Positioning tool for SMT tray patch component welding

By combining vacuum adsorption and extrusion plate positioning fixtures, the problem of welding position deviation caused by errors in positioning holes and positioning pins is solved, realizing precise positioning and convenient welding of PCB boards, and improving welding accuracy and efficiency.

CN224406607UActive Publication Date: 2026-06-26SHENZHEN SANDA XINGYE ELECTRONIC TECH CO LTD

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
SHENZHEN SANDA XINGYE ELECTRONIC TECH CO LTD
Filing Date
2025-05-28
Publication Date
2026-06-26

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    Figure CN224406607U_ABST
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Abstract

The utility model relates to positioning frock technical field, and disclose a kind of positioning frock for SMT tray patch component welding, including workbench, the workbench includes table body, the top of table body is evenly welded with locating block, the below of table body is evenly welded with support rod, the surface of table body is evenly provided with recess. The utility model places PCB board body in the inside of limiting groove, makes locating pin and locating hole to its simple positioning, then starts vacuum pump, is adsorbed to PCB board body by negative pressure, makes PCB board body and the bottom of limiting groove be in conformity with, compared with traditional positioning frock for SMT tray patch component welding, this SMT tray patch component welding positioning frock is positioned by vacuum adsorption, to effectively eliminate the warping caused by locating pin error, reduce the influence brought by error, make PCB board body and the surface of SMT tray body be flush, facilitate subsequent welding operation.
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Description

Technical Field

[0001] This utility model relates to the field of positioning tooling technology, and more specifically, to a positioning tooling for SMT tray surface mount component welding. Background Technology

[0002] SMT is an abbreviation for Surface Mount Technology, a technology that mounts leadless or short-lead surface mount components onto the surface of a printed circuit board or other substrate, and then assembles them by reflow soldering or dip soldering.

[0003] Currently, when soldering surface mount components (SMT) components onto an SMT tray, a robotic arm typically places the PCB on the tray. The tray's locating slots then limit the PCB's position, and a clamping mechanism holds and secures it. The PCB has multiple locating holes, and locating pins are usually placed within the locating slots. These pins engage with the locating holes to position the PCB and improve positioning accuracy. However, during manufacturing, deviations are unavoidable due to drill wear, mold wear, and equipment vibration. This can result in smaller hole diameters or larger pin diameters, making it difficult for the PCB to align flush with the locating slot surface after assembly. This leads to soldering position deviations, especially noticeable with larger PCBs. Therefore, improvements are needed. Utility Model Content

[0004] To overcome the shortcomings of the existing technology, this utility model provides a positioning fixture for SMT tray surface mount component soldering, which has the advantage of facilitating soldering.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a positioning fixture for SMT tray surface mount component soldering, comprising a worktable, the worktable including a platform body, positioning blocks uniformly welded on the upper part of the platform body, support rods uniformly welded on the lower part of the platform body, grooves uniformly formed on the surface of the platform body, a vacuum pump bolted to the lower part of the platform body, a vacuum tube bolted to the inside of the grooves, the output end of the vacuum pump connected to the bottom of the vacuum tube, an SMT tray disposed on the upper part of the platform body, the SMT tray including an SMT tray body located between the inner sides of the positioning blocks, a limiting groove uniformly formed on the surface of the SMT tray body, an adsorption groove formed on the inner side of the limiting groove, the adsorption groove being located above the vacuum tube, a PCB board disposed inside the limiting groove, the PCB board including a PCB board body soldered inside the limiting groove.

[0006] As a preferred embodiment of this utility model, a linear module is bolted to the upper front end of the platform, a robotic arm is fixedly mounted above the linear module, a fixing plate is bolted to the front end of the robotic arm, an extrusion plate is welded to the lower part of the fixing plate, and an extrusion plate is welded to the lower part of each of the four ends of the fixing plate.

[0007] As a preferred embodiment of this utility model, the surface of the limiting groove is uniformly welded with positioning pins, and the two ends of the PCB board body are uniformly provided with positioning holes, and the positioning pins are adapted to the positioning holes.

[0008] As a preferred embodiment of this utility model, the front end of the positioning pin is tapered, and both ends of the positioning hole are tapered.

[0009] As a preferred technical solution of this utility model, each of the two extrusion plates is equipped with a pressure sensor, and the four ends of the two extrusion plates correspond to the four ends of the PCB board body.

[0010] As a preferred technical solution of this utility model, the four ends of the limiting groove are designed with rounded corners, and the four ends of the PCB board body are designed with rounded corners.

[0011] In a preferred embodiment of this invention, the width of the adsorption groove is greater than the width of the vacuum tube, and the PCB board body is adapted to the limiting groove.

[0012] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0013] 1. This utility model places the PCB board body inside the limiting groove, allowing the positioning pins and positioning holes to provide simple positioning. Then, a vacuum pump is activated to adsorb the PCB board body through negative pressure, making the PCB board body fit against the bottom of the limiting groove. Compared with traditional positioning fixtures for SMT tray component soldering, this SMT tray component soldering positioning fixture uses vacuum adsorption to assist positioning, thereby effectively eliminating warping caused by positioning pin errors, reducing the impact of errors, and making the surface of the PCB board body flush with the surface of the SMT tray body, which facilitates subsequent soldering operations.

[0014] 2. This utility model uses extrusion plate one and extrusion plate two to extrude and fix the PCB board body. When the readings of the pressure sensor in extrusion plate two are consistent, the PCB board body and the SMT tray body are welded together. Compared with the traditional positioning fixture for SMT tray surface mount component welding, this positioning fixture for SMT tray surface mount component welding uses extrusion plate two to extrude the four ends of the PCB board body, so that the four ends of the PCB board body are completely housed inside the limiting groove, thereby facilitating the welding operation of the PCB board body and making it easy to use. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the structure of this utility model;

[0016] Figure 2 This is a schematic diagram of the workbench of this utility model;

[0017] Figure 3 This is a schematic diagram of the SMT tray of this utility model;

[0018] Figure 4 This is a schematic diagram of the PCB board of this utility model;

[0019] Figure 5 This is a schematic diagram of the fixing device of this utility model.

[0020] In the diagram: 1. Workbench; 11. Workbench body; 12. Support rod; 13. Linear module; 14. Positioning block; 15. Vacuum pump; 16. Groove; 17. Vacuum tube; 2. SMT tray; 21. SMT tray body; 22. Limiting groove; 23. Adsorption groove; 24. Positioning pin; 3. Fixing device; 31. Robotic arm; 32. Fixing plate; 33. Extrusion plate one; 34. Extrusion plate two; 4. PCB board; 41. PCB board body; 42. Positioning hole. Detailed Implementation

[0021] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0022] like Figures 1 to 5 As shown, this utility model provides a positioning fixture for SMT tray surface mount component soldering, including a worktable 1, the worktable 1 including a platform body 11, positioning blocks 14 uniformly welded on the upper part of the platform body 11, support rods 12 uniformly welded on the lower part of the platform body 11, grooves 16 uniformly formed on the surface of the platform body 11, a vacuum pump 15 bolted to the lower part of the platform body 11, a vacuum tube 17 bolted to the inside of the grooves 16, the output end of the vacuum pump 15 connected to the bottom of the vacuum tube 17, an SMT tray 2 is arranged on the upper part of the platform body 11, the SMT tray 2 includes an SMT tray body 21 located between the inner sides of the positioning blocks 14, a limiting groove 22 uniformly formed on the surface of the SMT tray body 21, an adsorption groove 23 formed on the inner side of the limiting groove 22, the adsorption groove 23 being located above the vacuum tube 17, a PCB board 4 is arranged inside the limiting groove 22, the PCB board 4 includes a PCB board body 41 soldered inside the limiting groove 22.

[0023] The limiting groove 22 is uniformly welded with positioning pins 24, and the two ends of the PCB board body 41 are uniformly provided with positioning holes 42, which are adapted to the positioning pins 24 and the positioning holes 42; the extrusion plate 24 is provided with pressure sensors inside, and the extrusion plate 24 corresponds to the four ends of the PCB board body 41; the width of the adsorption groove 23 is greater than the width of the vacuum tube 17, and the PCB board body 41 is adapted to the limiting groove 22.

[0024] In use, first place the SMT tray body 21 on top of the platform 11, then place the PCB board body 41 inside the limiting groove 22, so that the positioning pin 24 passes through the positioning hole 42 to position the PCB board body 41. At this time, start the vacuum pump 15, so that the vacuum pump 15 generates a negative pressure between the adsorption groove 23 and the inner side of the PCB board body 41 through the vacuum tube 17. The negative pressure adsorbs the PCB board body 41 onto the surface of the limiting groove 22, eliminating the warping caused by the positioning pin error. Then, fix the PCB board body 41 with the fixing device 3, thereby soldering the PCB board body 41 to the SMT tray body 21.

[0025] By placing the PCB board body 41 inside the limiting groove 22, the positioning pin 24 and positioning hole 42 are used for simple positioning. Then, the vacuum pump 15 is started to adsorb the PCB board body 41 through negative pressure, so that the PCB board body 41 is in contact with the bottom of the limiting groove 22. Compared with the traditional positioning fixture for SMT tray component soldering, this SMT tray component soldering positioning fixture uses vacuum adsorption to assist in positioning, which can effectively eliminate the warping caused by the error of the positioning pin, reduce the impact of the error, and make the surface of the PCB board body 41 flush with the surface of the SMT tray body 21, which is convenient for subsequent soldering operations.

[0026] Among them, a linear module 13 is bolted on the upper front end of the platform 11, a robotic arm 31 is fixedly installed on the upper part of the linear module 13, a fixing plate 32 is bolted on the front end of the robotic arm 31, an extrusion plate 33 is welded on the lower part of the fixing plate 32, and an extrusion plate 34 is welded on the lower part of each of the four ends of the fixing plate 32.

[0027] After the vacuum pump 15 generates negative pressure to complete the adsorption operation, the robotic arm 31 moves the fixing plate 32 above the PCB board body 41. Then, the fixing plate 32 is controlled to move downward and contact the PCB board body 41. The PCB board body 41 is squeezed by the first extrusion plate 33 and the second extrusion plate 34, so that the second extrusion plate 34 makes the surface of the PCB board body 41 flush with the surface of the SMT tray body 21. The first extrusion plate 33 squeezes the center part of the PCB board body 41. When the readings of the pressure sensors in the second extrusion plate 34 are consistent, it means that the four ends of the PCB board body 41 are on the same horizontal plane. At this time, the PCB board body 41 is soldered, thereby effectively improving the soldering effect.

[0028] The PCB board body 41 is pressed and fixed by the extrusion plate 33 and the extrusion plate 34. When the readings of the pressure sensor in the extrusion plate 34 are consistent, the PCB board body 41 is soldered to the SMT tray body 21. Compared with the traditional positioning fixture for SMT tray surface mount component soldering, this positioning fixture for SMT tray surface mount component soldering uses the extrusion plate 34 to extrude the four ends of the PCB board body 41, so that the four ends of the PCB board body 41 are completely housed inside the limiting groove 22, thereby facilitating the soldering operation of the PCB board body 41 and making it easy to use.

[0029] The front end of the positioning pin 24 is tapered, and both ends of the positioning hole 42 are tapered.

[0030] When the positioning pin 24 is inserted into the positioning hole 42, the tapered design of both the positioning pin 24 and the positioning hole 42 effectively reduces the error caused during production, making it easy to insert the positioning pin 24 into the positioning hole 42. When vacuum adsorption and extrusion operations are performed, the positioning pin 24 can be fully inserted into the positioning hole 42.

[0031] The four ends of the limiting groove 22 are rounded, and the four ends of the PCB board body 41 are also rounded.

[0032] By designing rounded corners at the four ends of the limiting groove 22 and the PCB board body 41, the four ends of the PCB board body 41 can be protected when it moves downward inside the limiting groove 22 during extrusion fixing and vacuum adsorption.

[0033] Working principle and usage process of this utility model:

[0034] In use, first place the SMT tray body 21 on top of the platform 11, then place the PCB board body 41 inside the limiting groove 22, so that the positioning pin 24 passes through the positioning hole 42 to position the PCB board body 41. At this time, start the vacuum pump 15, so that the vacuum pump 15 generates a negative pressure between the adsorption groove 23 and the inner side of the PCB board body 41 through the vacuum tube 17. The negative pressure adsorbs the PCB board body 41 onto the surface of the limiting groove 22, eliminating the warping caused by the positioning pin error. Then, fix the PCB board body 41 with the fixing device 3, thereby soldering the PCB board body 41 to the SMT tray body 21.

[0035] After the vacuum pump 15 generates negative pressure to complete the adsorption operation, the robotic arm 31 moves the fixing plate 32 above the PCB board body 41. Then, the fixing plate 32 is controlled to move downward and contact the PCB board body 41. The PCB board body 41 is squeezed by the first extrusion plate 33 and the second extrusion plate 34, so that the second extrusion plate 34 makes the surface of the PCB board body 41 flush with the surface of the SMT tray body 21. The first extrusion plate 33 squeezes the center part of the PCB board body 41. When the readings of the pressure sensors in the second extrusion plate 34 are consistent, it means that the four ends of the PCB board body 41 are on the same horizontal plane. At this time, the PCB board body 41 is soldered, thereby effectively improving the soldering effect.

[0036] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0037] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A positioning fixture for SMT tray component soldering, comprising a worktable (1), characterized in that: The workbench (1) includes a platform (11), with positioning blocks (14) uniformly welded to the top of the platform (11) and support rods (12) uniformly welded to the bottom of the platform (11). Grooves (16) are uniformly formed on the surface of the platform (11). A vacuum pump (15) is bolted to the bottom of the platform (11), and a vacuum tube (17) is bolted to the inside of the groove (16). The output end of the vacuum pump (15) is connected to the bottom of the vacuum tube (17). An S is provided on the top of the platform (11). The SMT tray (2) includes an SMT tray body (21) located between the inner sides of the positioning blocks (14). The surface of the SMT tray body (21) is uniformly provided with limiting grooves (22). The inner side of the limiting grooves (22) is provided with adsorption grooves (23). The adsorption grooves (23) are located above the vacuum tube (17). The PCB board (4) is provided inside the limiting grooves (22). The PCB board (4) includes a PCB board body (41) soldered inside the limiting grooves (22).

2. The positioning fixture for SMT tray component soldering according to claim 1, characterized in that: A linear module (13) is bolted on the upper front end of the platform (11). A robotic arm (31) is fixedly installed on the upper part of the linear module (13). A fixing plate (32) is bolted on the front end of the robotic arm (31). An extrusion plate (33) is welded on the lower part of the fixing plate (32). An extrusion plate (34) is welded on the lower part of each of the four ends of the fixing plate (32).

3. The positioning tool for SMT tray SMD components welding according to claim 1, characterized in that: The surface of the limiting groove (22) is uniformly welded with positioning pins (24), and the two ends of the PCB board body (41) are uniformly provided with positioning holes (42), and the positioning pins (24) are adapted to the positioning holes (42).

4. The positioning tool for SMT tray SMD components welding according to claim 3, characterized in that: The front end of the positioning pin (24) is tapered, and both ends of the positioning hole (42) are tapered.

5. The positioning tool for SMT tray SMD component welding according to claim 2, characterized in that: Pressure sensors are installed inside each of the two extrusion plates (34), and the four ends of the two extrusion plates (34) correspond to the four ends of the PCB board body (41).

6. The positioning tool for SMT tray component soldering according to claim 1, characterized in that: The four ends of the limiting groove (22) are rounded, and the four ends of the PCB board body (41) are rounded.

7. The positioning tool for SMT tray component soldering according to claim 1, characterized in that: The width of the adsorption groove (23) is greater than the width of the vacuum tube (17), and the PCB board body (41) is adapted to the limiting groove (22).