Furnace tube inner wall coating device and processing equipment

Abstract

The present disclosure relates to the technical field of semiconductor and photovoltaic, and particularly relates to a furnace tube inner wall coating device and processing equipment, which solves the problem that the deposition uniformity and deposition rate cannot meet the requirements when depositing a protective coating on the inner wall of the furnace tube in the related art. The furnace tube inner wall coating device comprises a quartz furnace tube with a furnace cavity and a plasma generating assembly, and the plasma generating assembly comprises: at least one inductive line movably connected to the outer wall of the furnace cavity or the furnace tube, the inductive line extending along a first direction and being arranged at a position close to the inner side wall of the quartz furnace tube or a position close to the outer wall of the furnace tube; a driving member connected with the inductive line, and the driving member is configured to drive the inductive line to rotate around the circumference of the inner side wall of the quartz furnace tube or the outer wall of the furnace tube. The furnace tube inner wall coating device and processing equipment provided by the present disclosure can make the protective coating deposited on the inner wall of the furnace tube more uniform and the deposition rate higher.

Description

Technical Field

[0001] This disclosure relates to the fields of semiconductor and photovoltaic technology, and in particular to a furnace tube inner wall coating apparatus and processing equipment. Background Technology

[0002] With the development of solar photovoltaic technology, solar cells are widely used in various fields. The manufacturing process of solar cells generally includes processes such as boron diffusion, annealing, oxidation, low-pressure chemical vapor deposition (LPCVD), and plasma-enhanced chemical vapor deposition (PACVD), which involve processing raw materials using gas diffusion. Common processing equipment includes plasma-enhanced chemical vapor deposition (PECVD) equipment, low-pressure chemical vapor deposition (LPCVD) equipment, and atmospheric pressure chemical vapor deposition (APCVD) equipment. In these processing devices, quartz tubes are typically used as furnace tubes. During processing, the inner wall of the furnace tube is easily corroded by parasitic high-stress films or corrosive raw materials, which can lead to furnace tube rupture or even explosion with prolonged use.

[0003] To extend the lifespan of furnace tubes, a high-density, corrosion-resistant protective coating is typically applied to the inner wall of the tubes. However, with the increase in solar cell production capacity, the length of furnace tubes in processing equipment has also become longer. This makes it difficult to achieve large-area deposition of the protective coating on the inner wall of the tubes, resulting in insufficient uniformity and deposition rate to meet requirements. Utility Model Content

[0004] In view of this, the present disclosure provides a furnace tube inner wall coating apparatus and processing equipment to solve the problem that the deposition uniformity and deposition rate of the protective coating deposited on the inner wall of the furnace tube cannot meet the requirements in the related art.

[0005] In a first aspect, one embodiment of this disclosure provides a furnace tube inner wall coating apparatus, configured to coat the inner wall of a furnace tube. The furnace tube inner wall coating apparatus includes: a quartz furnace tube having a furnace cavity extending along a first direction and communicating with the outside; the quartz furnace tube can be sleeved on the inner side of the furnace tube, forming a closed reaction cavity between the furnace tube and the quartz furnace tube; the reaction cavity is configured to be filled with a reactive gas; and a plasma generating assembly configured to provide an electromagnetic field to the reaction cavity to excite plasma and coat the inner wall of the furnace tube. The plasma generating assembly includes: at least one inductor wire movably connected to the outer wall of the furnace cavity or the furnace tube, the inductor wire extending along the first direction and positioned near the inner wall of the quartz furnace tube or near the outer wall of the furnace tube; and a driving member connected to the inductor wire, configured to drive the inductor wire to rotate circumferentially around the inner wall of the quartz furnace tube or around the outer wall of the furnace tube.

[0006] In some embodiments, the number of inductors includes two or more, and the multiple inductors are arranged circumferentially at intervals along the inner sidewall of the quartz furnace tube; the quartz furnace tube has a first axis parallel to a first direction, and in any two adjacent inductors, the center of one inductor is connected to the first axis by a first perpendicular line, and the center of the other inductor is connected to the first axis by a second perpendicular line, with a first angle between the first perpendicular line and the second perpendicular line, and the drive is configured to drive at least one inductor to rotate by the first angle.

[0007] In some embodiments, the plasma generating assembly further includes: an insulating support connected to multiple inductor lines, and the insulating support is connected to a driving member. The multiple inductor lines are arranged at equal intervals along the circumference of the inner wall of the quartz furnace tube. The two connecting lines formed by connecting the centers of any two adjacent inductor lines to the first axis have a second angle between them. The driving member is configured to drive the insulating support to rotate by the second angle.

[0008] In some embodiments, the two ends of the inductor wire in the first direction coincide with the two ends of the furnace tube, or the two ends of the inductor wire in the first direction are located outside the furnace tube.

[0009] In some embodiments, the inductor wire has a receiving cavity extending along a first direction, and the plasma generating assembly further includes a cooling element disposed in the receiving cavity, the cooling element being configured to cool the inductor wire.

[0010] In some embodiments, the plasma generating assembly further includes: a radio frequency power supply connected to the inductor to form a radio frequency circuit, the radio frequency power supply including a ground terminal and a feed terminal; and a capacitor connected in series with the radio frequency circuit, the capacitor being located between the ground terminal and the inductor.

[0011] In some embodiments, the device further includes: a heating component, wherein when the quartz furnace tube is fitted inside the furnace tube and the plasma generating component is disposed in the furnace cavity, the heating component covers the outer wall of the furnace tube; and when the quartz furnace tube is fitted inside the furnace tube and the plasma generating component is disposed on the outer wall of the furnace tube, the heating component covers the inner wall of the quartz furnace tube; the furnace tube inner wall coating device further includes: an electromagnetic shielding layer, disposed between the furnace tube and the heating component, or disposed between the quartz furnace tube and the heating component.

[0012] In some embodiments, the heating assembly includes: a heating element disposed on the side of the electromagnetic shielding layer away from the furnace tube; and a heat insulation layer covering the side of the heating element away from the electromagnetic shielding layer.

[0013] In some embodiments, the furnace tube further includes: a first end cap disposed at one end of the quartz furnace tube along a first direction; and a second end cap disposed at the other end of the quartz furnace tube along the first direction, wherein the first end cap, the second end cap, the furnace tube, and the quartz furnace tube enclose a closed reaction chamber; wherein one of the first end cap and the second end cap is provided with at least one air inlet communicating with the reaction chamber, the air inlet being configured to communicate with an external pipeline containing reaction gas, and the other end cap is provided with at least one air extraction port communicating with the reaction chamber, the air extraction port being configured to communicate with a vacuum pump.

[0014] Secondly, this disclosure also provides a processing device, including: a workbench configured to hold a furnace tube; and the furnace tube inner wall coating device described above, disposed on the workbench, the furnace tube inner wall coating device being detachably connected to the furnace tube, and the furnace tube inner wall coating device being configured to coat the inner wall of the furnace tube.

[0015] This disclosure provides a furnace tube inner wall coating apparatus and processing equipment. An inductor extending along a first direction is used for coating the inner wall of a furnace tube that also extends along the first direction. During the coating process, the inductor rotates circumferentially around the inner wall of the quartz furnace tube or around the outer wall of the furnace tube. As the length of the furnace tube increases, the inductor can also become longer, which can meet the requirement of depositing a large area protective coating on the inner wall of the furnace tube in one go, thereby improving the uniformity of the coating on the inner wall of the furnace tube.

[0016] Furthermore, by connecting the quartz furnace tube and the furnace tube together to form an annular reaction chamber, the volume of reaction gas required to fill the reaction chamber is reduced, thereby reducing the vacuum discharge volume of the plasma and lowering the requirements for the vacuum equipment's suction speed, thus reducing the consumption of reaction gas and the generation of dust.

[0017] In addition, when the inductor wire is placed in the furnace cavity, the quartz furnace tube is connected to the furnace tube in a sleeve manner, so that the inductor wire is closer to the inner wall of the furnace tube. This shortens the transmission path required for the plasma generated by the discharge and reduces energy loss, so as to utilize the energy of the plasma generating component more efficiently and improve the deposition rate.

[0018] In addition, placing the inductor wire on the outer wall of the furnace cavity or furnace tube in the atmospheric environment avoids parasitic deposition and the problem of unstable discharge caused by direct contact with plasma. It also allows the driving component to easily drive the inductor wire to rotate circumferentially around the inner wall of the quartz furnace tube or around the outer wall of the furnace tube, further improving the uniformity of the coating. Attached Figure Description

[0019] The above and other objects, features, and advantages of this disclosure will become more apparent from the more detailed description of the embodiments thereof in conjunction with the accompanying drawings. The drawings are provided to offer a further understanding of the embodiments of this disclosure and form part of the specification. They are used together with the embodiments of this disclosure to explain the disclosure and do not constitute a limitation thereof. In the drawings, the same reference numerals generally represent the same components or steps.

[0020] Figure 1 The diagram shown is a schematic diagram of a processing device provided in an embodiment of this disclosure.

[0021] Figure 2 As shown Figure 1 The diagram shows a cross-sectional view of the processing equipment along the AA direction.

[0022] Figure 3 The image shown is provided in another embodiment. Figure 1 The diagram shows a cross-sectional view of the processing equipment along the AA direction.

[0023] Figure 4 The image shown is provided in another embodiment. Figure 1 The diagram shows a cross-sectional view of the processing equipment along the AA direction.

[0024] Figure 5 The image shown is a cross-sectional view of the furnace tube inner wall coating device and the radio frequency power supply provided in an embodiment of this disclosure.

[0025] Figure 6 The image shown is a cross-sectional view of a furnace tube inner wall coating apparatus provided in an embodiment of this disclosure.

[0026] Figure 7 As shown Figure 6 A magnified view of part B in the furnace tube inner wall coating device shown.

[0027] Figure 8 The figure shown is a cross-sectional view of the furnace tube inner wall coating device and the furnace tube according to an embodiment of the present disclosure.

[0028] Figure label:

[0029] 100. Processing equipment; 10. Coating device for inner wall of furnace tube; 1. Quartz furnace tube; 1a. Furnace cavity; 11. First axis; 2. Plasma generating assembly; 21. Inductor wire; 22. Driving component; 23. Insulating bracket; 24. Radio frequency power supply; 241. Feed-in end; 242. Grounding end; 25. Capacitor; 3. Cooling component; 4. Electromagnetic shielding layer; 5. Heating assembly; 20. Furnace tube; 20a. Reaction chamber; 101. First end cap; 101a. Air inlet; 102. Second end cap; 102a. Air extraction port; 30. Worktable; 40. Fixed connecting component; X. First direction; Y. Vertical direction. Detailed Implementation

[0030] The technical solutions of the embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this disclosure, and not all embodiments. Based on the embodiments of this disclosure, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this disclosure.

[0031] Figure 1 The diagram shown is a schematic diagram of a processing device provided in an embodiment of this disclosure. Figure 2 As shown Figure 1 The diagram shows a cross-sectional view of the processing equipment along the AA direction. Figure 3 The image shown is provided in another embodiment. Figure 1 The diagram shows a cross-sectional view of the processing equipment along the AA direction. Figure 4 The image shown is provided in another embodiment. Figure 1 The diagram shows a cross-sectional view of the processing equipment along the AA direction. Figure 5 The image shown is a cross-sectional view of the furnace tube inner wall coating device and its electrical connection to an RF power supply according to an embodiment of this disclosure. Arrow X points to the first direction, which is also the extension direction of the furnace tube 20 (i.e., the length direction of the furnace tube 20), and arrow Y points to the vertical direction. The first direction X is perpendicular to the vertical direction Y.

[0032] This disclosure provides an apparatus for coating the inner wall of a furnace tube, such as... Figures 1 to 5 The furnace tube inner wall coating device 10 is applied to the processing equipment 100, and the furnace tube inner wall coating device 10 is configured to coat the inner wall of the furnace tube 20.

[0033] It is understandable that the furnace tube 20 is used in the reaction furnace of the coating equipment. The reaction furnace has a chamber, and the inner wall of the furnace tube 20 serves as the sidewall enclosing the chamber. The coating equipment can be, for example, PECVD equipment, LPCVD equipment, APCVD equipment, etc., used for depositing coatings on the surface of silicon wafers. It can also be equipment that uses gas diffusion to process raw materials, such as diffusion processes or oxidation processes, without specific limitations. Taking the deposition of coatings on the surface of silicon wafers using PECVD equipment as an example, when the reactive gas is introduced into the chamber to deposit coatings on the surface of the silicon wafer, the inner wall of the furnace tube 20 is prone to parasitic deposition of a high-stress film layer. It is necessary to disassemble the furnace tube 20 every once in a while to clean the deposited film layer. Otherwise, there is a risk that the furnace tube 20 may crack or even explode, resulting in a reduction in the service life of the furnace tube 20.

[0034] Therefore, before assembling the furnace tube 20 into the coating equipment, a protective coating is applied to the inner wall of the furnace tube 20 to prevent parasitic deposition on the inner wall during the operation of the coating equipment. It is understood that the protective coating can be deposited using PECVD, LPCVD, or other methods to achieve high density and corrosion resistance. The material of the protective coating can be silicon carbide, silicon nitride, etc., and is not specifically limited. In this embodiment, a PECVD process is used to deposit a protective coating on the inner wall of the furnace tube 20 using the furnace tube inner wall coating device 10.

[0035] Specifically, such as Figures 2 to 4 The furnace tube inner wall coating device 10 includes a quartz furnace tube 1 and a plasma generating assembly 2. The quartz furnace tube 1 has a furnace cavity 1a extending along a first direction X and communicating with the outside. The quartz furnace tube 1 can be sleeved on the inner side of the furnace tube 20, so that the furnace tube 20 and the quartz furnace tube 1 form a closed reaction cavity 20a. The reaction cavity 20a is configured to be filled with a reaction gas. The plasma generating assembly 2 is disposed on the outer wall of the furnace cavity 1a or the furnace tube 20. The plasma generating assembly 2 is configured to provide an electromagnetic field to the reaction cavity 20a to excite plasma and to coat the inner wall of the furnace tube 20. The plasma generating assembly 2 includes at least one inductor 21 and a drive 22. The inductor 21 is movably connected to the outer wall of the furnace cavity 1a or the furnace tube 20. The inductor 21 extends along the first direction X and is located near the inner wall of the quartz furnace tube 1 or near the outer wall of the furnace tube 20. The drive 22 is connected to the inductor 21 and is configured to drive the inductor 21 to rotate circumferentially around the inner wall of the quartz furnace tube 1 or around the outer wall of the furnace tube 20.

[0036] Understandably, the reaction gas can be drawn into / out of the reaction chamber 20a using a vacuum pump.

[0037] Optionally, such as Figure 1The furnace tube inner wall coating device 10 may further include a first end cap 101 and a second end cap 102. The first end cap 101 is disposed at one end of the quartz furnace tube 1 along a first direction X; the second end cap 102 is disposed at the other end of the quartz furnace tube 1 along the first direction. The first end cap 101, the second end cap 102, the furnace tube 20, and the quartz furnace tube 1 enclose a closed reaction chamber 20a. One of the first end cap 101 and the second end cap 102 is provided with at least one air inlet 101a communicating with the reaction chamber 20a. The air inlet 101a is configured to communicate with an external pipeline containing reaction gas. The other end cap 102 is provided with at least one exhaust port 102a communicating with the reaction chamber 20a. The exhaust port 102a is configured to communicate with a vacuum pump. In other examples, only one of the first end cap 101 and the second end cap 102 is provided with an inlet / outlet that communicates with the reaction chamber 20a. The inlet / outlet is configured to fill the reaction chamber 20a with reaction gas and to extract the reaction gas from the reaction chamber 20a, without specific limitations.

[0038] Optionally, the air inlet 101a may be connected to a gas equalization structure so that the reaction gas can enter the reaction chamber 20a uniformly, which will not be described in detail.

[0039] It is understood that the first end cap 101 and the second end cap 102 can be configured to match the shape and size of the annular structure formed by the sleeved furnace tube 20 and the quartz furnace tube 1. The first end cap 101 and the second end cap 102 are detachably connected to the furnace tube 20 and the quartz furnace tube 1, respectively. The specific structure of the first end cap 101 and the second end cap 102 and the specific connection method with the furnace tube 20 and the quartz furnace tube 1 will not be described in detail.

[0040] Optionally, at least one of the first end cap 101 and the second end cap 102 may be provided with a viewing window, configured to allow observation of the contents of the reaction chamber 20a from the outside, which will not be described in detail.

[0041] Optionally, the first end cap 101 and the second end cap 102 may be provided with a sealing element at the position in contact with the furnace tube 20 and the quartz furnace tube 1. The sealing element may be a sealing rubber ring to improve the sealing performance of the reaction chamber 20a.

[0042] The furnace tube inner wall coating apparatus 10 provided in this embodiment drives the rotation of an inductor 21 extending along the first direction X, which is disposed inside the furnace cavity 1a or outside the furnace tube 20, via a drive member 22. During the rotation of the inductor 21, the inductor 21 generates an electromagnetic field to ionize the corresponding reactive gas in the reaction chamber 20a into plasma for coating the inner wall of the furnace tube 20. The inductor 21 extending along the first direction X is used for coating the inner wall of the furnace tube 20, which also extends along the first direction X. During the coating process, the inductor 21 rotates circumferentially around the inner wall of the quartz furnace tube 1 or around the outer wall of the furnace tube 20. As the length of the furnace tube 20 increases, the inductor 21 can also become longer, which can meet the requirement of depositing a large-area protective coating on the inner wall of the furnace tube 20 in one step, thereby improving the uniformity of the coating on the inner wall of the furnace tube 20.

[0043] Furthermore, by connecting the quartz furnace tube 1 and the furnace tube 20 together to form an annular reaction chamber 20a, the volume of reaction gas required to fill the reaction chamber 20a is reduced, thereby reducing the vacuum discharge volume of the plasma and lowering the requirements for the vacuum equipment's pumping speed, thus reducing the consumption of reaction gas and the generation of dust.

[0044] In addition, when the inductor wire 21 is placed in the furnace cavity 1a, the quartz furnace tube 1 is arranged to be sleeved with the furnace tube 20, so that the inductor wire 21 is closer to the inner wall of the furnace tube 20, thereby shortening the transmission path required for the plasma generated by the discharge and reducing energy loss, so as to utilize the energy of the plasma generating component 2 more efficiently and improve the deposition rate.

[0045] In addition, by placing the inductor 21 on the outer wall of the furnace cavity 1a or furnace tube 20 in the atmospheric environment, problems such as parasitic deposition and unstable discharge caused by direct contact with plasma are avoided. Furthermore, the inductor 21 can be easily driven by the drive unit 22 to rotate circumferentially around the inner wall of the quartz furnace tube 1 or around the outer wall of the furnace tube 20, thereby further improving the uniformity of the coating.

[0046] Optionally, the furnace tube 20 and the quartz furnace tube 1 can be configured as square tubular structures or circular tubular structures. Both the furnace tube 20 and the quartz furnace tube 1 can be made of quartz material, and the length of the quartz furnace tube 1 in the first direction X can be matched to the length of the furnace tube 20 to be coated, so that the length of the quartz furnace tube 1 is equal to or greater than the length of the furnace tube 20, without specific limitation. In this embodiment, the furnace tube 20 and the quartz furnace tube 1 are configured as circular tubular structures, and the lengths of the furnace tube 20 and the quartz furnace tube 1 are the same.

[0047] It is understandable that the inductor 21 can be placed inside the furnace cavity 1a or on the outer wall of the furnace tube 20 according to actual needs. In this embodiment, the inductor 21 is placed inside the furnace cavity 1a, which is in an atmospheric environment.

[0048] like Figure 2 and Figure 4 The number of inductor wires 21 includes two or more, and multiple inductor wires 21 are arranged circumferentially at intervals along the inner sidewall of the quartz furnace tube 1; the quartz furnace tube 1 has a first axis 11, which is parallel to a first direction X. In any two adjacent inductor wires 21, the center of one inductor wire 21 has a first perpendicular connection with the first axis 11, and the center of the other inductor wire 21 has a second perpendicular connection with the first axis 11. There is a first angle between the first perpendicular connection and the second perpendicular connection. The driving member 22 is configured to drive at least one inductor wire 21 to rotate by the first angle.

[0049] Optionally, the inductor 21 may be in contact with the inner wall of the quartz furnace tube 1 or may have a gap with the inner wall of the quartz furnace tube 1, without specific limitation.

[0050] Optionally, the inductor 21 is a linear inductor, and the number of inductor 21 can be one or more, which can be adaptively adjusted according to actual needs. In this embodiment of the present disclosure, the number of inductor 21 is set to multiple to improve the coating rate on the inner wall of the furnace tube 20.

[0051] For example, such as Figure 2 When there are two inductor wires 21, in the initial state, the two inductor wires 21 are arranged horizontally opposite each other in the furnace cavity 1a of the quartz furnace tube 1. The line connecting the center of the two inductor wires 21 and the first axis 11 is perpendicular to the vertical direction Y. At this time, the first angle is n1, and n1 is 180°. When coating the inner wall of the furnace tube 20, the two inductor wires 21 rotate in the same direction n1 with the first axis 11 as the axis.

[0052] like Figure 4When four inductors 21 are used, in the initial state, the four inductors 21 are arranged circumferentially around the inner wall of the quartz furnace tube 1. Initially, the four inductors 21 are equally spaced around the inner wall of the quartz furnace tube 1 with the first axis 11 as the center. The two lines connecting the centers of any two adjacent inductors 21 to the first axis 11 form a second angle, n2, which is 90°. During the coating process on the inner wall of the furnace tube 20, the driving component 22 drives the four inductors 21 to rotate in the same direction (m) around the first axis 11, where m is the second angle (n2). In other examples, multiple inductors 21 are arranged non-equally around the inner wall of the quartz furnace tube 1. As long as the angle of rotation of each inductor 21 in the forward and / or reverse directions is controlled to be the angle formed between it and the next adjacent inductor 21, it can be ensured that the inner wall of the furnace tube 20 can be coated without localized multiple coatings, thus ensuring the uniformity of the coating.

[0053] Optionally, when multiple inductor lines 21 are provided, the multiple inductor lines 21 can be connected to different driving units 22 respectively, and the rotation speed of each driving unit 22 driving the inductor line 21 around the first axis 11 can be the same or different; or, the multiple inductor lines 21 can be connected to the same driving unit 22 so that the driving unit 22 drives the multiple inductor lines 21 to move around the first axis 11 at the same rotation speed.

[0054] It is understandable that when the driving element 22 is set to one, the plasma generating assembly 2 also includes an insulating support 23, which is connected to multiple inductor wires 21 and is connected to the driving element 22. The driving element 22 is configured to drive the insulating support 23 to rotate, thereby driving the multiple inductor wires 21 to rotate synchronously.

[0055] Figure 6 The image shown is a cross-sectional view of a furnace tube inner wall coating apparatus provided in an embodiment of this disclosure. Figure 7 As shown Figure 6 A magnified view of part B in the furnace tube inner wall coating device shown. Figure 8 The figure shown is a cross-sectional view of the furnace tube inner wall coating device and the furnace tube according to an embodiment of the present disclosure.

[0056] In some embodiments, such as Figure 6 and Figure 7 The inductor wire 21 has its two ends in the first direction X coinciding with the two ends of the furnace tube 20, or the inductor wire 21 has its two ends in the first direction X located outside the furnace tube 20, so as to meet the coating requirements of the inner wall of the furnace tube 20 of different lengths.

[0057] Optionally, the plasma generating assembly 2 further includes an RF power supply 24 and a capacitor 25. The RF power supply 24 is connected to the inductor 21 to form an RF circuit. The RF power supply 24 includes a ground terminal 242 and a feed terminal 241. The capacitor 25 is connected in series with the RF circuit and is located between the ground terminal 242 and the inductor 21.

[0058] It is understandable that the RF power supply 24 can use a conventional 13.56MHz or 400KHz power supply, or a power supply of other frequencies, without specific limitations.

[0059] In some embodiments, such as Figure 8 The inductor 21 is provided with a receiving cavity extending along the first direction X. The plasma generating assembly 2 also includes a cooling element 3, which is disposed in the receiving cavity and is configured to cool the inductor 21.

[0060] Optionally, the inductor wire 21 can be a copper wire, or the outer surface of the copper wire can be plated with gold or silver, etc., so that it has high conductivity and oxidation resistance while having conductivity.

[0061] Optionally, when the inductor 21 is configured in a tubular structure with a accommodating cavity, the cooling component 3 can be, for example, a coolant or a pipe through which circulating cooling water can flow, so that the inductor 21 can work stably for a long time at high power, without being specifically limited.

[0062] In some embodiments, such as Figure 7 and Figure 8 The furnace tube inner wall coating device 10 also includes a heating component 5. With the quartz furnace tube 1 fitted inside the furnace tube 20 and the plasma generating component 2 disposed in the furnace cavity 1a, the heating component 5 covers the outer wall of the furnace tube 20. The heating component 5 is used to heat the reaction cavity 20a, causing the reaction gas to be ionized at a certain temperature to generate plasma. Furthermore, an electromagnetic shielding layer 4 can be provided between the heating component 5 and the outer wall of the furnace tube 20. This electromagnetic shielding layer 4 shields the generated plasma from interfering with the heating component 5, ensuring heating stability.

[0063] It is understandable that when the quartz furnace tube 1 is fitted inside the furnace tube 20 and the plasma generating component 2 is disposed on the outer wall of the furnace tube 20, the heating component 5 covers the inner wall of the quartz furnace tube 1, and the electromagnetic shielding layer 4 is disposed between the quartz furnace tube 1 and the heating component 5, which will not be described in detail here.

[0064] In an optional embodiment, the heating assembly 5 includes a heating element and a heat insulation layer. The heating element is disposed on the side of the electromagnetic shielding layer 4 away from the furnace tube 20, and the heat insulation layer covers the side of the heating element away from the electromagnetic shielding layer 4, so that more heat generated by the heating element flows to the furnace tube 20, reducing heat loss and thereby increasing the heating rate of the reaction chamber 20a.

[0065] Alternatively, the heating element may be, for example, a heating wire or heating rod arranged around the outer wall of the furnace tube 20, without specific limitation.

[0066] This disclosure also provides a processing device, such as... Figure 1 The processing equipment 100 includes a workbench 30 and a furnace tube inner wall coating device 10. The workbench 30 is configured to place the furnace tube 20 and the furnace tube inner wall coating device 10. The furnace tube inner wall coating device 10 is disposed on the workbench 30 and is detachably connected to the furnace tube 20. The furnace tube inner wall coating device 10 is configured to coat the inner wall of the furnace tube 20.

[0067] It is understood that the furnace tube inner wall coating device 10 can refer to the relevant descriptions in the above embodiments, and will not be repeated here.

[0068] Optionally, the processing equipment 100 may also include a fixed connector 40, which is disposed on the worktable 30 and configured to support the sleeved furnace tube 20 and quartz furnace tube 1, which will not be described in detail.

[0069] In the embodiments of this disclosure, unless otherwise specified, the connection can be a detachable connection using bolts and nuts, screws, clips, magnetic attraction, etc. In some connections where there is no particular requirement for a detachable fit, a non-detachable connection can be achieved through welding, bonding, or other methods.

[0070] The basic principles of this disclosure have been described above with reference to specific embodiments. However, it should be noted that the advantages, benefits, and effects mentioned in this disclosure are merely examples and not limitations, and should not be considered as essential features of each embodiment of this disclosure. Furthermore, the specific details disclosed above are for illustrative and facilitative purposes only, and are not limitations. These details do not limit the scope of this disclosure to the necessity of employing the aforementioned specific details for implementation.

[0071] The block diagrams of devices, apparatuses, devices, and systems disclosed herein are merely illustrative examples and are not intended to require or imply that they must be connected, arranged, or configured in the manner shown in the block diagrams. As those skilled in the art will recognize, these devices, apparatuses, devices, and systems can be connected, arranged, and configured in any manner. Words such as “comprising,” “including,” “having,” etc., are open-ended terms meaning “including but not limited to,” and are used interchangeably with them. The terms “or” and “and” as used herein refer to the terms “and / or,” and are used interchangeably with them unless the context clearly indicates otherwise. The term “such as” as used herein refers to the phrase “such as but not limited to,” and is used interchangeably with it.

[0072] It should also be noted that in the apparatus, devices, and methods of this disclosure, the components or steps can be disassembled and / or recombined. These disassemblies and / or recombinations should be considered as equivalent solutions to this disclosure.

[0073] The above description of the disclosed aspects is provided to enable any person skilled in the art to make or use this disclosure. Various modifications to these aspects will be readily apparent to those skilled in the art, and the general principles defined herein may be applied to other aspects without departing from the scope of this disclosure. Therefore, this disclosure is not intended to be limited to the aspects shown herein, but rather to be carried out within the widest scope consistent with the principles and novel features disclosed herein.

[0074] The above description has been given for purposes of illustration and description. Furthermore, this description is not intended to limit the embodiments of this disclosure to the forms disclosed herein. Although numerous exemplary aspects and embodiments have been discussed above, those skilled in the art will recognize certain variations, modifications, alterations, additions, and sub-combinations therein.

Claims

1. A furnace tube inner wall coating device, characterized in that, Configured to coat the inner wall of a furnace tube, wherein the furnace tube inner wall coating apparatus includes: A quartz furnace tube has a furnace cavity extending along a first direction and communicating with the outside. The quartz furnace tube can be sleeved on the inner side of the furnace tube, and the furnace tube and the quartz furnace tube form a closed reaction cavity, which is configured to be filled with a reaction gas. A plasma generating assembly is configured to provide an electromagnetic field to the reaction chamber to excite plasma and to coat the inner wall of the furnace tube. The plasma generating assembly includes: At least one inductor wire is movably connected to the outer wall of the furnace cavity or the furnace tube. The inductor wire extends along the first direction and is located near the inner wall of the quartz furnace tube or near the outer wall of the furnace tube. A driving element, connected to the inductor, is configured to drive the inductor to rotate circumferentially around the inner wall of the quartz furnace tube or around the outer wall of the furnace tube.

2. The furnace tube inner wall coating apparatus according to claim 1, characterized in that, The number of inductor wires includes two or more, and the multiple inductor wires are arranged at intervals along the circumferential sidewall of the quartz furnace tube. The quartz furnace tube has a first axis parallel to the first direction. In any two adjacent inductor lines, the center of one inductor line has a first perpendicular connection with the first axis, and the center of the other inductor line has a second perpendicular connection with the first axis. There is a first angle between the first perpendicular connection and the second perpendicular connection. The drive is configured to drive at least one inductor line to rotate by the first angle.

3. The furnace tube inner wall coating apparatus according to claim 2, characterized in that, The plasma generating assembly further includes: An insulating bracket is connected to multiple inductor wires, and the insulating bracket is connected to the driving member. The multiple inductor wires are arranged at equal intervals along the circumference of the inner sidewall of the quartz furnace tube. The two connecting lines formed by the centers of any two adjacent inductor wires and the first axis have a second angle. The driving member is configured to drive the insulating bracket to rotate by the second angle.

4. The furnace tube inner wall coating apparatus according to claim 1, characterized in that, The inductor wires are respectively aligned with the two ends of the furnace tube at both ends in the first direction, or the inductor wires are respectively located outside the furnace tube at both ends in the first direction.

5. The furnace tube inner wall coating apparatus according to claim 1, characterized in that, The inductor wire has a receiving cavity extending along the first direction, and the plasma generating assembly further includes: A cooling element is disposed in the accommodating cavity, and the cooling element is configured to cool the inductor wire.

6. The furnace tube inner wall coating apparatus according to claim 1, characterized in that, The plasma generating assembly further includes: A radio frequency (RF) power supply is connected to the inductor to form an RF circuit, and the RF power supply includes a ground terminal and a feed-in terminal. A capacitor is connected in series with the radio frequency circuit, and the capacitor is located between the ground terminal and the inductor.

7. The furnace tube inner wall coating apparatus according to any one of claims 1-6, characterized in that, Also includes: In the case where the quartz furnace tube is fitted inside the furnace tube and the plasma generating component is disposed in the furnace cavity, the heating component covers the outer wall of the furnace tube; in the case where the quartz furnace tube is fitted inside the furnace tube and the plasma generating component is disposed on the outer wall of the furnace tube, the heating component covers the inner wall of the quartz furnace tube. The furnace tube inner wall coating device also includes: An electromagnetic shielding layer is disposed between the furnace tube and the heating component, or between the quartz furnace tube and the heating component.

8. The furnace tube inner wall coating apparatus according to claim 7, characterized in that, The heating component includes: The heating element is disposed on the side of the electromagnetic shielding layer away from the furnace tube; A heat insulation protective layer covers the side of the heating element away from the electromagnetic shielding layer.

9. The furnace tube inner wall coating apparatus according to any one of claims 1-6, characterized in that, Also includes: A first end cap is disposed at one end of the quartz furnace tube along the first direction; The second end cap is disposed at the other end of the quartz furnace tube along the first direction, and the first end cap, the second end cap, the furnace tube and the quartz furnace tube enclose the closed reaction chamber. The first end cap and the second end cap are provided with at least one air inlet communicating with the reaction chamber, and the air inlet is configured to communicate with an external pipeline containing reaction gas. The other end cap is provided with at least one air extraction port communicating with the reaction chamber, and the air extraction port is configured to communicate with a vacuum pump.

10. A processing device, characterized in that, include: The workbench is configured to hold the furnace tubes; The furnace tube inner wall coating apparatus according to any one of claims 1-9 is disposed on the workbench, the furnace tube inner wall coating apparatus is detachably connected to the furnace tube, and the furnace tube inner wall coating apparatus is configured to coat the inner wall of the furnace tube.

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