An ultra-long substrate carrier and an SMT mounting machine capable of processing an ultra-long substrate

Abstract

This utility model discloses an ultra-long substrate carrier and an SMT assembly machine capable of processing ultra-long substrates. The ultra-long substrate carrier includes a rectangular carrier plate. A support portion is formed at the center of the top surface of the carrier plate, and a first mounting surface is formed around the support portion. The first mounting surface is enclosed by two long plate surfaces and two short plate surfaces, and several positioning portions are provided on the two long plate surfaces. By setting multiple positioning portions on the carrier, the ultra-long substrate is loaded onto the carrier, and the substrate no longer directly contacts the transport track. The transport track is stopped by any set of positioning portions blocking a sensor on the transport track, thus stopping and positioning the substrate. Multiple sets of positioning portions enable multiple stops for ultra-long substrate mounting. This allows the SMT assembly machine to produce ultra-long substrates in multiple batches, enabling the production of substrates exceeding the machine's rated size. This eliminates the need to purchase equipment with multiple rated sizes, reducing enterprise costs.

Description

Technical Field

[0001] This utility model relates to the field of SMT technology, specifically to an ultra-long substrate carrier and an SMT assembly machine capable of processing ultra-long substrates. Background Technology

[0002] SMT is short for Surface Mount Technology, also known as surface mounting or surface placement technology. As a commonly used electronic manufacturing technology, SMT is widely used in the production process of various electronic products. An SMT assembly machine is an automated processing equipment that can accurately place various types of components onto the surface of a PCB (substrate) that has been printed with solder paste or adhesive. It has advantages such as high work efficiency and good placement quality.

[0003] Existing traditional SMT assembly machines can only process substrates within a fixed length range (generally within 600mm). The process mainly involves setting up sensors (such as photoelectric sensors, with two tracks opposite each other, one acting as a transmitting sensor and the other as a receiving sensor) on the substrate transport track to stop and position the substrate at the placement station. The substrate is directly transported on the transport track. When the substrate is placed, it needs to be positioned and stopped at the placement station. The principle is that when the substrate is transported on the transport track, it blocks the sensors on the transport track, so that the receiving sensor cannot receive the light signal emitted by the transmitting sensor. Thus, the controller (PLC control system) controls the transport track to stop the transmission, thereby positioning and stopping the substrate. However, since the position of the sensors on the transport track is fixed and the number is limited, when processing ultra-long substrates (usually greater than 600nm, such as 2*600, or 1200nm), existing traditional SMT assembly machines need to stop the board multiple times. However, due to the fixed position and limited number of sensors on the transport track, the use of existing traditional SMT assembly machines has significant limitations. Therefore, this utility model is derived from this. Utility Model Content

[0004] In view of at least one of the above-mentioned technical problems, the purpose of this utility model is to provide an ultra-long substrate carrier and an SMT assembly machine that can realize the processing of ultra-long substrates.

[0005] The technical solution of this utility model is:

[0006] One objective of this utility model is to provide an ultra-long substrate carrier, comprising a rectangular carrier plate, wherein a square support portion for fixing the ultra-long substrate is formed at the center of the top surface of the carrier plate, and a first mounting surface protruding from the top surface of the support portion is formed around the support portion. The first mounting surface is surrounded by two opposite and spaced-apart long plate surfaces and two opposite and spaced-apart short plate surfaces. On the two long plate surfaces, a plurality of spaced-apart and upwardly protruding positioning portions are provided along their respective length directions. The positioning portions on the two long plate surfaces correspond one-to-one, and any two corresponding positioning portions form a group.

[0007] Preferably, all the positioning portions on any of the long plate surfaces are arranged on the same straight line, and the outer side of any of the positioning portions is at a first distance from the outer side of the long plate surface on which it is located, and the first distance is not zero.

[0008] Preferably, the interval between any two adjacent positioning portions on any of the elongated plate surfaces is the same or different.

[0009] Another objective of this utility model is to provide an SMT assembly machine capable of processing ultra-long substrates, comprising a machine body, wherein the machine body is provided with two opposing and spaced-apart transport tracks, and a transmitting sensor and a receiving sensor are provided opposite to each other on the two transport tracks at the mounting station position. The transport tracks are adapted for transporting ultra-long substrate carriers as described above. When any set of positioning parts on the ultra-long substrate carrier is opposite to the transmitting sensor and the receiving sensor respectively, the projections of the transmitting sensor and the receiving sensor in the light emission direction of the transmitting sensor fall on the positioning parts on their respective sides.

[0010] Preferably, when any set of positioning portions on the ultra-long substrate carrier is opposite to the transmitting sensor and the receiving sensor respectively, the projections of the light emitting end of the transmitting sensor and the light receiving end of the receiving sensor in the light emitting direction of the transmitting sensor fall on the positioning portions on their respective sides.

[0011] Preferably, the height and length of any of the positioning portions on the ultra-long substrate carrier are not less than the height and length of any of the sensors.

[0012] Preferably, the top surface of any of the positioning portions on the ultra-long substrate carrier is at the same horizontal plane as the top surface of the transmitting sensor or the receiving sensor.

[0013] Preferably, the top surface of any of the conveying tracks that is close to the top surface of the other conveying track is configured as a conveying surface and the top surface that is far from the top surface of the other conveying track is configured as a second mounting surface. The height of the second mounting surface is higher than the height of the conveying surface. The transmitting sensor and the receiving sensor are respectively mounted on the second mounting surfaces of the two conveying tracks.

[0014] A limiting plate is also provided on the second mounting surface of any of the conveying tracks. The limiting plate extends along the length direction of the conveying track and has one end fixed to the second mounting surface in the width direction, while the other end extends toward the conveying surface. Along the conveying direction of the ultra-long substrate carrier, the limiting plate is located behind the transmitting sensor or the receiving sensor.

[0015] Preferably, when the extra-long substrate carrier is conveyed on the transport track and passes the limiting plate, the outer side of any of the limiting plates has a second distance from the outer side of the positioning part on the corresponding side, and the second distance is not zero.

[0016] Compared with the prior art, the advantages of this utility model are:

[0017] This invention relates to an extra-long substrate carrier and an SMT assembly machine capable of processing extra-long substrates. By incorporating multiple positioning units on the carrier, the extra-long substrate is loaded onto the carrier, eliminating direct contact between the substrate and the transport track. The transport track is stopped by any set of positioning units blocking sensors, thus stopping and positioning the substrate. Multiple positioning units enable multiple stops for mounting extra-long substrates. This allows the SMT assembly machine to process extra-long substrates in multiple steps, exceeding the machine's rated size, eliminating the need to purchase equipment with multiple rated sizes and reducing enterprise costs. Attached Figure Description

[0018] The present invention will be further described below with reference to the accompanying drawings and embodiments:

[0019] Figure 1 This is a schematic diagram of the structure of the ultra-long substrate carrier according to an embodiment of the present invention;

[0020] Figure 2 This is a schematic diagram of the structure of an SMT assembly machine capable of processing ultra-long substrates according to an embodiment of the present invention (only the transport track and ultra-long substrate carrier are shown).

[0021] Figure 3 This is a schematic diagram of the conveyor track of an SMT assembly machine capable of processing ultra-long substrates, according to an embodiment of the present invention.

[0022] Wherein: 100, extra-long substrate carrier; 10, carrier plate; 11, support part; 12, first mounting surface; 121, long plate surface; 122, short plate surface; 20, positioning part; 200, transport track; 210, transport surface; 220, second mounting surface; 230, limiting plate; 300, transmitting sensor; 310, receiving sensor. Detailed Implementation

[0023] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to specific embodiments and accompanying drawings. It should be understood that these descriptions are merely exemplary and not intended to limit the scope of this utility model. Furthermore, descriptions of well-known structures and technologies are omitted in the following description to avoid unnecessarily obscuring the concept of this utility model.

[0024] In existing SMT assembly machines, the substrate is placed directly on a transport track for mounting. A pair of sensors on the transport track at the mounting station (where the mounting equipment is located, and the entire mounting area accessible to the equipment belongs to the mounting station) control the substrate's stopping position. When the substrate reaches the mounting station, it blocks the sensors, stopping and positioning the substrate at the mounting station, thus completing the mounting process. However, this approach has limitations. Because the position and number of sensors on the transport track are fixed (two), and because the mounting range of the equipment is fixed (meaning the size of the substrate processed by one SMT assembly machine is calibrated and fixed (e.g., not exceeding 600nm), when processing ultra-long substrates exceeding 600nm (e.g., 1200nm or even longer), multiple stops are required. As mentioned above, this approach has significant limitations; for example, the stopping position is difficult to control, resulting in incomplete mounting in some areas and poor substrate quality.

[0025] To address the aforementioned technical problems, this utility model provides a carrier suitable for ultra-long substrates (referring to substrates exceeding the nominal size of an SMT assembly machine; for example, if the nominal size of an SMT assembly machine substrate is 600nm, then an ultra-long substrate refers to a substrate larger than 600nm, especially a substrate more than twice the nominal size, such as 1200nm, 1800nm, 2400nm, etc.). The ultra-long substrate carrier 100 enables multiple free stops of the ultra-long substrate (not shown). For details, see... Figures 1 to 2The system includes a rectangular carrier plate 10, the length of which can be selected and designed according to the length of the extra-long substrate to be mounted. A square support portion 11 for fixing the extra-long substrate is formed at the center of the top surface of the carrier plate 10, and a first mounting surface 12 protruding from the top surface of the support portion 11 is formed around the support portion 11. That is, the first mounting surface 12 convexes upward relative to the support portion 11, while the support portion 11 is concave downward relative to the first mounting surface 12. The first mounting surface 12 is formed by two opposing and spaced-apart long plate surfaces 121 and two opposing and spaced-apart short plate surfaces 122, i.e., the first mounting surface 12 and the support portion 11 form a U-shaped structure. Several spaced-apart and upwardly protruding positioning portions 20 are provided on the two long plate surfaces 121 along their respective length directions. The positioning portions 20 on the two long plate surfaces 121 correspond one-to-one, and any two corresponding positioning portions 20 form a group. In other words, the number of positioning parts 20 on the two long plate surfaces 121 is the same, and the positions of the positioning parts 20 on the two long plate surfaces 121 correspond one-to-one. For example, Figure 1 As shown, any one of the long plate surfaces 121 is provided with five positioning parts 20. For ease of description, along the... Figure 1In the left-to-right direction shown, the five positioning parts 20 on any long plate surface 121 are respectively referred to as the first positioning part, the second positioning part, the third positioning part, the fourth positioning part, and the fifth positioning part. The two first positioning parts on the two long plate surfaces 121 are corresponding, that is, they are on the same straight line (the straight line here corresponds to the wide side of the vehicle) and form a group. The other positioning parts 20 are similar and will not be described again. In this embodiment, all the positioning parts 20 on any long plate surface 121 are arranged on the same straight line (the straight line here corresponds to the long side of the vehicle), and the outer side of any positioning part 20 on any long plate surface 121, that is, the side of the positioning part 20 facing away from the other long plate surface 121, has a first distance from the outer side of the long plate surface 121 it is located at. This first distance is not zero, and the specific value is not described or limited. Those skilled in the art can select and design according to actual needs. The first distance between the outer side of all positioning parts 20 and the outer side of the long plate surface 121 they are located at is the same. The purpose is to avoid interference between the positioning part 20 and the transport track 200 on the SMT assembly machine, specifically the limiting plate 230 (described below), and the sensors on the transport track 200. The spacing between any two adjacent positioning parts 20 on any long board surface 121 can be the same or different (partially the same, partially different), preferably all the same. The spacing between any two adjacent positioning parts 20 on any long board surface 121 is not described or limited, and can be designed according to the mounting range of the SMT assembly machine's mounting mechanism; that is, the spacing between any two adjacent positioning parts 20 is consistent with the mounting range of the SMT assembly machine. The number of positioning parts 20 on any long board surface 121 is also not described or limited, and those skilled in the art can select and design it according to the length of the extra-long substrate to be mounted or the number of stops.

[0026] The ultra-long substrate carrier 100 of this utility model, such as Figure 1 As shown, by setting multiple positioning parts 20 on the carrier, the carrier is used to load the ultra-long substrate. The substrate no longer directly contacts the transport track 200. The transport track 200 is stopped by blocking the sensor on the transport track 200 by any set of positioning parts 20, so as to stop and position the substrate. By setting multiple sets of positioning parts 20, multiple stop-and-mount processing of ultra-long substrates can be realized.

[0027] This utility model embodiment also provides an SMT assembly machine capable of processing ultra-long substrates, see [link to relevant documentation]. Figures 1 to 3The system includes a body (not shown), which comprises two opposing and spaced-apart transport tracks 200 for conveying substrates by the extra-long substrate carrier 100 described in the above embodiment. A transmitting sensor 300 and a receiving sensor 310 are positioned on the two transport tracks 200 at corresponding substrate mounting stations. The transmitting and receiving sensors 300 and 310 are positioned opposite each other to form a conventional photoelectric control switch. This photoelectric control switch is communicatively connected to the transport tracks 200 to control their start and stop. The photoelectric control switch is also communicatively connected to a PLC control system, which enables the extra-long substrate carrier 100 to be restarted after one substrate mounting process is completed. The working principle and specific circuit structure are not specifically described or limited, and are considered prior art; see CN206908958U for details. This is not an innovation of this utility model. The transmitting sensor 300 and the receiving sensor 310 are conventional photoelectric sensors available on the market. The transmitting sensor 300 has a light emitting end (not shown), and the receiving sensor 310 has a light receiving end (not shown). The light emitting end of the transmitting sensor 300 and the light receiving end of the receiving sensor 310 are arranged opposite to each other. In order to stop the substrate at the mounting station position, in this embodiment, when any set of positioning parts 20 on the ultra-long substrate carrier 100 is opposite to the transmitting sensor 300 and the receiving sensor 310 respectively, that is, when any set of positioning parts 20 on the ultra-long substrate carrier 100 moves to the position of the transmitting sensor 300 and the receiving sensor 310, the projection of the transmitting sensor 300 and the receiving sensor 310 in the light emission direction of the transmitting sensor 300 falls on the positioning part 20 on their respective sides. In other words, when any set of positioning parts 20 on the extra-long substrate carrier 100 is opposite to the transmitting sensor 300 and the receiving sensor 310 respectively, they can precisely block the transmitting sensor 300 and the receiving sensor 310, thereby preventing them from receiving signals. The photoelectric control switch then activates, the transport track 200 stops running, and the substrate stops at the mounting station position. It should be noted that, to improve the accuracy of the substrate stopping position, a lifting and blocking mechanism, such as a cylinder, connected to the photoelectric control switch can be added to the transport track 200 at the positions corresponding to the transmitting sensor 300 and the receiving sensor 310. Specific details are not described or limited, and those skilled in the art can easily understand and implement such mechanisms; this is not an innovation of this utility model.In an optional embodiment, in order to enable the positioning part 20 to block the light signal emitted by the transmitting sensor 300 to the receiving sensor 310, the positioning part 20 is configured to only block the light emitting end of the transmitting sensor 300 and the light receiving end of the receiving sensor 310. That is, when any set of positioning parts 20 on the ultra-long substrate carrier 100 is opposite to the transmitting sensor 300 and the receiving sensor 310 respectively, the projections of the light emitting end of the transmitting sensor 300 and the light receiving end of the receiving sensor 310 in the light emission direction of the transmitting sensor 300 fall on the positioning part 20 on their respective sides. It is not required that the size of the positioning part 20 is necessarily larger than the size of the transmitting sensor 300 or the receiving sensor 310. It is only required that the size of the positioning part 20 is larger than the light emitting end of the transmitting sensor 300 and the light receiving end of the receiving sensor 310. In another optional embodiment, to ensure that the positioning part 20 can effectively form a shield, the dimensional relationship between the sensor and the positioning part 20 is defined. Specifically, the height and length of any positioning part 20 on the ultra-long substrate carrier 100 are not less than the height and length of any sensor. That is, when any set of positioning parts 20 on the ultra-long substrate carrier 100 is opposite to the transmitting sensor 300 and the receiving sensor 310 respectively, the positioning part 20 can completely shield the entire transmitting sensor 300 and the receiving sensor 310, and naturally also shield the light emitting end of the transmitting sensor 300 and the light receiving end of the receiving sensor 310. The specific height and length are not described or limited; for example, the height of the positioning part 20 can be selected as 1.5 times the height of the transmitting sensor 300 or the receiving sensor 310, and the length of the positioning part 20 can be selected as twice the length of the transmitting sensor 300 or the receiving sensor 310. In some embodiments of this invention, the top surface of any positioning part 20 on the ultra-long substrate carrier 100 is at the same horizontal plane as the top surface of the transmitting sensor 300 or the receiving sensor 310.

[0028] like Figure 2 and Figure 3As shown, for the conveying track 200, in this embodiment, the top surface of any conveying track 200 is composed of two surfaces of different heights. The height of the top surface closer to the other conveying track 200, i.e., the inner top surface, is lower than the height of the top surface farther from the other conveying track 200, i.e., the outer top surface. That is, the inner surface is lower than the outer surface. For ease of description and distinction, the inner top surface is described as the conveying surface 210 and the outer top surface is described as the second mounting surface 220. The conveying surface 210 is used for the ultra-long substrate carrier 100 to transport, while the second mounting surface 220 is used for the installation of the transmitting sensor 300 or the receiving sensor 310. To achieve longitudinal positioning of the ultra-long substrate carrier 100 during transport, a limiting plate 230 is provided on the second mounting surface 220 of any transport track 200. One end of the limiting plate 230, specifically one long side in the width direction, is fixed to the second mounting surface 220; the other end, specifically the other long side in the width direction, extends towards the transport surface 210 of the transport track 200. The extension length is consistent with the width of the transport surface 210. In other words, the portion of the limiting plate 230 extending above the transport surface 210, together with the transport surface 210, constitutes a vertical limiting space for the ultra-long substrate carrier 100 during transport. The length of the limiting plate 230 extends along the length direction of the transport track 200; the length is not described or limited, but can be selected as half the length of the transport track 200. In this embodiment of the present invention, along the transport direction of the ultra-long substrate carrier 100, i.e., as shown... Figure 2 or Figure 3 As shown by arrow a, the limiting plate 230 is located behind the transmitting sensor 300 or the receiving sensor 310.

[0029] Since the limiting plate 230 protrudes and extends towards the conveying surface 210, in order to avoid interference between the positioning part 20 on the limiting plate 230 and the limiting plate 230 when the ultra-long substrate carrier 100 is conveyed to the position of the limiting plate 230, in this embodiment of the present invention, there is a second distance between the outer side of the positioning part 20, that is, the side facing the limiting plate 230, and the outer side of the limiting plate 230, that is, the side facing the other conveying track 200. The second distance is not zero, but the specific value is not described or limited. Those skilled in the art can choose to design according to actual needs, as long as it is ensured that the positioning part 20 on the ultra-long substrate carrier 100 will not contact or interfere with the limiting plate 230 when it is conveyed to the position of the limiting plate 230.

[0030] This utility model embodiment of the SMT assembly machine capable of processing ultra-long substrates involves placing the ultra-long substrate to be processed into the support portion 11 of the ultra-long substrate carrier 100, and then placing the ultra-long substrate carrier 100 onto the transport track 200 for conveying. The transport track 200 is started. When the leading edge of the conveying direction's positioning portion 20 is opposite to the transmitting sensor 300 and the receiving sensor 310, a blockage is formed, triggering a photoelectric control switch to stop the board. The mounting mechanism then performs mounting processing on the leading edge portion of the substrate. After completion, the transport track 200 is started again to continue conveying the ultra-long substrate carrier 100 until the next positioning portion 20 blocks the transmitting sensor 300 and the receiving sensor 310, causing the ultra-long substrate carrier 100 to stop again. The mounting mechanism then performs mounting processing within its mounting range. After completion, the transport track 200 is started again, and this cycle repeats, achieving multiple stops until the entire ultra-long substrate processing is completed. With its simple structure and high practicality, it enables SMT equipment to produce ultra-long substrates in multiple batches, thereby producing substrates exceeding the equipment's rated size. This eliminates the need to purchase equipment with multiple rated sizes, reducing enterprise costs.

[0031] It should be understood that the specific embodiments described above are merely illustrative or explanatory of the principles of this utility model and do not constitute a limitation thereof. Therefore, any modifications, equivalent substitutions, improvements, etc., made without departing from the spirit and scope of this utility model should be included within its protection scope. Furthermore, the appended claims are intended to cover all variations and modifications falling within the scope and boundaries of the appended claims, or equivalent forms of such scope and boundaries.

Claims

1. An ultra-long substrate carrier, characterized in that, The device includes a rectangular carrier plate. A square support portion for fixing the extra-long substrate is formed at the center of the top surface of the carrier plate. A first mounting surface protruding from the top surface of the support portion is formed around the support portion. The first mounting surface is surrounded by two opposite and spaced-apart long plate surfaces and two opposite and spaced-apart short plate surfaces. Several spaced-apart and upwardly protruding positioning portions are provided on the two long plate surfaces along their respective length directions. The positioning portions on the two long plate surfaces correspond one-to-one, and any two corresponding positioning portions form a group.

2. The ultra-long substrate carrier according to claim 1, characterized in that, All the positioning parts on any of the long plate surfaces are arranged on the same straight line, and the outer side of any of the positioning parts is at a first distance from the outer side of the long plate surface on which it is located, and the first distance is not zero.

3. The ultra-long substrate carrier according to claim 1 or 2, characterized in that, The interval between any two adjacent positioning portions on any of the elongated plates may be the same or different.

4. An SMT assembly machine capable of processing ultra-long substrates, comprising a machine body, wherein the machine body is provided with two opposing and spaced-apart transport tracks, and a transmitting sensor and a receiving sensor are respectively provided on the two transport tracks at positions opposite to the placement station, characterized in that, The transport track is adapted for transport by the ultra-long substrate carrier according to any one of claims 1-3. When any set of positioning parts on the ultra-long substrate carrier is opposite to the transmitting sensor and the receiving sensor respectively, the projections of the transmitting sensor and the receiving sensor in the light emission direction of the transmitting sensor fall on the positioning parts on their respective corresponding sides.

5. The SMT assembly machine according to claim 4, characterized in that, When any set of positioning portions on the ultra-long substrate carrier is opposite to the transmitting sensor and the receiving sensor respectively, the projections of the light emitting end of the transmitting sensor and the light receiving end of the receiving sensor in the light emitting direction of the transmitting sensor fall on the positioning portions on their respective sides.

6. The SMT assembly machine according to claim 4, characterized in that, The height and length of any of the positioning portions on the ultra-long substrate carrier are not less than the height and length of any of the sensors.

7. The SMT assembly machine according to claim 6, characterized in that, The top surface of any of the positioning portions on the ultra-long substrate carrier is on the same horizontal plane as the top surface of the transmitting sensor or the receiving sensor.

8. The SMT assembly machine according to claim 4, characterized in that, The top surface of any of the conveying tracks that is close to the top surface of the other conveying track is configured as a conveying surface and the top surface that is far from the top surface of the other conveying track is configured as a second mounting surface. The height of the second mounting surface is higher than the height of the conveying surface. The transmitting sensor and the receiving sensor are respectively mounted on the second mounting surfaces of the two conveying tracks. A limiting plate is also provided on the second mounting surface of any of the conveying tracks. The limiting plate extends along the length direction of the conveying track and has one end fixed to the second mounting surface in the width direction, while the other end extends toward the conveying surface. Along the conveying direction of the ultra-long substrate carrier, the limiting plate is located behind the transmitting sensor or the receiving sensor.

9. The SMT assembly machine according to claim 8, characterized in that, When the extra-long substrate carrier is conveyed on the transport track and passes the limiting plate, the outer side of any of the limiting plates has a second distance from the outer side of the positioning part on the corresponding side, and the second distance is not zero.

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