A high-pressure high-electric-field MPCVD deposition chamber
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- WUHAN CHEN GUANG GUANG TIAN TECH CO LTD
- Filing Date
- 2025-05-14
- Publication Date
- 2026-06-26
AI Technical Summary
The mixing method of reaction gases in traditional MPCVD equipment leads to uneven distribution of gas components, which affects the uniformity and quality of the deposited material, resulting in differences in deposition rate and poor film performance.
The design employs a spiral tube and connecting cylinder, and ensures uniform distribution of gas components within the deposition cylinder through two mixing processes. Combined with a hot water circulation system and a semiconductor cooling chip to control the temperature, it ensures stable surface temperature of the spiral tube, and uses a ceramic rod to control the substrate stage temperature.
This method achieves uniform distribution of gas components within the deposition chamber, improves the overall performance of the thin film, enhances reaction efficiency, and promotes the activation efficiency of the reactive gases, thereby improving the quality of material deposition, especially suitable for the deposition of temperature-sensitive materials.
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Figure CN224411901U_ABST