Auxiliary packaging mechanism of MOSFET chip

Abstract

The utility model relates to chip packaging technical field, and disclose a kind of auxiliary packaging mechanism of MOSFET chip, including placing plate, the inside of placing plate is provided with clamping assembly, and the bottom surface of placing plate is fixedly connected with bottom plate.The auxiliary packaging mechanism of MOSFET chip, by the setting of adjusting assembly and down pressure hydraulic pole, when packaging, start rotating motor, rotating motor rotation drives bidirectional screw rod to rotate, and bidirectional screw rod rotation makes two groups of down pressure plate relative motion, when down pressure plate moves to the both ends of chip cover, start down pressure hydraulic pole, and down pressure hydraulic pole drives mounting frame to move, and mounting frame moves and drives down pressure plate to move, and down pressure plate is extruded to the both ends of chip, and it is packaged, so that the glue layer between chip cover and substrate is evenly stressed and fully filled gap, avoid the phenomenon that chip cover appears when packaging, ensure its structure stable, and good sealing.

Description

Technical Field

[0001] This utility model relates to the field of chip packaging technology, and in particular to an auxiliary packaging mechanism for MOSFET chips. Background Technology

[0002] In modern electronic systems, MOSFET chips, as key semiconductor devices, are widely used in various electronic products, from consumer electronics such as smartphones and laptops to automotive electronics, industrial control, and new energy fields. With the rapid development of technology, electronic devices are constantly evolving towards miniaturization, high performance, and low power consumption, which places extremely stringent requirements on the performance and packaging technology of MOSFET chips.

[0003] In existing devices, most of the packaging is done by squeezing from one side. During packaging, the chip cover may lift up, which affects its sealing and structural stability. Utility Model Content

[0004] (a) Technical problems to be solved

[0005] The purpose of this invention is to provide an auxiliary packaging mechanism for MOSFET chips, which solves the problem mentioned in the background art that most existing devices perform single-sided compression packaging, resulting in the chip cover lifting up during packaging, thus affecting its sealing and structural stability.

[0006] (II) Technical Solution

[0007] To achieve the above objectives, this utility model provides the following technical solution: an auxiliary packaging mechanism for a MOSFET chip, comprising a placement plate, a clamping assembly inside the placement plate, a base plate fixedly connected to the bottom surface of the placement plate, a support rod fixedly connected to one side of the top surface of the base plate, a downward hydraulic rod fixedly connected to one end of the support rod, a mounting frame fixedly connected to one end of the downward hydraulic rod, an adjustment assembly inside the mounting frame, the clamping assembly comprising a bidirectional lead screw disposed inside the placement plate, two sets of sliding blocks threadedly connected to the outer side of the bidirectional lead screw, a double-ended hydraulic rod fixedly connected to the top surface of each of the two sets of sliding blocks, clamping plates fixedly connected to both ends of each of the two sets of double-ended hydraulic rods, and a servo motor fixedly connected to one end of the bidirectional lead screw; the adjustment assembly comprising a bidirectional threaded rod disposed inside the mounting frame, two sets of downward pressure plates threadedly connected to the outer side of the bidirectional threaded rod, a guide block fixedly connected to one side of each of the two sets of downward pressure plates, and a rotation motor fixedly connected to one end of the bidirectional threaded rod.

[0008] As a further embodiment of this utility model, a first heat dissipation box is fixedly connected to one side of the mounting frame, and the rotating motor is disposed inside the first heat dissipation box. The first heat dissipation box serves to store the rotating motor.

[0009] As a further embodiment of this utility model, a second heat dissipation box is fixedly connected to one side of the placement plate, and the servo motor is set inside the second heat dissipation box. The second heat dissipation box serves to store the servo motor.

[0010] As a further embodiment of this utility model, a protective pad is fixedly connected to one side of each of the two sets of double-headed hydraulic rods, and a chip shell is placed on the surface of the placement plate. The protective pad serves to protect the chip shell.

[0011] As a further embodiment of this utility model, the surface of the placement plate is provided with three sets of placement grooves, one of which is fixedly connected to a limiting block. The limiting block serves to limit the movement of the double-headed hydraulic rod.

[0012] As a further embodiment of this utility model, four sets of support blocks are fixedly connected to the bottom surface of the base plate. The material of the four sets of support blocks is damping pads. The support blocks provide support for the device.

[0013] As a further embodiment of this utility model, two sets of guide rods are fixedly connected inside the other two sets of placement slots, and connecting blocks are slidably connected to the outer sides of the two sets of guide rods. The guide rods make the double-headed hydraulic rod more stable when moving.

[0014] (III) Beneficial Effects

[0015] This invention provides an auxiliary packaging mechanism for MOSFET chips, which has the following advantages:

[0016] 1. The auxiliary packaging mechanism of this MOSFET chip, through the adjustment of components and the setting of the pressure hydraulic rod, starts a rotating motor during packaging. The rotating motor drives the bidirectional threaded rod to rotate, causing the two sets of pressure plates to move relative to each other. When the pressure plates move to both ends of the chip cover, the pressure hydraulic rod is activated. The pressure hydraulic rod drives the mounting frame to move, and the movement of the mounting frame drives the pressure plates to move. The pressure plates squeeze both ends of the chip to encapsulate it, so that the adhesive layer between the chip cover and the substrate is evenly compressed and the gap is fully filled, preventing the chip cover from lifting during packaging and ensuring its structural stability and good sealing performance.

[0017] 2. The auxiliary packaging mechanism for this MOSFET chip, through the setting of the clamping component, places the chip shell on the placement plate, starts the servo motor, and the rotation of the servo motor drives the bidirectional lead screw to rotate. The rotation of the bidirectional lead screw causes the two sets of double-headed hydraulic rods to move relative to each other, and the double-headed hydraulic rods initially fix it. Start the double-headed hydraulic rods, and the double-headed hydraulic rods drive the clamping plate to move. The movement of the clamping plate further fixes the chip shell, so that the device can fix chip shells of different sizes, thereby meeting the different needs of different customers. Attached Figure Description

[0018] Fig. 1 This is a schematic diagram of the overall structure of this utility model;

[0019] Fig. 2 This is a schematic diagram of the base plate structure of this utility model;

[0020] Fig. 3 This is a schematic diagram of the adjustment component structure of this utility model;

[0021] Fig. 4 This is a schematic diagram of the clamping component structure of this utility model.

[0022] In the diagram: 1. Placement plate; 2. Clamping assembly; 201. Bidirectional lead screw; 202. Sliding block; 203. Double-ended hydraulic rod; 204. Clamping plate; 205. Servo motor; 3. Support rod; 4. Downward hydraulic rod; 5. Mounting frame; 6. Adjustment assembly; 601. Bidirectional threaded rod; 602. Downward pressure plate; 603. Guide block; 604. Rotation motor; 7. First heat dissipation housing; 8. Second heat dissipation housing; 9. Protective pad; 10. Chip shell; 11. Limiting block; 12. Base plate; 13. Support block; 14. Guide rod; 15. Connecting block. Detailed Implementation

[0023] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present utility model without creative effort are within the scope of protection of the present utility model.

[0024] Please see Figs. 1 to 4This utility model provides a technical solution: an auxiliary packaging mechanism for MOSFET chips, including a placement plate 1, with a clamping assembly 2 inside the placement plate 1. The clamping assembly 2 secures chip shells 10 of different sizes. A base plate 12 is fixedly connected to the bottom surface of the placement plate 1, and a support rod 3 is fixedly connected to one side of the top surface of the base plate 12. A downward hydraulic rod 4 is fixedly connected to the top surface of one end of the support rod 3, and a mounting frame 5 is fixedly connected to one end of the downward hydraulic rod 4. An adjustment assembly 6 is provided inside the mounting frame 5. By adjusting the assembly 6, the device can simultaneously package both ends of the chip, preventing it from tilting. Component 2 includes a bidirectional lead screw 201 disposed inside the placement plate 1. Two sets of sliding blocks 202 are threadedly connected to the outer side of the bidirectional lead screw 201. Double-headed hydraulic rods 203 are fixedly connected to the top surface of each set of sliding blocks 202. Clamping plates 204 are fixedly connected to both ends of each set of double-headed hydraulic rods 203. A servo motor 205 is fixedly connected to one end of the bidirectional lead screw 201. Adjustment component 6 includes a bidirectional threaded rod 601 disposed inside the mounting frame 5. Two sets of lower pressure plates 602 are threadedly connected to the outer side of the bidirectional threaded rod 601. Guide blocks 603 are fixedly connected to one side of each set of lower pressure plates 602. A rotary motor 604 is fixedly connected to one end of the bidirectional threaded rod 601.

[0025] The first heat dissipation box 7 is fixedly connected to one side of the mounting frame 5. The rotating motor 604 is set inside the first heat dissipation box 7. The first heat dissipation box 7 serves to store the rotating motor 604.

[0026] A second heat dissipation box 8 is fixedly connected to one side of the placement plate 1. The servo motor 205 is set inside the second heat dissipation box 8. The second heat dissipation box 8 serves to store the servo motor 205.

[0027] A protective pad 9 is fixedly connected to one side of each of the two sets of double-headed hydraulic rods 203. The chip shell 10 is placed on the surface of the placement plate 1. The protective pad 9 serves to protect the chip shell 10.

[0028] The surface of the placement plate 1 is provided with three sets of placement slots. One set of placement slots is fixedly connected to a limit block 11. The limit block 11 is used to limit the double-headed hydraulic rod 203.

[0029] Four sets of support blocks 13 are fixedly connected to the bottom surface of the base plate 12. The material of the four sets of support blocks 13 is damping pad. The support blocks 13 play a supporting role for the device.

[0030] The other two sets of placement slots are internally fixedly connected to two sets of guide rods 14, and the outer sides of the two sets of guide rods 14 are slidably connected to connecting blocks 15. The guide rods 14 are designed to make the double-headed hydraulic rod 203 more stable when moving.

[0031] In this invention, the working steps of the device are as follows:

[0032] First step: During encapsulation, the rotary motor 604 is started. The rotary motor 604 rotates, driving the bidirectional threaded rod 601 to rotate. The rotation of the bidirectional threaded rod 601 causes the two sets of lower pressure plates 602 to move relative to each other. When the lower pressure plates 602 move to both ends of the chip cover, the lower pressure hydraulic rod 4 is started. The lower pressure hydraulic rod 4 drives the mounting frame 5 to move. The movement of the mounting frame 5 drives the lower pressure plates 602 to move. The lower pressure plates 602 squeeze both ends of the chip to encapsulate it, so that the adhesive layer between the chip cover and the substrate is evenly compressed and the gap is fully filled, preventing the chip cover from lifting during encapsulation and ensuring its structural stability and good sealing performance.

[0033] The second step: In use, the chip casing 10 is placed on the placement plate 1, and the servo motor 205 is started. The servo motor 205 rotates, driving the bidirectional lead screw 201 to rotate. The rotation of the bidirectional lead screw 201 causes the two sets of double-headed hydraulic rods 203 to move relative to each other, initially fixing the chip casing 10. The double-headed hydraulic rods 203 are then started, driving the clamping plate 204 to move. The movement of the clamping plate 204 further fixes the chip casing 10, allowing the device to fix chip casings 10 of different sizes, thereby meeting the different needs of different customers. It should be noted that the device structure and accompanying drawings of this utility model mainly describe the principle of this utility model. In terms of the technical aspects of this design principle, the setting of the device's power mechanism, power supply system, and control system is not fully described. However, those skilled in the art, understanding the principle of the above utility model, can clearly understand the specifics of its power mechanism, power supply system, and control system. The control method in the application document is automatic control through a controller, and the control circuit of the controller can be implemented by those skilled in the art through simple programming.

[0034] All standard parts used can be purchased from the market, and can be customized according to the instructions and drawings. The specific connection methods of each part adopt conventional methods such as bolts, rivets, and welding that are mature in the existing technology. The machinery, parts and equipment adopt conventional models in the existing technology, and the structure and principle of the components known to those skilled in the art can be known by those skilled in the art through technical manuals or conventional experimental methods.

[0035] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. An auxiliary packaging mechanism for a MOSFET chip, comprising a placement plate (1), characterized in that: The placement plate (1) is provided with a clamping assembly (2) inside. A base plate (12) is fixedly connected to the bottom surface of the placement plate (1). A support rod (3) is fixedly connected to one side of the top surface of the base plate (12). A downward hydraulic rod (4) is fixedly connected to the top surface of one end of the support rod (3). A mounting frame (5) is fixedly connected to one end of the downward hydraulic rod (4). An adjustment assembly (6) is provided inside the mounting frame (5). The clamping assembly (2) includes a bidirectional lead screw (201) disposed inside the placement plate (1). Two sets of sliding blocks (202) are threadedly connected to the outer side of the bidirectional lead screw (201). A double-headed hydraulic rod (203) is fixedly connected to the top surface of each of the two sets of sliding blocks (202). A clamping plate (204) is fixedly connected to both ends of each of the two sets of double-headed hydraulic rods (203). A servo motor (205) is fixedly connected to one end of the bidirectional lead screw (201). The adjustment component (6) includes a bidirectional threaded rod (601) disposed inside the mounting frame (5). Two sets of lower pressure plates (602) are threadedly connected to the outer side of the bidirectional threaded rod (601). Guide blocks (603) are fixedly connected to one side of each of the two sets of lower pressure plates (602). A rotating motor (604) is fixedly connected to one end of the bidirectional threaded rod (601).

2. The auxiliary packaging mechanism for a MOSFET chip according to claim 1, characterized in that: The first heat sink box (7) is fixedly connected to one side of the mounting frame (5), and the rotating motor (604) is located inside the first heat sink box (7).

3. The auxiliary packaging mechanism for a MOSFET chip according to claim 1, characterized in that: A second heat dissipation box (8) is fixedly connected to one side of the placement plate (1), and the servo motor (205) is located inside the second heat dissipation box (8).

4. The auxiliary packaging mechanism for a MOSFET chip according to claim 1, characterized in that: A protective pad (9) is fixedly connected to one side of each of the two sets of double-headed hydraulic rods (203), and a chip shell (10) is placed on the surface of the placement plate (1).

5. The auxiliary packaging mechanism for a MOSFET chip according to claim 1, characterized in that: The surface of the placement plate (1) is provided with three sets of placement slots, one of which is fixedly connected to a limit block (11).

6. The auxiliary packaging mechanism for a MOSFET chip according to claim 1, characterized in that: The bottom surface of the base plate (12) is fixedly connected to four sets of support blocks (13), and the material of the four sets of support blocks (13) is damping pad.

7. The auxiliary packaging mechanism for a MOSFET chip according to claim 5, characterized in that: The other two sets of placement slots are fixedly connected to two sets of guide rods (14), and the outer sides of the two sets of guide rods (14) are slidably connected to connecting blocks (15).

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