.

[0076] In other embodiments, the metal block II62 can be replaced with other forms of insulating blocks, such as plastic blocks, that insulate the cold plate.

[0077] In other embodiments, the piezoelectric ceramic can be replaced with a pressure sensor, with metal block I61 contacting pressure sensor I and metal block II62 contacting pressure sensor II.

[0078] In other embodiments, the functional chip 31 can be directly in contact with the heat dissipation protrusion 8, or the heat dissipation protrusion 8 can be omitted, and the functional chip 31 can be directly thermally connected to the cold plate 1 through the thermally conductive pad 9.

[0079] This utility model discloses an embodiment of an integrated temperature control structure, including piezoelectric ceramic I71, piezoelectric ceramic II72, and a temperature control module in an embodiment of an environmentally controlled cooling module. In this embodiment, piezoelectric ceramic I71, piezoelectric ceramic II72, and the temperature control module are integrated on a PCB board 3. The heating device is the functional chip 31 integrated on the PCB board 3, which is the PCB board within the cooling module (board, cold plate structure). The cold plate 1, as a heat transfer structure, is thermally connected to the functional chip 31. Metal blocks II 61 and II 62 are disposed on the inner wall of the cold plate 1. Metal block II 61 is thermally connected to the cold plate 1, and metal block II 62 is thermally insulated from the cold plate. Metal blocks II 61 and II 62 are in contact with piezoelectric ceramic I71 and piezoelectric ceramic II72, respectively. Functional chip 1 generates heat and transfers the heat to metal block I 61. Metal block I 61 expands, causing piezoelectric ceramic I 71 to generate an electrical signal, which is then transmitted to the temperature control module. The temperature control module outputs an electrical signal to control the refrigeration equipment (including environmental control system, fan, thermoelectric cooler, etc.) to cool functional chip 31.

[0080] In other embodiments, improvements are made to the above-described integrated temperature control structure. When the temperature control structure operates in a stable environment, the structure can be simplified by removing the metal block II 62 and the piezoelectric ceramic II 72.

[0081] In other embodiments, improvements are made to the above-described integrated temperature control structure embodiment, and the metal block II 62 can be replaced with other forms of insulating blocks, such as plastic blocks, that insulate the cold plate.

[0082] In other embodiments, improvements are made to the above-described integrated temperature control structure embodiment, where the piezoelectric ceramic can be replaced with a pressure sensor, with metal block I 61 contacting pressure sensor I and metal block II 62 contacting pressure sensor II.

[0083] In other embodiments, improvements are made to the above-described integrated temperature control structure embodiment by providing a heat dissipation protrusion 8 on the inner wall of the cold plate, allowing the functional chip 31 to make thermally conductive contact with the heat dissipation protrusion 8; or, the heat dissipation protrusion 8 is not provided, and the functional chip 31 is directly thermally connected to the cold plate 1 via a thermally conductive pad 9; or, the functional chip 31 is thermally connected to the cold plate 1 via the thermally conductive pad 9 and the heat dissipation protrusion 8.

[0084] In other embodiments, this integrated temperature control structure can also be applied to other devices and facilities. For example, it can be used on the PCB board of a control device. The heating element on the PCB board is thermally connected to the device housing. A metal block is provided on the device housing and contacts the piezoelectric ceramic on the PCB board. A temperature control module is integrated on the PCB board. The temperature control module can send a signal to control the refrigeration equipment to cool and dissipate heat from the control device.

[0085] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. An integrated temperature control structure for heat dissipation of heat-generating devices, characterized in that: The heating device, piezoelectric ceramic I (71), and temperature control module are integrated on the PCB board (3). The heating device is thermally connected to the heat transfer structure. A metal block I (61) is provided on the heat transfer structure to contact the piezoelectric ceramic I (71) or the pressure sensor I. The metal block I (61) is thermally connected to the heat transfer structure. The piezoelectric ceramic I (71) or the pressure sensor I is electrically connected to the temperature control module.

2. The integrated temperature control structure according to claim 1, characterized in that: The heat transfer structure is provided with an insulating block, which is thermally connected to the heat transfer structure. The PCB board (3) is integrated with a piezoelectric ceramic II (72) or a pressure sensor II. The insulating block is in contact with the piezoelectric ceramic II (72) or the pressure sensor II. The piezoelectric ceramic II (72) or the pressure sensor II is electrically connected to the temperature control module. The metal block I (61) and the insulating block are grouped together. The distance between the metal block I (61) and the insulating block in the same group on the heat transfer structure is close so that the metal block I (61), the insulating block and the corresponding piezoelectric ceramic or pressure sensor will have equal or similar deformation under vibration conditions.

3. An environmentally controlled cooling module, comprising a module housing and a PCB board (3) disposed within the module housing, characterized in that: The module housing has flow channels (103) distributed in the wall. The outer wall of the module housing is provided with flow inlet (101) and flow outlet (102) respectively connected to the two ends of the flow channels (103). The flow inlet (101) and flow outlet (102) are respectively connected to the environmental control system through pipelines. The PCB board (3) is provided with a functional chip (31). The functional chip (31) is thermally connected to the inner wall of the module housing. The inner wall of the module housing is provided with a metal block I (61). The metal block I (61) is thermally connected to the module housing. The metal block I (61) is in contact with the piezoelectric ceramic I (71) or pressure sensor I provided on the PCB board (3). The piezoelectric ceramic I (71) or pressure sensor I is electrically connected to the temperature control module on the PCB board (3). The temperature control module is electrically connected to the environmental control system.

4. The environmentally controlled cooling module according to claim 3, characterized in that: The inner wall of the module housing is also provided with a heat insulation block, which is thermally connected to the module housing. The heat insulation block is in contact with the piezoelectric ceramic II (72) or pressure sensor II provided on the PCB board (3). The piezoelectric ceramic II (72) or pressure sensor II is electrically connected to the temperature control module. The metal block I (61) and the heat insulation block are arranged in a group. The distance between the metal block I (61) and the heat insulation block in the same group on the module housing is close so that the metal block I (61), the heat insulation block and the corresponding piezoelectric ceramic or pressure sensor will have equal or similar deformation under vibration conditions.

5. The environmentally controlled cooling module according to claim 4, characterized in that: The inner wall of the module housing is provided with a heat dissipation protrusion (8), and the functional chip (31) is thermally connected to the heat dissipation protrusion (8) through a thermally conductive pad (9).

6. The environmentally controlled cooling module according to claim 5, characterized in that: The metal block I (61) and the heat insulation block are disposed on the heat dissipation boss (8).

7. The environmentally controlled cooling module according to claim 4, characterized in that: A module connector (4) is provided on the PCB board (3), and the module connector (4) extends out of the module housing.

8. The environmentally controlled cooling module according to claim 4, characterized in that: A pull-out aid (5) is provided on the module housing.

9. A controlled cooling module according to claim 4, characterized in that: A driver (10) is provided on the PCB board (3).

10. A controlled cooling module according to claim 4, characterized in that: The module housing includes a cold plate (1) and a cover plate (2) that are connected to each other. A PCB board (3) is disposed between the cold plate (1) and the cover plate (2). The edge of the PCB board (3) is clamped and fixed between the edge of the cold plate (1) and the edge of the cover plate (2). The cavity formed by the cold plate (1), the cover plate (2) and the PCB board (3) respectively accommodates the functional chip (31) protruding from the PCB board (3).

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