Wafer detecting machine wafer pressing device

Abstract

The utility model relates to a wafer detection machine tablet press device, has the translation swing arm, elevating system and connecting seat, elevating system is installed on the translation swing arm, connecting seat is installed on elevating system, be equipped with a plurality of connecting rods on connecting seat, be equipped with the tablet press head on the outer end of connecting rod, be equipped with height adjusting mechanism on the tablet press head. The utility model is installed on wafer detection machine and uses, when using, put the sheet material to the detection seat, the lower part of sheet material is subjected to vacuum adsorption, connecting rod is pressed down under the action of air cylinder, a plurality of tablet press heads press the outer periphery of wafer, then carry out detection. Set up a plurality of connecting rods can realize many point tablet press, every connecting rod is all equipped with the tablet press head and set up, and sheet material is evenly stressed, prevent sheet material to have one side to lift up, every tablet press head is all set up adjusting structure, can adjust tablet press head level through bolt, every tablet press head can independently adjust, more convenient, and tablet press effect is better.

Description

Technical Field

[0001] This utility model relates to the field of diode manufacturing technology, and in particular to a wafer pressing device for a wafer inspection machine. Background Technology

[0002] Inspection machines are used to inspect wafers on wafers, such as... Figures 5-8 As shown, during use, the wafer needs to be placed on the inspection stand. The inspection stand is equipped with a lens for inspection. During inspection, the inspection stand moves slowly, and the lens can inspect multiple wafers on the wafer in sequence. In the prior art, a vacuum structure is set in the middle of the inspection stand to hold the wafer. However, wafers are not completely flat after production. Some wafers have very large deformities and warps. When such wafers are placed on the inspection stand, they cannot be level with the inspection platform. At this time, the vacuum mechanism cannot perform the vacuum function. The wafer is deformed in the lens, which affects the inspection. Utility Model Content

[0003] To address the aforementioned problems, the purpose of this utility model is to provide a wafer pressing device for a wafer inspection machine, which can effectively press wafers, is easy to adjust, and saves costs.

[0004] Each tablet press head is equipped with an adjustment mechanism, and the horizontal height of the tablet press head can be adjusted by bolts. Each tablet press head can be adjusted independently.

[0005] The frame is a telescopic pole that can be extended or retracted. It can be adjusted according to the size of the sheet material and is suitable for various sheet sizes. This eliminates the need to prepare multiple frames, saving costs.

[0006] To solve the above-mentioned technical problems, the present invention adopts the following technical solution: a wafer inspection machine pressing device, comprising a translational swing arm, a lifting mechanism and a connecting seat, wherein the lifting mechanism is mounted on the translational swing arm, the connecting seat is mounted on the lifting mechanism, the connecting seat is provided with a plurality of connecting rods, the outer end of the connecting rod is provided with a pressing head, and the pressing head is provided with a height adjustment mechanism.

[0007] In the above technical solution, the lifting mechanism is a lifting cylinder.

[0008] In the above technical solution, the connecting rod includes a first connecting rod and a second connecting rod. The inner end of the first connecting rod is mounted on a connecting seat, and the inner end of the second connecting rod is connected to the outer end of the first connecting rod. A pressure head is mounted on the outer end of the second connecting rod. The first connecting rod and the second connecting rod are connected by a first adjusting bolt and an elongated hole.

[0009] In the above technical solution, the height adjustment mechanism is a second adjusting bolt set on the outer end of the connecting rod, and the pressure head is installed at the lower part of the second adjusting bolt.

[0010] In the above technical solution, the height adjustment mechanism is a spring rod installed on the outer end of the connecting rod. The spring rod is equipped with a limiting piece, which limits the connection with the upper plane of the connecting rod. A spring is fitted on the spring rod, and the pressure head is installed at the lower part of the spring rod.

[0011] In the above technical solution, a silicone sleeve is fitted onto the tablet pressing head.

[0012] In the above technical solution, the connecting seat is provided with six connecting rods, which are arranged radially and evenly around the connecting seat.

[0013] In the above technical solution, the swing arm is mounted on the frame of the inspection machine and can be moved above the wafer inspection stand under the drive of a cylinder.

[0014] In summary, the advantages of this utility model over traditional technical means are as follows: This utility model is used on a wafer inspection machine. When in use, the wafer is placed on the inspection seat, the lower part of the wafer is vacuum-adsorbed, the connecting rod is pressed down by the cylinder, and multiple pressing heads flatten the outer periphery of the wafer before inspection.

[0015] Setting multiple connecting rods can achieve multi-point pressing. Each connecting rod is equipped with a pressing head, so that the sheet is evenly stressed and prevents the sheet from tilting up on one side.

[0016] Each tablet press head is equipped with an adjustment mechanism, which allows the horizontal height of the tablet press head to be adjusted via bolts. Each tablet press head can be adjusted independently, making it more convenient and resulting in better tablet compression. Attached Figure Description

[0017] The foregoing and other objects, features and advantages of this invention will become apparent from the following detailed description taken in conjunction with the accompanying drawings.

[0018] Figure 1 This is a front view schematic diagram of the present invention;

[0019] Figure 2 This is a top view of the connecting rod in this utility model.

[0020] Figure 3 This is a schematic diagram of the structure of a single connecting rod in Embodiment 1 of this utility model;

[0021] Figure 4 This is a schematic diagram of the structure of a single connecting rod in Embodiment 2 of this utility model;

[0022] Figure 5 This is a schematic diagram of the usage state of this utility model;

[0023] Figure 6 This is a front view schematic diagram of the detection seat;

[0024] Figure 7 This is a side sectional view of the testing seat;

[0025] Figure 8 This is a schematic diagram of a wafer;

[0026] The following are the labels: 100, translational swing arm; 200, lifting mechanism; 300, connecting seat; 400, connecting rod; 410, first connecting rod; 420, second connecting rod; 430, first adjusting bolt; 440, elongated hole; 500, pressing head; 510, silicone sleeve; 600, height adjustment mechanism; 610, second adjusting bolt; 620, spring rod; 630, limiting piece; 640, spring; 700, wafer; 800, frame; 810, camera; 820, wafer detection seat; 821, vacuum head. Detailed Implementation

[0027] Based on the preferred embodiments of this utility model, and through the following description, those skilled in the art can make various changes and modifications without departing from the technical concept of this utility model. The technical scope of this utility model is not limited to the contents of the specification, but must be determined according to the scope of the claims.

[0028] The present invention will be further described with reference to the following figures:

[0029] like Figures 1-5 As shown, a wafer inspection machine pressing device has a translational swing arm 100, a lifting mechanism 200 and a connecting seat 300. The lifting mechanism 200 is mounted on the translational swing arm 100, and the connecting seat 300 is mounted on the lifting mechanism 200. The connecting seat 300 is provided with a plurality of connecting rods 400, and the outer end of the connecting rod is provided with a pressing head 500. The pressing head 500 is provided with a height adjustment mechanism 600.

[0030] The lifting mechanism 200 is a lifting cylinder used to drive the lifting of the connecting seat 300. When it descends, the pressing head 500 can press on the edge of the wafer 700.

[0031] The connecting rod 400 includes a first connecting rod 410 and a second connecting rod 420. The inner end of the first connecting rod 410 is mounted on the connecting seat 300, and the inner end of the second connecting rod 420 is connected to the outer end of the first connecting rod 410. A pressing head 500 is mounted on the outer end of the second connecting rod 420. The first connecting rod 410 and the second connecting rod 420 are connected by a first adjusting bolt 430 and an elongated hole 440. The first connecting rod 410 and the second connecting rod 420 form a structure similar to a telescopic rod. By adjusting the position of the first adjusting bolt 430 in the elongated hole 440, the length of the connecting rod 400 can be controlled, making it suitable for various specifications of wafers 700. This eliminates the need to prepare multiple connecting rods 400, saving costs.

[0032] The height adjustment mechanism 600 is a second adjusting bolt 610 disposed on the outer end of the connecting rod, and the pressing head 500 is mounted on the lower part of the second adjusting bolt 610.

[0033] The height adjustment mechanism 600 is a spring rod 620 installed on the outer end of the connecting rod 400. The spring rod 620 is equipped with a limiting piece 630, which limits the connection between the spring rod 400 and the upper plane of the connecting rod 400. A spring 640 is fitted on the spring rod 620, and the pressing head 500 is installed at the lower part of the spring rod 620.

[0034] A silicone sleeve 510 is fitted onto the tablet press head 500.

[0035] The connecting seat 300 is provided with six connecting rods 400, which are arranged radially and evenly around the connecting seat 300.

[0036] The translational swing arm 100 is mounted on the frame 800 of the inspection machine and can move the connecting rod 400 above the wafer inspection seat 820 under the drive of the cylinder.

[0037] The above description is merely a preferred embodiment of this utility model and is not intended to limit the utility model. Various modifications and variations can be made to this utility model by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. A wafer pressing device for a wafer inspection machine, characterized in that: It has a translational swing arm, a lifting mechanism and a connecting seat. The lifting mechanism is mounted on the translational swing arm, the connecting seat is mounted on the lifting mechanism, and the connecting seat is provided with multiple connecting rods. The outer end of each connecting rod is provided with a pressing head, and the pressing head is provided with a height adjustment mechanism.

2. The wafer pressing device for a wafer inspection machine according to claim 1, characterized in that: The lifting mechanism is a lifting cylinder.

3. The wafer pressing device for a wafer inspection machine according to claim 1, characterized in that: The connecting rod includes a first connecting rod and a second connecting rod. The inner end of the first connecting rod is mounted on a connecting seat, and the inner end of the second connecting rod is connected to the outer end of the first connecting rod. A pressure head is mounted on the outer end of the second connecting rod. The first connecting rod and the second connecting rod are connected by a first adjusting bolt and an elongated hole.

4. The wafer pressing device for a wafer inspection machine according to claim 1, characterized in that: The height adjustment mechanism is a second adjusting bolt located on the outer end of the connecting rod, and the pressure head is mounted on the lower part of the second adjusting bolt.

5. The wafer pressing device for a wafer inspection machine according to claim 1, characterized in that: The height adjustment mechanism is a spring rod installed on the outer end of the connecting rod. The spring rod is equipped with a limiting piece, which limits the connection between the spring rod and the upper plane of the connecting rod. A spring is fitted on the spring rod, and the pressure head is installed at the lower part of the spring rod.

6. The wafer pressing device for a wafer inspection machine according to claim 1, characterized in that: The tablet press head is fitted with a silicone sleeve.

7. The wafer pressing device for a wafer inspection machine according to claim 1, characterized in that: The connecting seat is provided with six connecting rods, which are arranged radially and evenly around the connecting seat.

8. The wafer pressing device for a wafer inspection machine according to claim 1, characterized in that: The swing arm is mounted on the frame of the inspection machine and can be moved above the wafer inspection stand under the drive of a cylinder.

Images