Guiding and aligning mechanism and gluing system
By coordinating the guiding and alignment mechanism with the lifting mechanism, the semiconductor substrate is precisely aligned using the guiding and alignment components and power components, solving the problem of substrate misalignment on the marble platform and improving the accuracy and efficiency of adhesive application.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SHENZHEN RUIRONG AUTOMATION CO LTD
- Filing Date
- 2025-07-07
- Publication Date
- 2026-06-23
AI Technical Summary
Semiconductor substrates are thin and easily bent and deformed. When transported to a marble platform, they are prone to misalignment, resulting in inaccurate positioning and affecting the precision of adhesive application.
The system employs a guide alignment mechanism in conjunction with a lifting mechanism, including a guide alignment component and a power component. The guide alignment component raises the semiconductor substrate from a first height position to a second height position, guiding it to the adhesive application position on the marble platform. The substrate then descends from the first height position to the adhesive application height of the applicator, achieving precise alignment using the guide alignment surface and rollers.
This technology enables precise alignment of semiconductor substrates on a marble platform, ensuring accurate and efficient adhesive application, reducing the height difference of roller movement, and saving production costs.
Smart Images
Figure CN224389215U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to an adhesive application system, and also to a guiding and alignment mechanism applied in the adhesive application system. Background Technology
[0002] The adhesive coating system includes a marble platform for placing semiconductor substrates and a coating blade for applying adhesive to the semiconductor substrates. Before applying adhesive, the semiconductor substrates need to be sent to the adhesive coating station on the marble platform so that the coating blade can apply adhesive to their surfaces.
[0003] Because semiconductor substrates are relatively thin (approximately 10–30 μm), they are easily bent and deformed. When transferred to the marble platform, semiconductor substrates are prone to misalignment and inaccurate positioning, which affects the precision of adhesive application.
[0004] For the reasons mentioned above, there is an urgent need for a guide alignment mechanism for an adhesive application system that can solve the above problems. Utility Model Content
[0005] The purpose of this invention is to overcome the shortcomings of the prior art and provide a guide alignment mechanism with a guide alignment function and an adhesive application system with a guide alignment mechanism.
[0006] This utility model is implemented as follows: a guide alignment mechanism, used in conjunction with a lifting mechanism, includes:
[0007] A guide alignment assembly is used to guide and align a semiconductor substrate placed on a lifting mechanism.
[0008] The power unit drives the guide alignment assembly to move up and down;
[0009] The power component drives the guide alignment assembly to rise from a first height position to a second height position. The guide alignment assembly guides the semiconductor substrate placed on the lifting mechanism to the adhesive application position on the marble platform at the second height position.
[0010] The power unit drives the guide alignment assembly to descend from the second height position to the first height position, which is lower than the height at which the applicator applies adhesive in the horizontal direction.
[0011] Preferably, the guiding alignment component includes:
[0012] At least two spaced-apart first guide alignment surfaces are used for guiding and aligning the semiconductor substrate along its length.
[0013] At least two spaced second guide alignment surfaces are used for guiding alignment of the semiconductor substrate in the width direction.
[0014] Preferably, there are n first guide alignment surfaces and n second guide alignment surfaces, where n is an even number greater than 1, and the plurality of first guide alignment surfaces and the plurality of second guide alignment surfaces are arranged symmetrically.
[0015] Preferably, the upper ends of the opposing first guide alignment surface and the opposing second guide alignment surface are used to guide the semiconductor substrate to the lower ends of the first guide alignment surface and the second guide alignment surface, respectively.
[0016] The lower ends of the opposing first guide alignment surface and the opposing second guide alignment surface are used for aligning the semiconductor substrate, respectively.
[0017] Preferably, the guiding alignment mechanism includes:
[0018] Multiple rollers rotating along their axes are located around the semiconductor substrate. The first guide alignment surface and the second guide alignment surface are guide areas formed between the horizontal diameter and the vertical diameter of the multiple rollers, respectively.
[0019] Preferably, the position corresponding to the horizontal diameter of the rollers arranged opposite each other in the X and Y directions is used to align the semiconductor substrate in the length and width directions, and the position corresponding to the horizontal diameter of the rollers arranged opposite each other is at the same height as the lower surface of the semiconductor substrate.
[0020] Furthermore, the guiding alignment mechanism includes a vertically movable guiding support assembly. The guiding support assembly includes a hollow bracket and a plurality of slide rods disposed on the bracket for mounting the guiding alignment assembly. The bracket is located below the marble platform, and the slide rods pass through the second guide hole of the marble platform.
[0021] Furthermore, the guiding alignment mechanism includes a sliding guide for linking the bracket to move up and down. The sliding guide includes two symmetrically arranged linear slide rails and sliders respectively slidably mounted on the linear slide rails. The bracket is fixed on the two sliders.
[0022] Furthermore, the guiding alignment mechanism includes:
[0023] A first position detector is used to detect the first height position of the guide alignment component and output a first height position signal to the outside.
[0024] The second position detector is used to detect the second height position of the guide alignment component and output the second height position signal to the outside.
[0025] A drive unit is used to control power components.
[0026] The controller outputs control commands to the driver based on the received first or second height position signal, and the driver controls the power component to start or stop working according to the received control commands.
[0027] This utility model also provides an adhesive application system, including the above-described guiding and alignment mechanism, and further comprising:
[0028] A marble platform for mounting a semiconductor substrate has multiple first guide holes located below the semiconductor substrate and multiple second guide holes located on the outer periphery of the semiconductor substrate;
[0029] The lifting mechanism has multiple ejector pins that are respectively inserted into the first guide hole, and the top of the multiple ejector pins has a placement position for placing a semiconductor substrate;
[0030] The guide alignment assembly has multiple guide rods for mounting the guide alignment assembly, and the multiple guide rods are respectively vertically slidably disposed in the second guide hole.
[0031] This utility model provides a guiding alignment mechanism for use with a lifting mechanism and an adhesive application system having the above-mentioned guiding alignment mechanism. The guiding alignment component is used to guide and align a semiconductor substrate placed on the lifting mechanism and a power component to drive the guiding alignment component to move up and down. The power component drives the guiding alignment component to rise from a first height position to a second height position. At the second height position, the guiding alignment component accurately guides the semiconductor substrate placed on the lifting mechanism to the adhesive application position on the marble platform. The power component drives the guiding alignment component to descend from the second height position to the first height position. The first height position is lower than the height of the adhesive application blade in the horizontal direction, which facilitates the accurate application of adhesive by the adhesive application blade on the fixed semiconductor substrate. Attached Figure Description
[0032] To more clearly illustrate the technical solution of this utility model, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0033] Figure 1 This is a structural diagram of the guiding and alignment mechanism provided in an embodiment of this utility model.
[0034] Figure 2 This is a schematic diagram of the guide alignment frame in the guide alignment mechanism provided in this embodiment of the utility model.
[0035] Figure 3 This is a structural diagram showing the cooperation between the guiding alignment mechanism and the lifting mechanism provided in this embodiment of the utility model.
[0036] Figure 4 This is a schematic diagram of the guiding area in the guiding alignment mechanism provided in this embodiment of the utility model.
[0037] Figure 5 This is a structural diagram of the length direction guiding alignment component or the width direction guiding alignment component in the guiding alignment mechanism provided in this utility model embodiment.
[0038] Figure 6 This is a block diagram showing the connection between the driver, controller, and power component in the guiding and alignment mechanism provided in this embodiment of the utility model.
[0039] Figure 7 This is a diagram showing the semiconductor substrate at a first height position in the coating system provided in this embodiment of the utility model.
[0040] Figure 8 This is a diagram showing the semiconductor substrate at its second height position in the coating system provided in this embodiment of the utility model.
[0041] Figure 9 This is a schematic diagram of a coating knife applying adhesive to a semiconductor substrate in the coating system provided in this embodiment of the utility model.
[0042] The realization of the purpose, functional features and advantages of this utility model will be further explained in conjunction with the embodiments and with reference to the accompanying drawings.
[0043] The reference numerals in the attached figures are explained as follows:
[0044] Guide alignment mechanism 100, guide alignment assembly 110, first guide alignment surface 111, second guide alignment surface 112, guide alignment frame 113, roller 114, guide area 1141, power component 120, guide support assembly 130, bracket 131, slide bar 132, plate 133, roller bracket 134, sleeve 135, connection position 1351, arc-shaped part 1352, limiting component 136, horizontal position 1361, vertical position 1362, sliding guide component 140, linear slide rail assembly 141, slider 142, first position detector 150, second position detector 150', driver 160, controller 170;
[0045] Lifting mechanism 200, ejector pin 210, placement position 220, rotating power component 230;
[0046] Semiconductor substrate 300;
[0047] Marble platform 400, first guide hole 410, second guide hole 420;
[0048] 500 scalpels. Detailed Implementation
[0049] In this invention, the terms "upper," "lower," "left," "right," "front," "rear," "top," "bottom," "inner," "outer," "middle," "vertical," "horizontal," "lateral," and "longitudinal" indicate the orientation or state relationship based on the orientation or state relationship shown in the accompanying drawings. These terms are primarily for the purpose of better describing this invention and its embodiments, and are not intended to limit the indicated device, element, or component to having a specific orientation, or to be constructed and operated in a specific orientation.
[0050] Furthermore, in addition to indicating location or state relationships, some of the aforementioned terms may also have other meanings. For example, the term "above" may also be used in certain situations to indicate a dependency or connection relationship. Those skilled in the art can understand the specific meaning of these terms in this utility model based on the specific circumstances.
[0051] Furthermore, the terms "installation," "setup," "equipped with," "connection," and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral structure; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium, or an internal connection between two devices, components, or parts. Those skilled in the art can understand the specific meaning of these terms in this utility model based on the specific circumstances.
[0052] Furthermore, the terms "first," "second," etc., are primarily used to distinguish different devices, components, or parts, which may be the same or different in type and construction, and are not intended to indicate or imply the relative importance or quantity of the indicated devices, components, or parts. Unless otherwise stated, "a plurality of" means two or more.
[0053] To clarify the directional relationships in the diagram, a coordinate system with the vertical direction as the Z-direction and the horizontal plane as the XY-plane is appropriately labeled.
[0054] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention.
[0055] An overview of the alignment mechanism as an example
[0056] like Figures 1-3 As shown, the present invention provides a guide alignment mechanism 100, which is used in conjunction with a lifting mechanism 200, and includes:
[0057] The guide alignment component 110 is used to guide and align the semiconductor substrate 300 placed on the lifting mechanism 200. In this embodiment, the semiconductor substrate 300 is preferably rectangular. The semiconductor substrate 300 includes, but is not limited to, various substrates such as glass substrates for liquid crystal display devices, glass substrates for PDP, glass substrates for photomasks, substrates for color filters, substrates for recording disks, substrates for solar cells, substrates for electronic paper, rectangular glass substrates, flexible substrates for thin-film liquid crystals, and substrates for organic EL.
[0058] Power unit 120 drives the guide alignment assembly 110 to move up and down (see...) Figure 1 In the Z direction), the power components include, but are not limited to, a lead screw motor, a telescopic motor, or a telescopic cylinder. In this embodiment, the power component 120 is preferably a lead screw motor.
[0059] The lead screw motor rotates according to the set first number of revolutions, first speed and first direction, and the linkage guide alignment component 110 rises and moves from the first height position to the second height position. The guide alignment component 110 accurately guides the semiconductor substrate 300 placed on the lifting mechanism 200 to the glue application position of the marble platform 400 at the second height position.
[0060] The lead screw motor rotates according to the set second number of revolutions, second speed and second direction. The linkage guide alignment component 110 moves down from the second height position to the first height position. The first height position is lower than the height of the applicator when applying adhesive in the horizontal direction, so that the applicator 500 can accurately apply adhesive on the fixed semiconductor substrate 300.
[0061] In this embodiment, the first direction and the second direction are opposite, the first number of revolutions and the second number of revolutions are the same, and the first speed and the second speed are the same, which enables the power unit 120 to output uniform rotational power.
[0062] An overview of the first and second guiding alignment planes as examples.
[0063] Preferably, the guide alignment component 110 includes:
[0064] At least two spaced-apart length direction guiding alignment components, each length direction guiding alignment component having a first guiding alignment surface 111 for length direction guiding alignment of semiconductor substrate 300;
[0065] At least two spaced-apart width-direction guide alignment components, each width-direction guide alignment component having a second guide alignment surface 112 for width-direction guide alignment of the semiconductor substrate 300.
[0066] In this embodiment, preferably, the length direction guiding alignment component and the width direction guiding alignment component are symmetrically arranged and have the same structure. The symmetrical structural design can make the semiconductor substrate 300 uniformly stressed in the length and width directions, resulting in the best guiding alignment effect.
[0067] There are n first guide alignment surfaces 111 and n second guide alignment surfaces 112, where n is an even number greater than 1. In this embodiment, preferably, n is four. The four first guide alignment surfaces 111 and the four second guide alignment surfaces 112 are symmetrically arranged, which can quickly guide the semiconductor substrate 300 and improve the guidance alignment efficiency.
[0068] Preferably, the first guide alignment surface 111 and the second guide alignment surface 112 are, but are not limited to, inclined surfaces, arc surfaces, or a combination of inclined surfaces and arc surfaces, all of which can achieve the effect of guide alignment.
[0069] Overview of the guide alignment frame as an example
[0070] like Figure 2 As shown, the upper ends of the two opposing first guide alignment surfaces 111 and the two opposing second guide alignment surfaces 112 are used to guide the semiconductor substrate 300. In this embodiment, the distance L between the upper ends of the two opposing first guide alignment surfaces 111 and the distance M between the upper ends of the two opposing second guide alignment surfaces 112 are both greater than the outer dimensions of the semiconductor substrate 300, and are used to guide the semiconductor substrate 300 to the lower ends of the first guide alignment surfaces 111 and the second guide alignment surfaces 112.
[0071] The lower ends of the two opposing first guide alignment surfaces 111 and the two opposing second guide alignment surfaces 112 are respectively used to align the semiconductor substrate 300. In this embodiment, the distance L' between the lower ends of the two opposing first guide alignment surfaces 111 and the distance M' between the lower ends of the two opposing second guide alignment surfaces 112 are adapted to the outer dimensions of the semiconductor substrate 300. Preferably, the distance L' between the lower ends of the two opposing first guide alignment surfaces 111 and the distance M' between the lower ends of the two opposing second guide alignment surfaces 112 are both equal to or 0.01 to 0.02 mm larger than the outer dimensions of the semiconductor substrate 300, so as to facilitate the precise alignment of the semiconductor substrate 300 to the adhesive application position of the marble platform 400.
[0072] In this embodiment, preferably, a plurality of first guide alignment surfaces 111 and a plurality of second guide alignment surfaces 112 form a guide alignment frame 113 with a larger upper end and a smaller lower end, and the guide alignment frame 113 is located directly above the adhesive application position of the marble platform 400.
[0073] Overview of a roller as an example
[0074] like Figure 4As shown, preferably, the length direction guiding alignment component and the width direction guiding alignment component in the guiding alignment mechanism 100 both include:
[0075] Multiple rollers 114 rotating along their axes, preferably eight in this embodiment, are symmetrically arranged around the semiconductor substrate 300. The first guide alignment surface 111 and the second guide alignment surface 112 are guide areas 1141 formed between the vertical diameter D1 and the horizontal diameter D2 of the rollers 114. Since the resistance of rolling friction is less than that of sliding friction, the semiconductor substrate 300 can be moved quickly to the coating position, improving the efficiency of guidance and alignment.
[0076] The aforementioned method guides the semiconductor substrate 300 to the lower end of the first guide alignment surface 111 and the second guide alignment surface 112, which is preferably the position corresponding to the horizontal diameter D2.
[0077] In another embodiment, the roller 114 can be set to not rotate, which can also achieve the function of guiding and aligning. At the same time, a slope and a guide surface combining the slope and the arc surface can be provided on the roller 114.
[0078] Preferably, the position corresponding to the horizontal diameter D2 of the rollers 114 arranged opposite each other in the X and Y directions is used to align the semiconductor substrate 300 in the length and width directions. In this embodiment, the position corresponding to the horizontal diameter D2 of the rollers 114 is at the same height as the upper surface of the marble platform 400. With this structural design, the semiconductor substrate 300 can be guided to the adhesive application position on the marble platform 400 at the second height position, which is beneficial for the applicator 500 to accurately apply adhesive to the semiconductor substrate 300. At the same time, it also reduces the height difference between the upper end of the first guide alignment surface 111 and the second guide alignment surface 112 of the rollers 114 and the top of the lifting mechanism 200, shortens the guiding distance, and facilitates the first guide alignment surface 111 and the second guide alignment surface 112 of the rollers 114 to quickly guide the semiconductor substrate 300 onto the marble platform 400.
[0079] Overview of guide support components as an example
[0080] like Figure 1 and Figure 3 As shown, the guide alignment mechanism 100 further includes a vertically movable guide support assembly 130. The guide support assembly 130 includes a hollow bracket 131 and a plurality of slide rods 132 disposed on the bracket 131 for mounting the guide alignment assembly 110. The slide rods 132 slide through the second guide hole 420 of the marble platform 400. The bracket 131 is located below the marble platform 400 and is arranged parallel to the marble platform 400. The slide rods 132 are located on the outer periphery of the semiconductor substrate 300.
[0081] Overview of roller mounting structure and slide bar correction structure as examples
[0082] like Figure 5 As shown in this embodiment, each roller 114 is supported by two spaced and vertically arranged slide rods 132. The two slide rods 132 are at the same height. A roller mounting structure is detachably connected to the top of the two slide rods 132. A slide rod correction structure is installed at the lower end of each slide rod 132.
[0083] The roller mounting structure includes a flat plate 133 horizontally mounted on the top of the two slide rods 132 and a roller bracket 134 fixed on the flat plate 133. The roller 114 is rotatably mounted on the roller bracket 134, and the flat plate 133 is screwed to the two slide rods 132 by screws (not shown).
[0084] like Figure 5 As shown, the sliding rod correction structure includes a sleeve 135 screwed to the lower end of the sliding rod 132 and a limiting member 136 that is axially limited and radially slidingly engaged with the sleeve 135. The limiting member 136 is detachably fixedly connected to the bracket 131 and applies a thrust in the radial direction to the sleeve 135 (see...). Figure 5 (in the X direction), so that the sleeve 135 can be translated relative to the limiting member 136 to the position corresponding to the second guide hole 420.
[0085] The axial limiting and radial sliding fit structure includes:
[0086] An annular connecting position 1351 is provided on the outer peripheral surface of the sleeve 135. The connecting position 1351 extends in the radial direction of the sleeve 135. The limiting member 136 has a horizontal position 1361 that slides and fits against the upper surface of the connecting position 1351 and a vertical position 1362 that is fixedly connected to the horizontal position 1361. The vertical position 1362 is directly or indirectly detachably fixedly connected to the bracket 131.
[0087] Furthermore, the horizontal position 1361 is provided with a clearance opening 1363 through which the sleeve 135 can pass. The clearance opening 1363 can increase the contact area between the connecting position 1351 and the horizontal position 1361, thereby expanding the translation range of the connecting position 1351.
[0088] Furthermore, the bottom of the sleeve 135 is an arc-shaped portion 1352 that reduces the contact area between the sleeve 135 and the bracket 131. The connecting position 1351 is located near the arc-shaped portion 1352. The sleeve 135 can be translated relative to the horizontal end 131 (such as forward or backward or left or right) to adjust the slide rod 132 to the position corresponding to the second guide hole 220 of the marble platform 200. Since the contact area between the bracket 131 and the arc-shaped portion 1352 is small, there is a suitable friction between them, which allows the connecting position 1351 to be translated along the horizontal position 1361 and makes it easy for the connected position 1351 to stop at the adjusted position after translation.
[0089] Furthermore, a pad 1364 is provided parallel to the bracket 131 and the arc-shaped portion 1352, and is detachably fixedly connected to the bracket 131. A detachable fixed connection block 1365 is provided vertically on the side of the pad 1364 and is fixedly connected to the vertical position 1362. In this embodiment, the detachable fixed connection is fixedly connected by screws, which is simple to disassemble and assemble, and facilitates timely replacement of damaged pads 1364. This avoids the phenomenon that the height of the slide rod 132 is reduced due to wear of the pad 1364, which would cause the roller 114 to be inaccurately aligned with the semiconductor substrate 300.
[0090] In this embodiment, the second height position can be set at the top of the lifting mechanism 200, the top surface of the marble platform 400, or between the top of the lifting mechanism 200 and the top surface of the marble platform 400. All of these positions can guide and align the semiconductor substrate 300 placed at the placement position of the lifting mechanism 200.
[0091] When the second height position is set at the top of the lifting mechanism 200, the position corresponding to the horizontal diameter D2 of the roller 114 is at the same height as the placement position of the lifting mechanism 200. The roller 114 moves up and down synchronously with the semiconductor substrate 300 on the placement position. During the up and down movement, the rollers 114 around the semiconductor substrate 300 can also prevent the semiconductor substrate 300 from shifting on the placement position.
[0092] When the second height position is set on the upper surface of the marble platform 400, the position corresponding to the horizontal diameter D2 of the roller 114 is at the same height as the upper surface of the marble platform 400. This can directly guide the semiconductor substrate 300 during the downward movement to the adhesive application position on the marble platform 400. In this embodiment, setting the second height position on the upper surface of the marble platform 400 can save the stroke of the roller 114 moving up and down, thereby reducing the length of the slide bar 132 and saving production costs.
[0093] like Figure 1As shown, the guide alignment mechanism 100 further includes a sliding guide 140 for moving the linkage bracket 131 up and down. The sliding guide 140 includes two symmetrically arranged linear slide rail groups 141 and sliders 142 respectively slidably mounted on the two linear slide rail groups 141 (one of which is not shown). The bracket 131 is directly or indirectly fixed on the two sliders 142 (one of which is not shown). The power component 120 drives the guide alignment assembly 110 to rise or fall uniformly along the linear slide rail group 141.
[0094] In this embodiment, the center of the slide rod 132 and the center of the second guide hole 420 are located at the same position, which facilitates the smooth sliding of the slide rod 132 in the second guide hole 420 after adjustment. The parallelism of the pin 110 along its vertical direction can be manually adjusted before or after the limiting member 136 is fixedly connected to the bracket 131.
[0095] In addition, during the downward movement of the marble platform 400, the inner circumference of the vertically set second guide hole 420 applies a radial thrust to the outer circumference of the bent slide rod 132, causing the slide rod 132 to move to the position corresponding to the second guide hole 420, thereby automatically correcting the bending of the slide rod 132.
[0096] Overview of intelligent control components as an example
[0097] like Figure 1 , Figure 3 and Figure 6 As shown, the guide alignment mechanism 100 further includes an intelligent control component, which includes:
[0098] The first position detector 150 is used to detect the first height position of the guide alignment component 110 and output the first height position signal to the outside.
[0099] The second position detector 150' is used to detect the second height position of the guide alignment component 110 and output the second height position signal to the outside.
[0100] A driver 160 is used to control the power unit 120;
[0101] The controller 170 outputs control commands to the driver 160 based on the received first height position signal or second height position signal. The driver 160 controls the power unit 120 to start or stop working according to the received control commands. The controller 170 stores parameter information such as the speed, direction and number of revolutions of the power unit.
[0102] The above structure enables intelligent control of the alignment of the semiconductor substrate 300, improving the efficiency of alignment of the semiconductor substrate 300. It is simple to operate and easy to use.
[0103] Overview of an adhesive application system as an example
[0104] like Figure 3 , Figures 7-9 As shown, this utility model also provides an adhesive application system, including the above-mentioned guide alignment mechanism 100, and further including:
[0105] A marble platform 400 is used to mount a semiconductor substrate 300 and has a plurality of first guide holes 410 located below the semiconductor substrate 300 and a plurality of second guide holes 420 located on the outer periphery of the semiconductor substrate 300.
[0106] The lifting mechanism 200 has a plurality of ejector pins 210 respectively inserted into the first guide hole 410. The top of the plurality of ejector pins is formed with a placement position 220 for placing the semiconductor substrate 300, wherein the placement position 220 is driven to move up and down by a rotational power component 230.
[0107] The guide alignment assembly 110 has a plurality of slide rods 132 for mounting the guide alignment assembly 110, and the plurality of slide rods 132 are respectively vertically slidably disposed in the corresponding second guide hole 420.
[0108] The above description is the preferred embodiment of this utility model. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the principle of this utility model, and these improvements and modifications are also considered to be within the protection scope of this utility model.
Claims
1. A guiding and alignment mechanism, configured to be used in conjunction with a lifting mechanism, characterized in that, include: A guide alignment assembly is used to guide and align a semiconductor substrate placed on a lifting mechanism. The power unit drives the guide alignment assembly to move up and down; The power component drives the guide alignment assembly to rise from a first height position to a second height position. At the second height position, the guide alignment assembly guides the semiconductor substrate placed on the lifting mechanism to the adhesive application position on the marble platform.
2. The guiding and alignment mechanism according to claim 1, characterized in that, The guiding alignment component includes: At least two spaced-apart first guide alignment surfaces are used for guiding and aligning the semiconductor substrate along its length. At least two spaced second guide alignment surfaces are used for guiding alignment of the semiconductor substrate in the width direction.
3. The guiding and alignment mechanism according to claim 2, characterized in that, There are n first guide alignment surfaces and n second guide alignment surfaces, where n is an even number greater than 1. The multiple first guide alignment surfaces and the multiple second guide alignment surfaces are symmetrically arranged.
4. The guiding and alignment mechanism according to claim 3, characterized in that, The upper ends of the first guide alignment surface and the second guide alignment surface are respectively used to guide the semiconductor substrate to the lower ends of the first guide alignment surface and the second guide alignment surface; The lower ends of the first and second guiding alignment surfaces are used for aligning the semiconductor substrate.
5. The guiding and alignment mechanism according to claim 2, characterized in that, It includes multiple rollers that rotate around their axes, the rollers being located around the semiconductor substrate, and the first guide alignment surface and the second guide alignment surface being located within a guide area formed between the horizontal and vertical diameters of the multiple rollers.
6. The guiding and alignment mechanism according to claim 1, characterized in that, The system includes a vertically movable guide support assembly, which comprises a hollow bracket and a plurality of sliding rods disposed on the bracket for mounting the guide alignment assembly. The bracket is located below the marble platform, and the sliding rods slide through a second guide hole in the marble platform.
7. The guiding and alignment mechanism according to claim 6, characterized in that, The bracket includes a sliding guide for moving the support up and down. The sliding guide includes two symmetrically arranged linear slide rails and sliders that slide on the two linear slide rails respectively. The support is fixed on the two sliders.
8. The guiding and alignment mechanism according to claim 6 or 7, characterized in that, The system includes a slide bar correction structure, which includes a sleeve screwed to the lower end of the slide bar and a limiting member that is axially limited and radially slidingly engaged with the sleeve. The limiting member is detachably fixed to the bracket and applies a thrust to the sleeve in the radial direction, so that the sleeve can be translated relative to the limiting member to a position corresponding to the second guide hole.
9. The guiding and alignment mechanism according to claim 1, characterized in that, include: A first position detector is used to detect the first height position of the guide alignment component and output a first height position signal to the outside. A driver, used to control the power components; The controller outputs control commands to the driver based on the received first height position signal, and the driver controls the power component to start or stop working according to the received control commands.
10. An adhesive application system, characterized in that, The guide alignment mechanism according to any one of claims 1 to 9 further includes: A marble platform for mounting a semiconductor substrate has multiple first guide holes located below the semiconductor substrate and multiple second guide holes located on the outer periphery of the semiconductor substrate; The lifting mechanism has multiple ejector pins that are respectively inserted into the first guide hole, and the top of the multiple ejector pins has a placement position for placing a semiconductor substrate. The guide alignment assembly has multiple guide rods for mounting the guide alignment assembly, and the multiple guide rods are respectively vertically slidably disposed in the second guide hole.