Electronic device

Abstract

The embodiment of the application provides an electronic device, and belongs to the technical field of electronic devices. The electronic device comprises a bearing part, a circuit board and at least one antenna. The antenna comprises a radiator and a feeding structure, and a gap is formed between the radiator and the feeding structure, and the radiator and the feeding structure form a capacitor at the gap. The radiator is arranged on the bearing part, and the radiator is not directly connected with the circuit board. The feeding structure is electrically connected with the circuit board. In this way, the difficulty of the whole machine assembly of the electronic device can be reduced, and the assembly cost is reduced.

Description

Technical Field

[0001] This application relates to the field of electronic equipment technology, and in particular to an electronic device. Background Technology

[0002] Customer premises equipment (CPE) is a device that converts cellular signals received from a base station into WiFi signals and then transmits them for user terminals to access. It can support multiple mobile terminals to access at the same time and is widely used in homes, hospitals, factories, shopping malls, offices and other places. Compared with wired networks, its application scenarios are more flexible and network construction is more convenient.

[0003] In related technologies, the multiple antennas of a CPE are wall-mounted antennas. The radiators and feed structures of the wall-mounted antennas are respectively mounted on different circuit boards. The radiators are physically connected to the feed structure via coaxial cables, and the radiators are electrically connected to the circuit board carrying the feed structure via steel plates to achieve grounding. However, the large number of coaxial cables and steel plates makes the overall assembly of the CPE difficult, resulting in high assembly costs. Utility Model Content

[0004] This application provides an electronic device that can reduce the difficulty of assembling the entire electronic device and reduce assembly costs.

[0005] This application provides an electronic device including a carrier, a circuit board, and at least one antenna. The at least one antenna includes a radiator and a feeding structure, with a gap between the radiator and the feeding structure, forming a capacitor at the gap. The radiator is disposed on the carrier and is not directly connected to the circuit board. The feeding structure is electrically connected to the circuit board.

[0006] As can be seen from the above, the radiator with gaps and the feeding structure constitute an antenna. The feeding structure is electrically connected to the circuit board. Therefore, the circuit board can feed power to the radiator through the feeding structure to achieve the purpose of feeding power from the circuit board to the antenna.

[0007] Based on this, a capacitor is formed at the gap between the radiator and the feed structure. The radiator and the feed structure can be coupled via this capacitor. When energy is transferred between the feed structure and the radiator through capacitive coupling, the feed structure is not physically connected to the radiator, eliminating the need for physical connections such as coaxial cables. Simultaneously, when the feed structure feeds power to the radiator via capacitive coupling, the circuit board and the radiator are not directly connected, and the radiator does not need to be grounded to the circuit board via a grounding structure such as a steel sheet.

[0008] Therefore, when the feeding structure supplies power to the radiator via a capacitor, it reduces the number of parts in the electronic device, facilitating miniaturization and significantly simplifying assembly, thereby lowering the assembly cost. Furthermore, it avoids the noise issues associated with coaxial cables and the inconsistencies caused by coaxial cable length redundancy, improving antenna performance and consistency.

[0009] In some possible implementations, the radiator of at least one antenna is located inside the carrier.

[0010] In this way, protecting the radiator with a carrier component can prevent damage to the radiator. Furthermore, it removes the constraints the radiator places on the design of the carrier component, contributing to a more aesthetically pleasing appearance of the electronic device.

[0011] In some possible implementations, at least one radiator of the antenna is attached to the inner surface of the carrier.

[0012] In this way, the radiator and the carrier can be integrated into a single structure through processes such as laser direct forming, which can form radiators with various structures on the inner surface of the carrier, thus helping to improve antenna performance.

[0013] In some possible implementations, at least one extension extending into the interior of the carrier is provided on at least one inner wall of the carrier, and at least a portion of the radiator of at least one antenna is provided on the at least one extension.

[0014] In this way, by rationally designing the structure of the extension, a 3D trace surface can be provided, which allows for greater design freedom for the antenna and helps to further improve antenna performance.

[0015] In some possible implementations, the feeding structure of at least one antenna is printed on a circuit board.

[0016] This allows the power supply structure to be fabricated during the circuit board manufacturing process, improving the manufacturing efficiency of electronic devices.

[0017] In some possible implementations, the feeding structure of at least one antenna includes a feeding metal element.

[0018] In this way, the circuit board does not need to provide a large area to cooperate with the feeding metal component, enabling a small circuit board design. In addition, the shape of the feeding metal component can be bent or folded according to the internal space of the electronic device, enabling a more compact antenna layout and facilitating the miniaturization of electronic devices.

[0019] In some possible implementations, the capacitor is located at the zero-current position when the antenna achieves its second resonance. This is because the capacitor forms at the zero-current position at which the antenna achieves its second resonance. In this way, the feed structure can feed the radiator via capacitive coupling without the radiator needing to be grounded.

[0020] In some possible implementations, the capacitor is located approximately one-third of the distance from the feed input to the radiator end of the feed structure, specifically one-third, or, understandably, close to one-third, due to design constraints. The feed input is electrically connected to the circuit board. In this way, the feed structure does not have direct physical contact with the radiator and is able to transfer energy to the radiator.

[0021] In some possible implementations, the carrier is a housing, which is the external appearance of the electronic device as a whole that is visible to the user, and the circuit board is located inside the housing.

[0022] By mounting the radiator on the outer casing, the casing provides a larger surface area for wiring, increasing the antenna design freedom, allowing for a larger antenna trace area, increasing the antenna aperture, and improving antenna performance. Furthermore, the antenna design is more flexible, allowing for more antennas to be incorporated within a limited overall size, which is beneficial for miniaturizing electronic devices. In addition, the plastic brackets and first circuit boards used in existing technologies to support the radiator can be eliminated, reducing the number of parts in the electronic device, simplifying its structure, simplifying assembly, lowering costs, and contributing to miniaturization.

[0023] In some other possible implementations, the carrier may be located near the housing or in other locations.

[0024] In some possible implementations, the part where the outer casing connects to the radiator is a non-metallic part.

[0025] This prevents the outer casing from affecting the radiation performance of the radiator, thus ensuring antenna performance.

[0026] In some possible implementations, the casing is a non-metallic casing.

[0027] This reduces the difficulty of manufacturing the casing and greatly reduces the impact of the casing on antenna performance, thus helping to improve antenna performance.

[0028] In some possible implementations, the outer shell is a plate-shaped shell or a cylindrical shell.

[0029] This allows for the miniaturization of electronic devices while enabling the placement of a larger number of antennas.

[0030] In some possible implementations, there are multiple antennas, with at least two antennas operating in different frequency bands.

[0031] In this way, electronic devices can cover multiple communication frequency bands.

[0032] In some possible implementations, the electronic device is a client terminal device. Attached Figure Description

[0033] Figure 1 This is a schematic diagram illustrating an application scenario of a CPE provided in an embodiment of this application;

[0034] Figure 2 This is a cross-sectional schematic diagram of the CPE in related technology one;

[0035] Figure 3 for Figure 2 A three-dimensional structural diagram of the CPE when its outer shell is removed;

[0036] Figure 4 This is an exploded schematic diagram of the CPE in related technology 2;

[0037] Figure 5 for Figure 4 A three-dimensional structural diagram of a wall-mounted antenna electrically connected to a feed structure via a coaxial cable.

[0038] Figure 6 This is a schematic diagram of the CPE structure in related technology three;

[0039] Figure 7 for Figure 6 A schematic diagram of the radiator and spring-loaded foot working together;

[0040] Figure 8 An exploded view of an electronic device provided in an embodiment of this application;

[0041] Figure 9 for Figure 8 A cross-sectional schematic diagram of the electronic device shown;

[0042] Figure 10 for Figure 8 A schematic diagram of a shell antenna consisting of a radiator and an outer shell;

[0043] Figure 11 for Figure 8 A schematic diagram of the interaction between the radiator and the feeding structure.

[0044] Figure 12 A schematic diagram of a first structure for cooperating with a circuit board and a radiator, provided in an embodiment of this application;

[0045] Figure 13 for Figure 12The diagram shows a second structure in which the power supply structure mates with the circuit board and the radiator.

[0046] Figure 14 This is a schematic diagram showing the interaction between multiple antennas and a circuit board.

[0047] Figure 15 A three-dimensional structural schematic diagram of another electronic device provided in an embodiment of this application;

[0048] Figure 16 for Figure 15 A schematic diagram showing the interaction between the top wall and the circuit board and antenna.

[0049] Figure 17 For having Figure 14 The diagram shows the structure of another electronic device with an antenna and circuit board.

[0050] Figure 18 for Figure 17 The diagram shows an exploded view of the electronic device.

[0051] Explanation of reference numerals in the attached figures:

[0052] 100. Electronic devices;

[0053] 110. Outer shell; 111. Extension; 112. Top wall;

[0054] 120. Circuit board;

[0055] 130. Antenna;

[0056] 131. Radiation body;

[0057] 132. Power supply structure; 1321. Connecting part; 1322. Suspended part;

[0058] 200. Terminal;

[0059] 300, base station. Detailed Implementation

[0060] The terminology used in the implementation section of this application is for the purpose of explaining specific embodiments of this application only, and is not intended to limit this application.

[0061] The following provides a detailed description of the terminology that may be involved in the embodiments of this application.

[0062] Coupling can be understood as direct coupling and / or indirect coupling. "Coupled connection" can be understood as a direct coupling connection and / or indirect coupling connection. Direct coupling can also be called "electrical connection," which can be understood as physical contact and electrical conduction between components; it can also be understood as the form of connection between different components in a circuit structure through physical lines that can transmit electrical signals, such as copper foil or wires on a printed circuit board (PCB). "Indirect coupling" can be understood as electrical conduction between two conductors through a gap / non-contact method. In one embodiment, indirect coupling can also be called capacitive coupling, for example, signal transmission is achieved by forming an equivalent capacitance through coupling between the gaps between two conductive parts.

[0063] Radiator: In an antenna, this is the device used to receive / transmit electromagnetic wave radiation. In some cases, the term "antenna" is narrowly defined as a radiator, which converts guided wave energy from the transmitter into radio waves, or converts radio waves into guided wave energy, for radiating and receiving radio waves. The modulated high-frequency current energy (or guided wave energy) generated by the transmitter is transmitted to the transmitting radiator via a feed line, where it is converted into electromagnetic wave energy of a specific polarization and radiated in the desired direction. The receiving radiator converts the electromagnetic wave energy of a specific polarization from a specific direction in space back into modulated high-frequency current energy, which is then transmitted to the receiver input via a feed line.

[0064] Operating Frequency Band: Regardless of the type of antenna, it always operates within a certain frequency range (bandwidth). For example, an antenna supporting the B40 band operates within the frequency range of 2300MHz to 2400MHz, or in other words, its operating frequency band includes the B40 band. The frequency range that meets the specifications can be considered the antenna's operating frequency band. The width of the operating frequency band is called the operating bandwidth. The bandwidth can be considered as a frequency range on both sides of the center frequency (e.g., the resonant frequency of a dipole), where the antenna characteristics are within the acceptable range of the center frequency.

[0065] This application provides an electronic device 100, which may include, but is not limited to, smart speakers, smart door locks, mobile phones, tablets, laptops, routers, customer premise equipment (CPE), Internet of Things (IoT) devices, ultra-mobile personal computers (UMPCs), handheld computers, walkie-talkies, netbooks, point-of-sale (POS) machines, personal digital assistants (PDAs), wearable devices, virtual reality devices, wireless USB flash drives, Bluetooth speakers / headphones, or in-vehicle pre-installed devices, dashcams, security equipment, base stations, and other mobile or fixed terminal devices with antennas.

[0066] In this embodiment, the electronic device 100 described above is used as an example for illustration.

[0067] Figure 1 This is a schematic diagram of an application scenario for a CPE provided in an embodiment of this application.

[0068] like Figure 1 As shown, the CPE can receive cellular signals sent by the base station 300, convert the received cellular signals into WiFi signals, and then transmit them for the terminal 200 to access, enabling the terminal 200 to connect to the network. The CPE can support multiple terminals 200 accessing simultaneously and is widely applicable to homes, hospitals, factories, shopping malls, offices, and other locations. Compared to wired networks, its application scenarios are more flexible, and network construction is more convenient. With the increasing specifications of CPE products, for example, to further enhance the possible functions of the CPE, multiple antennas 130 are built into the CPE.

[0069] Among them, the terminal 200 may include, but is not limited to, mobile phones, tablets, laptops, smart bracelets, smartwatches, smart helmets, smart glasses, etc.

[0070] Figure 2 This is a cross-sectional schematic diagram of the CPE in related technology one. Figure 3 for Figure 2 A schematic diagram of the three-dimensional structure of the CPE when the outer shell is removed.

[0071] In related technology one, such as Figure 2 As shown, the CPE includes a housing 440, a circuit board 430, and radiators 410 disposed on opposite sides of the circuit board 430. Figure 3As shown, the radiator 410 is fixedly connected to the circuit board 430. The radiator 410 is physically connected to the power supply structure set on the circuit board 430 through the coaxial cable 420. The power supply structure is directly coupled to the radiator, so that the power supply structure supplies power to the radiator 410.

[0072] However, in related technology one, the coaxial cable 420 typically has redundant length for ease of assembly, which can lead to discrepancies in the overall assembly consistency of the cable, resulting in performance issues such as noise and pattern distortion. Furthermore, the assembly process of the coaxial cable 420 is relatively complex, increasing assembly costs, and a large number of coaxial cables 420 can also result in a larger CPE size. Additionally, during assembly, a safety gap is left between the radiator 410 and the outer casing 440, preventing full utilization of the overall space.

[0073] Figure 4 This is an exploded view of the CPE in related technology 2. Figure 5 for Figure 4 A three-dimensional structural diagram showing the wall-mounted antenna connected to the feed structure via a coaxial cable.

[0074] In related technology two, such as Figure 4 As shown, the CPE has multiple wall-mounted antennas, each including a radiator (not shown) and a first circuit board 520 supporting the radiator. The first circuit board 520 is fixedly connected to the CPE's outer casing 510 via a mid-frame bracket 540. The radiator is physically connected to a feed structure (not shown) mounted on a second circuit board 550 via a coaxial cable 530. Figure 5 As shown, the radiator also needs to be connected to the second circuit board 550 via a steel sheet 560 for grounding, so as to form an effective current loop and enable effective power feeding.

[0075] However, in related technology two, the coaxial cable 530 typically has redundant length for ease of assembly, which can lead to inconsistencies in the assembly of the coaxial cable 530 within the overall device, resulting in performance issues such as clutter and pattern distortion. Furthermore, considering the miniaturization of the CPE, the size of the first circuit board 520 generally cannot be made too large, limiting the trace area of ​​the radiator and thus limiting antenna performance. In addition, the assembly process of the coaxial cable 530 and steel sheet 560 is relatively complex, increasing assembly costs. A large number of coaxial cables 530 and steel sheets 560 may also result in a larger CPE size. Finally, the first circuit board 520 requires support from the mid-frame bracket 540, further increasing the overall cost.

[0076] Figure 6 This is a schematic diagram of the CPE structure in related technology three. Figure 7 for Figure 6A schematic diagram of the radiator and spring feet working together.

[0077] In related technology three, such as Figure 6 As shown, the CPE's multiple antennas are bracket antennas, each including a plastic bracket 620 and a radiator 610 mounted on the surface of the plastic bracket 620. The radiator 610 can be a hot-melt steel sheet or an FPC (flexible printed circuit). The radiator 610 is physically connected to a feed structure mounted on a circuit board 630, and the radiator 610 is physically connected to the circuit board 630 for grounding. See also... Figure 7 The feeding structure has spring-loaded feet 640 welded on it. After the plastic bracket 620 is snapped onto the circuit board 630, the radiator 610 is pressed onto the top of the spring-loaded feet 640, realizing the feeding connection between the feeding structure and the radiator 610. The circuit board 630 has spring-loaded feet 640 welded on it, and the circuit board 630 is electrically connected to the radiator 610 through the spring-loaded feet 640 to ground the radiator 610, thereby forming an effective current loop. Typically, a bracket antenna requires multiple spring-loaded feet 640 to physically connect the radiator 610 to the feeding structure and the circuit board 630 to achieve an effective feeding connection.

[0078] However, in related technology three, the plastic bracket 620 can provide a 3D wiring surface for the radiator 610, but a safety gap needs to be left between the plastic bracket 620 and the CPE shell during assembly, thus the internal space of the whole machine cannot be fully utilized in terms of wiring height. In addition, the numerous materials such as the plastic bracket 620, the radiator 610, and a large number of spring feet 640 make the assembly process of the whole machine more complicated and are also prone to reliability problems such as antenna misalignment due to drops.

[0079] Figure 8 This is an exploded view of an electronic device 100 provided in an embodiment of this application. Figure 9 for Figure 8 The schematic cross-sectional view of the electronic device 100 shown is shown below. Figure 10 for Figure 8 A schematic diagram of the housing antenna formed by the radiator 131 and the carrier 110. Figure 11 for Figure 8 A schematic diagram of the radiator 131 and the feeding structure 132 in the diagram.

[0080] Therefore, in the embodiments of the application, see Figure 8 The electronic device 100 includes a carrier 110, a circuit board 120, and at least one antenna 130. Among them, such as... Figure 9 As shown, at least one antenna 130 includes a radiator 131 and a feed structure 132, with a gap (e.g., between the radiator 131 and the feed structure 132) between them. Figure 11As shown), the radiator 131 and the feeding structure 132 form a capacitor at the gap. The radiator 131 is disposed on the support member 110 (e.g., Figure 10 As shown), the radiator 131 is not directly connected to the circuit board 120 (e.g. Figure 9 (As shown). The power supply structure 132 is electrically connected to the circuit board 120.

[0081] like Figure 9 As shown, the radiator 131 with a gap and the feeding structure 132 constitute the antenna 130. The feeding structure 132 is electrically connected to the circuit board 120. Therefore, the circuit board 120 can feed the radiator 131 through the feeding structure 132 to achieve the purpose of feeding the antenna 130 from the circuit board 120.

[0082] Because a capacitor is formed between the radiator 131 and the feed structure 132 at the gap between them, the radiator 131 and the feed structure 132 can be capacitively coupled. When energy is transferred between the feed structure 132 and the radiator 131 through capacitive coupling, the feed structure 132 is not physically connected to the radiator 131, eliminating the need for physical connections such as coaxial cables. Simultaneously, when the feed structure 132 feeds power to the radiator 131 via capacitive coupling, the circuit board 120 is not directly connected to the radiator 131, and the radiator 131 does not need to be grounded to the circuit board 120 via a grounding structure such as a steel sheet.

[0083] Therefore, when the feeding structure 132 feeds the radiator 131 through a capacitor, it can reduce the number of parts in the electronic device 100, which helps to miniaturize the design of the electronic device 100, greatly simplifies the assembly difficulty, and further reduces the cost of the electronic device 100. In addition, it can avoid the noise caused by using coaxial cables and the consistency problem caused by the redundancy of coaxial cable length, thus improving antenna performance and antenna consistency. Furthermore, compared with the existing technology, which has many antenna components, complex cable management, and cumbersome assembly, in this embodiment, the feeding structure 132 is set on the circuit board 120 and the radiator 131 is set on the carrier 110, which reduces the number of parts required for the antenna 130, reduces the cost of the antenna 130 and the assembly difficulty, and also helps to miniaturize the electronic device 100.

[0084] Since the feed structure 132 and the radiator 131 are capacitively coupled, the capacitance value can be adjusted by changing the gap between the feed structure 132 and the radiator 131, that is, by adjusting the length of the gap formed by the coupling between the feed structure 132 and the radiator 131, thereby adjusting the operating frequency of the antenna 130 to meet the usage requirements.

[0085] In some embodiments, the radiator 131 may be a single, integral structure. Alternatively, in other embodiments, the radiator 131 may include a plurality of spaced-apart sub-radiators.

[0086] Antenna 130 can be a cellular antenna, a WiFi (wireless fidelity) antenna, a BT (blue-tooth) antenna, etc.

[0087] In some embodiments, the number of antennas 130 is multiple, for example, ten antennas 130. Of course, the number of antennas 130 may be more or less than ten. This increases the possible functions that the electronic device 100 can implement.

[0088] When there are multiple antennas 130, at least one antenna 130 has a gap between its radiator 131 and the feed structure 132, and a capacitor is formed at the gap. That is, at least one antenna 130's radiator 131 and the feed structure 132 are capacitively coupled.

[0089] In some embodiments, there are multiple antennas 130, and the radiator 131 of each antenna 130 is capacitively coupled to the feeding structure 132. Alternatively, in some embodiments, there are multiple antennas 130, which may include at least one first antenna and at least one second antenna. The radiator 131 of the first antenna and the feeding structure 132 may be capacitively coupled. The radiator 131 of the first antenna is not directly connected to the circuit board 120. The radiator 131 of the second antenna may be physically connected to the feeding structure 132 through a coaxial cable, spring-loaded feet, or other structures. The radiator 131 of the second antenna may be connected to the circuit board 120 for grounding through a steel sheet or other structures.

[0090] In some embodiments, at least two antennas 130 operate in different frequency bands, enabling the electronic device 100 to cover multiple communication frequency bands.

[0091] In some embodiments, the circuit board 120 may be a printed circuit board (PCB). In this way, the circuit board 120 has greater strength and can be directly assembled to the carrier 110, which helps to reduce the number of parts in the electronic device 100 and improve the assembly efficiency of the electronic device 100.

[0092] In some possible implementations, the capacitor is located at the zero-current position when the antenna 130 achieves its second resonance. This is because the capacitor is formed at the zero-current position where the antenna 130 achieves its second resonance. In this way, the feed structure 132 feeds the radiator 131 through capacitive coupling, while the radiator 131 does not need to be grounded.

[0093] In some possible implementations, the capacitor is located approximately one-third of the distance from the feed input terminal of the feed structure 132 to the end of the radiator 131, specifically including one-third, or understandably, due to design constraints, near one-third. The feed input terminal is electrically connected to the circuit board 120. In this way, the feed structure 132 does not have direct physical contact with the radiator 131 and is able to transfer energy to the radiator 131.

[0094] The power input terminal can be understood as the end where the power supply structure 132 is electrically connected to the circuit board 120, or the end where the power supply structure 132 receives signals transmitted from the circuit board 120.

[0095] In some possible implementations, at least one radiator 131 of the antenna 130 is located inside the carrier 110; for example, the number of antennas 130 may be multiple, such as... Figure 10 As shown, the radiators 131 of each antenna 130 are disposed inside the carrier 110.

[0096] In this way, the radiator 131 is protected by the carrier 110, preventing damage to the radiator 131. In addition, the radiator 131 can also relieve the constraints on the shape of the carrier 110, which helps to improve the aesthetics of the electronic device.

[0097] In addition to being disposed inside the support member 110, in some embodiments, the radiator 131 of at least one antenna 130 may also be disposed outside the support member 110. Specifically, when there are multiple antennas 130, the radiator 131 of each antenna 130 may be disposed outside the support member 110, or a portion of the radiators 131 of multiple antennas 130 may be disposed outside the support member 110, and another portion may be disposed inside the support member 110.

[0098] In some possible implementations, at least one radiator 131 of an antenna 130 is attached to the inner surface of a carrier 110. For example, there are multiple antennas 130, and the radiator 131 of each antenna 130 is attached to the inner surface of the carrier 110.

[0099] In this way, the radiator 131 and the carrier 110 can be integrated into a single structure through processes such as laser-direct-structuring (LDS), and a variety of structures of the radiator 131 can be formed on the inner surface of the carrier 110.

[0100] Of course, in addition to direct contact with the inner surface of the carrier 110, in some embodiments, the radiator 131 of at least one antenna 130 may also indirectly contact the inner surface of the carrier 110. In this case, the electronic device 100 may also include a connector, and the radiator 131 may be fixedly connected to the inner surface of the carrier 110 through the connector.

[0101] The connector can be a double-sided tape or glue, or other components that can fix the radiator 131 to the carrier 110.

[0102] When the radiators 131 of the multiple antennas 130 are located inside the carrier 110, the radiators 131 of each antenna 130 can directly or indirectly contact the inner surface of the carrier 110, or a portion of the radiators 131 of the multiple antennas 130 can directly contact the inner surface of the carrier 110 and another portion can indirectly contact the inner surface of the carrier 110.

[0103] It should be noted that when at least one radiator 131 of the antenna 130 is disposed outside the carrier 110, the radiator 131 may also be in direct or indirect contact with the outer surface of the carrier 110.

[0104] In some possible implementations, such as Figure 11 As shown, the feeding structure 132 of at least one antenna 130 is printed on the circuit board 120. In this way, the feeding structure 132 can be fabricated during the fabrication of the circuit board 120, which can improve the manufacturing efficiency of the electronic device 100.

[0105] It is understandable that when the power supply structure 132 is printed on the circuit board 120, the power supply structure 132 is a metal layer disposed on the surface of the circuit board 120.

[0106] Figure 12 This is a schematic diagram of a first structure for the cooperation of another power supply structure 132 provided in an embodiment of this application with a circuit board 120 and a radiator 131.

[0107] See also some possible implementations. Figure 12 At least one antenna 130 has a feeding structure 132 including a feeding metal element, a portion of which is disposed on and electrically connected to the circuit board 120, and another portion of which has a gap with the radiator 131 and a capacitor is formed at the gap.

[0108] In this way, the area where the circuit board 120 mates with the feeding metal component is small, enabling a small-volume design for the circuit board 120. Furthermore, the shape of the feeding metal component can be bent or folded according to the internal space of the electronic device 100, allowing for a more compact antenna 130 layout, which is beneficial for miniaturizing the electronic device 100.

[0109] When the power supply structure 132 includes a power supply metal element, in some embodiments, such as Figure 12 As shown, the power supply structure 132 can be constructed from a power supply metal component. Alternatively, in some embodiments, the power supply structure 132 includes a power supply metal component and a power supply layer printed on the circuit board 120. The power supply layer electrically connects the power supply metal component and the circuit board 120. Therefore, the power supply structure 132 can be constructed from a power supply metal component and other structures (e.g., a power supply layer).

[0110] Figure 13 for Figure 12 The diagram shows a second structure in which the power supply structure 132 cooperates with the circuit board 120 and the radiator 131.

[0111] The specific structure of the power supply metal component is not limited here. For example, such as... Figure 12 As shown, the power supply metal component includes a connecting portion 1321 and a suspended portion 1322. The connecting portion 1321 is electrically connected to the circuit board 120 (e.g., ...). Figure 12 As shown). Figure 13 As shown, the suspended portion 1322 and the radiator 131 are spaced apart, so that there is a gap between the suspended portion 1322 and the radiator 131. Thus, a capacitor is formed at the gap between the suspended portion 1322 and the radiator 131, and the suspended portion 1322 and the radiator 131 can be coupled by the capacitor.

[0112] It is understandable that the suspended part 1322 is suspended relative to the circuit board 120, and the suspended part 1322 is not provided on the circuit board 120.

[0113] In some embodiments, such as Figure 12 As shown, the connecting portion 1321 and the suspended portion 1322 form an L-shaped plate structure. Of course, the connecting portion 1321 and the suspended portion 1322 can also form other structures of the power supply metal component, for example, the power supply metal component can also be a U-shaped plate structure.

[0114] When there are multiple power supply metal components, the structures of each power supply metal component can be the same or different. Alternatively, some of the multiple power supply metal components can have the same structure, while others can have different structures.

[0115] In some embodiments, the connecting portion 1321 may be fixedly connected to the circuit board 120 by soldering and electrically connected to the circuit board 120. Of course, the connecting portion 1321 may also be fixedly connected to the circuit board 120 in other ways, for example, the connecting portion 1321 may also be fixedly connected to the circuit board 120 by snap-fit.

[0116] It should be noted that when there are multiple antennas 130, the feeding structure 132 of each antenna 130 can be printed on the circuit board 120 (e.g., Figure 8 (as shown), or, the feeding structure 132 of each antenna 130 includes a feeding metal element, or, as shown Figure 13 As shown, a portion of the feed structure 132 of the multiple antennas 130 can be printed on the circuit board 120, while another portion of the feed structure 132 may include a feed metal component. Wherein, Figure 14 This is a schematic diagram showing the interaction between multiple antennas 130 and circuit board 120.

[0117] Figure 15 This is a three-dimensional structural diagram of another electronic device 100 provided in an embodiment of this application.

[0118] In some possible implementations, at least one extension 111 extending into the interior of the support member 110 is provided on at least one inner wall of the support member 110, for example... Figure 15 As shown, an extension 111 is provided on the inner side of the top wall 112 of the support member 110. Of course, in addition to the extension 111 being provided on the inner side of the top wall 112 of the support member 110, extensions 111 can also be provided on the inner side of the side wall 113 and / or the inner side of the bottom wall 114 of the support member 110. At least one extension 111 is provided with at least a portion of the radiator 131 of at least one antenna 130. For example, four extensions 111 are provided on the inner side of the top wall 112 of the support member 110, two of the four extensions 111 are provided with the radiator 131, and the other two extensions 111 are not provided with the radiator 131. Of course, the number of extensions 111 provided with the radiator 131 can be more or less than two.

[0119] In this way, by rationally designing the structure of the extension 111, a 3D trace surface can be provided, so that the radiator 131 has a 3D structure, which allows for greater design freedom of the antenna 130 and helps to further improve antenna performance.

[0120] Figure 16 for Figure 15 A schematic diagram showing the top wall 112 engaging with the circuit board 120 and the antenna 130.

[0121] In some embodiments, see Figure 16 At least one radiator 131 can be entirely disposed in the extension 111. In this way, by rationally designing the structure of the extension 111, the extension 111 can provide a 3D trace surface, which allows for greater design freedom of the antenna 130 and helps to further improve antenna performance.

[0122] Of course, in addition to all of the radiators being disposed on the extension 111, in some embodiments, a portion of the radiators 131 may be disposed on the surface of the extension 111 and another portion may be disposed on the inner wall of the support member 110. In this way, the extension 111 and the inner wall of the support member 110 together provide a 3D trace surface, which allows for greater design freedom of the antenna 130 and helps to further improve antenna performance.

[0123] When a plurality of extensions 111 are provided on one inner wall of the support member 110, each extension 111 may be provided with a radiator 131, or a portion of the plurality of extensions 111 may be provided with a radiator 131 while another portion may not be provided with a radiator 131. In addition, for a single extension 111, one or more radiators 131 may be provided on the extension 111.

[0124] In some embodiments, the extension 111 can be in direct contact with the radiator 131, for example... Figure 16 As shown. Alternatively, in some embodiments, the extension 111 may also indirectly contact the radiator 131.

[0125] The structure of the radiator 131 disposed on the extension 111 is not limited here. For example, the radiator 131 disposed on the extension 111 can be a U-shaped structure.

[0126] In addition to supporting the radiator 131, in some embodiments, the extension 111 can also be used to fix the circuit board 120. For example, the circuit board 120 is snapped into the extension 111, which can reduce the number of parts in the electronic device 100 and help simplify the structure of the electronic device 100.

[0127] In some possible implementations, such as Figure 9 As shown, the carrier 110 is the outer casing, which is the external appearance of the electronic device 100 as seen by the user in its complete state. The circuit board 120 is located inside the outer casing. The complete state can be understood as the state after all the components of the electronic device 100 have been assembled.

[0128] See Figure 10 As shown, the radiator 131 is mounted on the housing and can form a housing antenna (housing-mounted antenna) with the housing. The housing is large, providing a larger surface area for the radiator 131 to trace. This allows for greater design freedom for the antenna 130, enabling a larger radiator trace area, increasing the antenna's radiating aperture, and improving antenna performance. Furthermore, compared to existing wall-mounted antennas 130 and bracket antennas 130, the housing antenna offers a larger radiator trace area, making antenna design more flexible. This allows for more antennas 130 to be placed within a limited overall size, facilitating the miniaturization of the electronic device 100.

[0129] Furthermore, by using the outer shell as the carrier for the radiator 131, the existing plastic bracket, first circuit board, and other structures that carry the radiator 131 can be eliminated, reducing the number of parts in the electronic device 100, simplifying the structure of the electronic device 100, simplifying the assembly of the whole device, reducing the cost of the electronic device 100, and contributing to the miniaturization of the electronic device 100.

[0130] Of course, in addition to being a housing, in some embodiments the carrier 110 may not be a housing. In this case, the electronic device 100 may include the carrier 110 and the housing. The carrier 110 may be located near the housing or in other locations.

[0131] In some possible implementations, the part where the housing connects to the radiator 131 is a non-metallic part, for example, the material of the part where the housing connects to the radiator 131 is plastic, which can reduce the impact of the housing on the radiator and improve antenna performance.

[0132] In some embodiments, the housing is a non-metallic housing, for example, a plastic housing, which can improve antenna performance.

[0133] Of course, in addition to being a non-metallic part, in some embodiments the outer casing includes a first part and a second part, the first part being a metallic part and the second part being a non-metallic part, and the second part being connected to the radiator 131.

[0134] In some possible implementations, the outer shell is a plate-shaped shell (e.g. Figure 8 In the middle 110), at this time, electronic device 100 is a plate-shaped product.

[0135] When the electronic device 100 is a plate-shaped product, the feeding structure 132 of each antenna 130 can be disposed on one side of the circuit board 120 along the thickness direction of the circuit board 120, or the feeding structure 132 of multiple antennas 130 can be disposed on opposite sides of the circuit board 120 along the thickness direction of the circuit board 120 respectively.

[0136] In some embodiments, when the electronic device 100 is a plate-shaped product, the radiators 131 of each antenna 130 can be arranged on one side of the circuit board 120 in the thickness direction of the circuit board 120 to achieve a single-sided layout, which helps to miniaturize the electronic device 100.

[0137] Figure 17 For having Figure 14 The diagram shows the structure of another electronic device 100 with antenna 130 and circuit board 120. Figure 18 for Figure 17 An exploded view of the electronic device 100 shown.

[0138] In some possible implementations, such as Figure 17 , Figure 18 As shown, the outer casing can be a cylindrical shell, in which case the electronic device 100 is a cylindrical product.

[0139] When the electronic device 100 is a cylindrical product, the feeding structure 132 of each antenna 130 can be disposed on one side of the circuit board 120 along the thickness direction of the circuit board 120, or the feeding structure 132 of multiple antennas 130 can be disposed on opposite sides of the circuit board 120 along the thickness direction of the circuit board 120 respectively.

[0140] In some embodiments, when the electronic device 100 is a cylindrical product, the circuit board 120 is provided with radiators 131 on both sides of the thickness direction of the circuit board 120 to achieve a dual-sided layout, which allows for the arrangement of a larger number of antennas 130.

[0141] In the description of the embodiments of this application, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, an indirect connection through an intermediate medium, or the internal connection of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in the embodiments of this application according to the specific circumstances. The terms "first," "second," "third," "fourth," etc. (if present) are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence.

[0142] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the embodiments of this application, and are not intended to limit them. Although the embodiments of this application have been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. An electronic device (100), characterized in that, include: At least one antenna (130), the at least one antenna (130) includes a radiator (131) and a feed structure (132), the radiator (131) and the feed structure (132) having a gap, the radiator (131) and the feed structure (132) forming a capacitor at the gap; A support member (110), wherein the radiator (131) is disposed on the support member (110); The circuit board (120) is not directly connected to the radiator (131), and the power supply structure (132) is electrically connected to the circuit board (120).

2. The electronic device (100) according to claim 1, characterized in that, At least one of the radiators (131) of the antenna (130) is located inside the carrier (110).

3. The electronic device (100) according to claim 2, characterized in that, At least one of the radiators (131) of the antenna (130) is attached to the inner surface of the carrier (110).

4. The electronic device (100) according to claim 2, characterized in that, At least one extension (111) extending into the interior of the carrier (110) is provided on at least one inner wall of the carrier (110), and at least a portion of the radiator (131) of at least one antenna (130) is provided on at least one of the extensions (111).

5. The electronic device (100) according to claim 1, characterized in that, The feeding structure (132) of at least one of the antennas (130) is printed on the circuit board (120).

6. The electronic device (100) according to claim 1, characterized in that, The feeding structure (132) of at least one of the antennas (130) includes a feeding metal element.

7. The electronic device (100) according to any one of claims 1-6, characterized in that, The capacitor is at the zero current position when the antenna (130) resonates for the second time.

8. The electronic device (100) according to claim 7, characterized in that, The capacitor is located at approximately 1 / 3 of the total length from the power input terminal of the power supply structure (132) to the end of the radiator (131); wherein the power input terminal is electrically connected to the circuit board (120).

9. The electronic device (100) according to any one of claims 1-6, characterized in that, The carrier (110) is a housing, which is the appearance of the electronic device (100) as seen by the user when the device is in its complete state, and the circuit board (120) is located inside the housing.

10. The electronic device (100) according to claim 9, characterized in that, The portion of the outer shell that connects to the radiator (131) is a non-metallic part.

11. The electronic device (100) according to claim 10, characterized in that, The outer shell is a non-metallic shell.

12. The electronic device (100) according to claim 9, characterized in that, The outer shell is a plate-shaped shell or a cylindrical shell.

13. The electronic device (100) according to any one of claims 1-6, characterized in that, The number of antennas (130) is multiple, and at least two of the antennas (130) operate in different frequency bands.

14. The electronic device (100) according to any one of claims 1-6, characterized in that, The electronic device (100) is a client terminal device.

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