An ultrasonic bonding mechanism and a bonder

Abstract

The application provides an ultrasonic bonding mechanism and a bonding machine. The ultrasonic bonding mechanism comprises a transducer, a variable amplitude rod, a bonding tool and a holding assembly. The variable amplitude rod is arranged along a first axis, the first end of the variable amplitude rod is connected with the transducer, and the second end of the variable amplitude rod is provided with a first through hole penetrating through the variable amplitude rod along a second axis. The holding assembly is fixedly connected with the variable amplitude rod, the holding assembly is provided with a locking groove opposite to the first through hole, the bonding tool is arranged along the second axis, the first end of the bonding tool is locked in the locking groove after penetrating through the first through hole, and the second end of the bonding tool is a bonding end. The ultrasonic bonding mechanism of the application can complete the installation of the bonding tool by sequentially inserting the bonding tool into the first through hole and the locking groove, and does not need to install the bonding tool through a special installation tool, thereby reducing the installation and debugging workload, and in the bonding process, the torque of the end of the transducer can be reduced by applying a static load to the holding assembly, and the bonding effect is improved.

Description

Technical Field

[0001] This application relates to the field of semiconductor equipment, specifically an ultrasonic bonding mechanism and bonding machine. Background Technology

[0002] In power semiconductor packaging and testing, ultrasonic bonding is typically used to bond wires to chips. Existing ultrasonic bonding mechanisms include a transducer, an amplitude transformer, and a bonding tool connected in sequence. The transducer converts electrical energy into ultrasonic vibrations, which are then transmitted to the bonding tool via the amplitude transformer. The bonding end of the bonding tool contacts the wire and the chip and vibrates at a high frequency, thereby achieving a solid-state metal-to-metal bond between the wire and the chip.

[0003] To ensure bonding effectiveness, a static load (a predetermined pressure) is typically applied at the node of the amplitude transformer during ultrasonic welding. This static load is transmitted to the wire bonding location via the amplitude transformer and bonding tool. However, because the bonding tool is connected to the end of the amplitude transformer, while the static load is applied at a node on the amplitude transformer at a certain distance from the end, there is a distance between the connection point of the bonding tool and the pressure point of the static load. This causes the pressure point and the wire bonding location to be out of sync, ultimately resulting in torque at the transducer end. If the bending stiffness of the amplitude transformer is insufficient, the relative positions of the bonding tool, wires, and chip cannot remain stable during bonding, thus affecting the bonding effect.

[0004] Furthermore, after prolonged bonding, bonding tools inevitably suffer damage, necessitating periodic replacement to ensure bonding effectiveness. To guarantee the assembly accuracy of the bonding tools, each replacement requires the use of appropriate mounting fixtures for different tool specifications, necessitating precise adjustments to the tool's position and angle. This process significantly increases the workload of bonding tool replacement, reduces production efficiency, and the additional fixtures also increase production and maintenance costs. Utility Model Content

[0005] To address at least one of the aforementioned technical problems, this application provides an ultrasonic bonding mechanism, the detailed technical solution of which is as follows:

[0006] An ultrasonic bonding mechanism includes a transducer, an amplitude transformer, a bonding tool, and a holding assembly, wherein:

[0007] The amplitude rod is arranged along the first axis, the first end of the amplitude rod is connected to the transducer, and the second end of the amplitude rod is provided with a first through hole that passes through the amplitude rod along the second axis, wherein the second axis is perpendicular to the first axis;

[0008] The holding assembly is fixedly connected to the amplitude rod, and the holding assembly is provided with a locking groove that is opposite to the first through hole;

[0009] The bonding tool is set along the second axis. The first end of the bonding tool passes through the first through hole and is locked in the locking groove. The second end of the bonding tool is the bonding end.

[0010] The ultrasonic bonding mechanism provided in this application has a retaining component mounted on the amplitude transformer rod. The retaining component has a locking groove. The bonding tool is positioned perpendicular to the amplitude transformer rod and is locked in the locking groove after passing through the first through hole on the amplitude transformer rod. With this configuration, the bonding tool can be installed simply by sequentially inserting it into the first through hole and the locking groove, eliminating the need for specialized installation fixtures and reducing the workload of installation and debugging.

[0011] Furthermore, since the bonding tool is set perpendicular to the amplitude transformer and its end is locked to the holding assembly, the structural rigidity is enhanced. Therefore, during the bonding process, applying static load to the holding assembly can reduce the torque at the transducer end and even make the pressure application position coaxial with the wire bonding position, thereby eliminating torque. This ensures that the relative positions of the bonding tool, lead, and chip remain stable during the bonding process, improving the bonding effect.

[0012] In some embodiments, the second end of the amplitude transformer is provided with a first locking hole extending along the first axis and communicating with the first through hole; the ultrasonic bonding mechanism further includes a locking set screw inserted into the first locking hole, the end of the locking set screw being fitted into the first through hole and abutting against the bonding tool.

[0013] After inserting the bonding tool into the first through hole and the locking groove in sequence, tightening the locking set screw can lock the bonding tool into the first through hole of the amplitude transformer, thereby increasing the connection strength between the bonding tool and the amplitude transformer.

[0014] In some embodiments, the locking groove passes through the retaining assembly along a third axis, which is perpendicular to the first axis and the second axis; a first protrusion and a second protrusion are respectively provided on the inner walls of opposite sides of the locking groove, and the first protrusion and the second protrusion are used to press the opposite first side wall and the second side wall of the bonding tool from both sides.

[0015] After the bonding tool is inserted into the first through hole and the locking groove in sequence, the first protrusion and the second protrusion press against the opposite first side wall and second side wall of the bonding tool from both sides, thereby increasing the connection strength between the bonding tool and the retaining assembly.

[0016] In some embodiments, the first protrusion and the second protrusion correspond to the vibration wave node position of the bonding tool.

[0017] The first and second protrusions clamp the bonding tool at the vibration wave node position, thus ensuring a firm clamping effect while preventing the first and second protrusions from suppressing the vibration of the bonding tool. Furthermore, this reduces the friction between the bonding tool and the first and second protrusions, thereby reducing wear on the first and second protrusions.

[0018] In some embodiments, the retaining component has a second locking hole and a third locking hole spaced apart from the first axis and communicating with the locking groove at one end near the locking groove; the ultrasonic bonding mechanism further includes a first locking screw and a second locking screw, wherein: the first locking screw is screwed into the second locking hole and passes through the locking groove, the second locking screw is screwed into the third locking hole and passes through the locking groove, and the first locking screw and the second locking screw are used to adjust the distance between the first protrusion and the second protrusion to loosen or tighten the bonding tool.

[0019] After inserting the bonding tool into the first through hole and the locking groove in sequence, tightening the first and second locking screws compresses the locking groove, causing the first and second protrusions to move closer together, thus ensuring the clamping strength of the bonding tool. Loosening the first and second locking screws allows the locking groove to release pressure and restore its original position, causing the first and second protrusions to open to both sides, thereby releasing the bonding tool.

[0020] Of course, by controlling the screwing depth of the first and second locking screws, the clamping force of the first and second protrusions on the bonding tool can be adjusted to ensure that the first and second protrusions clamp the bonding tool with appropriate pressure.

[0021] In some embodiments, the holding component is further provided with a positioning hole parallel to the first axis and communicating with the locking groove at one end near the locking groove, the positioning hole being located above the locking groove; the ultrasonic bonding mechanism also includes a positioning pin, the positioning pin passing through the positioning hole, the positioning pin being provided with a second through hole, the diameter of the second through hole being larger than the diameter of the bonding tool.

[0022] Before inserting the bonding tool into the first through hole and locking groove, insert the locating pin into the locating hole, ensuring that the cylindrical surface of the locating pin blocks the top opening of the locking groove. The second through hole is offset from the top opening of the locking groove. Thus, when the bonding tool is inserted into the first through hole and locking groove, the top surface of the bonding tool abuts against the cylindrical surface of the locating pin, thereby positioning the bonding tool on the second axis. Subsequently, rotate the locating pin so that the second through hole on the locating pin aligns with the top opening of the locking groove. This allows the locating pin to avoid interfering with the bonding tool's vibration.

[0023] In some embodiments, a first elastic ball and a second elastic ball are spaced apart on the sidewall of the positioning pin along the length direction of the positioning pin; an annular first positioning groove is provided at a first position on the inner wall of the positioning hole, and a circular second positioning groove and a circular third positioning groove are spaced apart circumferentially at a second position on the inner wall, wherein the first position and the second position are spaced apart along the length direction of the positioning hole, and the distance between the first position and the second position matches the distance between the first elastic ball and the second elastic ball; after the positioning pin is inserted into the positioning hole, the first elastic ball enters into the first positioning groove and can rotate along the first positioning groove, and the positioning pin is configured to be able to rotate and switch between a positioning state and a clearance state relative to the positioning hole; the second elastic ball enters into the second positioning groove, and the cylindrical surface of the positioning pin is used to press against the second end of the bonding tool to implement the installation positioning of the bonding tool on the second axis, at which time the positioning pin is in the positioning state; the second elastic ball enters into the third positioning groove, and the second through hole on the positioning pin is directly opposite the second end of the bonding tool to avoid the bonding tool, at which time the positioning pin is in the clearance state.

[0024] Before inserting the bonding tool into the first through hole and locking groove, adjust the locating pin to the positioning state. Because the second elastic ball on the locating pin enters the second positioning groove, the locating pin remains relatively fixed, ensuring it can stably remain in the positioning state. This allows the locating pin to perform the installation and positioning of the bonding tool on the second axis. After the bonding tool is installed in place, adjust the locating pin to the clearance state. Because the second elastic ball on the locating pin enters the third positioning groove, the locating pin remains relatively fixed, ensuring it can stably remain in the clearance state and preventing the locating pin from interfering with the vibration of the bonding tool.

[0025] In some embodiments, the end of the locating pin is provided with a mating groove for the rotating operating element to be engaged and rotated.

[0026] Insert the rotating actuator into the mating groove, and the locating pin can be easily rotated by the rotating actuator, so that the locating pin can switch between the locating state and the avoidance state.

[0027] In some embodiments, the holding component is provided with a socket hole, and the holding component is interference-fitted onto the luffing rod through the socket hole; or, the holding component is provided with a screw hole, and the holding component is screwed onto the luffing rod through the screw hole; or, the holding component is welded or riveted onto the luffing rod.

[0028] All of the above connection methods can ensure the stability of the connection between the holding assembly and the luffing rod. The holding assembly is connected to the luffing rod via a socket or screw hole, which also facilitates the assembly and disassembly of the holding assembly and the luffing rod.

[0029] In some embodiments, the holding assembly is an integral structure; or, the holding assembly is a split structure, the holding assembly including a connector as a positioning member, wherein: the connector is fixedly connected to the amplitude rod, the positioning member is fixedly connected to the connector, and a locking groove is provided on the positioning member.

[0030] The retaining assembly is designed as a separate structure consisting of connectors and positioning components, which facilitates the installation and maintenance of the retaining assembly.

[0031] This application also provides a bonding machine, which includes a wire feeding mechanism, a carrier mechanism driving mechanism, and the ultrasonic bonding mechanism described in any one of the above, wherein:

[0032] The lead feeding mechanism is configured to provide leads of the corresponding specifications to the ultrasonic bonding mechanism;

[0033] The carrier mechanism is located below the ultrasonic bonding mechanism and is configured to carry and / or transport the frame on which the chip is mounted.

[0034] An ultrasonic bonding mechanism is installed at the drive end of the drive mechanism, and the drive mechanism is configured to drive the ultrasonic bonding mechanism to move along a predetermined motion trajectory.

[0035] The ultrasonic bonding mechanism is configured to ultrasonically bond the lead to the chip after it has been moved to a predetermined position.

[0036] The bonding machine provided in this application uses an ultrasonic bonding mechanism to bond wires to chips on a frame, thereby achieving ultrasonic bonding of the chips. Specifically, the ultrasonic bonding mechanism reduces the workload of installing and debugging the bonding tools, enhances structural rigidity, reduces torque at the transducer end, and can even make the pressure application position coaxial with the wire bonding position to eliminate torque. This ensures that the relative positions of the bonding tools, wires, and chips remain stable during the bonding process, improving the bonding effect. Attached Figure Description

[0037] Figure 1 This is a three-dimensional structural diagram of the ultrasonic welding mechanism in the embodiments of this application;

[0038] Figure 2 This is a side view of the structure in an embodiment of this application;

[0039] Figure 3 for Figure 2 AA section view;

[0040] Figure 4 for Figure 3 A magnified view of region C in the image;

[0041] Figure 5 This is a schematic diagram of the positioning pin assembly in the embodiments of this application;

[0042] Figure 6 This is a side view of the positioning sleeve in an embodiment of this application.

[0043] Figure 7 for Figure 6 BB cross-sectional view.

[0044] Figures 1 to 7 It includes: transducer 1, amplitude transformer 2, first through hole 21, bonding tool 3, holding assembly 4, locking groove 41, first protrusion 42, second protrusion 43, positioning hole 44, first positioning groove 45, second positioning groove 46, third positioning groove 47, connector 48, positioning component 49, socket hole 40, locking set screw 5, first locking screw 6, second locking screw 7, positioning pin 8, first elastic ball 81, second elastic ball 82, second through hole 83, mating groove 84. Detailed Implementation

[0045] To make the above-mentioned objects, features, and advantages of this application more apparent and understandable, the application will be further described in detail below with reference to the accompanying drawings and specific embodiments. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this application. Rather, they are merely examples of apparatuses and methods consistent with some aspects of this application as detailed in the appended claims.

[0046] As described in the background section, in existing ultrasonic bonding mechanisms, the connection position of the bonding tool on the amplitude transformer is some distance away from the pressure position of the static load on the amplitude transformer. This causes the pressure position and the wire bonding position to be misaligned, ultimately resulting in torque at the transducer end. If the bending stiffness of the amplitude transformer is insufficient, the relative positions of the bonding tool, lead, and chip cannot remain stable during the bonding process, thus affecting the bonding effect. Furthermore, to ensure the assembly accuracy of the bonding tool, each time the bonding tool is replaced, corresponding mounting fixtures are required for different specifications of bonding tools to precisely adjust the installation position and angle of the bonding tool. This process significantly increases the workload of changing bonding tools, reduces production efficiency, and the additional fixtures also increase production and maintenance costs.

[0047] In order to solve at least one of the above-mentioned technical problems of existing ultrasonic bonding mechanisms, this application provides an ultrasonic bonding mechanism.

[0048] like Figures 1 to 4 As shown, the ultrasonic bonding mechanism provided in this application includes a transducer 1, an amplitude transformer 2, a bonding tool 3, and a holding assembly 4, wherein:

[0049] The amplitude rod 2 is arranged along a first axis (e.g., the x-axis). The first end (e.g., the left end) of the amplitude rod 2 is connected to the transducer 1. The second end (e.g., the right end) of the amplitude rod 2 is provided with a first through hole 21 that passes through the amplitude rod 2 along a second axis (e.g., the z-axis), wherein the second axis is perpendicular to the first axis.

[0050] The holding component 4 is fixedly connected to the amplitude rod 2, and the holding component 4 is provided with a locking groove 41 that is opposite to the first through hole 21.

[0051] The bonding tool 3 is set along the second axis. The first end (e.g., the upper end) of the bonding tool 3 passes through the first through hole 21 and is locked in the locking groove 41. The second end (e.g., the lower end) of the bonding tool 3 is the bonding end.

[0052] The ultrasonic bonding mechanism provided in this application has a retaining component 4 fixedly mounted on the amplitude transformer 2. The retaining component 4 is provided with a locking groove 41. The bonding tool 3 is set perpendicular to the amplitude transformer 2. After the bonding tool 3 passes through the first through hole 21 on the amplitude transformer 2, the upper end of the bonding tool 3 is locked in the locking groove 41. With this configuration, the bonding tool 3 can be inserted and positioned by sequentially inserting it into the first through hole 21 and the locking groove 41. Therefore, there is no need to use special installation fixtures to install the bonding tool 3, reducing the workload of installation and debugging of the bonding tool 3.

[0053] Furthermore, since the bonding tool 3 is positioned perpendicular to the amplitude transformer 2 and its end is locked to the holding assembly 4, structural rigidity is enhanced. Therefore, during bonding, a static load is applied to the holding assembly 4, which can then be transmitted to the bonding end of the bonding tool 3, thereby reducing the torque at the transducer 1 end. By applying the static load along the second axis to the holding assembly 4, the pressure application position can be made coaxial with the wire bonding position, thus eliminating torque and ensuring that the relative positions of the bonding tool 3, the lead, and the chip remain stable during bonding, improving the bonding effect.

[0054] like Figure 1 As shown, optionally, the second end of the amplitude transformer 2 is provided with a first locking hole extending along the first axis and communicating with the first through hole 21. Correspondingly, the ultrasonic bonding mechanism in this embodiment of the application further includes a locking set screw 5 inserted into the first locking hole, and the end of the locking set screw 5 (e.g., the left end) is fitted into the first through hole 21 and abuts against the portion of the bonding tool 3 that is also located in the first through hole 21.

[0055] Specifically, after inserting the bonding tool 3 into the first through hole 21 and the locking groove 41 in sequence, tighten the locking screw 5. The locking screw 5, by pushing against the side of the bonding tool 3 which is also located in the first through hole 21, locks the bonding tool 3 into the first through hole 21 of the amplitude transformer 2, thereby increasing the connection strength between the bonding tool 3 and the amplitude transformer 2. When it is necessary to remove the bonding tool 3, loosen the locking screw 5, which will release the amplitude transformer 2 located in the first through hole 21.

[0056] like Figure 1 , Figure 3 and Figure 4 As shown, optionally, the locking groove 41 extends through the retaining assembly 4 along a third axis (e.g., the y-axis), which is perpendicular to the first and second axes. A first protrusion 42 and a second protrusion 43 are respectively provided on the inner walls of opposite sides (e.g., left and right sides) of the locking groove 41. The first protrusion 42 and the second protrusion 43 are used to press against the opposite first and second sidewalls of the bonding tool 3 from both sides.

[0057] After the bonding tool 3 is inserted into the first through hole 21 and the locking groove 41 in sequence, the first protrusion 42 and the second protrusion 43 press against the opposite first side wall and second side wall of the bonding tool 3 from both sides, thereby increasing the connection strength between the bonding tool 3 and the retaining component 4 and further improving the installation stability of the bonding tool 3.

[0058] like Figure 4 As shown, optionally, the first protrusion 42 and the second protrusion 43 correspond to the location of the vibration wave node a of the bonding tool 3. Vibration wave node a is the position where the amplitude of the bonding tool 3 is minimum or zero during vibration. The first protrusion 42 and the second protrusion 43 clamp the bonding tool 3 at the vibration wave node a. This arrangement ensures a firm clamping of the bonding tool 3 by the first protrusion 42 and the second protrusion 43, while avoiding any suppression of the vibration of the bonding tool 3 by the first protrusion 42 and the second protrusion 43. Furthermore, it reduces the friction between the bonding tool 3 and the first protrusion 42 and the second protrusion 43, thereby reducing the wear of the first protrusion 42 and the second protrusion 43.

[0059] like Figure 1 and Figure 2As shown, optionally, the retaining component 4 has a second locking hole and a third locking hole spaced apart from the first axis and communicating with the locking groove 41 at one end near the locking groove 41. Correspondingly, the ultrasonic bonding mechanism in this embodiment also includes a first locking screw 6 and a second locking screw 7, wherein: the first locking screw 6 is screwed into the second locking hole and passes through the locking groove 41, and the second locking screw 7 is screwed into the third locking hole and passes through the locking groove 41. The first locking screw 6 and the second locking screw 7 are used to adjust the distance between the first protrusion 42 and the second protrusion 43 to loosen or tighten the bonding tool 3.

[0060] Specifically, after inserting the bonding tool 3 into the first through hole 21 and the locking groove 41 in sequence, tightening the first locking screw 6 and the second locking screw 7 causes the locking groove 41 to contract inward under pressure, causing the first protrusion 42 and the second protrusion 43 to move closer together, thereby ensuring the clamping strength of the first protrusion 42 and the second protrusion 43 on the bonding tool 3. When it is necessary to remove the bonding tool 3, first loosening the first locking screw 6 and the second locking screw 7 allows the locking groove 41 to release pressure and return to its original position, and the first protrusion 42 and the second protrusion 43 to open to both sides, thereby releasing the bonding tool 3.

[0061] Of course, by controlling the screwing depth of the first locking screw 6 and the second locking screw 7 respectively, the clamping force of the first protrusion 42 and the second protrusion 43 on the bonding tool 3 can be adjusted respectively, so as to ensure that the first protrusion 42 and the second protrusion 43 clamp the bonding tool 3 with appropriate pressure.

[0062] like Figures 1 to 2 and Figures 5 to 7 As shown, optionally, the retaining component 4 is further provided with a positioning hole 44 parallel to the first axis and communicating with the locking groove 41 at one end near the locking groove 41. The positioning hole 44 is located above the locking groove 41. Correspondingly, the ultrasonic bonding mechanism in this embodiment also includes a positioning pin 8, which passes through the positioning hole 44. The positioning pin 8 is provided with a second through hole 83, the diameter of which is larger than the diameter of the bonding tool 3.

[0063] Specifically, before inserting the bonding tool 3 into the first through hole 21 and the locking groove 41, the positioning pin 8 is first inserted into the positioning hole 44, so that the cylindrical surface of the positioning pin 8 blocks the top opening of the locking groove 41, and the second through hole 83 is offset from the top opening of the locking groove 41. At this time, after inserting the bonding tool 3 into the first through hole 21 and the locking groove 41, the top surface of the bonding tool 3 abuts against the cylindrical surface of the positioning pin 8, thus enabling the bonding tool 3 to be installed and positioned on the second axis. Subsequently, the positioning pin 8 is rotated so that the second through hole 83 on the positioning pin 8 is aligned with the top opening of the locking groove 41. At this time, the positioning pin 8 does not contact the top surface of the bonding tool 3, thus enabling the positioning pin 8 to avoid contact with the bonding tool 3 during the bonding process, preventing the positioning pin 8 from suppressing or interfering with the vibration of the bonding tool 3.

[0064] like Figures 5 to 7 As shown, optionally, a first elastic ball 81 and a second elastic ball 82 are spaced apart on the side wall of the positioning pin 8 along the length direction of the positioning pin 8. An annular first positioning groove 45 is provided at a first position on the inner wall of the positioning hole 44, and a circular second positioning groove 46 and a circular third positioning groove 47 are spaced apart circumferentially at a second position on the inner wall. The first and second positions are spaced apart along the length direction of the positioning hole 44 (e.g., ...). Figure 7 The positions are spaced apart (as indicated by the dashed lines in the diagram), with the distance between the first and second positions matching the distance between the first elastic ball 81 and the second elastic ball 82. After the positioning pin 8 is inserted into the positioning hole 44, the first elastic ball 81 enters the first positioning groove 45 and can rotate along the first positioning groove 45. The positioning pin 8 is configured to rotate and switch between a positioning state and a clearance state relative to the positioning hole 44. Rotating the positioning pin 8 causes the second elastic ball 82 to enter the second positioning groove 46, so that the cylindrical surface of the positioning pin 8 presses against the second end of the bonding tool 3 to perform installation positioning of the bonding tool 3 on the second axis. At this time, the positioning pin 8 is in the positioning state. Rotating the positioning pin 8 causes the second elastic ball 82 to enter the third positioning groove 47, so that the second through hole 83 on the positioning pin 8 is aligned with the second end of the bonding tool 3 to clearance the bonding tool 3. At this time, the positioning pin 8 is in the clearance state.

[0065] Specifically, after the positioning pin 8 is inserted into the positioning hole 44, the first elastic ball 81 enters and is limited in the first positioning groove 45, and the second elastic ball 82 elastically abuts against the inner wall of the positioning hole 33. At this time, the first elastic ball 81 can rotate along the first positioning groove 45, and the positioning pin 8 can rotate and switch between the positioning state and the avoidance state relative to the positioning hole 44.

[0066] Before inserting the bonding tool 3 into the first through hole 21 and the locking groove 41, the positioning pin 8 is first rotated to switch it to the positioning state, and the second elastic ball 82 enters the second positioning groove 46. This causes the cylindrical surface of the positioning pin 8 to block the top opening of the locking groove 41. Thus, when the bonding tool 3 is inserted into the first through hole 21 and the locking groove 41, the cylindrical surface of the positioning pin 8 can abut against the upper end face of the bonding tool 3, thereby achieving the installation and positioning of the bonding tool 3 on the second axis. Since the second elastic ball 82 on the positioning pin 8 is confined within the second positioning groove 46, the positioning pin 8 can be stably maintained in the positioning state during the positioning process to ensure the positioning effect.

[0067] After the bonding tool 3 is installed in place, the positioning pin 8 is rotated to switch to the avoidance state, and the second elastic ball 82 on the positioning pin 8 enters the third positioning groove 47. At this time, the second through hole 83 on the positioning pin 8 is aligned with the top opening of the locking groove 41, and the positioning pin 8 can avoid the bonding tool 3. Similarly, since the second elastic ball 82 on the positioning pin 8 is confined within the third positioning groove 47, the positioning pin 8 can be stably maintained in the avoidance state during ultrasonic bonding, preventing the positioning pin 8 from rotating unexpectedly and interfering with the vibration of the bonding tool 3.

[0068] Optionally, the locating pin 8 is provided with circular mounting grooves at positions corresponding to the first elastic ball 81 and the second elastic ball 82. The first elastic ball 81 and the second elastic ball 82 are respectively installed in their corresponding mounting grooves by springs. When not under pressure, the first elastic ball 81 and the second elastic ball 82 protrude outward from their corresponding mounting grooves, and the springs naturally extend. When under pressure, the first elastic ball 81 and the second elastic ball 82 are pressed into their corresponding mounting grooves, and the springs contract under pressure.

[0069] like Figure 5 As shown, optionally, the end of the locating pin 8 is provided with a mating groove 84 for the rotating operating component to be locked and rotated.

[0070] By inserting the rotating actuator into the mating groove 84, the locating pin 8 can be easily rotated, allowing it to switch between a locating state and a clearance state. In practice, the rotating actuator can be a screwdriver.

[0071] like Figure 3 As shown, the retaining component 4 is provided with a sleeve hole 40, and the retaining component 4 is interference-fitted onto the amplitude transformer 2 through the sleeve hole 40. In some other embodiments, the retaining component 4 is provided with a screw hole, and the retaining component 4 is screwed onto the amplitude transformer 2 through the screw hole. Alternatively, the retaining component 4 is welded or riveted onto the amplitude transformer 2.

[0072] All of the above-mentioned connection methods can ensure the stability of the connection between the holding assembly 4 and the amplitude rod 2. Among them, the holding assembly 4 is connected to the amplitude rod 2 through the sleeve hole 40 or the screw hole, which also facilitates the assembly and disassembly of the holding assembly 4 and the amplitude rod 2.

[0073] like Figure 1 and Figure 3 As shown, optionally, the holding component 4 is a split structure. The holding component 4 includes a connector 48 and a positioning component 49, wherein: the connector 48 is fixedly connected to the amplitude rod 2, the positioning component 49 is fixedly connected to the connector 48, and the locking groove 41 is provided on the positioning component 49.

[0074] The retaining component 4 is configured as a split structure consisting of a connector 48 and a positioning component 49, which facilitates the installation and maintenance of the retaining component 4. The positioning component 49 can be fixed to the connector 48 by means of screwing, welding, riveting, etc.

[0075] During the bonding process, a static load can be applied to the connector 48. The static load can be transmitted sequentially through the connector 48 and the positioning member 49 to the bonding end of the bonding tool 3, thereby reducing the torque at the end of the transducer 1. Furthermore, by applying the static load along the second axis to the positioning member 49, the pressure application position can be made coaxial with the wire bonding position, thereby eliminating torque and ensuring that the relative positions of the bonding tool 3, the wire, and the chip remain stable during the bonding process, thus improving the bonding effect.

[0076] Of course, in other embodiments, the retaining component 4 can also be configured as an integral structure.

[0077] Based on the same inventive concept, this application also provides a bonding machine, which includes a lead feeding mechanism, a carrying mechanism driving mechanism, and the ultrasonic bonding mechanism in any of the above embodiments, wherein:

[0078] The lead feeding mechanism is configured to provide leads of the corresponding specifications to the ultrasonic bonding mechanism.

[0079] The carrier mechanism is located below the ultrasonic bonding mechanism and is configured to carry and / or transport the frame on which the chip is mounted.

[0080] An ultrasonic bonding mechanism is installed at the drive end of the drive mechanism, and the drive mechanism is configured to drive the ultrasonic bonding mechanism to move along a predetermined motion trajectory.

[0081] The ultrasonic bonding mechanism is configured to ultrasonically bond the lead to the chip after it has been moved to a predetermined position.

[0082] The bonding machine provided in this application uses an ultrasonic bonding mechanism to bond wires to a chip on a frame, thereby achieving ultrasonic bonding of the chip. Specifically, the ultrasonic bonding mechanism reduces the workload of installing and debugging the bonding tools, enhances structural rigidity, reduces torque at the transducer end, and can even make the pressure application position coaxial with the wire bonding position to eliminate torque. This ensures that the relative positions of the bonding tools, wires, and chip remain stable during the bonding process, improving the bonding effect.

[0083] The lead feeding mechanism in this embodiment can be any existing lead feeding mechanism, as long as it can feed the lead wire to the bonding end of the bonding tool of the ultrasonic bonding mechanism. For example, the lead feeding mechanism includes a feeding part and a clamping part. The feeding part is used to install the material roll and release the lead wire to the clamping part by controlling the rotation of the material roll. The clamping part is used to clamp the end of the lead wire and pull the lead wire toward the bonding end of the bonding tool.

[0084] The carrier mechanism can be, for example, a stage driven by a drive module. The stage carries the frame with the chip mounted on it, and the drive module drives the stage to move, allowing the chip-mounted frame to enter a predetermined bonding station, and then removes the chip-mounted frame from the bonding station after bonding. Alternatively, the carrier mechanism can be a conveyor belt, which transports the chip-mounted frame to the bonding station and outputs it after bonding. The carrier mechanism can also be a conveyor track, using a pusher mechanism to push the frame on the carrier mechanism to transport the lead frame. Additionally, adsorption components or limiting components can be installed on the carrier mechanism to limit the movement of the frame.

[0085] This application provides a sufficiently detailed and specific description. Those skilled in the art should understand that the descriptions in the embodiments are merely exemplary, and all changes made without departing from the true spirit and scope of this application should fall within its protection scope. The scope of protection claimed in this application is defined by the claims, not by the above descriptions in the embodiments. Without contradiction, some optional components in one embodiment can also be used in another embodiment, and some preferred structures of the same component in one embodiment are also applicable to another embodiment. Furthermore, there may be slight differences in the wording of the names of certain components in different embodiments; these slight differences will not affect the understanding of the technical solution of the present invention by those skilled in the art.

Claims

1. An ultrasonic bonding mechanism, characterized in that, The ultrasonic bonding mechanism includes a transducer, an amplitude transformer, a bonding tool, and a holding assembly, wherein: The amplitude transformer is arranged along a first axis, the first end of the amplitude transformer is connected to the transducer, and the second end of the amplitude transformer is provided with a first through hole that passes through the amplitude transformer along a second axis, wherein the second axis is perpendicular to the first axis; The holding component is fixedly connected to the amplitude rod, and the holding component is provided with a locking groove that is opposite to the first through hole; The bonding tool is arranged along the second axis. The first end of the bonding tool passes through the first through hole and is locked in the locking groove. The second end of the bonding tool is the bonding end.

2. The ultrasonic bonding mechanism as described in claim 1, characterized in that: The second end of the amplitude rod is provided with a first locking hole that extends along the first axis and communicates with the first through hole; The ultrasonic bonding mechanism further includes a locking screw inserted into the first locking hole, the end of which is fitted into the first through hole and abuts against the bonding tool.

3. The ultrasonic bonding mechanism as described in claim 1, characterized in that, The locking groove extends through the retaining assembly along a third axis, which is perpendicular to the first axis and the second axis; The locking groove has a first protrusion and a second protrusion on its opposite inner walls. The first protrusion and the second protrusion are used to press the opposite first side wall and second side wall of the bonding tool from both sides.

4. The ultrasonic bonding mechanism as described in claim 3, characterized in that, The first protrusion and the second protrusion correspond to the vibration wave node positions of the bonding tool.

5. The ultrasonic bonding mechanism as described in claim 3, characterized in that, The retaining component is provided with a second locking hole and a third locking hole at an interval near the locking groove, which are parallel to the first axis and communicate with the locking groove; The ultrasonic bonding mechanism further includes a first locking screw and a second locking screw, wherein: The first locking screw is screwed into the second locking hole and passes through the locking groove, and the second locking screw is screwed into the third locking hole and passes through the locking groove. The first locking screw and the second locking screw are used to adjust the distance between the first protrusion and the second protrusion to loosen or tighten the bonding tool.

6. The ultrasonic bonding mechanism as described in claim 1, characterized in that, The retaining component is also provided with a positioning hole that is parallel to the first axis and communicates with the locking groove at one end near the locking groove, and the positioning hole is located above the locking groove; The ultrasonic bonding mechanism further includes a positioning pin, which passes through the positioning hole and has a second through hole, the diameter of which is larger than the diameter of the bonding tool.

7. The ultrasonic bonding mechanism as described in claim 6, characterized in that, The side wall of the positioning pin is provided with a first elastic ball and a second elastic ball at intervals along the length direction of the positioning pin. An annular first positioning groove is provided at a first position on the inner wall of the positioning hole, and a circular second positioning groove and a circular third positioning groove are provided at a second position on the inner wall along the circumferential direction. The first position and the second position are spaced apart along the length direction of the positioning hole, and the distance between the first position and the second position matches the distance between the first elastic ball and the second elastic ball. After the positioning pin is inserted into the positioning hole, the first elastic ball enters the first positioning groove and can rotate along the first positioning groove. The positioning pin is configured to be able to rotate and switch between a positioning state and a clearance state relative to the positioning hole. The second elastic ball enters the second positioning groove, and the cylindrical surface of the positioning pin is used to press against the second end of the bonding tool to implement the installation and positioning of the bonding tool on the second axis. At this time, the positioning pin is in the positioning state. The second elastic ball enters the third positioning groove, and the second through hole on the positioning pin is aligned with the second end of the bonding tool to avoid the bonding tool. At this time, the positioning pin is in the avoidance state.

8. The ultrasonic bonding mechanism as described in claim 7, characterized in that, The end of the positioning pin is provided with a mating groove for the rotating operating component to be locked in and rotated.

9. The ultrasonic bonding mechanism as described in claim 1, characterized in that, The retaining component is provided with a sleeve hole, and the retaining component is interference-fitted onto the amplitude transformer rod through the sleeve hole; or... The holding assembly is provided with a screw hole, and the holding assembly is screwed onto the amplitude transformer rod through the screw hole; or... The retaining component is welded or riveted to the luffing rod.

10. The ultrasonic bonding mechanism as described in claim 1, characterized in that, The retaining component is a one-piece structure; or, The holding assembly is a split structure, and the holding assembly includes a connecting member that is a positioning member, wherein: the connecting member is fixedly connected to the amplitude rod, the positioning member is fixedly connected to the connecting member, and the locking groove is provided on the positioning member.

11. A bonding machine, characterized in that, The bonding machine includes a lead feeding mechanism, a carrying mechanism driving mechanism, and an ultrasonic bonding mechanism as described in any one of claims 1 to 10, wherein: The lead feeding mechanism is configured to provide the ultrasonic bonding mechanism with leads of the corresponding specifications. The support mechanism is located below the ultrasonic bonding mechanism and is configured to support and / or transport the frame on which the chip is mounted. The ultrasonic bonding mechanism is mounted on the drive end of the drive mechanism, and the drive mechanism is configured to drive the ultrasonic bonding mechanism to move along a predetermined motion trajectory. The ultrasonic bonding mechanism is configured to ultrasonically bond the lead to the chip after moving to a predetermined position.

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