An ultra-precision polishing semiconductor metal surface grinding processing equipment

Abstract

The utility model relates to the related field of semiconductor metal grinding technology especially a kind of ultra-precision polishing's semiconductor metal surface grinding processing equipment, including device ontology, the device ontology inside contains grinding cylinder, separating component and blanking component, the outer cover of grinding cylinder front surface is hinged with and outer cover lower end is equipped with sealing ring, self-locking buckle is connected between the grinding cylinder and outer cover, the drive motor is connected to the one side of grinding cylinder, the separating component is provided with two groups and is fixed in the inside of grinding cylinder, the blanking component is arranged in the lower end of grinding cylinder, the separating component includes the two groups of fixed plate fixed in the inner wall of grinding cylinder, and pull-out plate is inserted in the inside of two groups of fixed plate, the flexible adjustment of the space inside grinding cylinder can be realized, different semiconductor metal is conveniently zoned and grinds operation, can assist stirring grinding, improve the efficiency and quality of grinding, also can realize the screening and independent collection operation to grinding debris.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor metal grinding technology, and in particular to an ultra-precision polishing semiconductor metal surface grinding processing equipment. Background Technology

[0002] Semiconductor metals are substances whose resistivity is between that of metals and insulators and which have a negative temperature coefficient of resistance. Semiconductor metal grinding refers to a series of process steps in semiconductor manufacturing to grind metal materials. These steps aim to improve the surface quality of the material, remove surface damage layers, and ensure processing accuracy and efficiency. When grinding large quantities of semiconductor metals, a drum grinding machine can be used.

[0003] Existing drum-type grinding equipment typically lacks the ability to flexibly adjust its internal space. It can only be designed as a single space or multiple independent spaces, and cannot freely switch between single and multiple spaces. The equipment is not flexible in use and is difficult to adapt to different usage needs. It also lacks the ability to assist in grinding metal parts. Therefore, we need to upgrade and modify the existing technology to overcome the existing problems and shortcomings. Utility Model Content

[0004] The purpose of this invention is to provide an ultra-precision polishing semiconductor metal surface grinding equipment to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, this utility model provides the following technical solution:

[0006] Design an ultra-precision polishing semiconductor metal surface grinding processing equipment, including a device body, which contains a grinding cylinder, a separating component, and a feeding component. The grinding cylinder has an outer cover plate hinged to its front and a sealing ring at its lower end. A self-locking buckle connects the grinding cylinder and the outer cover plate. A drive motor is connected to one side of the grinding cylinder. Two sets of separating components are provided and fixed inside the grinding cylinder. The feeding component is located at the lower end of the grinding cylinder.

[0007] The separation assembly includes two sets of fixing plates fixed to the inner wall of the grinding cylinder, with pull-out plates inserted into the inner sides of the two sets of fixing plates, and two sets of grinding rods fixed to the sides of the pull-out plates.

[0008] Preferably, the feeding assembly includes a screening disc and a collecting disc, the screening disc being disposed on the upper end of the collecting disc and a vibration motor being installed at the bottom of the screening disc.

[0009] Preferably, the inner side of the fixed plate is provided with a positioning rod, and the inner side of the pull-out plate is provided with a positioning groove, the positioning groove being slidably connected to the positioning rod.

[0010] Preferably, the grinding rod has an inner mounting plate, and a fixing bolt connects the mounting plate to the pull-out plate.

[0011] Preferably, connecting columns are fixed on both sides of the screening tray, and spring seats are provided on the side of the collection tray, with the bottom of the connecting columns elastically connected to the upper end of the spring seats.

[0012] Preferably, the screening disc has a discharge port at its front end, the collection disc has a discharge port on its side, and a baffle plate is inserted into each of the two discharge ports.

[0013] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0014] 1. This utility model includes a partition component, a fixed plate, a positioning rod, a pull-out plate, a positioning groove, a grinding rod, a mounting plate, and a fixing bolt. The pull-out plate is installed inside the fixed plate by the positioning rod and the positioning groove, and the grinding rod is assembled and disassembled by the mounting plate and the fixing bolt. This allows for partitioning of the internal space of the grinding cylinder, facilitating the grinding of different semiconductor metals in separate areas. It prevents mutual collision and wear between semiconductor metals, improves the flexibility of the device, and can assist in stirring and grinding, thereby improving the efficiency and quality of grinding.

[0015] 2. This utility model includes a feeding assembly, a screening disc, a collecting disc, a vibrating motor, a connecting column, a spring seat, a feeding port, and a baffle plate. The vibrating motor drives the screening disc and the connecting column to vibrate above the spring seat. The screening disc filters the grinding debris into the collecting disc below, and the debris is discharged through the feeding port. This enables the screening and collection of grinding debris, facilitating the separate removal of the debris and preventing the problem of grinding debris being mixed with the grinding material and difficult to separate, thus improving the practicality of the device.

[0016] Specific embodiments of the present invention are disclosed in detail with reference to the following description and accompanying drawings, indicating how the principles of the present invention can be employed. It should be understood that the embodiments of the present invention are not limited in scope. Within the spirit and scope of the appended claims, the embodiments of the present invention include many changes, modifications, and equivalents. Attached Figure Description

[0017] The accompanying drawings are provided to further illustrate the present invention and form part of the specification. They are used together with the embodiments of the present invention to explain the present invention, but do not constitute a limitation thereof. In the drawings:

[0018] Figure 1 This is a schematic diagram of the overall structure according to the present utility model;

[0019] Figure 2 This is a schematic diagram of the working structure according to this utility model;

[0020] Figure 3 An exploded view of the separator component according to this utility model;

[0021] Figure 4 This is an exploded view of the feeding assembly according to this utility model.

[0022] In the diagram: 1. Device body; 2. Grinding cylinder; 21. Outer cover plate; 22. Self-locking buckle; 23. Sealing ring; 3. Drive motor; 4. Separating assembly; 41. Fixing plate; 42. Positioning rod; 43. Pull-out plate; 44. Positioning groove; 45. Grinding rod; 46. Mounting plate; 47. Fixing bolt; 5. Feeding assembly; 51. Screening plate; 52. Collection plate; 53. Vibrating motor; 54. Connecting column; 55. Spring seat; 56. Feeding port; 57. Baffle plate. Detailed Implementation

[0023] To make the technical means, creative features, objectives and effects of this utility model easier to understand, the present utility model will be further described below in conjunction with specific embodiments.

[0024] like Figure 1 As shown in Figure 4, this embodiment provides an ultra-precision polishing semiconductor metal surface grinding equipment, including a device body 1. The device body 1 includes a grinding cylinder 2, a separating component 4, and a feeding component 5. The grinding cylinder 2 is hinged to an outer cover plate 21 on the front and a sealing ring 23 is provided at the lower end of the outer cover plate 21. A self-locking buckle 22 is connected between the grinding cylinder 2 and the outer cover plate 21. A drive motor 3 is connected to one side of the grinding cylinder 2. Two sets of separating components 4 are provided and fixed inside the grinding cylinder 2. The feeding component 5 is located at the lower end of the grinding cylinder 2.

[0025] In this embodiment, the partition component 4 includes two sets of fixing plates 41 fixed to the inner wall of the grinding cylinder 2. A pull-out plate 43 is inserted into the inner side of the two sets of fixing plates 41. Two sets of grinding rods 45 are fixed to the side of the pull-out plate 43. A positioning rod 42 is provided on the inner side of the fixing plate 41. A positioning groove 44 is provided on the inner side of the pull-out plate 43. The positioning groove 44 is slidably connected to the positioning rod 42. An installation plate 46 is provided on the inner side of the grinding rod 45. A fixing bolt 47 is connected between the installation plate 46 and the pull-out plate 43. The pull-out plate 43 is installed on the inner side of the fixing plate 41 by the positioning rod 42 and the positioning groove 44, so that the interior of the grinding cylinder 2 is divided into three independent spaces. The grinding rods 45 can be disassembled and assembled by the installation plate 46 and the fixing bolt 47, thereby realizing the partitioning operation of the interior space of the grinding cylinder 2. This facilitates the grinding of different semiconductor metals in different partitions, prevents mutual collision and wear between semiconductor metals, and improves the flexibility of the device. The grinding rods 45 can assist in stirring and grinding, improving the grinding efficiency and quality.

[0026] In this embodiment, the feeding assembly 5 includes a screening disc 51 and a collecting disc 52. The screening disc 51 is located on the upper end of the collecting disc 52, and a vibration motor 53 is installed at the bottom of the screening disc 51. Connecting columns 54 are fixed on both sides of the screening disc 51. A spring seat 55 is provided on the side of the collecting disc 52. The bottom of the connecting column 54 is elastically connected to the upper end of the spring seat 55. A feeding port 56 is opened at the front end of the screening disc 51 and a feeding port 56 is opened on the side of the collecting disc 52. A baffle plate 57 is inserted into each of the two sets of feeding ports 56. The vibration motor 53 drives the screening disc 51 and the connecting column 54 to vibrate above the spring seat 55. The grinding debris is screened by the screening disc 51 into the collecting disc 52 below and discharged through the feeding port 56. This enables the screening and collection of grinding debris, making it easier to remove the debris separately and preventing the grinding debris from being mixed in with the grinding material and difficult to separate, thus improving the practicality of the device.

[0027] The working principle and process of this utility model are as follows: In use, the pull-out plate 43 can be inserted into the inside of the fixed plate 41 through the positioning groove 44 and the positioning rod 42, so that the inside of the grinding cylinder 2 is divided into two or three independent spaces, which is convenient for placing different semiconductor metal parts. The semiconductor metal and abrasive are poured into the grinding cylinder 2, the outer cover plate 21 is locked, and the grinding cylinder 2 is rotated by the drive motor 3, so that the semiconductor metal and the abrasive can fully contact each other and complete the grinding operation. The grinding rod 45 can assist in grinding and dispersing the semiconductor metal to prevent accumulation and dead corners. After grinding, the outer cover plate 21 is set downward so that the internal semiconductor metal and abrasive fall onto the screening plate 51. The screening plate 51 is driven to vibrate by the vibration motor 53. The debris generated by grinding will fall into the collection plate 52 below through the sieve holes, while the abrasive and semiconductor metal remain in the screening plate 51. The semiconductor metal is taken out, and then the abrasive and debris are collected separately through the two side discharge ports 56.

[0028] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installed," "equipped with," "connected," etc., should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be a connection within two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0029] In the description of this embodiment, the terms "upper," "lower," "right," etc., refer to the orientation or positional relationship shown in the accompanying drawings. They are used only for ease of description and simplification of operation, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. In addition, the terms "first" and "second" are only used for distinction in description and have no special meaning.

Claims

1. A semiconductor metal surface grinding and polishing equipment for ultra-precision polishing, characterized in that: The device includes a main body (1), which contains a grinding cylinder (2), a separating component (4) and a feeding component (5). The grinding cylinder (2) has an outer cover plate (21) hinged to its front and a sealing ring (23) at the lower end of the outer cover plate (21). A self-locking buckle (22) connects the grinding cylinder (2) and the outer cover plate (21). A drive motor (3) is connected to one side of the grinding cylinder (2). Two sets of the separating component (4) are provided and fixed inside the grinding cylinder (2). The feeding component (5) is located at the lower end of the grinding cylinder (2). The separating component (4) includes two sets of fixing plates (41) fixed to the inner wall of the grinding cylinder (2), and a pull plate (43) is inserted into the inner side of the two sets of fixing plates (41). Two sets of grinding rods (45) are fixed to the side of the pull plate (43).

2. The apparatus according to claim 1, wherein the apparatus is characterized by: The feeding assembly (5) includes a screening plate (51) and a collecting plate (52). The screening plate (51) is located on the upper end of the collecting plate (52), and a vibration motor (53) is installed at the bottom of the screening plate (51).

3. The apparatus according to claim 1, wherein the apparatus is characterized by: The fixing plate (41) is provided with a positioning rod (42) on the inner side, and the pull plate (43) is provided with a positioning groove (44) on the inner side. The positioning groove (44) is slidably connected to the positioning rod (42).

4. The apparatus according to claim 1, wherein the apparatus is characterized by: The grinding rod (45) has an installation plate (46) on its inner side, and a fixing bolt (47) connects the installation plate (46) and the pull plate (43).

5. The apparatus of claim 2, wherein: the polishing pad is a super-precision polishing pad; and the polishing pad is a semiconductor metal surface polishing pad. The screening tray (51) is fixed with connecting posts (54) on both sides, and the collection tray (52) is provided with a spring seat (55) on the side. The bottom of the connecting post (54) is elastically connected to the upper end of the spring seat (55).

6. The apparatus according to claim 5, wherein: The screening tray (51) has a discharge port (56) at the front end, and the collection tray (52) has a discharge port (56) on the side. Each of the two discharge ports (56) is fitted with a baffle plate (57).

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