Programmable adjustable diode device for high-voltage measurement and control of aerospace power supply
By designing a programmable adjustable diode device for high-voltage measurement and control of aerospace power supplies, and using a control mechanism and a high-voltage relay array to achieve automated switching of the diode array, the problem of not being able to programmatically switch between diodes of different specifications in high-voltage measurement and control of aerospace power supplies was solved, thus improving testing efficiency and safety.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SHAANXI SHENGSI INTELLIGENT MEASUREMENT & CONTROL CO LTD
- Filing Date
- 2025-06-13
- Publication Date
- 2026-06-23
Smart Images

Figure CN224399448U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of aerospace power supply test and control, and in particular to a programmable adjustable diode device for high-voltage test and control of aerospace power supplies. Background Technology
[0002] In the design of aerospace power supplies, the determination of diode parameters in the circuit typically relies on theoretical calculations and simulation analysis. However, in actual manufacturing, factors such as external electromagnetic interference, parasitic parameters of circuit board layout and wiring, and component process deviations can significantly affect the actual performance of the circuit, leading to deviations between theoretical design values and actual optimal values. This deviation can be even more pronounced in high-voltage applications, severely impacting the circuit's operational stability and reliability.
[0003] Therefore, in the development of aerospace power supplies, in addition to theoretical calculations and simulation verification, experimental testing is also required to determine the actual optimal parameter values of the diodes in the circuit. The traditional verification method first determines the approximate range of each parameter through theoretical calculations and simulations, and then manually replaces diodes of different specifications within that range one by one, repeatedly testing to find the diode parameters corresponding to the optimal circuit performance. This verification measurement method has significant drawbacks: on the one hand, the efficiency of manually replacing components is extremely low, especially when a large number of diodes of different specifications need to be tested, severely extending the development cycle; on the other hand, manual operation has poor precision, easily introducing errors, and poses safety risks under high-voltage environments, seriously restricting the development process of aerospace power supplies. Therefore, existing technologies suffer from the deficiency of being unable to programmatically switch between different specifications of diodes for automated testing during high-voltage measurement and control of aerospace power supplies. Utility Model Content
[0004] The main objective of this application is to provide a programmable adjustable diode device for high-voltage measurement and control of aerospace power supplies, aiming to solve the technical problem in the prior art that it is impossible to programmatically switch between diodes of different specifications for automated testing during high-voltage measurement and control of aerospace power supplies.
[0005] To achieve the above objectives, this application provides a programmable adjustable diode device for high-voltage measurement and control of aerospace power supplies, comprising: a housing space; a control mechanism disposed within the housing space for controlling diode array switching; a high-voltage relay array disposed within the control mechanism for responding to the control mechanism to switch diodes of different specifications in the diode array; and a diode packaging mechanism connected to the control mechanism via high-voltage relay contacts and high-voltage lines. The diode packaging mechanism is disposed within the housing space and comprises a diode array composed of multiple diodes of different specifications.
[0006] Optionally, the control mechanism includes: a control chip for receiving external commands and controlling the switching of the high-voltage relay array; a communication module for supporting communication between the control chip and external systems; and a power supply module for providing power.
[0007] Optionally, the device further includes a diode input terminal and a diode output terminal, which are connected to the diode packaging mechanism via a high-voltage cable for receiving and outputting diode test signals.
[0008] Optionally, the device further includes: a potting mechanism disposed inside the accommodating space, comprising: a potting port; a diode potting block for potting the diode packaging mechanism; and a terminal potting block for potting the diode input terminal and the diode output terminal.
[0009] Optionally, the device further includes: an isolation module, which includes optocoupler isolation and an amplifier circuit; wherein the high-voltage relay array is connected to the control mechanism through the isolation module, the optocoupler isolation is used to protect the control mechanism IO, and the amplifier circuit is used to realize voltage conversion.
[0010] Optionally, the device further includes a housing, the interior of which is divided into a potting area and a non-potting area, the potting area being used to house the diode packaging mechanism and the potting structure, and the non-potting area being used to house other mechanisms.
[0011] Optionally, the device further includes a reverse diode disposed across the coil of the high-voltage relay array.
[0012] Optionally, the device indicator light is located inside the accommodating space and is used to indicate the switching status of the high-voltage relay array.
[0013] Optionally, the device further includes: the contacts and coils of the high-voltage relay array are isolated by a high-voltage-resistant insulating material to achieve electrical isolation between the control end and the load end.
[0014] Optionally, the control chip is a microcontroller.
[0015] The beneficial effects that this application can achieve are as follows:
[0016] A control mechanism is installed within the enclosure to control the switching of the diode array, thereby providing intelligent control for the entire device and enabling programmed management of the diode switching process. A high-voltage relay array is installed on the control mechanism to switch different specifications of diodes in the array in response to commands from the control mechanism. Electrical switching between different diodes is achieved through the contact switching action of the high-voltage relays, solving the safety switching problem under high-voltage environments. A diode packaging mechanism is also included, comprising a diode array composed of multiple diodes of different specifications, connected to the control mechanism via high-voltage relay contacts and high-voltage lines. This provides a variety of diode specifications to meet the diode parameter requirements under different testing needs, while ensuring a reliable connection between the control signal and the high-voltage test circuit.
[0017] Through the above technical solution, this application realizes the automatic switching of diodes by program control, eliminates the low efficiency and high error of manual operation, solves the technical problem in the prior art that it is impossible to switch diodes of different specifications for automated testing in the high voltage measurement and control process of aerospace power supplies by program control, and realizes the technical effect of automatically switching diodes of different specifications by program control to meet the high voltage measurement and control automation test requirements of aerospace power supplies. Attached Figure Description
[0018] Figure 1 A block diagram illustrating the control principle of the programmable adjustable diode device provided in this application embodiment;
[0019] Figure 2 An automatic adjustment circuit diagram of a diode array provided in an embodiment of this application;
[0020] Figure 3 This is a schematic diagram of the overall structure of the programmable adjustable diode device according to an embodiment of this application.
[0021] The attached figures are labeled as follows:
[0022] 1-Control mechanism, 2-Power supply module, 3-Communication module, 4-Potting port, 5-Housing shell, 6-Diode input terminal, 7-Diode output terminal, 8-Terminal potting block, 9-Diode potting block, 10-Diode packaging mechanism, 11-Diode, 12-High voltage relay. Detailed Implementation
[0023] The technical solutions in this embodiment will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.
[0024] It should be noted that all directional indicators (such as up, down, left, right, front, back, etc.) in this embodiment are only used to explain the relative positional relationship and movement of each component under a certain preset posture (as shown in the figure). If the preset posture changes, the directional indicator will also change accordingly.
[0025] In this utility model, unless otherwise explicitly specified and limited, the terms "connection," "fixing," etc., should be interpreted broadly. For example, "fixing" can mean a fixed connection, a detachable connection, or an integral part; it can mean a mechanical connection or an electrical connection; it can mean a direct connection or an indirect connection through an intermediate medium; it can mean the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.
[0026] Furthermore, if this embodiment involves descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, features defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the meaning of "and / or" throughout the text includes three parallel solutions; for example, "A and / or B" includes solution A, solution B, or a solution where both A and B are satisfied simultaneously. Furthermore, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this utility model.
[0027] This application provides a programmable adjustable diode device for high-voltage measurement and control of aerospace power supplies, including a housing space, a control mechanism, a high-voltage relay array, and a diode packaging mechanism.
[0028] The control mechanism is located inside the accommodating space and is used to control the switching of the diode array;
[0029] The high-voltage relay array is disposed on the control mechanism and is used to switch diodes of different specifications in the diode array in response to the control mechanism.
[0030] A diode packaging mechanism is provided, which is connected to the control mechanism via a high-voltage relay contact high-voltage line. The diode packaging mechanism is disposed inside the accommodating space and includes a diode array composed of multiple diodes of different specifications.
[0031] Specifically, the programmable adjustable diode device for high-voltage measurement and control of aerospace power supplies adopts a modular design, with each functional module working together to realize the programmable switching function of the diode, including the housing space, control mechanism, high-voltage relay array and diode packaging mechanism.
[0032] The housing provides the physical structure for the entire device, ensuring the rational layout and effective protection of each functional module. The control mechanism, as the core of the entire device, is located within the housing. It receives external control commands and generates corresponding control signals to control the switching operation of the diode array, thereby enabling the selection and control of diodes of different specifications.
[0033] The high-voltage relay array, acting as an actuator, is located within the control mechanism. Specifically, it responds to control signals issued by the control mechanism by switching different diodes within the diode array through the opening and closing of the high-voltage relay contacts. This high-voltage relay array can operate stably under high-voltage environments, ensuring the safety and reliability of the switching process.
[0034] The diode packaging mechanism, as the controlled object, is housed within the enclosure and electrically connected to the control mechanism via high-voltage relay contacts and high-voltage lines. The internal structure comprises a diode array consisting of multiple diodes of different specifications. These diodes possess different electrical parameters, meeting the diverse testing requirements of high-voltage measurement and control processes in aerospace power supplies. By switching the high-voltage relay array, any single diode in the array can be selectively connected to the test circuit, enabling programmable adjustment of the diode parameters.
[0035] The aforementioned programmable adjustable diode device establishes a complete programmable switching system through the organic combination of the control mechanism, high-voltage relay array, and diode packaging mechanism. This effectively solves the problems of low efficiency and poor accuracy of traditional manual switching methods. At the same time, it solves the problem of not being able to programmatically switch between different specifications of diodes for automated testing during high-voltage measurement and control of aerospace power supplies. It realizes the automatic switching of different specifications of diodes through programmable control, meeting the automated testing requirements of high-voltage measurement and control of aerospace power supplies.
[0036] Furthermore, the control mechanisms include:
[0037] A control chip, which is used to receive external commands and control the switching of the high-voltage relay array;
[0038] A communication module, wherein the communication module enables the control chip to communicate with external devices;
[0039] A power supply module, which is used to provide power.
[0040] Specifically, the control mechanism adopts an integrated design, including three core components: a control chip, a communication module, and a power supply module. These components work together to achieve intelligent control of the entire device.
[0041] Specifically, the control chip, as the core of the control mechanism's computation and decision-making, is responsible for receiving control commands from external testing equipment. It then parses and processes these commands according to preset control logic, generating corresponding control signals to control the switching state of each relay in the high-voltage relay array. The control chip outputs control signals through corresponding I / O pins, controlling the output state of these pins based on external signals, thereby precisely selecting the target diode in the diode array and achieving programmable switching of the diodes.
[0042] The communication module uses the RS-485 communication protocol to establish a reliable communication link between the control chip and external testing equipment. This module includes a serial-to-RS-485 converter chip, enabling the control chip to exchange data and transmit commands in real time with external testing equipment, host computers, or other control systems, thereby achieving the device's control and status monitoring functions.
[0043] The power supply module includes multi-stage voltage conversion circuits, specifically a 24V to 5V circuit and a 5V to 3.3V circuit, responsible for providing a stable and reliable power supply to the control chip, communication module, and other related circuits. The voltage conversion circuits power the control chip and communication module by progressively converting the external 24V power input into the 3.3V required for the control chip's operation and the 5V required for the communication module's operation, ensuring stable operation of the control mechanism under various working conditions.
[0044] The control mechanism enables precise control of the diode array switching, providing a reliable guarantee for the automated operation of the entire device.
[0045] Furthermore, the programmable diode device also includes a diode input terminal and a diode output terminal, which are connected to the diode packaging mechanism via a high-voltage cable for receiving and outputting diode test signals.
[0046] Specifically, the programmable diode device also includes a diode input terminal and a diode output terminal, which are used to establish an electrical connection between the device and an external test system to achieve safe and reliable transmission of diode test signals.
[0047] Specifically, the diode input terminal serves as the input interface for test signals, responsible for receiving test signals from external test equipment and transmitting these signals to the currently selected diode within the diode package. The diode output terminal serves as the output interface for test signals, responsible for outputting the processed signal to external test equipment for subsequent signal analysis and measurement.
[0048] Both the input and output terminals of the diode are electrically connected to the diode packaging structure via high-voltage cables. These high-voltage cables possess excellent high-voltage insulation and electrical transmission characteristics, ensuring the stability and safety of signal transmission under high-voltage testing conditions, effectively preventing high-voltage breakdown and signal interference, and guaranteeing the accuracy of test results.
[0049] By configuring the diode input and output terminals, external testing equipment can easily establish an electrical connection with the programmable diode device, enabling the input and output of test signals. Combined with the control mechanism's programmable switching function for the diode array, the external testing equipment can select diodes of different specifications for testing via control commands without altering the physical connections, thereby improving testing efficiency and simplifying the testing process.
[0050] Furthermore, the programmable diode device also includes:
[0051] A filling mechanism, disposed within the accommodating space, includes:
[0052] Filling and sealing;
[0053] A diode potting block is used to pot the diode packaging mechanism.
[0054] Terminal potting block, used to pot the input terminal and the output terminal of the diode.
[0055] Specifically, considering the harsh working environment of aerospace power systems and the safety requirements of high-voltage applications, the programmable diode device also includes a potting mechanism to seal and protect key components, thereby improving the device's environmental adaptability and reliability.
[0056] Specifically, the potting mechanism is located inside the accommodating space and adopts a regional potting technology, which includes three main components: potting port, diode potting block and terminal potting block.
[0057] The filling port serves as the injection channel for the filling material, providing an operational interface for the filling process. Through the filling port, liquid filling material can be precisely injected into the area requiring filling, ensuring the controllability of the filling process and the consistency of filling quality.
[0058] Diode potting blocks are specifically designed to encapsulate and protect the diode package structure. They completely cover the diode package, forming a sealed protective layer that effectively prevents external environmental factors such as moisture, dust, and corrosive gases from damaging the diode. This also enhances the diode's mechanical stability under vibration and shock conditions. Furthermore, diode potting blocks possess excellent insulation properties, improving the electrical safety of the diode under high-voltage environments.
[0059] Terminal potting blocks are specifically designed for potting and protecting the input and output terminals of diodes. They seal the connection points between the diode's input and output terminals, preventing arcing and insulation breakdown under high-voltage conditions. Simultaneously, they protect the mechanical strength of the diode input and output connection, ensuring reliable connection during long-term use.
[0060] Through the zoned protection of the potting mechanism, the programmable diode device can operate stably under harsh conditions such as extreme temperature, vacuum, and radiation in the aerospace environment, thereby improving the device's environmental adaptability and service life.
[0061] Furthermore, the programmable diode device also includes: an isolation module, which includes optocoupler isolation and amplification circuitry;
[0062] The high-voltage relay array is connected to the control mechanism through the isolation module, the optocoupler isolation is used to protect the control mechanism I / O, and the amplifier circuit is used to realize voltage conversion.
[0063] Specifically, in order to ensure electrical safety isolation between the control mechanism and the high-voltage relay array and to achieve reliable signal transmission, the programmable diode device also includes an isolation module, which establishes a safe signal transmission channel between the control mechanism and the high-voltage relay array.
[0064] Specifically, the isolation module includes two core components: optocoupler isolation and amplifier circuit, which realizes the dual functions of electrical isolation and signal conditioning.
[0065] Optocoupler isolation utilizes the principle of photoelectric coupling to achieve electrical isolation between the control mechanism and the high-voltage relay array. When the control mechanism's I / O pins output control signals, the optocoupler isolates the electrical signals into optical signals for transmission, and then converts the optical signals back into electrical signals for transmission to subsequent circuits. Through this photoelectric conversion process, optocoupler isolation effectively blocks the direct electrical connection between the control mechanism and the high-voltage relay array, protecting the control mechanism's I / O pins from potential damage from electrical interference such as high voltage and surge current generated in the high-voltage circuit of the high-voltage relay array, thus ensuring the safe operation of the control mechanism.
[0066] The amplifier circuit is used to convert the voltage of the control signal and enhance its driving capability. Since the control signal output by the control mechanism is usually a low-voltage logic signal, while the operation of the high-voltage relay array requires a higher driving voltage and current, the amplifier circuit amplifies the voltage and current of the control signal after optocoupler isolation, so that it meets the electrical parameter requirements for driving the high-voltage relay array, ensuring that the relay can reliably perform switching operations.
[0067] By setting up the isolation module, a safe and reliable connection is established between the high-voltage relay array and the control mechanism, which not only ensures the accurate transmission of control signals, but also effectively prevents the high-voltage circuit from interfering with the control circuit in the reverse direction, thereby improving the electrical safety and operational stability of the entire device.
[0068] Furthermore, the programmable diode device includes a housing, the interior of which is divided into a potting area and a non-potting area. The potting area is used to house the diode packaging mechanism and potting structure, while the non-potting area is used to house other mechanisms.
[0069] Specifically, the programmable diode device also includes a housing that provides mechanical protection and structural support for the entire device, thereby optimizing the device's structural layout and improving the effectiveness of the potting process.
[0070] The interior of the shell adopts a partitioned design, dividing it into two functional areas: a potting area and a non-potting area, which allows for the separate arrangement of different functional modules.
[0071] The potting area, requiring sealing and protection, is specifically designed to house the diode packaging mechanism and potting structure. Within this area, the diode packaging mechanism, along with its associated connecting lines, is arranged uniformly, facilitating the overall potting process. By concentrating the devices requiring potting within the potting area, the application range of the potting material can be effectively controlled, ensuring precise implementation of the potting process and preventing the potting material from affecting other devices that do not require potting.
[0072] The non-potting area, which does not require sealing, is used to house control mechanisms, isolation modules, and other components. These components typically have good environmental adaptability or require maintenance and adjustment during use, making potting unsuitable. Placing these components in the non-potting area ensures normal operation while facilitating subsequent maintenance and repair.
[0073] Through the partitioned design inside the casing, the programmable diode device effectively separates the potting process from the non-potting process. This not only improves the potting effect and process controllability, but also ensures the reasonable layout of each functional module and convenient maintenance, further enhancing the overall performance and practicality of the device.
[0074] Furthermore, the programmable adjustable diode device also includes a reverse diode, which is disposed across the coil of the high-voltage relay array.
[0075] Specifically, the programmable adjustable diode device also includes a reverse diode, which is set as a protection device in the high-voltage relay array to protect the high-voltage relay array from damage caused by the reverse electromotive force.
[0076] Specifically, the reverse diode is placed across the coil of the high-voltage relay array, forming a parallel connection with the relay coil. When the relay coil in the high-voltage relay array is energized, the reverse diode is in a reverse bias state, does not conduct, and does not affect the normal operation of the relay.
[0077] When the relay coil is de-energized, the magnetic field energy in the coil cannot disappear instantaneously, generating a reverse electromotive force (EMF) opposite to the original voltage across the coil terminals. The reverse diode then functions as a protective mechanism. This reverse EMF causes the diode to conduct in the forward direction, providing a discharge path for the magnetic field energy stored in the coil. It clamps the reverse EMF at the diode's forward conduction voltage, effectively limiting its amplitude. In this way, the reverse diode can quickly dissipate the remaining energy in the coil, preventing high-amplitude reverse EMFs from damaging the drive and control circuits.
[0078] By using reverse diodes, the reliability and service life of the high-voltage relay array are improved, while the isolation module and control mechanism connected to the relays are protected from electrical shocks, ensuring the stable operation of the entire device in frequent switching modes.
[0079] Furthermore, the programmable adjustable diode device also includes an indicator light, disposed inside the accommodating space, for indicating the switching status of the high-voltage relay array.
[0080] Specifically, the programmable diode device also includes an indicator light, which is set inside the accommodating space as a status display device to provide intuitive indication of the working status, making it easy for operators to monitor the operation of the device.
[0081] Specifically, the indicator lights are used to indicate the switching status of the high-voltage relay array, providing real-time feedback to the operator on the current operating status via optical signals. The indicator lights are electrically linked to the high-voltage relay array; when a specific relay in the array activates, the corresponding indicator light will illuminate or extinguish, thus visually displaying the operating status of the currently selected diode or relay.
[0082] With the indicator lights, operators can quickly understand the current operating mode and switching status of the programmable diode device through visual observation without relying on external testing equipment. This visual status indication function not only improves the convenience and intuitiveness of device operation, but also helps to promptly identify and eliminate potential faults, providing an effective auxiliary means for the normal operation and maintenance of the device.
[0083] Furthermore, the programmable adjustable diode device also includes: the contacts and coils of the high-voltage relay array are isolated by a high-voltage-resistant insulating material to achieve electrical isolation between the control end and the load end.
[0084] Specifically, the programmable diode device employs high-voltage insulation isolation technology in the design of the high-voltage relay array to ensure electrical safety under high-voltage testing conditions.
[0085] Specifically, the contacts and coils of the high-voltage relay array are physically isolated by a high-voltage-resistant insulating material. This high-voltage-resistant insulating material has excellent insulation and voltage resistance properties, enabling it to withstand the high voltage stress that may occur in a high-voltage test environment, effectively blocking the electrical connection between the contacts and the coil.
[0086] This insulation design achieves electrical isolation between the control and load terminals. The coil, acting as the control terminal, connects to the control signal of the control mechanism and operates at a relatively low control voltage. The contacts, acting as the load terminal, connect to the high-voltage test circuit of the diode package mechanism and may withstand higher test voltages. High-voltage-resistant insulating material forms a reliable insulating barrier between the two, ensuring that the voltage in the high-voltage test circuit is not reverse-conducted to the control circuit, thus protecting the control mechanism and related low-voltage control circuits from high-voltage surges.
[0087] By using high-voltage insulating materials for isolation, not only is the operational safety of the device improved in high-voltage environments, but the accurate transmission of control signals and reliable operation of relay contacts are also ensured, providing reliable electrical safety guarantees for high-voltage measurement and control applications in aerospace power supplies.
[0088] Furthermore, the control chip is a microcontroller.
[0089] Specifically, the control chip is implemented using a microcontroller, which, as an integrated microcontroller, provides an efficient and reliable control core for the programmable adjustable diode device.
[0090] A microcontroller integrates a central processing unit, memory, input / output interfaces, and other functional modules into one unit, offering advantages such as small size, low power consumption, high integration, and strong programmability. The microcontroller can run preset control programs to achieve precise control of a high-voltage relay array. When external control commands are transmitted to the microcontroller via the communication module, the microcontroller parses and processes the commands according to its built-in control algorithm and outputs corresponding digital control signals through its I / O pins to drive the high-voltage relay array to perform the corresponding switching operations.
[0091] The programmability of microcontrollers gives devices excellent flexibility and scalability, allowing control logic and switching strategies to be adjusted according to different application requirements. At the same time, microcontrollers can also implement intelligent functions such as status monitoring, fault diagnosis, and parameter storage, further improving the automation level and reliability of the device.
[0092] By using a microcontroller as the control chip, the programmable adjustable diode device achieves a good balance between cost-effectiveness and performance, providing an economical and practical solution for high-voltage measurement and control applications in aerospace power supplies.
[0093] like Figure 1 As shown, Figure 1 This is a block diagram illustrating the control principle of a programmable adjustable diode device. The control mechanism is a microcontroller. The microcontroller receives diode adjustment commands from an external source via a communication module. Based on the output requirements of the diode being adjusted, it controls the corresponding I / O port output, thereby controlling the high-voltage relay array (relay matrix module) to open and close. The diode array automatically adjusts as needed. Figure 2 The circuit shown uses different relay combinations to adjust diodes of different specifications.
[0094] The power supply module includes a 24V-5V conversion module and a 5V-3V3 conversion module, providing the required operating voltage for the entire programmable adjustable diode device. An external 24V power supply is connected through the power supply terminals, converted to 5V by the 24V-5V conversion module, and then converted to 3.3V3 by the 5V-3V3 conversion module, providing operating power for the communication module and the MCU (microcontroller).
[0095] The communication module uses the RS-485 communication protocol and establishes a connection with external test equipment through the communication terminal. The MCU (microcontroller) acts as the control mechanism, receiving control commands from the communication module and generating corresponding control signals according to the preset control logic.
[0096] The I / O isolation module is located between the MCU (microcontroller) and the high-voltage relay array (relay matrix module) to achieve electrical isolation between the control and execution ends. The high-voltage relay array (relay matrix module) receives the isolated control signals and controls the opening and closing states of the corresponding high-voltage relays, thereby selectively connecting diodes of different specifications into the test circuit.
[0097] like Figure 2 As shown, Figure 2 This is an automatic adjustment circuit for a diode array. The diode array consists of multiple diodes of different specifications. Figure 2 Specifically, these are diodes D1-D11, each controlled by a corresponding high-voltage relay contact. By combining and opening different high-voltage relays, single diodes or combinations of diodes can be selectively connected to the circuit, achieving programmable adjustment of diode parameters.
[0098] When an external testing device sends a switching command, the MCU (microcontroller) parses the command and determines the diode that needs to be connected. It then controls the corresponding I / O port to output a control signal. This control signal, after being processed by the I / O isolation module, drives the corresponding relay in the high-voltage relay array (relay matrix module) to activate, thereby connecting the target diode to the test circuit and completing the programmable switching of the diode.
[0099] Through the above control principles and circuit design, the automatic programmable adjustment of the diodes was realized, effectively solving the technical problems of low efficiency and poor accuracy of the traditional manual switching method.
[0100] like Figure 3 As shown, the outer casing 5 provides mechanical protection and structural support for the entire programmable adjustable diode device, and the various functional modules are arranged in a reasonable manner inside.
[0101] The control mechanism 1 is located in the non-potted area inside the housing 5, serving as the control core of the entire device. The power supply module 2 and the communication module 3, as important components of the control mechanism 1, work together with the control mechanism 1 to provide power supply and communication function support, respectively.
[0102] Multiple high-voltage relays 12 are arranged near the control mechanism 1 to form a high-voltage relay array, which is used to perform diode switching operations in response to commands from the control mechanism 1. The high-voltage relays 12 are connected to the control mechanism 1 through control signal lines to achieve precise programmable switching.
[0103] The diode packaging mechanism 10 is located in the potting area inside the housing 5, and contains a diode array consisting of multiple diodes 11. The diodes 11 have different specifications and are selectively connected via a high-voltage relay 12. A potting port 4 is located on the housing 5, providing an operating channel for the potting process. The diode potting block 9 provides overall sealing protection for the diode packaging mechanism 10.
[0104] The diode input terminal 6 and diode output terminal 7 are located at the external interface of the housing 5, and are electrically connected to the diode packaging mechanism 10 via a high-voltage cable, providing a standardized signal input and output interface for external testing equipment. The terminal potting block 8 seals and protects the connection between the diode input terminal 6 and diode output terminal 7, ensuring reliable operation of the device in harsh environments.
[0105] Through such Figure 3 The structural layout shown demonstrates that the entire adjustable diode device organically combines control, execution, and protection functions, providing a complete programmable diode switching solution for high-voltage measurement and control of aerospace power supplies.
[0106] The above are merely preferred embodiments of this application and do not limit the patent scope of this application. Any equivalent structural or procedural transformations made using the content of this application's specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this application.
Claims
1. A programmable adjustable diode device for high-voltage measurement and control of aerospace power supplies, characterized in that, include: Storage space; A control mechanism, disposed within the accommodating space, is used to control the switching of the diode array; A high-voltage relay array, which is disposed in the control mechanism, is used to switch diodes of different specifications in the diode array in response to the control mechanism; A diode packaging mechanism, wherein the diode packaging mechanism is connected to the control mechanism via a high-voltage relay contact high-voltage line, the diode packaging mechanism is disposed inside the accommodating space, and the diode packaging mechanism includes: A diode array consisting of multiple diodes of different specifications.
2. The apparatus as claimed in claim 1, characterized in that, The control mechanism includes: A control chip, which is used to receive external commands and control the switching of the high-voltage relay array; A communication module, wherein the communication module enables the control chip to communicate with external devices; A power supply module, which is used to provide power.
3. The apparatus as described in claim 1, characterized in that, Also includes: The diode input and output terminals are connected to the diode packaging structure via high-voltage cables for receiving and outputting diode test signals.
4. The apparatus as described in claim 3, characterized in that, Also includes: A filling mechanism, disposed within the accommodating space, includes: Filling and sealing; A diode potting block is used to pot the diode packaging mechanism. Terminal potting block, used to pot the input terminal and the output terminal of the diode.
5. The apparatus as claimed in claim 1, characterized in that, Also includes: The isolation module includes optocoupler isolation and amplifier circuitry. The high-voltage relay array is connected to the control mechanism through the isolation module, the optocoupler isolation is used to protect the control mechanism I / O, and the amplifier circuit is used to realize voltage conversion.
6. The apparatus as described in claim 4, characterized in that, It also includes: a housing, the interior of which is divided into a potting area and a non-potting area. The potting area is used to house the diode packaging mechanism and the potting structure, while the non-potting area is used to house other mechanisms.
7. The apparatus as claimed in claim 1, characterized in that, Also includes: A reverse diode is disposed across the coil of the high-voltage relay array.
8. The apparatus as claimed in claim 1, characterized in that, Also includes: An indicator light, located inside the accommodating space, is used to indicate the switching status of the high-voltage relay array.
9. The apparatus as claimed in claim 1, characterized in that, Also includes: The contacts and coils of the high-voltage relay array are isolated by high-voltage-resistant insulating material to achieve electrical isolation between the control end and the load end.
10. The apparatus as claimed in claim 2, characterized in that, The control chip is a microcontroller.