Wafer lifting mechanism

Abstract

The utility model discloses a wafer lifting mechanism, include: two first slide rail, two first slide rail parallelly arranged, just first slide rail along the first direction setting, first support and first linear module, first support both ends respectively with two first slide rail sliding fit, first linear module install on first support, first support with first linear module all along second direction setting, second linear module, the top of second linear module passes through second support and is inactively arranged on first linear module along second direction, second linear module is along longitudinal setting, just stretches to the below of first slide rail with first support, and the bottom of second linear module is used for installing wafer equipment. The utility model reduces the occupied space of ground, can expand the space of placing wafer equipment and expand artificial channel.

Description

Technical Field

[0001] This utility model relates to the technical field of wafers, and more particularly to a wafer lifting mechanism. Background Technology

[0002] Currently, wafer equipment is lifted using ground-mounted lifting devices, which results in a large floor space requirement, a small space for placing the wafer equipment, the need for frequent replenishment of wafer equipment, and limited manual access. Utility Model Content

[0003] In view of this, the purpose of this utility model is to provide a wafer lifting mechanism, in which the first slide rail is set at a certain height and the second linear module can extend to the bottom of the first slide rail and the first support, thereby reducing the space occupied on the ground and expanding the space for placing wafer equipment and expanding the manual passage.

[0004] To achieve the above objectives, the technical solution adopted by this utility model is as follows:

[0005] A wafer lifting mechanism, comprising:

[0006] Two first slide rails are arranged in parallel and along a first direction;

[0007] The first bracket and the first linear module are provided. The two ends of the first bracket are respectively slidably engaged with the two first slide rails. The first linear module is mounted on the first bracket. Both the first bracket and the first linear module are arranged along the second direction.

[0008] The second linear module has its top movably mounted on the first linear module along the second direction via the second bracket. The second linear module is arranged longitudinally and extends below the first slide rail and the first bracket. The bottom of the second linear module is used to mount wafer equipment.

[0009] In the aforementioned wafer lifting mechanism, each of the first slide rails is provided with a sliding plate, and the two ends of the first bracket are respectively fixedly connected to the two sliding plates;

[0010] The wafer lifting mechanism further includes a drive assembly, which is connected to the two slide plates respectively.

[0011] The wafer lifting mechanism described above, wherein the driving component includes: a first motor, a first gearbox, and two transmission components, wherein the first motor is drivingly connected to the first gearbox, the first gearbox is drivingly connected to the two transmission components respectively, and the two transmission components are drivingly connected to the two slide plates respectively.

[0012] In the aforementioned wafer lifting mechanism, each of the transmission components includes: a first transmission rod, a second gearbox, and a ball screw, wherein the first gearbox, the first transmission rod, the second gearbox, the ball screw, and the slide are sequentially connected in a transmission manner.

[0013] In the aforementioned wafer lifting mechanism, both the first direction and the second direction are horizontal, and the first direction is perpendicular to the second direction.

[0014] In the aforementioned wafer lifting mechanism, the first support includes a first horizontal plate and a first vertical plate connected to each other. The first vertical plate has a plurality of hollow cavities along its length, and one or more reinforcing ribs are provided in the hollow cavities.

[0015] In the aforementioned wafer lifting mechanism, one or more cavities are provided on both sides of the first vertical plate.

[0016] In the aforementioned wafer lifting mechanism, the number of the second supports is one or more, and each second support includes a second horizontal plate and a second vertical plate connected to each other, with a reinforcing plate provided between the second horizontal plate and the second vertical plate.

[0017] In the aforementioned wafer lifting mechanism, the first linear module and the second linear module are respectively driven by a second motor.

[0018] Because this utility model employs the aforementioned technology, it has the following positive effects compared to existing technologies:

[0019] (1) The present invention sets the first slide rail at a certain height, and the second linear module can extend to the bottom of the first slide rail and the first bracket, reducing the space occupied on the ground, expanding the space for placing wafer equipment and expanding the manual passage. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of the overall structure of the wafer lifting mechanism of this utility model.

[0021] Figure 2 This is a front view of the wafer lifting mechanism of this utility model.

[0022] Figure 3 This is a side view of the structure of the wafer lifting mechanism of this utility model.

[0023] Figure 4 This is a top view of the wafer lifting mechanism of this utility model.

[0024] Figure 5 This is a schematic diagram of the structure of the first support in the wafer lifting mechanism of this utility model.

[0025] In the attached diagram: 1. First slide rail; 2. First bracket; 3. First linear module; 4. Second linear module; 5. Second bracket; 6. Slide plate; 7. First motor; 8. First gearbox; 9. First transmission rod; 10. Second gearbox; 11. First horizontal plate; 12. First vertical plate; 13. Hollow cavity; 14. Reinforcing rib; 15. Recessed cavity; 16. Second horizontal plate; 17. Second vertical plate; 18. Reinforcing plate; 19. Second motor. Detailed Implementation

[0026] The technical solution of this utility model will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this utility model. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this utility model.

[0027] In the description of this utility model, it should be understood that the orientation or positional relationship indicated by terms such as "upper", "lower", "left", "right", "inner", "outer", "front", "back", "horizontal", and "vertical" are based on the orientation or positional relationship shown in the accompanying drawings and are only for the convenience of describing this utility model, and are not intended to indicate or imply that the device or component referred to must have a specific orientation, and therefore should not be construed as a limitation of this utility model.

[0028] It should be noted that the terms "horizontal" and "vertical" in this utility model are used to describe approximate positional relationships, and not strictly "horizontal plane" or "vertical plane".

[0029] It should be noted that, unless otherwise specified, this utility model can be used at the angle shown in the accompanying drawings or at other angles.

[0030] Please see Figures 1 to 5 The diagram illustrates a preferred embodiment of a wafer lifting mechanism, comprising: two first slide rails 1, a first support 2, a first linear module 3, and a second linear module 4. The two first slide rails 1 are arranged in parallel and along a first direction. The two ends of the first support 2 are slidably engaged with the two first slide rails 1, respectively. The first linear module 3 is mounted on the first support 2. Both the first support 2 and the first linear module 3 are arranged along a second direction. The top of the second linear module 4 is movably mounted on the first linear module 3 along the second direction via a second support 5. The second linear module 4 is arranged longitudinally and extends below the first slide rails 1 and the first support 2. The bottom of the second linear module 4 is used to mount wafer equipment. The wafer equipment can also be wafer-related devices or mechanisms, etc.

[0031] Furthermore, the two first slide rails 1 are set at the same height, both of which are located above the ground and fixed in a set position, such as a wall or beam.

[0032] This invention places the first slide rail 1 at a certain height, and the second linear module 4 can extend below the first slide rail 1 and the first support 2, reducing the space occupied on the ground and expanding the space for placing wafer equipment and the manual passage.

[0033] The two first slide rails 1 and the first bracket 2 form a U-shaped structure or an I-shaped structure.

[0034] Furthermore, as a preferred embodiment, each first slide rail 1 is provided with a slide plate 6, and the two ends of the first bracket 2 are respectively fixedly connected to the two slide plates 6.

[0035] Furthermore, as a preferred embodiment, the wafer lifting mechanism also includes a drive assembly, which is connected to the two slide plates 6 respectively.

[0036] The above are merely preferred embodiments of the present utility model and are not intended to limit the implementation methods and protection scope of the present utility model.

[0037] Based on the above, this utility model also has the following embodiments:

[0038] In a further embodiment of the present invention, the drive assembly includes: a first motor 7, a first gearbox 8, and two transmission assemblies. The first motor 7 is connected to the first gearbox 8 in a transmission connection. The first gearbox 8 is connected to the two transmission assemblies in a transmission connection. The two transmission assemblies are connected to the two slide plates 6 in a transmission connection.

[0039] In a further embodiment of the present invention, each transmission component includes: a first transmission rod 9, a second gearbox 10 and a ball screw (not shown in the figure), and the first gearbox 8, the first transmission rod 9, the second gearbox 10, the ball screw and the slide plate 6 are sequentially connected in a transmission manner.

[0040] The ball screw is located inside the first slide rail 1.

[0041] In a further embodiment of this utility model, both the first direction and the second direction are horizontal, and the first direction is perpendicular to the second direction.

[0042] In a further embodiment of the present invention, the first support 1 includes a first horizontal plate 11 and a first vertical plate 12 connected to each other. The first vertical plate 12 has a plurality of hollow cavities 13 along its length direction, and one or more reinforcing ribs 14 are provided in the hollow cavities 13.

[0043] Preferably, the hollow cavity 13 can reduce the weight of the first support 1, the reinforcing rib 14 can improve the strength of the first longitudinal plate 12, and the bottom of the first longitudinal plate 12 is connected to the middle of the first horizontal plate 11.

[0044] In a further embodiment of this utility model, one or more recesses 15 are provided on both sides of the first longitudinal plate 11. The recesses 15 have two functions: one is to facilitate installation, and the other is to improve the strength of the first longitudinal plate 12.

[0045] The two sides of the opening of the cavity 15 protrude inward, which can be used to install parts. The protruding parts limit the movement of the parts, and the parts can slide within the cavity 15.

[0046] In a further embodiment of the present invention, the number of second supports 5 is one or more, and each second support 5 includes a second horizontal plate 16 and a second vertical plate 17 connected to each other, with a reinforcing plate 18 provided between the second horizontal plate 16 and the second vertical plate 17.

[0047] The reinforcing plate 18 can improve the strength of the second support 5.

[0048] The side wall of the second horizontal plate 16 is connected to the middle of the side wall of the second vertical plate 17.

[0049] In a further embodiment of this utility model, the first linear module 3 and the second linear module 4 are driven by the second motor 19, respectively.

[0050] The above description is only a preferred embodiment of the present utility model and does not limit the implementation method and protection scope of the present utility model. Those skilled in the art should realize that all solutions obtained by equivalent substitutions and obvious changes made based on the description and illustrations of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A wafer lifting mechanism, characterized in that, include; Two first slide rails are arranged in parallel and along a first direction; The first bracket and the first linear module are provided. The two ends of the first bracket are respectively slidably engaged with the two first slide rails. The first linear module is mounted on the first bracket. Both the first bracket and the first linear module are arranged along the second direction. The second linear module has its top movably mounted on the first linear module along the second direction via a second bracket. The second linear module is arranged longitudinally and extends below the first slide rail and the first bracket. The bottom of the second linear module is used to mount wafer equipment.

2. The wafer lifting mechanism according to claim 1, characterized in that, Each of the first slide rails is equipped with a slide plate, and the two ends of the first bracket are respectively fixedly connected to the two slide plates; The wafer lifting mechanism further includes a drive assembly, which is connected to the two slide plates respectively.

3. The wafer lifting mechanism according to claim 2, characterized in that, The drive assembly includes: a first motor, a first gearbox, and two transmission assemblies. The first motor is connected to the first gearbox, the first gearbox is connected to the two transmission assemblies, and the two transmission assemblies are connected to the two slide plates.

4. The wafer lifting mechanism according to claim 3, characterized in that, Each of the transmission components includes: a first transmission rod, a second gearbox, and a ball screw, wherein the first gearbox, the first transmission rod, the second gearbox, the ball screw, and the slide are sequentially connected in a transmission manner.

5. The wafer lifting mechanism according to claim 1, characterized in that, Both the first direction and the second direction are horizontal, and the first direction is perpendicular to the second direction.

6. The wafer lifting mechanism according to claim 1, characterized in that, The first support includes a first horizontal plate and a first vertical plate connected to each other. The first vertical plate has a plurality of hollow cavities along its length, and one or more reinforcing ribs are provided in the hollow cavities.

7. The wafer lifting mechanism according to claim 6, characterized in that, One or more recesses are provided on both sides of the first longitudinal plate.

8. The wafer lifting mechanism according to claim 1, characterized in that, The number of the second brackets is one or more, and each second bracket includes a second horizontal plate and a second vertical plate connected to each other, with a reinforcing plate provided between the second horizontal plate and the second vertical plate.

9. The wafer lifting mechanism according to claim 1, characterized in that, The first linear module and the second linear module are each driven by a second motor.

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