A high efficiency power conversion device based on MOSFETs
By using silicon carbide heat sinks and fins, cooling fans, and dust filters in the MOSFET power conversion device, the problems of low heat dissipation efficiency and dust ingress are solved, achieving efficient heat dissipation and improved stability.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- FOSHAN HEXIN SEMICON CO LTD
- Filing Date
- 2025-06-18
- Publication Date
- 2026-06-23
AI Technical Summary
Traditional MOSFET power conversion devices have low heat dissipation efficiency, which cannot meet the heat dissipation requirements under high heat conditions, and dust can easily enter, affecting stability.
The heat sink and heat dissipation fins are made of silicon carbide material, combined with a heat dissipation fan and dust filter, and designed with serpentine heat dissipation holes and L-shaped ventilation cover to achieve efficient heat dissipation and dust prevention.
It improves the heat dissipation of MOSFET components, ensuring they operate at a suitable temperature, thereby enhancing the stability and reliability of the power converter, while preventing dust from entering and ensuring normal equipment operation.
Smart Images
Figure CN224401918U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of power conversion technology, and in particular to a high-efficiency power conversion device based on MOSFET. Background Technology
[0002] A power converter is an electronic device that can convert one type of current into another. In modern electronic devices, the efficiency and performance requirements for power converters are increasingly stringent. Traditional power converters suffer from numerous problems during the energy conversion process. For example, high losses in power components lead to low overall conversion efficiency, resulting in energy waste and increased operating costs. Furthermore, some power converters exhibit poor stability, failing to provide stable output voltage and current under varying load conditions, thus affecting the normal operation of connected electronic devices. MOSFETs (Metal-Oxide-Semiconductor Field-Effect Transistors) have been widely used in the power converter field due to their advantages such as fast switching speed and low on-resistance.
[0003] In related technologies, during the use of MOSFET-based power conversion devices, due to the large amount of heat generated by the MOSFET components during operation, heat sinks are usually installed on the power conversion device for heat transfer and heat dissipation. However, passive heat dissipation using heat sinks relies solely on natural convection between the heat sinks and the air, resulting in low heat dissipation efficiency and failing to meet the heat dissipation requirements of MOSFET components under high heat generation conditions. Although some devices have introduced active cooling fans, the heat dissipation path design is not reasonable enough, and the airflow fails to fully remove heat, resulting in unsatisfactory heat dissipation effects.
[0004] Therefore, we propose a high-efficiency power conversion device based on MOSFETs to solve the above problems. Utility Model Content
[0005] The purpose of this application is to provide a high-efficiency power conversion device based on MOSFETs, which can efficiently dissipate heat from the inside of the power converter body, effectively prevent dust from entering the interior, ensure that the MOSFET components operate at a suitable temperature, and improve the stability and reliability of the power converter.
[0006] The above-mentioned technical objective of this application is achieved through the following technical solution: a high-efficiency power conversion device based on MOSFET, comprising a power converter body, a cover plate fixedly installed on the top of the power converter body by screws, a MOSFET element fixedly installed inside the power converter body, terminals fixedly installed on both the left and right sides of the power converter body, two partitions fixedly installed inside the power converter body, the MOSFET element located between the two partitions, the tops of the two partitions being in contact with the bottom of the cover plate, a heat sink fixedly installed on the bottom of the cover plate, the bottom surface of the heat sink contacting the top surface of the MOSFET element, a serpentine heat dissipation hole opened on one side of the heat sink, and a cooling fan fixedly embedded on the left side wall of the power converter body.
[0007] A further feature of this application is that each of the two partitions has a slot with an open top on one side, and the heat sink slides through the corresponding slot on both sides.
[0008] A further feature of this application is that the inner wall of the slot and the outer wall of the heat sink are both smooth planar structures.
[0009] A further feature of this application is that the number of the serpentine heat dissipation holes is set to multiple, and the multiple serpentine heat dissipation holes are distributed in an array.
[0010] A further feature of this application is that a dustproof mesh is fixedly installed on the left side wall of the cooling fan, and an air outlet is opened on the right side wall of the power converter body, with a dustproof mesh fixedly installed inside the air outlet.
[0011] A further feature of this application is that a plurality of evenly distributed heat dissipation fins are fixedly installed on the top of the heat sink, and the tops of the plurality of heat dissipation fins all penetrate the cover plate.
[0012] A further feature of this application is that an L-shaped ventilation hood is fixedly installed on the top of the cover plate, one end of the L-shaped ventilation hood penetrates the cover plate and is located between the cooling fan and the partition on the left side, and the other end of the L-shaped ventilation hood is fixedly connected to the left side of a plurality of cooling fins.
[0013] A further feature of this application is that both the heat sink and the heat sink fins are made of silicon carbide material.
[0014] This application includes at least one of the following beneficial technical effects:
[0015] 1. This application utilizes a heat sink in direct contact with the MOSFET element. The heat generated by the MOSFET element is rapidly conducted to the heat sink, and some of the heat on the heat sink is transferred to the outside air through multiple heat dissipation fins, achieving a certain heat dissipation effect. By starting the cooling fan, cool outside air can be introduced into multiple serpentine heat dissipation holes. The airflow absorbs the heat on the heat sink, effectively reducing its temperature and achieving effective heat dissipation. Guided by the L-shaped ventilation shroud, some cool air can be directed to flow between the multiple heat dissipation fins, absorbing the heat on the fins and accelerating the heat transfer to the outside atmosphere, further improving the heat dissipation effect. This achieves a highly efficient heat dissipation effect, ensuring that the MOSFET element operates at a suitable temperature and improving the stability and reliability of the power converter.
[0016] 2. By utilizing the synergistic effect of two partitions, dustproof mesh one and dustproof mesh two, this application can effectively prevent dust from entering the MOSFET device while efficiently dissipating heat, thereby further improving the heat dissipation effect. Attached Figure Description
[0017] Figure 1 This is a front-view stereoscopic structural diagram of this embodiment.
[0018] Figure 2 This is a top-view three-dimensional structural diagram of this embodiment.
[0019] Figure 3 This is a front view sectional three-dimensional structural schematic diagram of this embodiment.
[0020] Figure 4 This is a three-dimensional structural diagram of the main body of the power converter.
[0021] Figure 5 This is a schematic diagram of the three-dimensional structure of the cover plate.
[0022] In the diagram, 1. Power converter body; 2. Cover plate; 3. MOSFET component; 4. Terminal block; 5. Partition plate; 6. Heat sink; 7. Slot; 8. Snake-shaped heat dissipation hole; 9. Cooling fan; 10. Dustproof mesh one; 11. Heat dissipation fins; 12. L-shaped ventilation cover; 13. Dustproof mesh two. Detailed Implementation
[0023] The technical solution of this application will be clearly and completely described below with reference to specific embodiments. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the scope of protection of this application.
[0024] See Figures 1-5This application provides a high-efficiency power conversion device based on MOSFETs, including a power converter body 1. A cover plate 2 is fixedly installed on the top of the power converter body 1 by screws. The design of fixing the cover plate 2 with screws facilitates installation and disassembly, and facilitates the maintenance and replacement of internal components. A MOSFET element 3 is fixedly installed inside the power converter body 1. Terminal blocks 4 are fixedly installed on both the left and right sides of the power converter body 1. Two partitions 5 are fixedly installed inside the power converter body 1, and the MOSFET element 3 is located between the two partitions 5. The tops of the two partitions 5 are attached to the bottom of the cover plate 2. The two cover plates 5 can enclose the MOSFET element 3 in a sealed space, ensuring heat dissipation while preventing external contamination. Dust enters, and a heat sink 6 is fixedly installed at the bottom of the cover plate 2. The bottom surface of the heat sink 6 contacts the top surface of the MOSFET element 3. The heat sink 6 can quickly conduct the heat generated by the MOSFET element 3. A serpentine heat dissipation hole 8 is opened on one side of the heat sink 6. The number of serpentine heat dissipation holes 8 is set to multiple and distributed in an array. A cooling fan 9 is fixedly installed on the left side wall of the power converter body 1. The design of multiple serpentine heat dissipation holes 8 increases the heat dissipation area and effectively improves the heat conduction and heat dissipation efficiency. The setting of the cooling fan 9 accelerates the air flow and can deliver air to the multiple serpentine heat dissipation holes 8, so that the heat on the heat sink 6 can be transferred to the flowing air and then discharged, improving the heat dissipation effect.
[0025] In this embodiment, each of the two partitions 5 has a slot 7 with an open top on one side. The heat sink 6 slides through the corresponding slot 7 on both sides. The design of the slot 7 facilitates the installation and fixation of the heat sink 6. The inner sidewall of the slot 7 and the outer sidewall of the heat sink 6 are both smooth flat surfaces, ensuring that the heat sink 6 can slide smoothly in the slot 7, thereby improving the smoothness of the installation or removal of the cover plate 2.
[0026] In this embodiment, a dustproof net 10 is fixedly installed on the left side wall of the cooling fan 9, and an air outlet is opened on the right side wall of the power converter body 1. A dustproof net 2 13 is fixedly installed inside the air outlet. The dustproof net 10 and the dustproof net 2 13 can effectively block dust and other impurities from entering the interior of the power converter body 1.
[0027] In this embodiment, a plurality of evenly distributed heat dissipation fins 11 are fixedly installed on the top of the heat sink 6. The tops of the plurality of heat dissipation fins 11 all penetrate the cover plate 2. By utilizing the plurality of heat dissipation fins 11, the heat conduction and heat dissipation area is further expanded, and the heat dissipation effect is enhanced.
[0028] In this embodiment, an L-shaped ventilation hood 12 is fixedly installed on the top of the cover plate 2. One end of the L-shaped ventilation hood 12 passes through the cover plate 2 and is located between the heat dissipation fan 9 and the partition plate 5 on the left side. The other end of the L-shaped ventilation hood 12 is fixedly connected to the left side of multiple heat dissipation fins 11. The L-shaped ventilation hood 12 is used to guide a portion of the airflow, optimize the heat dissipation path, and allow some air to flow in the gaps between multiple heat dissipation fins 11. During the airflow, some of the heat on the heat dissipation fins 11 can be carried away, accelerating the heat transfer to the outside air, ensuring that the MOSFET element 3 operates at a suitable temperature, and improving the stability and reliability of the power converter.
[0029] In this embodiment, both the heat sink 6 and the heat sink fins 11 are made of silicon carbide. Silicon carbide has good thermal conductivity and mechanical properties, which can better conduct and dissipate the heat generated by the MOSFET element 3. At the same time, it has high strength and stability, which can meet the needs of long-term operation of the power converter.
[0030] With the above structure, the MOSFET-based high-efficiency power conversion device provided in this application, when in use, takes the power converter body 1 as the core, and external power is connected through the terminal 4. Inside the power converter body 1, the MOSFET element 3 plays a key role. It controls the conduction and cutoff of the semiconductor to achieve precise regulation of the current, thereby completing the task of high-efficiency power conversion.
[0031] During the high-efficiency power conversion process, the MOSFET element 3 generates a large amount of heat due to its operation. The heat generated by the MOSFET element 3 is quickly conducted to the heat sink 6 through direct contact between the bottom of the heat sink 6 and the top of the MOSFET element 3. Some of the heat on the heat sink 6 is transferred to the outside air through multiple heat dissipation fins 11, achieving a certain heat dissipation effect. By starting the cooling fan 9, the cooling fan 9 introduces outside cold air into the power converter body 1. At this time, some air will flow into multiple serpentine heat dissipation holes 8. During the flow of air in the serpentine heat dissipation holes 8, the air will absorb the heat on the heat sink 6, which will effectively reduce the temperature of the heat sink 6. The hot air that has absorbed the heat will be discharged to the outside atmosphere through the dustproof mesh 13, achieving an effective heat dissipation effect. Another part of the cold air is guided by the L-shaped ventilation shroud 12 and is directed to the gaps between the multiple heat dissipation fins 11. When the cold air flows between the multiple heat dissipation fins 11, it will absorb the heat on the heat dissipation fins 11, which can accelerate the heat transfer to the outside atmosphere and further improve the heat dissipation effect, thereby ensuring that the MOSFET element 3 operates at a suitable temperature.
Claims
1. A high-efficiency power conversion device based on MOSFETs, characterized in that, The device includes a power converter body (1), a cover plate (2) fixedly installed on the top of the power converter body (1) by screws, a MOSFET element (3) fixedly installed inside the power converter body (1), terminals (4) fixedly installed on both the left and right sides of the power converter body (1), two partitions (5) fixedly installed inside the power converter body (1), the MOSFET element (3) located between the two partitions (5), the tops of the two partitions (5) are in contact with the bottom of the cover plate (2), a heat sink (6) fixedly installed on the bottom of the cover plate (2), the bottom surface of the heat sink (6) is in contact with the top surface of the MOSFET element (3), a serpentine heat dissipation hole (8) is opened on one side of the heat sink (6), and a cooling fan (9) is fixedly installed on the left side wall of the power converter body (1).
2. The high-efficiency power conversion device based on MOSFET according to claim 1, characterized in that: Each of the two partitions (5) has a slot (7) with an open top on one side, and the heat sink (6) slides through the corresponding slot (7) on both sides.
3. The high-efficiency power conversion device based on MOSFET according to claim 2, characterized in that: The inner wall of the slot (7) and the outer wall of the heat sink (6) are both smooth planar structures.
4. The high-efficiency power conversion device based on MOSFET according to claim 1, characterized in that: The number of the serpentine heat dissipation holes (8) is set to multiple, and the multiple serpentine heat dissipation holes (8) are distributed in an array.
5. The high-efficiency power conversion device based on MOSFET according to claim 1, characterized in that: A dustproof net (10) is fixedly installed on the left side wall of the cooling fan (9), and an air outlet is opened on the right side wall of the power converter body (1), with a dustproof net (13) fixedly installed inside the air outlet.
6. The high-efficiency power conversion device based on MOSFET according to claim 1, characterized in that: The top of the heat sink (6) is fixedly equipped with a plurality of evenly distributed heat dissipation fins (11), and the top of the plurality of heat dissipation fins (11) all penetrate the cover plate (2).
7. The high-efficiency power conversion device based on MOSFET according to claim 6, characterized in that: An L-shaped ventilation hood (12) is fixedly installed on the top of the cover plate (2). One end of the L-shaped ventilation hood (12) passes through the cover plate (2) and is located between the heat dissipation fan (9) and the partition plate (5) on the left side. The other end of the L-shaped ventilation hood (12) is fixedly connected to the left side of a plurality of heat dissipation fins (11).
8. The high-efficiency power conversion device based on MOSFET according to claim 6, characterized in that: Both the heat sink (6) and the heat sink fins (11) are made of silicon carbide.