A semiconductor tank cleaning box assembly modular device

Abstract

The utility model relates to the field of semiconductor cleaning, specifically relates to a kind of semiconductor tank type cleaning box assembly modularization device, including processing box, the top of the processing box is provided with top cover, the outside of the top cover is provided with controller, the side of the processing box is provided with side plate, the outside both ends of the side plate are provided with auxiliary block.The utility model realizes the quick connection and separation between processing box and extension piece by auxiliary block, it is convenient for user to change module or use alone according to different needs, so as to improve the application range and maintenance efficiency of equipment;Auxiliary block cooperates control screw and resistance block, the relative position between processing box and extension piece can be accurately adjusted and locked, ensure that the overall structure runs stably;Ultrasonic cleaning component and lifting cleaning component are arranged separately inside processing box, so that each functional module can be independently disassembled, replaced or upgraded, which is beneficial to prolong the service life of equipment.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor cleaning, specifically to a modular device for a semiconductor tank cleaning box assembly. Background Technology

[0002] In semiconductor manufacturing processes, the cleaning process is a crucial step in ensuring the cleanliness of the wafer surface, especially in high-precision processes where the removal of particulate matter and metallic impurities is of extremely high standard.

[0003] A Chinese patent discloses a tank-type cleaning machine (application number: CN202020899379.5), comprising a housing and an installation assembly. The housing defines a cleaning tank for containing cleaning agents. The installation assembly includes a mounting plate, a rotating frame for mounting wafers, and a rotation drive device. Both the rotation drive device and the rotating frame are mounted on the mounting plate. The output ends of the rotating frame and the rotation drive device are connected. The mounting plate is detachably mounted on the opening of the cleaning tank. The tank-type cleaning machine using this invention has a simple structure. The cleaning solution on the wafer surface is in a flowing state, effectively improving the uniformity of wafer etching and surface cleanliness, avoiding wafer defects, and increasing production efficiency and yield.

[0004] In existing cleaning systems, the ultrasonic cleaning component and the lifting cleaning component are usually integrated and fixed in the same processing chamber, lacking the ability to be independently disassembled and replaced. This not only increases maintenance costs but also limits the flexibility and multi-functional expansion capabilities of the equipment. Furthermore, due to the lack of modular design between the various parts of the cleaning equipment, the transportation, installation, and on-site commissioning processes are cumbersome, making it difficult to meet the demands of modern semiconductor production lines for efficient and flexible production. Summary of the Invention

[0005] To address the shortcomings of existing technologies, this utility model provides a modular device for semiconductor tank cleaning box components.

[0006] The technical solution of this utility model is as follows:

[0007] This utility model provides a modular device for a semiconductor tank cleaning box assembly, including a processing box. A top cover is provided on the top of the processing box, and a controller is located outside the top cover. A side plate is provided on one side of the processing box, with auxiliary blocks at both ends of the side plate. An extension is provided on one side of the side plate, and two telescopic auxiliary components are provided outside the extension. A movable sliding plate is provided between the two telescopic auxiliary components. An auxiliary strip is provided outside the extension, and the auxiliary strip contacts the movable sliding plate. A processor, an ultrasonic cleaning assembly, and a lifting cleaning assembly are all located inside the processing box.

[0008] Optionally, the processing box is provided with an external door, which is connected to the processing box via a hinge. The external door is provided with a door handle, and support bases are evenly distributed at the bottom of the processing box.

[0009] Optionally, the side plate is fixedly connected to the processing box by screws, the side plate is fixedly connected to the auxiliary block, one side of the auxiliary block is slidably connected to an abutment block that contacts the extension, and the other end of the auxiliary block is threadedly connected to a control screw that is rotatably connected to the abutment block.

[0010] Optionally, an extension plate is fixedly connected to the bottom of the extension member, and a walking handle is fixedly connected to the other end of the extension plate. Auxiliary walking wheels are evenly arranged at the bottom of the extension plate.

[0011] Optionally, the telescopic auxiliary component is composed of multiple sliding cylinders that are progressively smaller and slidably connected to each other. One end of the telescopic auxiliary component is fixedly connected to the extension component. One side of the extension component has a sliding hole that extends into the interior of the processing box. The movable slide plate passes through the sliding hole. A protrusion is provided on the outside of the movable slide plate. The other end of the telescopic auxiliary component is fixedly connected to the inside of the protrusion. A processing groove is provided on the top of the movable slide plate. A movable handle is fixedly connected to the outside of the protrusion.

[0012] Optionally, the interior of the processing box is a processing cavity, and the processor, ultrasonic cleaning assembly, and lifting cleaning assembly are all fixedly connected inside the processing cavity and controlled by a controller. The ultrasonic cleaning assembly is located above the processor, the lifting cleaning assembly is located above the ultrasonic cleaning assembly, and the movable slide is located between the ultrasonic cleaning assembly and the lifting cleaning assembly when inserted.

[0013] The beneficial effects achieved by this utility model are as follows:

[0014] This invention enables quick connection and separation between the processing box and the extension component via an auxiliary block, facilitating module replacement or individual use according to different needs, thereby improving the applicability and maintenance efficiency of the equipment. The auxiliary block, in conjunction with the control screw and the contact block, enables precise adjustment and locking of the relative position between the processing box and the extension component, ensuring stable operation of the overall structure. The ultrasonic cleaning component and the lifting cleaning component are arranged separately inside the processing box, allowing each functional module to be independently disassembled, replaced, or upgraded, which helps extend the service life of the equipment and allows for flexible configuration according to different cleaning process requirements. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0016] Figure 2This is a structural schematic diagram of the entire utility model from another perspective;

[0017] Figure 3 This is a schematic diagram of the internal structure of the processing box;

[0018] Figure 4 This is a schematic diagram of the auxiliary block.

[0019] In the diagram, 1. Processing box; 101. Opening / closing door; 102. Support base; 103. Processing chamber; 2. Top cover; 201. Controller; 3. Side panel; 4. Extension piece; 401. Extension cross plate; 402. Auxiliary walking wheel; 403. Walking handle; 5. Telescopic auxiliary piece; 6. Movable sliding plate; 601. Processing tank; 602. Protruding block; 603. Movable handle; 7. Auxiliary strip; 701. Stabilizing wire; 8. Auxiliary block; 801. Abutment block; 802. Control screw; 9. Processor; 10. Ultrasonic cleaning assembly; 11. Lifting cleaning assembly. Detailed Implementation

[0020] To facilitate understanding of this utility model by those skilled in the art, the specific embodiments of this utility model are described below with reference to the accompanying drawings. Example 1

[0021] like Figure 1-4 As shown, this utility model provides a modular device for a semiconductor tank cleaning box assembly, including a processing box 1. A top cover 2 is provided on the top of the processing box 1. A controller 201 is provided on the outside of the top cover 2. A side plate 3 is provided on one side of the processing box 1. Auxiliary blocks 8 are provided at both ends of the side plate 3. An extension 4 is provided on one side of the side plate 3. Two telescopic auxiliary parts 5 are provided on the outside of the extension 4. A movable slide plate 6 is provided between the two telescopic auxiliary parts 5. An auxiliary strip 7 is provided on the outside of the extension 4. The auxiliary strip 7 contacts the movable slide plate 6. A processor 9 is provided inside the processing box 1. An ultrasonic cleaning assembly 10 is provided inside the processing box 1. A lifting cleaning assembly 11 is provided inside the processing box 1.

[0022] This utility model uses an auxiliary block 8 to enable quick connection and separation between the processing box 1 and the extension 4, allowing users to easily replace modules or use them individually according to different needs, thereby improving the applicability and maintenance efficiency of the equipment. The auxiliary block 8, together with the control screw 802 and the abutment block 801, can accurately adjust and lock the relative position between the processing box 1 and the extension 4, ensuring the stable operation of the overall structure. The ultrasonic cleaning component 10 and the lifting cleaning component 11 are arranged separately inside the processing box 1, so that each functional module can be disassembled, replaced or upgraded independently, which helps to extend the service life of the equipment and can be flexibly configured according to different cleaning process requirements. Example 2

[0023] like Figure 1-2 and Figure 4 As shown, the processing box 1 is provided with a switch door 101 on the outside. The switch door 101 is connected to the processing box 1 by a hinge. The switch door 101 is provided with a door handle on the outside. Support seats 102 are evenly provided on the bottom of the processing box 1.

[0024] Specifically, the support base 102 enhances the stability of the device, and the switch door 101 facilitates observation of the objects inside the processing box 1.

[0025] In this embodiment, the side plate 3 is fixedly connected to the processing box 1 by screws, and the side plate 3 is fixedly connected to the auxiliary block 8. One side of the auxiliary block 8 is slidably connected to an abutment block 801 that contacts the extension 4, and the other end of the auxiliary block 8 is threadedly connected to a control screw 802 that is rotatably connected to the abutment block 801.

[0026] Specifically, by adjusting the control screw 802, the contact pressure between the abutment block 801 and the extension 4 can be controlled, thereby precisely adjusting the fixing range of the movable slide plate 6.

[0027] In this embodiment, an extension plate 401 is fixedly connected to the bottom of the extension member 4, and a walking handle 403 is fixedly connected to the other end of the extension plate 401. Auxiliary walking wheels 402 are evenly arranged at the bottom of the extension plate 401.

[0028] Specifically, the walking handle 403, together with the auxiliary walking wheel 402, is used to assist the overall movement of the extension 4. In addition, through the counteracting action of the auxiliary block 8, the relative positions of the processing box 1 and the extension 4 can be fixed, which facilitates subsequent processing.

[0029] In this embodiment, the telescopic auxiliary component 5 is composed of multiple sliding cylinders that are progressively smaller and slidably connected to each other. One end of the telescopic auxiliary component 5 is fixedly connected to the extension component 4. A sliding hole penetrating into the processing box 1 is opened on one side of the extension component 4. The movable slide plate 6 passes through the sliding hole. A protrusion 602 is provided on the outside of the movable slide plate 6. The other end of the telescopic auxiliary component 5 is fixedly connected to the inside of the protrusion 602. A processing groove 601 is opened on the top of the movable slide plate 6. A movable handle 603 is fixedly connected to the outside of the protrusion 602.

[0030] Specifically, the position of the movable slide plate 6 is precisely adjusted by the step-by-step extension and retraction of the sliding cylinder to ensure the efficient operation of the cleaning component. At the same time, the design of the protrusion 602 enhances the connection stability and improves the overall ease of operation and durability of the device. The processing slot 601 is used to process the semiconductor parts placed inside, and the movable handle 603 is mainly used to facilitate the connection of objects. Example 3

[0031] like Figure 1-3As shown, the interior of the processing box 1 is a processing cavity 103. The processor 9, ultrasonic cleaning assembly 10 and lifting cleaning assembly 11 are all fixedly connected inside the processing cavity 103 and controlled by the controller 201. The ultrasonic cleaning assembly 10 is located above the processor 9, and the lifting cleaning assembly 11 is located above the ultrasonic cleaning assembly 10. When the movable slide plate 6 is inserted, it is located between the ultrasonic cleaning assembly 10 and the lifting cleaning assembly 11.

[0032] In use, the controller 201 controls various electrical components, and the ultrasonic cleaning assembly 10 works in conjunction with the lifting cleaning assembly 11 to achieve multi-level cleaning of semiconductor parts. The structure and principle of the ultrasonic cleaning assembly 10 and the lifting cleaning assembly 11 are well known in the art, and will not be described in detail here.

[0033] It should be noted that the structure and principle of the controller 201 and the processor 9 are well known in the art, and will not be described in detail here.

[0034] In summary, by setting the auxiliary block 8, the processing box 1 and the extension 4 can be connected, thereby precisely fixing their relative positions and facilitating disassembly and installation. This also allows for easy separation of the processing box 1 for processing and the extension 4 for placing objects. Furthermore, the ultrasonic cleaning assembly 10 and the lifting cleaning assembly 11 inside the processing box 1 are set separately, which also facilitates disassembly and installation.

[0035] The embodiments of this utility model described above do not constitute a limitation on the scope of protection of this utility model. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this utility model should be included within the scope of protection of the claims of this utility model.

Claims

1. A modular device for a semiconductor tank cleaning box assembly, characterized in that: The device includes a processing box (1), a top cover (2) on the top of the processing box (1), a controller (201) on the outside of the top cover (2), a side plate (3) on one side of the processing box (1), auxiliary blocks (8) on both ends of the side plate (3), an extension (4) on one side of the side plate (3), two telescopic auxiliary parts (5) on the outside of the extension (4), a movable slide plate (6) between the two telescopic auxiliary parts (5), an auxiliary strip (7) on the outside of the extension (4), the auxiliary strip (7) in contact with the movable slide plate (6), a processor (9) inside the processing box (1), an ultrasonic cleaning assembly (10) inside the processing box (1), and a lifting cleaning assembly (11) inside the processing box (1).

2. The modular device for a semiconductor tank cleaning box assembly according to claim 1, characterized in that: The processing box (1) is provided with a switch door (101) on the outside. The switch door (101) is connected to the processing box (1) by a hinge. The switch door (101) is provided with a door handle on the outside. Support seats (102) are evenly provided at the bottom of the processing box (1).

3. The modular device for a semiconductor tank cleaning box assembly according to claim 1, characterized in that: The side plate (3) is fixedly connected to the processing box (1) by screws. The side plate (3) is fixedly connected to the auxiliary block (8). One side of the auxiliary block (8) is slidably connected to an abutment block (801) that contacts the extension (4). The other end of the auxiliary block (8) is threadedly connected to a control screw (802) that is rotatably connected to the abutment block (801).

4. The modular device for a semiconductor tank cleaning box assembly according to claim 1, characterized in that: The bottom of the extension (4) is fixedly connected to an extension plate (401), and the other end of the extension plate (401) is fixedly connected to a walking handle (403). Auxiliary walking wheels (402) are evenly arranged at the bottom of the extension plate (401).

5. The modular device for a semiconductor tank cleaning box assembly according to claim 1, characterized in that: The telescopic auxiliary component (5) is composed of multiple sliding cylinders that are progressively smaller and slidably connected to each other. One end of the telescopic auxiliary component (5) is fixedly connected to the extension component (4). One side of the extension component (4) is provided with a sliding hole that penetrates into the interior of the processing box (1). The movable slide plate (6) passes through the sliding hole. A protrusion (602) is provided on the outside of the movable slide plate (6). The other end of the telescopic auxiliary component (5) is fixedly connected to the inside of the protrusion (602). A processing groove (601) is provided on the top of the movable slide plate (6). A movable handle (603) is fixedly connected to the outside of the protrusion (602).

6. The modular device for a semiconductor tank cleaning box assembly according to claim 1, characterized in that: The interior of the processing box (1) is a processing cavity (103). The processor (9), ultrasonic cleaning assembly (10) and lifting cleaning assembly (11) are all fixedly connected inside the processing cavity (103) and controlled by the controller (201). The ultrasonic cleaning assembly (10) is located above the processor (9), and the lifting cleaning assembly (11) is located above the ultrasonic cleaning assembly (10). When the movable slide plate (6) is inserted, it is located between the ultrasonic cleaning assembly (10) and the lifting cleaning assembly (11).

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