A device for processing swarf for a grinding machine

Abstract

The utility model relates to the technical field of scrap processing, disclose a kind of scrap processing device for grinding machine, including installation component, the installation component includes grinder, the bottom of the grinder is fixedly connected with processing box by receiving material frame, the inside sliding installation of the processing box has guard door, the outer surface of the processing box is fixedly connected with support frame.The utility model is slid in the buffer cylinder by force bar, in combination with the elastic support of first buffer spring and second buffer spring, absorb the impact energy in the reciprocating motion of force plate, double spring buffer system converts the start-stop impact of force plate into spring deformation, reduce mechanical vibration and component collision, impact force is dispersed by spring buffer structure, protect the precision components such as first separating frame, second separating frame from rigid impact damage, reduce maintenance cost, buffering system significantly reduces mechanical vibration noise, while avoiding the structural loosening or displacement due to impact, ensure the stability and consistency of classification process.

Description

Technical Field

[0001] This utility model relates to the field of waste chip treatment technology, and in particular to a waste chip treatment device for grinding machines. Background Technology

[0002] As the manufacturing industry develops towards intelligence and precision, it is necessary to efficiently classify and environmentally treat the waste chips generated by grinding machines during the metal processing process, which requires the use of processing equipment.

[0003] In practical use, similar processing devices still have many shortcomings, such as: traditional processing devices mostly use static screens or simple mechanical vibration to classify metal chips and grinding wheel particles by particle size and shape, which cannot accurately separate metal chips and grinding wheel particles, resulting in impurities being mixed into recyclable metals and reducing resource utilization. At the same time, the moving parts of traditional processing devices are prone to wear and noise. Therefore, it is necessary to design a waste chip processing device for grinding machines. Utility Model Content

[0004] To solve the above-mentioned technical problems, this utility model provides a waste chip treatment device for grinding machines.

[0005] This utility model is achieved using the following technical solution: a waste chip treatment device for a grinding machine, comprising an installation assembly, the installation assembly including a grinding machine, a treatment box fixedly connected to the bottom of the grinding machine via a receiving rack, a protective door slidably installed inside the treatment box, and a support frame fixedly connected to the outer surface of the treatment box, and further comprising:

[0006] A separation assembly is slidably mounted on a force-bearing plate on the outer surface of the processing box. A first separation frame, a second separation frame, and a recycling frame are sequentially fixedly connected to the inner wall of the force-bearing plate.

[0007] A buffer assembly includes a buffer cylinder fixedly connected to the outer surface of the processing box, and a force-bearing rod is slidably installed inside the buffer cylinder.

[0008] As a further improvement to the above solution, a protective plate is fixedly connected to the outer surface of the grinding machine, an operating plate is fixedly connected to the center of the inner wall of the grinding machine, a receiving rack is fixedly connected to the bottom of the grinding machine, and a processing box is fixedly connected to the bottom of the receiving rack.

[0009] By using the above technical solution, a protective plate is installed on the outer surface of the grinding machine to effectively block the splashing of waste chips, ensuring that the waste chips fall in a controlled manner inside the grinding machine and preventing them from scattering into the external environment, thereby improving safety and cleanliness.

[0010] As a further improvement to the above solution, a dual-axis servo motor is fixedly connected to the bottom of the processing box, a drive rod is fixedly connected to the output end of the dual-axis servo motor, a connecting rod is threadedly connected to the outer surface of the drive rod, and a cam is fixedly connected to the outer surface of the connecting rod.

[0011] Through the above technical solution, the dual-axis servo motor provides high-precision, adjustable-speed driving force, and transmits the rotary motion to the cam through the drive rod and connecting rod to achieve uniform and controllable reciprocating motion.

[0012] As a further improvement to the above solution, the outer surface of the force-bearing plate is provided with an arc that matches the cam, a force-bearing rod is fixedly connected to the outer surface of the force-bearing plate, and a connecting plate is fixedly connected to the bottom of the force-bearing rod.

[0013] Through the above technical solution, the arc surface of the force plate cooperates with the cam to ensure smooth movement; the force rod fixed on its outer wall transmits the reciprocating motion to the buffer assembly, realizing the synchronous linkage between the movement of the sorting rack and the buffer protection.

[0014] As a further improvement to the above solution, support plates are fixedly connected to both sides of the outer surface of the processing box, a buffer cylinder is fixedly connected to the top of the support plates, a force-bearing rod is slidably installed inside the buffer cylinder, and a connecting plate is fixedly connected to the bottom of the force-bearing rod.

[0015] Through the above technical solution, the support plate provides stable support for the buffer cylinder, ensuring that the force-bearing rod maintains vertical sliding during high-speed reciprocating motion, and avoiding jamming or wear caused by tilting.

[0016] As a further improvement to the above solution, a first buffer spring is fixedly connected to the top of the connecting plate, and the side of the first buffer spring away from the connecting plate is fixedly connected to the top of the inner wall of the buffer cylinder.

[0017] Through the above technical solution, the first buffer spring is installed between the top of the connecting plate and the inner wall of the buffer cylinder, which effectively absorbs the inertial impact when the force plate rises and reduces rigid collisions between components.

[0018] As a further improvement to the above solution, a second buffer spring is fixedly connected to the bottom of the connecting plate, and the side of the second buffer spring away from the connecting plate is fixedly connected to the bottom of the inner wall of the buffer cylinder.

[0019] Through the above technical solution, the second buffer spring provides a reverse support force at the bottom of the connecting plate, balancing the impact energy when the force plate descends and avoiding severe vibration caused by gravity acceleration.

[0020] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0021] This invention uses a dual-axis servo motor to drive a drive rod to rotate, which in turn drives a cam to move in conjunction with a force plate. This causes the first separation frame, the second separation frame, and the recycling frame to slide back and forth within the processing box. By utilizing the difference in aperture between the first and second separation frames, waste is dynamically classified and screened according to particle size or shape. Metal scrap, grinding wheel particles, and impurities are separated into different zones, achieving continuous automatic classification of waste, reducing manual intervention, improving processing efficiency, and ensuring the directional collection of metal scrap and non-metallic impurities (such as grinding wheel particles), thus facilitating subsequent recycling or environmental treatment.

[0022] This invention absorbs the impact energy of the reciprocating motion of the force plate by sliding the force rod within the buffer cylinder, combined with the elastic support of the first and second buffer springs. The dual-spring buffer system converts the starting and stopping impact of the force plate into spring deformation, reducing mechanical vibration and component collisions. The spring buffer structure disperses the impact force, protecting precision components such as the first and second separation frames from rigid collision damage, reducing maintenance costs. The buffer system significantly reduces mechanical vibration noise and avoids structural loosening or displacement caused by impacts, ensuring the stability and consistency of the sorting process. Attached Figure Description

[0023] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0024] Figure 2 This is a schematic diagram of the separation component structure of this utility model;

[0025] Figure 3 This is a schematic diagram of the buffer component structure of this utility model;

[0026] Figure 4 This utility model Figure 3 Enlarged schematic diagram of the structure at point A in the middle;

[0027] Figure 5 This is a schematic diagram of the overall internal structure of this utility model.

[0028] Explanation of key symbols:

[0029] 1. Installation Components; 101. Grinding Machine; 102. Protective Plate; 103. Operation Panel; 104. Receiving Rack; 105. Processing Box; 106. Protective Door; 107. Support Frame; 2. Separation Components; 201. Dual-Axis Servo Motor; 202. Drive Rod; 203. Connecting Rod; 204. Cam; 205. Force Plate; 206. First Separating Frame; 207. Second Separating Frame; 208. Recycling Rack; 3. Buffer Components; 301. Force Rod; 302. Connecting Plate; 303. Support Plate; 304. Buffer Cylinder; 305. First Buffer Spring; 306. Second Buffer Spring. Detailed Implementation

[0030] The present invention will be further described below with reference to the accompanying drawings and specific embodiments. It should be noted that, without conflict, the various embodiments or technical features described below can be arbitrarily combined to form new embodiments.

[0031] Example:

[0032] Please combine Figure 1-5 This embodiment of a grinding machine waste chip treatment device includes a mounting assembly 1, which includes a grinding machine 101. A processing box 105 is fixedly connected to the bottom of the grinding machine 101 via a receiving rack 104. A protective door 106 is slidably installed inside the processing box 105, and a support frame 107 is fixedly connected to the outer surface of the processing box 105. The device also includes:

[0033] Separation component 2 is slidably installed on the force plate 205 on the outer surface of the processing box 105. The inner wall of the force plate 205 is sequentially fixedly connected to the first separation frame 206, the second separation frame 207 and the recycling frame 208.

[0034] The buffer assembly 3 includes a buffer cylinder 304 fixedly connected to the outer surface of the processing box 105, and a force-bearing rod 301 is slidably installed inside the buffer cylinder 304.

[0035] A protective plate 102 is fixedly connected to the outer surface of the grinding machine 101, an operating plate 103 is fixedly connected to the center of the inner wall of the grinding machine 101, a receiving rack 104 is fixedly connected to the bottom of the grinding machine 101, and a processing box 105 is fixedly connected to the bottom of the receiving rack 104.

[0036] The workpiece is placed on the surface of the operating plate 103 for grinding. The generated waste chips are confined inside the grinding machine 101 by the shielding effect of the protective plate 102. The waste chips enter the box body through the inlet of the processing box 105 under their own gravity and the guiding effect of the receiving rack 104.

[0037] A dual-axis servo motor 201 is fixedly connected to the bottom of the processing box 105. A drive rod 202 is fixedly connected to the output end of the dual-axis servo motor 201. A connecting rod 203 is threadedly connected to the outer surface of the drive rod 202. A cam 204 is fixedly connected to the outer surface of the connecting rod 203.

[0038] The connecting rod 203 drives the cam 204 to rotate synchronously. Since the outer edge of the cam 204 matches the arc structure on the surface of the force plate 205, the rotational motion of the cam 204 is converted into the linear reciprocating motion of the force plate 205.

[0039] The outer surface of the force plate 205 is provided with an arc that matches the cam 204. A force rod 301 is fixedly connected to the outer surface of the force plate 205, and a connecting plate 302 is fixedly connected to the bottom of the force rod 301.

[0040] Support plates 303 are fixedly connected to both sides of the outer surface of the processing box 105. A buffer cylinder 304 is fixedly connected to the top of the support plate 303. A force-bearing rod 301 is slidably installed inside the buffer cylinder 304. A connecting plate 302 is fixedly connected to the bottom of the force-bearing rod 301.

[0041] A first buffer spring 305 is fixedly connected to the top of the connecting plate 302, and the side of the first buffer spring 305 away from the connecting plate 302 is fixedly connected to the top of the inner wall of the buffer cylinder 304.

[0042] A second buffer spring 306 is fixedly connected to the bottom of the connecting plate 302, and the side of the second buffer spring 306 away from the connecting plate 302 is fixedly connected to the bottom of the inner wall of the buffer cylinder 304.

[0043] The dual-spring buffer structure can significantly reduce the impact of starting and stopping the force plate 205, reduce mechanical vibration and noise, and protect precision components such as the first separation frame 206, the second separation frame 207 and the recovery frame 208 from collision damage.

[0044] The implementation principle of a waste chip treatment device for a grinding machine in this embodiment is as follows: During the operation of the grinding machine 101, the workpiece is placed on the surface of the operating plate 103 for grinding. The generated waste chips are confined inside the grinding machine 101 by the shielding effect of the protective plate 102. Under the influence of its own gravity and the guiding effect of the receiving rack 104, the waste chips enter the box through the inlet of the treatment box 105. At this time, the dual-axis servo motor 201 starts, driving the drive rod 202 to rotate at a constant speed, which drives the cam 204 to rotate synchronously through the connecting rod 203. Because the cam 204... The outer edge cooperates with the arc structure on the surface of the force plate 205. The rotational motion of the cam 204 is converted into the linear reciprocating motion of the force plate 205. The reciprocating sliding of the force plate 205 drives the first separation frame 206, the second separation frame 207 and the recycling frame 208 fixed inside to move synchronously. The first separation frame 206 classifies and screens waste chips according to particle size or shape through different aperture or gap designs. This dynamic classification method can efficiently separate metal chips, grinding wheel wear particles and other impurities, providing convenience for subsequent recycling or processing.

[0045] During the reciprocating motion of the force plate 205, the force rod 301 fixedly connected to its outer wall slides along the inner wall of the buffer cylinder 304. When the force plate 205 rises or falls, the first buffer spring 305 at the top of the connecting plate 302 and the second buffer spring 306 at the bottom provide elastic support force to absorb the impact energy during the motion. This double spring buffer structure can significantly reduce the starting and stopping impact of the force plate 205, reduce mechanical vibration noise, and protect precision components such as the first separation frame 206, the second separation frame 207, and the recycling frame 208 from collision damage. After the waste is sorted, the dual-axis servo motor 201 is turned off, the cam 204 stops driving, and the force plate 205 returns to a stationary state. At this time, the staff can open the protective door 106 of the processing box 105 to collect and take out the sorted waste for subsequent processing.

[0046] The above embodiments are merely preferred embodiments of this utility model and should not be construed as limiting the scope of protection of this utility model. Any non-substantial changes and substitutions made by those skilled in the art based on this utility model shall fall within the scope of protection claimed by this utility model.

Claims

1. A waste chip treatment device for a grinding machine, comprising a mounting assembly (1), the mounting assembly (1) including a grinding machine (101), a processing box (105) fixedly connected to the bottom of the grinding machine (101) via a receiving rack (104), a protective door (106) slidably installed inside the processing box (105), and a support frame (107) fixedly connected to the outer surface of the processing box (105), characterized in that, Also includes: The separation component (2) is slidably installed on the force plate (205) on the outer surface of the processing box (105). The inner wall of the force plate (205) is sequentially fixedly connected to the first separation frame (206), the second separation frame (207) and the recycling frame (208). The buffer assembly (3) includes a buffer cylinder (304) fixedly connected to the outer surface of the processing box (105), and a force-bearing rod (301) is slidably installed inside the buffer cylinder (304).

2. A device for processing swarf for grinding machines according to claim 1, characterized in that: A protective plate (102) is fixedly connected to the outer surface of the grinding machine (101), an operating plate (103) is fixedly connected to the center of the inner wall of the grinding machine (101), a receiving rack (104) is fixedly connected to the bottom of the grinding machine (101), and a processing box (105) is fixedly connected to the bottom of the receiving rack (104).

3. A device for processing swarf for grinding machines according to claim 2, characterized in that: A dual-axis servo motor (201) is fixedly connected to the bottom of the processing box (105). A drive rod (202) is fixedly connected to the output end of the dual-axis servo motor (201). A connecting rod (203) is threadedly connected to the outer surface of the drive rod (202). A cam (204) is fixedly connected to the outer surface of the connecting rod (203).

4. A device for processing swarf for grinding machines according to claim 1, characterized in that: The outer surface of the force plate (205) is provided with an arc that matches the cam (204), and a force rod (301) is fixedly connected to the outer surface of the force plate (205). A connecting plate (302) is fixedly connected to the bottom of the force rod (301).

5. A device for processing swarf for grinding machines according to claim 1, characterized in that: Support plates (303) are fixedly connected to both sides of the outer surface of the processing box (105). A buffer cylinder (304) is fixedly connected to the top of the support plate (303). A force-bearing rod (301) is slidably installed inside the buffer cylinder (304). A connecting plate (302) is fixedly connected to the bottom of the force-bearing rod (301).

6. A swarf disposal device for an abrasive machine as claimed in claim 5, characterised in that: A first buffer spring (305) is fixedly connected to the top of the connecting plate (302), and the side of the first buffer spring (305) away from the connecting plate (302) is fixedly connected to the top of the inner wall of the buffer cylinder (304).

7. A waste chip treatment device for grinding machines as described in claim 6, characterized in that: A second buffer spring (306) is fixedly connected to the bottom of the connecting plate (302), and the side of the second buffer spring (306) away from the connecting plate (302) is fixedly connected to the bottom of the inner wall of the buffer cylinder (304).

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