A high-efficiency glue brushing and pasting system

Abstract

The utility model discloses a kind of high-efficiency glue brushing and mounting systems, it is related to electronic manufacturing technology field, including glue brushing mechanism, track positioning mechanism and mounting mechanism, the track positioning mechanism is located between glue brushing mechanism and mounting mechanism, the track positioning mechanism includes Z direction bonding track, Y direction positioning track and X direction positioning track, the mounting mechanism includes multiple mounting heads, multiple mounting heads are annular distribution and can rotate around central axis. The research and development design of this system can greatly improve the working efficiency of chip packaging or electronic components, save time cost, improve single machine capacity, save machine cost, provide a more efficient, more stable, more compatible choice for semiconductor back-end packaging and component mounting process, while relative demand capacity, can save less machine cost, make effective saving protection means for earth environment cause.

Description

Technical Field

[0001] This utility model relates to the field of electronic manufacturing technology, specifically to a high-efficiency adhesive application system. Background Technology

[0002] In the semiconductor and electronics industries, chip packaging and component mounting are crucial processes. Adhesive application and mounting systems are advanced systems that integrate adhesive application and mounting functions. Primarily used in chip packaging and component mounting within the semiconductor and electronics industries, the core function of this system is to apply a layer of specific adhesive evenly to designated locations on the substrate or chip frame using a precisely controlled adhesive application device before mounting the chips and electronic components onto the substrate or chip frame. This adhesive provides strong adhesion, ensuring the chips and electronic components are firmly attached to the substrate or chip frame. Meanwhile, the pick-and-place machine is mainly used to precisely mount the chips and electronic components onto the substrate or chip frame.

[0003] Most existing chip mounters use dispensing for chip frame application, typically with a single or double head for dispensing or spot welding, performing dispensing and mounting steps one by one. This workflow consumes most of the time, requiring extensive positioning and complex design. Furthermore, the placement process mainly uses single-head linear placement and single-head rotary placement, which are inefficient and cannot meet the high-efficiency requirements of brushing.

[0004] Therefore, it is necessary to invent a highly efficient adhesive application system to solve the above problems. Utility Model Content

[0005] The purpose of this invention is to provide a high-efficiency adhesive application system that solves the problem of having to apply adhesive and place each piece individually, which consumes most of the working time and requires long positioning and complex design.

[0006] To achieve the above objectives, this utility model provides the following technical solution: a high-efficiency adhesive application and mounting system, comprising an adhesive application mechanism, a track positioning mechanism, and a mounting mechanism. The track positioning mechanism is located between the adhesive application mechanism and the mounting mechanism. The adhesive application mechanism includes an adhesive application track, an adhesive application head, a stencil frame, and a stencil track. The adhesive application head achieves X-axis and Z-axis movement through an X-axis drive component and a Z-axis drive component. The stencil frame is located below the adhesive application head, and the stencil track is located below the stencil frame. The track positioning mechanism includes a Z-axis bonding track, a Y-axis positioning track, and an X-axis positioning track. The track positioning mechanism also includes a cylinder for pushing a negative pressure plate and a negative pressure plate for fixing a chip frame or substrate. The mounting mechanism includes multiple mounting heads arranged in a ring and capable of rotating around a central axis.

[0007] Furthermore, a slide table is provided on the glue application track, and the glue application head is mounted on the slide table via a Z-axis transmission assembly.

[0008] Furthermore, the adhesive application mechanism also includes a camera for auxiliary positioning and a vacuum positioning suction cup for positioning the chip frame or substrate.

[0009] Furthermore, the camera is positioned on both sides of the glue brush head.

[0010] Furthermore, the vacuum positioning suction cup is positioned below the mesh frame, and the upper surface of the vacuum positioning suction cup maintains a vertical distance from the lower surface of the mesh frame.

[0011] Furthermore, the negative pressure plate is tightly attached to the bottom of the chip frame or substrate after the glue application mechanism has completed the glue application operation, and cylinders are provided on the left and right sides of the bottom of the negative pressure plate.

[0012] Furthermore, the cylinder body is fixed to the outer support of the Z-axis conforming track, and the piston rod of the cylinder is connected to the bottom surface of the negative pressure plate.

[0013] Furthermore, the top of the negative pressure plate is provided with several air intake holes that are connected to an external negative pressure system.

[0014] The technical effects and advantages provided by this utility model in the above technical solution are as follows:

[0015] 1. In this utility model, the glue application mechanism achieves precise glue application to the chip frame or substrate by using the precise movement of the glue application head in the X and Z directions, combined with the stencil frame and stencil track. The track positioning mechanism uses the Z, Y and X direction positioning tracks, as well as the cylinder to push the negative pressure plate to tightly fit the bottom of the glued chip frame or substrate for precise positioning and fixation. The multiple rotatable mounting heads of the mounting mechanism then mount the positioned chips. The coordinated work of each mechanism achieves efficient and precise connection between glue application, positioning and mounting, effectively improving the efficiency and quality of the entire glue application and mounting system.

[0016] 2. In this utility model, the negative pressure plate in the track positioning mechanism is connected to an external negative pressure system. It uses the negative pressure generated by the suction hole to tightly adsorb the chip frame or substrate, and the cylinder provides a stable driving force to ensure that the negative pressure plate is tightly attached to the chip frame or substrate. This adsorption fixation can be adapted to most chip frames or substrates, has strong locking ability, and can achieve three-way omnidirectional movement. At the same time, compared with other chip packaging or component mounting processes, it converts the positioning action of the chip or component in the X and Y directions to the guide rail, so that the positioning action can be performed simultaneously, saving mounting time and improving mounting efficiency. In addition, the X and Y directions adopt full closed-loop control, which greatly improves the mounting accuracy of the system.

[0017] 3. In this utility model, multiple placement heads can perform a small rotation after placing one product to place (adsorb) the next product. It can also adsorb the next product while placing one product. In contrast, single-head linear or rotary placement head structures on the market require a certain amount of time to return and pick up the second product after placing one product. This structure makes full use of this time, which greatly improves the operating efficiency of the equipment and saves positioning time during placement.

[0018] In summary, the research and development of this system can greatly improve the working efficiency of chip packaging or electronic components, save time costs, increase single-machine capacity, and reduce machine costs. It provides a more efficient, stable, and compatible option for semiconductor back-end packaging and component mounting processes. At the same time, it can save less machine costs relative to the required capacity, thus making an effective means of saving and protecting the Earth's environment. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0020] Figure 2 This is a top view of the overall structure of this utility model;

[0021] Figure 3 This is a schematic diagram of the overall front structure of this utility model;

[0022] Figure 4 This is a three-dimensional structural diagram of the glue application mechanism of this utility model.

[0023] Figure 5 This is a three-dimensional structural diagram of the camera and vacuum positioning suction cup of this utility model;

[0024] Figure 6 This is a three-dimensional structural diagram of the track positioning mechanism of this utility model;

[0025] Figure 7 This is a three-dimensional structural diagram of the cylinder and negative pressure plate of this utility model;

[0026] Figure 8 This is a front view schematic diagram of the track positioning mechanism of this utility model;

[0027] Figure 9 This is a schematic diagram of the track positioning mechanism of this utility model from the left side.

[0028] Explanation of reference numerals in the attached figures:

[0029] 1. Glue application mechanism; 101. Glue application track; 102. Glue application head; 103. Screen frame; 104. Screen track; 11. Camera; 12. Vacuum positioning suction cup; 2. Track positioning mechanism; 201. Z-axis bonding track; 202. Y-axis positioning track; 203. X-axis positioning track; 21. Cylinder; 22. Negative pressure plate; 3. Mounting mechanism. Detailed Implementation

[0030] To enable those skilled in the art to better understand the technical solution of this utility model, the present utility model will be further described in detail below with reference to the accompanying drawings.

[0031] This utility model provides, for example Figure 1-9 The high-efficiency adhesive application and mounting system shown includes an adhesive application mechanism 1, a track positioning mechanism 2, and a mounting mechanism 3. The track positioning mechanism 2 is located between the adhesive application mechanism 1 and the mounting mechanism 3. The adhesive application mechanism 1 includes an adhesive application track 101, an adhesive application head 102, a stencil frame 103, and a stencil track 104. The adhesive application head 102 achieves X-axis and Z-axis movement through an X-axis drive component and a Z-axis drive component. The stencil frame 103 is located below the adhesive application head 102, and the stencil track 104 is located below the stencil frame 103. The track positioning mechanism 2 includes a Z-axis bonding track 201, a Y-axis positioning track 202, and an X-axis positioning track 203. The track positioning mechanism 2 also includes a cylinder 21 for pushing a negative pressure plate 22 and a negative pressure plate 22 for fixing a chip frame or substrate. The mounting mechanism 3 includes multiple mounting heads that are arranged in a ring and can rotate around a central axis.

[0032] In this embodiment, the adhesive brush head 102, through precise X- and Z-axis movements, can flexibly adjust the adhesive application position and thickness according to the shape and size of the chip frame or substrate. For example, during the adhesive application process, the adhesive brush head 102 can first move in the X-axis to apply adhesive to one edge of the chip frame or substrate, and then adjust the height of the adhesive brush head 102 through Z-axis movement to apply adhesive to the next edge, thereby achieving a uniform and accurate adhesive application effect. Moreover, the Z-, Y-, and X-axis tracks cooperate with each other to achieve three-dimensional positioning and adjustment of the chip frame or substrate. After the adhesive application is completed, the chip frame or substrate is precisely moved to the mounting position by the track positioning mechanism 2, ensuring that the mounting mechanism 3 can accurately mount the chip onto the chip frame or substrate. At the same time, different stencil templates can be used to quickly adapt to the corresponding chip frame, greatly saving program costs and time costs. It can achieve one-time adhesive application to cover the entire frame, achieving high efficiency, high precision, short process, and low cost.

[0033] A slide table is provided on the glue application track 101, and the glue application head 102 is mounted on the slide table through a Z-axis transmission assembly. The glue application mechanism 1 also includes a camera 11 for auxiliary positioning and a vacuum positioning suction cup 12 for positioning the chip frame or substrate. The camera 11 is located on both sides of the glue application head 102, and the vacuum positioning suction cup 12 is located below the stencil frame 103, and the upper surface of the vacuum positioning suction cup 12 maintains a vertical distance from the lower surface of the stencil frame 103.

[0034] In this embodiment, the glue-applying head 102 can precisely adjust the glue-applying position in three-dimensional space through the movement of the slide table on the glue-applying track 101 and the lifting and lowering movement of the Z-axis transmission component. Combined with the camera 11, it can acquire the position information of the chip frame or substrate in real time, and perform precise analysis and positioning through the image processing system. It can promptly detect the position deviation of the chip frame or substrate and feed it back to the control system for adjustment, which can ensure that the glue-applying head 102 accurately reaches the glue-applying position of the chip frame or substrate, achieving a uniform and accurate glue-applying effect and improving the glue-applying quality. In addition, the vacuum positioning suction cup 12 firmly adsorbs the chip frame or substrate onto the suction cup by generating negative pressure, preventing the chip frame or substrate from moving or shaking during the glue-applying process. This provides stable support for the glue-applying operation, ensures the smooth progress of the glue-applying process, and improves the glue-applying quality and product qualification rate.

[0035] The negative pressure plate 22 is tightly attached to the bottom of the chip frame or substrate after the glue application mechanism 1 has completed the glue application operation. Cylinders 21 are provided on the left and right sides of the bottom of the negative pressure plate 22. The cylinder body of the cylinder 21 is fixed to the outer support of the Z-direction fitting track 201, and the piston rod of the cylinder 21 is connected to the bottom surface of the negative pressure plate 22. Several suction holes are opened on the top of the negative pressure plate 22 and connected to the external negative pressure system.

[0036] In this embodiment, after the adhesive application is completed on the chip frame or substrate, the cylinder 21 pushes the negative pressure plate 22 upward, so that it fits tightly against the bottom of the chip frame or substrate. At the same time, the external negative pressure system is activated, and the air between the negative pressure plate 22 and the chip frame or substrate is extracted through the suction hole to form a negative pressure environment, which firmly adsorbs the chip frame or substrate onto the negative pressure plate 22. This fixing method can effectively prevent the chip frame or substrate from shifting during subsequent mounting operations, ensuring the accuracy and quality of mounting.

[0037] Working principle of this utility model:

[0038] Refer to the instruction manual appendix Figure 1-9When using this utility model, firstly, the chip frame or substrate is output to the stencil track 104. The vacuum positioning chuck 12 under the stencil track 104 will pick up the chip frame or substrate and accurately position it below the stencil frame 103 with the assistance of the camera 11. Then, the silver paste or solder paste is immersed in the stencil frame 103. At this time, the glue brush head 102 realizes the X-axis pushing motion of the silver paste in the stencil frame 103 through the X-axis movement of the glue brush track 101 and its own Z-axis movement. Then, the silver paste is squeezed out of the stencil and applied into the chip frame or substrate. After the above operation is completed, the chip frame or substrate will be output to the next process.

[0039] Then, after the chip frame or substrate is coated with silver paste or solder paste by the glue application mechanism 1, it is output to the track positioning mechanism 2. At this time, facing the chip frame or substrate that has been sent in, the Z-axis bonding track 201 will use the cylinders 21 on both sides to push the negative pressure plate 22 into the bottom of the chip frame or substrate. At this time, the negative pressure plate 22 will hold the chip frame or substrate to fix it. The bonding position of the chip or electronic component on the X-axis and Y-axis is adjusted by the Y-axis positioning track 202 and the X-axis positioning track 203.

[0040] Finally, using the multiple placement heads shown in the figure in the placement mechanism 3, the placement head is rotated in the direction of the arrow in the figure. The placement head can be rotated slightly to achieve the placement and adsorption of the next piece of material. This allows the placement head to complete the placement of one product while simultaneously preparing to adsorb the next product, which greatly improves the efficiency and continuity of the placement operation.

[0041] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0042] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A high-efficiency adhesive application and mounting system, comprising an adhesive application mechanism (1), a track positioning mechanism (2), and a mounting mechanism (3), characterized in that: The track positioning mechanism (2) is located between the glue application mechanism (1) and the mounting mechanism (3). The glue application mechanism (1) includes a glue application track (101), a glue application head (102), a stencil frame (103), and a stencil track (104). The glue application head (102) achieves X-axis and Z-axis movement through an X-axis drive component and a Z-axis drive component. The stencil frame (103) is located below the glue application head (102), and the stencil track (104) is located below the stencil frame (103). The track positioning mechanism (2) includes a Z-axis bonding track (201), a Y-axis positioning track (202), and an X-axis positioning track (203). The track positioning mechanism (2) also includes a cylinder (21) for pushing a negative pressure plate (22) and a negative pressure plate (22) for fixing a chip frame or substrate. The mounting mechanism (3) includes multiple mounting heads, which are arranged in a ring and can rotate around a central axis.

2. The high-efficiency adhesive application system according to claim 1, characterized in that: A slide table is provided on the glue application track (101), and the glue application head (102) is mounted on the slide table through a Z-axis transmission assembly.

3. The high-efficiency adhesive application system according to claim 1, characterized in that: The adhesive application mechanism (1) also includes a camera (11) for auxiliary positioning and a vacuum positioning suction cup (12) for positioning the chip frame or substrate.

4. The high-efficiency adhesive application system according to claim 3, characterized in that: The camera (11) is positioned on both sides of the brush head (102).

5. The high-efficiency adhesive application system according to claim 3, characterized in that: The vacuum positioning suction cup (12) is located below the mesh frame (103), and the upper surface of the vacuum positioning suction cup (12) and the lower surface of the mesh frame (103) maintain a vertical distance.

6. The high-efficiency adhesive application system according to claim 1, characterized in that: The negative pressure plate (22) is closely attached to the bottom of the chip frame or substrate after the glue application mechanism (1) has completed the glue application operation. Cylinders (21) are provided on the left and right sides of the bottom of the negative pressure plate (22).

7. The high-efficiency adhesive application system according to claim 6, characterized in that: The cylinder body of the cylinder (21) is fixed to the outer support of the Z-axis fitting track (201), and the piston rod of the cylinder (21) is connected to the bottom surface of the negative pressure plate (22).

8. The high-efficiency adhesive application system according to claim 1, characterized in that: The negative pressure plate (22) has several air intake holes on its top and is connected to the external negative pressure system.

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