Mold for forming positioning holes in a carrier substrate for electronic components

Abstract

The utility model provides a kind of die of positioning hole of forming of electronic component with carrier tape base material, positioning hole die technical field, including die body, still including the vibration piece setting in the one end outside of die body, collection hopper is set in the bottom end inside of die body, cleaning piece is set in the below of die body, for the waste cleaning to outside collected, cleaning plate is set in the below of die body, avoid waste residue to influence positioning hole forming precision, and roller auxiliary reduces friction in vibration process, make shake material more smooth, cooperate the cleaning design of box door, can effectively keep inside clean, improve die use efficiency and the processing quality of electronic component carrier tape base material.

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