Wafer dicing blade correction device
By using electrode discharge technology to repair wafer dicing blades, the problems of long grinding time and high cost in existing technologies are solved, achieving efficient and low-cost blade repair and precision improvement.
CN224390810UActive Publication Date: 2026-06-23CHENGDU XIHUA TECH CO LTD
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- CHENGDU XIHUA TECH CO LTD
- Filing Date
- 2025-07-14
- Publication Date
- 2026-06-23
AI Technical Summary
Technical Problem
In existing technologies, wafer dicing blades are difficult to repair quickly after wear, resulting in long sharpening times, high costs, and insufficient precision.
Method used
Electrode discharge technology is used to repair wafer dicing blades. It utilizes the high temperature generated by electric arc discharge to remove material and trim the blade edge to a uniform and round shape. Electrode discharge blade repair is low-cost and highly efficient.
Benefits of technology
It enables rapid and low-cost wafer dicing tool repair, improving repair efficiency and accuracy while reducing repair costs.
✦ Generated by Eureka AI based on patent content.
Smart Images
Figure CN224390810U_ABST
Abstract
The utility model discloses a wafer cutting knife correction device, including X -axis movement module, Y -axis movement module, blade rotary motor, blade clamp, electrode rotary motor, electrode, electrode clamp, blade rotary motor is installed on the mobile part of X -axis movement module, blade clamp is installed on the rotary axle of blade rotary motor, wafer cutting knife is clamped and installed on the blade clamp, electrode rotary motor is installed on the mobile part of Y -axis movement module, the rotary axle of blade rotary motor and the rotary axle of electrode rotary motor parallelly set up, electrode clamp is installed on the rotary axle of electrode rotary motor, electrode is clamped and installed on the electrode clamp, and the electrode is close to wafer cutting knife setting when working. In this application, using pulse power, adopting electrode discharge, the cutting repair of wafer cutting knife is carried out, and the repair time of the knife sharpening is faster than the original grinding knife mode, and the original grinding knife mode needs to consume the grinding plate, and the use cost of electrode discharge knife sharpening is relatively lower.
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