A heat dissipation system of a refrigeration and heating dual-purpose cup mat

Abstract

The utility model discloses a heat dissipation system of refrigeration and heating dual -purpose cup mat, including shell body and heat dissipation module, and heat dissipation module includes heat dissipation seat and heat dissipation fan, and heat dissipation seat includes the heat dissipation mounting panel for attaching installation semiconductor refrigeration piece, and the hot end of semiconductor refrigeration piece is attached to set up in the upper end surface of heat dissipation mounting panel, and the lower end surface of heat dissipation mounting panel is provided with heat dissipation fin group, and heat dissipation fin group includes a plurality of heat dissipation fins perpendicular to heat dissipation mounting panel, and a plurality of heat dissipation fins are arranged in parallel interval, and form the heat dissipation channel of through between the adjacent heat dissipation fin, and the characteristic is that heat dissipation fan is set up in the side of heat dissipation fin group and is sent air to heat dissipation channel. The advantage is simple structure, and the whole volume of cup mat and heat dissipation efficiency are realized at the same time.

Description

Technical Field

[0001] This utility model relates to a dual-purpose coaster for both cooling and heating, and more particularly to a heat dissipation system for a dual-purpose coaster for both cooling and heating. Background Technology

[0002] A cooling / heating coaster is a portable, small temperature-controlled device primarily used to heat or cool beverages (such as water, coffee, tea, etc.) in a cup. It mainly consists of a shell, a temperature control module, a heat dissipation mechanism, and a circuit control section. The temperature control module is the core component of this type of coaster, typically a thermoelectric cooler (TEK). It achieves cooling or heating primarily through the Peltier effect. The circuit control section switches between cooling and heating modes by changing the direction of the current. In cooling mode, the heat at the other end must be dissipated quickly. High thermal resistance on the hot side during cooling will reduce cooling efficiency. Therefore, a corresponding heat dissipation system needs to be installed inside the coaster. Currently, common heat dissipation systems used in this type of coaster consist of a heat sink base supplemented by a cooling fan. The heat sink base has a mounting plate for mounting the TCK. The hot end of the TCK is attached to the upper surface of the mounting plate, and the lower surface of the mounting plate has a heat dissipation fin assembly. The heat generated by the hot end of the TCK in cooling mode is first received by the mounting plate and then dissipated by the heat dissipation fin assembly in conjunction with the cooling fan.

[0003] Currently, the common heat dissipation mechanisms used in coasters of this type typically place the cooling fan below the heat sink. For example, Chinese utility model patent number 201920838372.X discloses a coaster that can be used for both rapid cooling and heating, with the fan attached to the bottom surface of the heat sink. This structure cannot simultaneously achieve both size and heat dissipation efficiency; higher heat dissipation efficiency requires a larger overall size, while a smaller size necessitates sacrificing heat dissipation efficiency. Therefore, how to simultaneously balance size and heat dissipation efficiency has become a pressing issue. Summary of the Invention

[0004] The technical problem to be solved by this utility model is to provide a heat dissipation system for a coaster that can be used for both cooling and heating, so as to simultaneously take into account the overall size of the coaster and the heat dissipation efficiency.

[0005] The technical solution adopted by this utility model to solve the above-mentioned technical problems is as follows:

[0006] A heat dissipation system for a dual-purpose cooling and heating coaster includes an outer shell and a heat dissipation module disposed within the outer shell. The heat dissipation module includes a heat dissipation base and a heat dissipation fan. The heat dissipation base includes a heat dissipation mounting plate for attaching and mounting a thermoelectric cooler. The hot end of the thermoelectric cooler is attached to the upper surface of the heat dissipation mounting plate. A heat dissipation fin assembly is disposed on the lower surface of the heat dissipation mounting plate. The heat dissipation fin assembly includes multiple heat dissipation fins perpendicular to the heat dissipation mounting plate. The multiple heat dissipation fins are arranged in parallel and spaced apart, and a through heat dissipation channel is formed between adjacent heat dissipation fins. The heat dissipation fan is disposed on the side of the heat dissipation fin assembly and blows air towards the heat dissipation channel.

[0007] The cooling fans are two in number and are arranged side by side along a direction perpendicular to the cooling channels. All the cooling channels are located within the airflow area formed by the two cooling fans when they are working.

[0008] The outer casing has heat dissipation areas on two opposite side walls corresponding to the through direction of the heat dissipation channel, and the heat dissipation areas have several heat dissipation slots.

[0009] All heat dissipation channels are located within the aforementioned heat dissipation area.

[0010] The upper end of the heat dissipation fins is bent horizontally to form an upper connecting part, which is fixedly mounted on the lower end surface of the heat dissipation mounting plate.

[0011] The upper connecting portions on the multiple heat dissipation fins are bent in the same direction, and adjacent upper connecting portions are fixed together by welding.

[0012] The lower end of the heat dissipation fins is bent horizontally to form a lower connecting part. The lower connecting parts on multiple heat dissipation fins are bent in the same direction, and adjacent lower connecting parts are fixed together by welding.

[0013] The heat dissipation mounting plate is embedded with an auxiliary heat dissipation component for assisting heat dissipation, and the auxiliary heat dissipation component contains a cooling medium.

[0014] The auxiliary heat sink is disposed on the heat sink mounting plate in the area where the semiconductor cooling chip is attached and mounted.

[0015] Compared with the prior art, the advantages of this utility model are:

[0016] (1) The cooling fan is changed from the traditional bottom installation to the side arrangement, directly targeting the heat dissipation channel formed by the heat dissipation fins to form a horizontal through airflow, which effectively enhances the air convection efficiency. Compared with the bottom air supply mode, the wind resistance is reduced and the heat dissipation air volume per unit time is increased, which effectively improves the heat dissipation efficiency.

[0017] (2) The parallel and spaced vertical heat dissipation fins and the side-mounted heat dissipation fan form a three-dimensional heat dissipation structure, which greatly reduces the overall height of the coaster under the same heat dissipation area, realizes the thin design, and solves the problem of the positive correlation between heat dissipation efficiency and volume in traditional structures.

[0018] (3) The heat dissipation mounting plate adopts a double-sided design. The upper end directly contacts the hot end of the semiconductor cooling chip to achieve rapid heat conduction. The lower end expands the heat dissipation area through the heat dissipation fin group. Combined with the lateral forced convection of the cooling fan, a complete and efficient thermal management chain of "heat conduction-diffusion-forced heat dissipation" is formed.

[0019] (4) The through-type heat dissipation channel formed between adjacent heat dissipation fins is parallel to the air outlet direction of the cooling fan, avoiding the problems of turbulence and dead angles in traditional bottom air supply, so that the cold air can penetrate the gaps of all heat dissipation fins evenly, and the heat exchange efficiency can be effectively improved. Attached Figure Description

[0020] Figure 1 A three-dimensional structural diagram of a coaster incorporating the heat dissipation system of this utility model;

[0021] Figure 2 This is a three-dimensional structural diagram of the heat dissipation module with a semiconductor cooling chip attached according to this utility model;

[0022] Figure 3 This is an exploded view of the heat dissipation module in this utility model;

[0023] Figure 4 This is a three-dimensional structural diagram of the heat sink in this utility model;

[0024] Figure 5 This is a cross-sectional view of the heat sink in this utility model.

[0025] Figure 6 This is a front view schematic diagram of the heat dissipation fins in this utility model;

[0026] Figure 7 This is a three-dimensional structural diagram of the heat dissipation mounting plate in this utility model. Detailed Implementation

[0027] The present invention will be further described in detail below with reference to the accompanying drawings and embodiments.

[0028] As shown in the figure, a heat dissipation system for a dual-purpose cooling and heating coaster includes an outer shell 1 and a heat dissipation module disposed within the outer shell 1. The heat dissipation module includes a heat dissipation base 2 and a heat dissipation fan 3. The heat dissipation base 2 includes a heat dissipation mounting plate 21 for attaching and mounting a semiconductor cooling chip 4. The hot end of the semiconductor cooling chip 4 is attached to the upper surface of the heat dissipation mounting plate 21. A heat dissipation fin assembly 20 is disposed on the lower surface of the heat dissipation mounting plate 21. The heat dissipation fin assembly 20 includes multiple heat dissipation fins 201 perpendicular to the heat dissipation mounting plate 21. The multiple heat dissipation fins 201 are arranged in parallel and spaced apart, and a through heat dissipation channel 22 is formed between adjacent heat dissipation fins 201. The heat dissipation fan 3 is disposed on the side of the heat dissipation fin assembly 20 and blows air towards the heat dissipation channel 22.

[0029] In this specific embodiment, there are two cooling fans 3, which are arranged side by side along a direction perpendicular to the heat dissipation channel 22. All heat dissipation channels 22 are located within the airflow area formed by the two cooling fans 3 during operation. The side-by-side arrangement of the two fans ensures that all heat dissipation channels 22 are within the airflow coverage area, avoiding local heat accumulation and improving the overall consistency of heat dissipation. The dual-fan working together can generate higher air pressure, forcing airflow to penetrate the dense heat dissipation fin assembly 20, which significantly improves the heat dissipation efficiency per unit time compared to a single-fan system. If one cooling fan 3 fails, the other cooling fan 3 can still maintain basic heat dissipation capacity, preventing the semiconductor cooling chip 4 from overheating and being damaged due to the failure of the cooling fan 3.

[0030] In this specific embodiment, heat dissipation areas 10 are respectively provided on two opposite side walls of the outer casing 1 corresponding to the through direction of the heat dissipation channel 22. The heat dissipation area 10 has a plurality of heat dissipation slots 101. The above design places the heat dissipation slots 101 in the extension direction of the heat dissipation channel 22, forming a straight air duct with the air delivery direction of the cooling fan 3, reducing airflow detour resistance and achieving efficient closed-loop heat dissipation of "intake-penetration-exhaust". The heat dissipation slot structure 101 can still dissipate heat through natural convection when the cooling fan 3 is not started, reducing heat accumulation in standby mode and improving system safety.

[0031] In this specific embodiment, all heat dissipation channels 22 are located within the heat dissipation area 10. The fact that all heat dissipation channels 22 are located within the heat dissipation area 10 of the outer casing ensures that heat from the gaps between all heat dissipation fins 201 can be quickly discharged through the heat dissipation channel 101, avoiding secondary heating caused by hot air recirculation; the airflow is directed in a straight line from "fan—fins—channel," reducing turbulence and wind noise.

[0032] In this specific embodiment, the upper end of the heat dissipation fin 201 is horizontally bent to form an upper connecting portion 2011, which is fixedly disposed on the lower end surface of the heat dissipation mounting plate 21. The horizontal bending design of the upper connecting portion 2011 increases the contact area with the heat dissipation mounting plate 21, improves the heat conduction efficiency, and the welding fixing method ensures structural stability and reduces thermal resistance.

[0033] In this specific embodiment, the upper connecting portions 2011 on multiple heat dissipation fins 201 are bent in the same direction, and adjacent upper connecting portions 2011 are fixed together by welding. The bending and welding in the same direction make multiple heat dissipation fins 201 form an integral connection on the lower end face of the heat dissipation mounting plate 21, which enhances the structural strength and avoids deformation or loosening due to thermal expansion and contraction.

[0034] In this specific embodiment, the lower end of the heat dissipation fin 201 is horizontally bent to form a lower connecting portion 2012. The lower connecting portions 2012 on multiple heat dissipation fins 201 are bent in the same direction, and adjacent lower connecting portions 2012 are fixed together by welding. The horizontal bending and welding of the lower connecting portions 2012 further strengthen the integrity of the heat dissipation fin assembly 20 and improve mechanical stability. At the same time, it helps to distribute heat evenly throughout the heat dissipation structure. In conjunction with the upper connecting portion 2011, it forms a complete heat dissipation channel 22 that runs through in one direction. Together with the cooling fan 3 and the heat dissipation slot 101, it can quickly dissipate heat to the outside.

[0035] In this specific embodiment, the heat dissipation mounting plate 21 is embedded with an auxiliary heat dissipation component 5 for assisting heat dissipation, and the auxiliary heat dissipation component 5 contains a cooling medium. This further accelerates heat dissipation.

[0036] In this specific embodiment, the auxiliary heat sink 5 is disposed on the heat dissipation mounting plate 21 in the area where the thermoelectric cooler 4 is attached and mounted. It can efficiently absorb the heat generated by the hot end of the thermoelectric cooler 4 in a timely manner, achieving rapid cooling and heat dissipation.

[0037] In this specific embodiment, the heat sink 2 is made of a metal material with good thermal conductivity, such as copper, aluminum or alloy. The high thermal conductivity metal can quickly transfer heat to the entire heat sink 2, reducing the risk of local overheating and improving heat dissipation efficiency.

Claims

1. A heat dissipation system of a refrigeration and heating dual-purpose cup mat, comprising an outer housing and a heat dissipation module arranged in the outer housing, the heat dissipation module comprising a heat dissipation seat and a heat dissipation fan, the heat dissipation seat comprising a heat dissipation mounting plate for attaching a semiconductor refrigeration sheet, a hot end of the semiconductor refrigeration sheet being attached to an upper end surface of the heat dissipation mounting plate, a lower end surface of the heat dissipation mounting plate being provided with a heat dissipation fin group, the heat dissipation fin group comprising a plurality of heat dissipation fins perpendicular to the heat dissipation mounting plate, the plurality of heat dissipation fins being arranged in parallel and spaced apart, through heat dissipation channels being formed between adjacent heat dissipation fins, characterized in that The cooling fan is located on the side of the heat dissipation fin assembly and blows air into the heat dissipation channel.

2. The heat dissipation system of the dual-purpose cooling and heating coaster as described in claim 1, characterized in that... The cooling fans are two in number and are arranged side by side along a direction perpendicular to the cooling channels. All the cooling channels are located within the airflow area formed by the two cooling fans when they are working.

3. The heat dissipation system of a dual-purpose cooling and heating coaster as described in claim 1, characterized in that... The outer casing has heat dissipation areas on two opposite side walls corresponding to the through direction of the heat dissipation channel, and the heat dissipation areas have several heat dissipation slots.

4. The heat dissipation system of a dual-purpose cooling and heating coaster as described in claim 3, characterized in that... All heat dissipation channels are located within the aforementioned heat dissipation area.

5. The heat dissipation system of a dual-purpose cooling and heating coaster as described in claim 1, characterized in that... The upper end of the heat dissipation fins is bent horizontally to form an upper connecting part, which is fixedly mounted on the lower end surface of the heat dissipation mounting plate.

6. The heat dissipation system of a dual-purpose cooling and heating coaster as described in claim 1, characterized in that... The upper connecting portions on multiple heat dissipation fins are bent in the same direction, and adjacent upper connecting portions are fixed together by welding.

7. The heat dissipation system of a dual-purpose cooling and heating coaster as described in claim 5, characterized in that... The lower end of the heat dissipation fins is bent horizontally to form a lower connecting part. The lower connecting parts on multiple heat dissipation fins are bent in the same direction, and adjacent lower connecting parts are fixed together by welding.

8. The heat dissipation system of a dual-purpose cooling and heating coaster as described in claim 1, characterized in that... The heat dissipation mounting plate is embedded with an auxiliary heat dissipation component for assisting heat dissipation, and the auxiliary heat dissipation component contains a cooling medium.

9. The heat dissipation system of a dual-purpose cooling and heating coaster as described in claim 8, characterized in that... The auxiliary heat sink is disposed on the heat sink mounting plate in the area where the semiconductor cooling chip is attached and mounted.

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