Chip flip LED support structure

Abstract

This utility model provides a flip-chip LED bracket structure, comprising a molding compound, pads, a light-emitting chip, and solder paste. A reflector is located in the center of the molding compound. The pads are fixed to the bottom of the molding compound and include an integrally formed connecting portion and a soldering portion. The outer end of the connecting portion protrudes from the molding compound, and one end of the soldering portion is fixed to the inner end of the connecting portion, while the other end extends along the length of the molding compound. Two sets of pads are provided, symmetrically arranged centrally. The two sets of soldering portions correspond to the lower part of the reflector. A barrier band is formed between the two sets of soldering portions in the molding compound. The two sets of electrodes of the light-emitting chip face downwards and correspond to the upper parts of the two sets of soldering portions, respectively. The two sets of electrodes are soldered to the two sets of soldering portions using solder paste. Its advantages are: eliminating the gold wire bonding process, breaking through production capacity bottlenecks; reducing the manufacturing cost of the LED bracket by eliminating the need for gold wire; and improving the product's strength by providing metal soldering portions on both the front and rear sides.

Description

Technical Field

[0001] This utility model relates to the field of LED bracket structures, and in particular to an LED bracket structure with flip-chip design. Background Technology

[0002] Currently, most LED brackets use a front-mount chip solution, requiring gold wire bonding to electrically connect the positive and negative pads. This process introduces an additional wire bonding step. During this process, the bottleneck in packaging plant capacity is concentrated at the wire bonding station, where efficiency significantly restricts overall production progress. From a cost perspective, the high price of gold materials and their continuous upward trend exacerbate material cost pressures. To address this issue, some manufacturers have attempted to use flip-chip technology, achieving electrical connection by adjusting the position of the insulating strip to the center. However, this technological adjustment brings new challenges, resulting in varying degrees of decrease in product mechanical strength. Therefore, it is necessary to develop a flip-chip LED bracket structure to solve the aforementioned problems. Utility Model Content

[0003] The purpose of this invention is to provide a flip-chip LED support structure to solve the problems mentioned in the background art.

[0004] To achieve the above objectives, this utility model provides the following technical solution:

[0005] A flip-chip LED support structure includes a molding compound, pads, a light-emitting chip, and solder paste. A reflector is provided in the middle of the molding compound. The pads are fixed to the bottom of the molding compound. Each pad includes an integrally formed connecting part and a soldering part. The outer end of the connecting part protrudes from the molding compound. One end of the soldering part is fixed to the inner end of the connecting part, and the other end extends along the length of the molding compound. Two sets of pads are provided, and the two sets of pads are symmetrically arranged in the center. The two sets of soldering parts correspond to the lower part of the reflector. The molding compound between the two sets of soldering parts forms a barrier band. The two sets of electrodes of the light-emitting chip face downward and correspond to the upper part of the two sets of soldering parts, respectively. The two sets of electrodes are soldered to the two sets of soldering parts by solder paste.

[0006] Further description of the present invention: The molding body is also provided with a transverse boss, which is connected above the barrier strip and corresponds to the space between the two sets of solder paste.

[0007] Further description of this utility model: The bottom of the reflector cup is provided with a mounting hole, and both ends of the connecting part extend through the mounting hole.

[0008] Further description of the present invention: One end of the connecting part extends in the width direction of the encapsulated body and corresponds to the end of another set of welded parts.

[0009] The beneficial effects of this utility model are as follows: In this design, the soldering parts on the pads are arranged horizontally, and the barrier strip is arranged along the length direction. The electrodes on the front and rear sides of the light-emitting chip are respectively soldered to the two sets of soldering parts using solder paste. Its beneficial effects are: 1. The light-emitting chip has a flip-chip structure, eliminating the process of soldering gold wires and breaking through production capacity bottlenecks; 2. During the assembly of the light-emitting chip, no gold wire is needed, reducing the manufacturing cost of the LED bracket; 3. The barrier strip is arranged horizontally, and in the width direction, both the front and rear sides are supported by metal soldering parts, improving the product's strength. Attached Figure Description

[0010] Figure 1 This is a top view of an existing LED bracket structure;

[0011] Figure 2 This is a top view of the LED bracket structure of existing technology 2;

[0012] Figure 3 This is a top view of the structure of this utility model;

[0013] Figure 4 This is a bottom view of the structure of this utility model;

[0014] Figure 5 This is a left sectional view of the present invention;

[0015] Explanation of reference numerals in the attached figures:

[0016] 01. Molded body; 011. Reflector cup; 0111. Mounting hole; 012. Barrier strip; 013. Lateral boss;

[0017] 02. Pad; 021. Connector; 022. Soldering part; 03. Light-emitting chip; 04. Solder paste; 05. Gold wire. Detailed Implementation

[0018] The present invention will be further described below with reference to the accompanying drawings:

[0019] like Figure 1 As shown, this is an existing LED bracket structure that uses a positive chip mounting method (i.e., the electrodes of the light-emitting chip 03 face upwards). The barrier strip 012 is offset to one side, and the pads 02 are distributed on both sides of the barrier strip 012. The chip is fixed on the longer pad 02 and connected to the positive and negative pads 02 by gold wire 05. This method requires an additional wire bonding process, resulting in low production efficiency. Moreover, with the rise in gold prices, the use of gold wire 05 will lead to an increase in material costs.

[0020] like Figure 2As shown, this is the LED bracket structure of the prior art 2, which adopts the reverse chip mounting method (i.e., the electrodes of the light-emitting chip 03 face down). The barrier strip 012 is set along the width direction and is located in the middle of the encapsulation body 01. Since the length-to-width ratio of the encapsulation body 01 is large, stress is easily concentrated in the middle of the length direction. Setting the barrier strip 012 along the width direction at this position will cause the strength of the middle of the LED bracket to decrease significantly, and it is very easy to break at the barrier strip 012.

[0021] like Figures 3 to 5 As shown, a flip-chip LED support structure includes a molding compound 01, pads 02, a light-emitting chip 03, and solder paste 04. A reflector cup 011 is provided in the middle of the molding compound 01. The pads 02 are fixed to the bottom of the molding compound 01. The pads 02 include an integrally formed connecting part 021 and a soldering part 022. The outer end of the connecting part 021 protrudes outside the molding compound 01. One end of the soldering part 022 is fixed to the inner end of the connecting part 021, and the other end extends along the length of the molding compound 01. Two sets of pads 02 are provided, and the two sets of pads 02 are symmetrically arranged. The two sets of soldering parts 022 correspond to the lower part of the reflector cup 011. The molding compound 01 between the two sets of soldering parts 022 forms a barrier band 012. The two sets of electrodes of the light-emitting chip 03 face downward and correspond to the upper part of the two sets of soldering parts 022 respectively. The two sets of electrodes are soldered to the two sets of soldering parts 022 respectively by solder paste 04.

[0022] In this design, the soldering portions 022 on the pad 02 are arranged horizontally, and the barrier strip 012 is arranged along the length direction. The electrodes on the front and rear sides of the light-emitting chip 03 are soldered to the two sets of soldering portions 022 using solder paste 04. The advantages are: 1. The light-emitting chip 03 has a flip-chip structure, eliminating the need for soldering gold wire 05 and breaking through production capacity bottlenecks; 2. During the assembly of the light-emitting chip 03, gold wire 05 is not required, reducing the manufacturing cost of the LED bracket; 3. The barrier strip 012 is arranged horizontally, and in the width direction, both the front and rear sides are supported by metal soldering portions 022, increasing the product's strength.

[0023] The molding compound 01 is also provided with a lateral boss 013, which is connected above the barrier strip 012 and corresponds to the space between the two sets of solder paste 04. The lateral boss 013 is provided to prevent the solder paste 04 at the die bond point from flowing and causing a short circuit.

[0024] The bottom of the reflector cup 011 is provided with a mounting hole 0111, and both ends of the connecting part 021 extend through the mounting hole 0111. That is, the front and rear sides of the mounting hole 0111 are metal supports, which improves the strength of the LED bracket.

[0025] One end of the connecting portion 021 extends in the width direction of the molding compound 01 and corresponds to the end of another set of welding portions 022. That is, the solder pad 02 is L-shaped, which increases the area of ​​the connecting portion 021 of the solder pad 02 and improves the strength of the LED bracket end.

[0026] The above does not limit the technical scope of this utility model. Any modifications, equivalent changes and alterations made to the above embodiments based on the technical essence of this utility model shall still fall within the scope of the technical solution of this utility model.

Claims

1. A flip-chip LED support structure, characterized in that: The device includes a molding compound, pads, a light-emitting chip, and solder paste. A reflector cup is located in the center of the molding compound. The pads are fixed to the bottom of the molding compound and include an integrally formed connecting portion and a soldering portion. The outer end of the connecting portion protrudes outside the molding compound. One end of the soldering portion is fixed to the inner end of the connecting portion, and the other end extends along the length of the molding compound. Two sets of pads are provided, symmetrically arranged at the center. The two sets of soldering portions correspond to the area below the reflector cup. A barrier band is formed between the two sets of soldering portions in the molding compound. Two sets of electrodes of the light-emitting chip face downwards and correspond to the area above the two sets of soldering portions, respectively. The two sets of electrodes are soldered to the two sets of soldering portions using solder paste.

2. The LED support structure for flip-chip bonding according to claim 1, characterized in that: The molding compound is also provided with a lateral boss, which is connected above the barrier strip and corresponds to the space between the two sets of solder paste.

3. The LED support structure for chip flip-chip bonding according to claim 1, characterized in that: The bottom of the reflector cup is provided with a mounting hole, and both ends of the connector extend through the mounting hole.

4. The LED support structure for flip-chip bonding according to claim 1, characterized in that: One end of the connecting portion extends in the width direction of the encapsulated body and corresponds to the end of another set of welded portions.

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