Temperature detection mounting structure and inverter

Abstract

The utility model provides a kind of temperature detection mounting structure and inverter, it is related to sensor assembly technical field.The temperature detection mounting structure of the present application is by being provided with support block between flexible connecting piece and semiconductor element, its top surface is connected with flexible connecting piece, bottom surface is fixed in semiconductor element, form support structure, can effectively disperse external pressure, avoid the deformation or displacement of temperature sensor due to pressure;While cooperating the bendable characteristics of flexible connecting piece, the composite structure of traditional rigid PIN needle connection is converted into flexible connection and support protection, both avoid the defect that PIN needle is easy to break in vibration environment, and the stability of sensor installation is improved by the support of support block, fundamentally solve the problem of low sensor fixing reliability, significantly prolong the service life of sensor under vibration working condition.The inverter of the application includes temperature detection mounting structure thereon, and has the corresponding beneficial effects thereof.

Description

Technical Field

[0001] This utility model relates to the field of sensor assembly technology, and in particular to a temperature detection mounting structure and inverter. Background Technology

[0002] Inverters play a crucial role in new energy vehicles, their main function being to convert the direct current (DC) from the battery pack into alternating current (AC) to power the motor. The semiconductor components in the inverter generate a significant amount of heat during operation, especially the IGBT chips.

[0003] Because the significant heat generated by IGBT chips during continuous switching can affect their efficiency and even functionality, temperature sensors are commonly used to detect the temperature of IGBT chips and prevent overheating. Temperature sensors can be packaged together with the IGBT chip or installed separately.

[0004] For stand-alone installations, temperature sensors often feature a pin-type structure. For example... Figure 1 As shown, the PIN pins of the temperature sensor are soldered onto PCB1. Similarly, the PIN pins of the IGBT chip are electrically connected to the PCB via soldering. The temperature sensor transmits the temperature signal to the PCB through the PIN pins, and the circuitry on the PCB controls the switching duty cycle of the IGBT chip based on the temperature signal to prevent overheating. However, because the temperature sensor itself is small and its PIN pins are relatively thin and fragile, the PIN pins of the temperature sensor are prone to breakage under vibration conditions during use, causing the temperature sensor to malfunction. Utility Model Content

[0005] In view of the shortcomings of the prior art described above, the purpose of this utility model is to provide a temperature detection installation structure and inverter to solve the related problems in the prior art.

[0006] To achieve the above and other related objectives, this utility model provides a temperature detection installation structure, comprising:

[0007] Semiconductor components;

[0008] The PCB board is electrically connected to the semiconductor components;

[0009] A sensor is disposed on the surface of the semiconductor element near the PCB board to detect the temperature of the semiconductor element;

[0010] A flexible connector is provided, through which the sensor is electrically connected to the PCB board;

[0011] A support block is disposed between the flexible connector and the semiconductor element, and the support block supports the flexible connector to reduce the pressure on the sensor.

[0012] Furthermore, the flexible connector includes a first connecting portion, a transition connecting portion, and a second connecting portion that are folded back in sequence;

[0013] The first connecting part is electrically connected to the PCB board;

[0014] The second connection portion is located between the PCB board and the semiconductor element, and the sensor is connected to the side of the second connection portion closer to the semiconductor element.

[0015] Furthermore, foam is provided between the second connecting part and the PCB board to provide compression force for the flexible connector.

[0016] Furthermore, the foam and the support block are symmetrically arranged about the second connecting portion, and the projected surface shapes of the foam and the support block are the same.

[0017] Furthermore, a thermally conductive adhesive layer is provided between the sensor and the semiconductor element.

[0018] Furthermore, the cross-sectional shape of the support block is U-shaped, the sensor is located within the U-shaped area of ​​the support block, and an overflow groove is formed at the opening of the U-shaped end of the support block.

[0019] Furthermore, the support block is provided in two sets, both sets of the support block are strip-shaped block structures, respectively set on both sides of the sensor, and two overflow grooves are formed between the two ends of the two sets of the support block.

[0020] Furthermore, the flexible connector is a flexible printed circuit board, and a board-end connector is provided on the PCB board. The flexible connector is electrically connected to the PCB board through the board-end connector.

[0021] Furthermore, the support block is welded or bonded to the semiconductor element using pressure-sensitive adhesive.

[0022] This application also discloses an inverter, including a temperature sensing mounting structure as described in any of the above.

[0023] As described above, the temperature detection mounting structure and inverter of this utility model have at least the following beneficial effects, including but not limited to:

[0024] The temperature detection mounting structure of this application sets a support block between the flexible connector and the semiconductor element. The top surface of the support block is connected to the flexible connector, and the bottom surface is fixed to the semiconductor element, forming a support structure. This structure can effectively disperse external pressure and prevent the temperature sensor from deforming or shifting due to pressure. At the same time, in conjunction with the flexible connector's bendability, the traditional PIN pin connection is transformed into a composite structure of flexible connection and support protection. This not only avoids the defect of PIN pins being prone to breakage under vibration, but also improves the stability of sensor installation through the support block. This fundamentally solves the problem of low sensor fixation reliability and significantly extends the sensor's service life under vibration conditions. Attached Figure Description

[0025] Figure 1 This is a schematic diagram of the sensor installation structure in related technologies;

[0026] Figure 2 The diagram shown is a structural schematic of the temperature detection installation structure in this application.

[0027] Figure 3 The example shown is from this application. Figure 2 A schematic diagram of the local cross-sectional structure at point A in the middle;

[0028] Figure 4 This is shown as another embodiment of the present application. Figure 2 A schematic diagram of the local cross-sectional structure at point A.

[0029] Icons: 1. PCB board, 2. Sensor, 3. Semiconductor component, 4. Support block, 5. Foam, 6. Flexible connector, 7. Board end connector, 8. Glue overflow groove, 9. PIN pin. Detailed Implementation

[0030] The following specific examples illustrate the implementation of this utility model. Those skilled in the art can easily understand other advantages and effects of this utility model from the content disclosed in this specification. This utility model can also be implemented or applied through other different specific embodiments, and various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of this utility model. It should be noted that, unless otherwise specified, the following embodiments and features described therein can be combined with each other.

[0031] It should be noted that the illustrations provided in the following embodiments are only schematic representations of the basic concept of the present invention. Therefore, the illustrations only show the components related to the present invention and are not drawn according to the number, shape and size of the components in actual implementation. In actual implementation, the form, quantity and proportion of each component can be arbitrarily changed, and the layout of the components may also be more complex.

[0032] Please refer to Figure 2 This application discloses a temperature detection mounting structure, including a semiconductor element 3, a PCB board 1, a sensor 2, a flexible connector 6, and a support block 4; the PCB board 1 is electrically connected to the semiconductor element 3; the sensor 2 is disposed on the surface of the semiconductor element 3 near the PCB board 1, for detecting the temperature of the semiconductor element 3; the sensor 2 is electrically connected to the PCB board 1 through the flexible connector 6; the support block 4 is disposed between the flexible connector 6 and the semiconductor element 3, and the support block 4 supports the flexible connector 6 to reduce the pressure on the sensor 2.

[0033] It is worth noting that the temperature detection mounting structure of this application, by setting a support block 4 between the flexible connector 6 and the semiconductor element 3, with its top surface connected to the flexible connector 6 and its bottom surface fixed to the semiconductor element 3, forms a support structure. This effectively disperses external pressure and prevents the temperature sensor 2 from deforming or shifting due to pressure. Simultaneously, the flexible connector 6's bendability transforms the traditional rigid pin connection into a composite structure of flexible connection and support protection. This avoids the defect of pin breakage under vibration, and the support block 4 enhances the stability of the sensor 2 installation, fundamentally solving the problem of low sensor 2 fixation reliability and significantly extending the sensor 2's service life under vibration conditions. It should be noted that, due to its inherent characteristics, the sensor is more susceptible to external factors such as vibration; therefore, a flexible connector is used instead of a traditional pin connection. The PCB board 1 and the semiconductor element 3 can be electrically connected via pins 9. It should be noted that the height of the support block 4 should be greater than or equal to the installation thickness of the sensor 2 to achieve the corresponding support effect.

[0034] Please see Figure 2 The flexible connector 6 includes a first connecting part, a transition connecting part, and a second connecting part that are folded back in sequence; the first connecting part is electrically connected to the PCB board 1; the second connecting part is located between the PCB board 1 and the semiconductor element 3, and the sensor 2 is connected to the side of the second connecting part closer to the semiconductor element 3.

[0035] Specifically, the flexible connector 6 adopts a folded structure consisting of a first connecting part, a transition connecting part, and a second connecting part. This shortens the temperature measurement path and improves the real-time performance of temperature detection. Furthermore, the folded design flexibly adapts to the spatial relationship between the semiconductor element 3 and the PCB board, reducing installation space requirements. The flexibility of the transition connecting part further buffers vibration stress, enhancing the overall structure's resistance to bending. It should also be noted that the sensor 2 is connected to the side of the second connecting part closer to the semiconductor element 3, placing it between the second connecting part of the flexible connector 6 and the semiconductor element 3, thus fulfilling the spatial arrangement requirements for the support block 4. Moreover, compared to a design where the sensor is connected to the side of the second connecting part closer to the semiconductor element 3, the second connecting part of the flexible connector 6 does not need to be directly connected to the semiconductor element 3 being measured. Even when the temperature of the semiconductor element 3 is very high, the flexible connector 6 will not experience electrical performance failure due to excessive temperature. Therefore, the overall electrical performance of the structure in this embodiment is more stable.

[0036] Please see Figures 2-4 Foam 5 is provided between the second connecting part and the PCB board to provide compression force for the flexible connector 6.

[0037] Specifically, the foam 5 between the second connecting part of the flexible connector 6 and the PCB board generates a continuous pressing force through elastic deformation, which can provide pressing force for the flexible connector 6 and avoid poor contact caused by vibration. At the same time, the buffering effect of the foam 5 can absorb the small deformation of the flexible connector 6 and the vibration of the structure body caused by external factors, prevent the circuit from breaking due to repeated bending, and improve the stability and durability of the electrical connection.

[0038] In this embodiment, please refer to Figure 4 The foam 5 and the support block 4 are symmetrically arranged about the second connecting part, and the projected surface shapes of the foam 5 and the support block 4 are the same.

[0039] Specifically, the foam 5 and the support block 4 are symmetrically arranged about the second connection part and have the same projected shape, which can make the upper and lower surfaces of the flexible connector 6 uniformly stressed, avoiding deformation or warping caused by local stress concentration, further optimizing the balance of the structure, and ensuring the positional accuracy and temperature measurement reliability of the sensor 2 under long-term vibration conditions. Furthermore, the projected areas of the foam 5 and the support block 4 are also the same, which can further ensure the balance of their stress.

[0040] In this embodiment, a thermally conductive adhesive layer is provided between the sensor 2 and the semiconductor element 3.

[0041] It should be noted that the thermally conductive adhesive layer between sensor 2 and semiconductor element 3 enhances heat conduction efficiency, reduces temperature measurement delay, and enables sensor 2 to more accurately capture the real-time temperature of semiconductor element 3. This improves the response sensitivity and accuracy of the temperature control system, avoiding the risk of motor overheating or aging due to temperature measurement deviations. Simultaneously, the distance between the support block 4 and the flexible connector 6 and semiconductor element 3 is greater than the installation thickness of sensor 2, ensuring sufficient space for dispensing the thermally conductive adhesive layer. Optionally, the thermally conductive adhesive used can be TC4525 type adhesive, or other types or models of adhesive, depending on the specific requirements; no further limitations are imposed here.

[0042] In this embodiment, please refer to Figure 3 The cross-sectional shape of the support block 4 is U-shaped, the sensor 2 is located within the U-shaped area of ​​the support block 4, and an overflow groove 8 is formed at the opening of the U-shaped end of the support block 4.

[0043] Specifically, the U-shaped cross-section of the support block 4 can enhance the support and protection of the sensor 2 through an enclosed support form, while also allowing for the overflow groove 8 to accommodate the overflow of thermally conductive adhesive during the dispensing process, preventing adhesive accumulation from affecting structural performance and improving the reliability and consistency of the assembly process.

[0044] In this embodiment, please refer to Figure 4 The support block 4 is provided in two sets, both sets of the support block 4 are strip-shaped block structures, respectively set on both sides of the sensor 2, and two overflow grooves 8 are formed between the two ends of the two sets of support blocks 4.

[0045] Specifically, two sets of strip-shaped support blocks 4 are symmetrically arranged on both sides of the sensor 2. The pressure on the sensor 2 is dispersed by the support on both sides. While meeting the support requirements, the strip structure is easier to process and form, reducing the structural complexity of the workpiece and the production cost. In addition, the overflow grooves 8 formed at both ends can conveniently and effectively guide the overflow of thermal conductive adhesive, preventing the thermal conductive adhesive residue from affecting the performance of the sensor 2. While meeting the support function, the processing convenience and production efficiency are significantly improved.

[0046] In some embodiments, the flexible connector 6 is a flexible printed circuit board, and the PCB board 1 is provided with a board end connector 7. The flexible connector 6 is electrically connected to the PCB board 1 through the board end connector 7.

[0047] Specifically, the flexible connector 6 in this application is a flexible printed circuit board (FPC) and is connected through the board end connector 7. The FPC has high reliability and good flexibility, and also has the characteristics of high wiring density, light weight, thin thickness and good bending, which can realize vibration-resistant flexible conductivity. The modular design of the connector simplifies the assembly process, supports quick replacement and maintenance, reduces after-sales costs, and adapts to the needs of large-scale production.

[0048] In some embodiments, the support block 4 is welded or bonded to the semiconductor element 3 using pressure-sensitive adhesive.

[0049] Specifically, welding is suitable for high-reliability scenarios, ensuring a firm fixation between the support block 4 and the semiconductor element 3; pressure-sensitive adhesive bonding facilitates rapid assembly, meeting the efficiency requirements of mass production and enhancing the process adaptability of the solution. Other technical methods can also be used to achieve the same result.

[0050] In summary, the temperature detection mounting structure of this application, by setting a support block 4 between the flexible connector 6 and the semiconductor element 3, with its top surface connected to the flexible connector 6 and its bottom surface fixed to the semiconductor element 3, forms a support structure that can effectively disperse external pressure and prevent the temperature sensor 2 from deforming or shifting due to pressure. At the same time, in conjunction with the bendable characteristics of the flexible connector 6, the traditional rigid PIN pin connection is transformed into a composite structure of flexible connection and support protection. This not only avoids the defect of easy breakage of PIN pins under vibration environment, but also improves the stability of sensor 2 installation through the support of the support block 4, fundamentally solving the problem of low fixation reliability of sensor 2 and significantly extending the service life of sensor 2 under vibration conditions.

[0051] This application further discloses an inverter that includes the aforementioned temperature detection mounting structure, possessing all its beneficial effects. It should be noted that this inverter can also be used for temperature detection applications in other functional modules.

[0052] The above embodiments are merely illustrative of the principles and effects of this utility model and are not intended to limit the scope of this utility model. Any person skilled in the art can modify or alter the above embodiments without departing from the spirit and scope of this utility model. Therefore, all equivalent modifications or alterations made by those skilled in the art without departing from the spirit and technical concept disclosed in this utility model should still be covered by the claims of this utility model.

[0053] Throughout this description, numerous specific details, such as examples of components and / or methods, are provided to provide a complete understanding of embodiments of this application. However, those skilled in the art will recognize that embodiments of this invention may be practiced without one or more of these specific details or by other devices, systems, components, methods, parts, materials, components, etc. In other instances, well-known structures, materials, or operations have not been specifically shown or described in detail to avoid obscuring aspects of embodiments of this application.

[0054] Throughout this specification, references to "an embodiment," "an embodiment," or "a specific embodiment" mean that a particular feature, structure, or characteristic described in connection with an embodiment is included in at least one embodiment of the present invention, but not necessarily in all embodiments. Therefore, the various representations of the phrases "in one embodiment," "in an embodiment," or "in a specific embodiment" in different places throughout the specification do not necessarily refer to the same embodiment. Furthermore, a particular feature, structure, or characteristic of any specific embodiment of the present invention can be combined with one or more other embodiments in any suitable manner. It should be understood that other variations and modifications of the embodiments described herein may be based on the teachings herein and will be considered part of the spirit and scope of the present invention.

[0055] It should also be understood that one or more of the elements shown in the figures may be implemented in a more separate or more integrated manner, or may even be removed because they are inoperable in certain circumstances or provided because they may be useful for a particular application.

[0056] Furthermore, unless otherwise expressly stated, any arrows in the accompanying drawings should be considered illustrative only and not limiting. Additionally, unless otherwise stated, the term "or" as used herein is generally intended to mean "and / or". Where a term is anticipated to provide a separation or combination capability that is unclear, a combination of components or steps will also be considered as indicated.

[0057] As used herein and throughout the claims below, unless otherwise specified, “a” and “the” include the plural references. Similarly, as used herein and throughout the claims below, unless otherwise specified, “in” means “in” and “on”.

[0058] The above description of the embodiments shown in this utility model (including the content in the abstract of the specification) is not intended to be an exhaustive enumeration or to limit the utility model to the precise forms disclosed herein. Although specific embodiments and examples of the utility model have been described herein for illustrative purposes only, various equivalent modifications are possible within the spirit and scope of the utility model, as will be recognized and understood by those skilled in the art. As indicated, these modifications can be made to the utility model in accordance with the above description of the embodiments of this application, and such modifications will be within the spirit and scope of the utility model.

[0059] This document has generally described the systems and methods in detail to aid in understanding the present invention. Furthermore, various specific details have been set forth to provide a general understanding of the embodiments of this application. However, those skilled in the art will recognize that embodiments of the present invention can be practiced without one or more specific details, or using other devices, systems, accessories, methods, components, materials, parts, etc. In other instances, well-known structures, materials, and / or operations have not been specifically shown or described in detail to avoid obscuring various aspects of the embodiments of this application.

Claims

1. A temperature detecting mounting structure characterized by comprising: include: Semiconductor components; The PCB board is electrically connected to the semiconductor components; A sensor is disposed on the surface of the semiconductor element near the PCB board to detect the temperature of the semiconductor element; A flexible connector is provided, through which the sensor is electrically connected to the PCB board; A support block is disposed between the flexible connector and the semiconductor element, and the support block supports the flexible connector to reduce the pressure on the sensor.

2. The temperature detection mounting structure according to claim 1, characterized in that: The flexible connector includes a first connecting part, a transition connecting part, and a second connecting part that are folded back and connected in sequence. The first connecting part is electrically connected to the PCB board; The second connection portion is located between the PCB board and the semiconductor element, and the sensor is connected to the side of the second connection portion closer to the semiconductor element.

3. The temperature detection mounting structure according to claim 2, characterized in that: Foam is provided between the second connecting part and the PCB board to provide compression force for the flexible connector.

4. The temperature detection mounting structure according to claim 3, characterized in that: The foam and the support block are symmetrically arranged about the second connecting part, and the projected surface shapes of the foam and the support block are the same.

5. The temperature detection mounting structure according to claim 1, characterized in that: A thermally conductive adhesive layer is provided between the sensor and the semiconductor element.

6. The temperature detection mounting structure according to claim 5, characterized in that: The support block has a U-shaped cross-section, and the sensor is located within the U-shaped area of ​​the support block. An overflow groove is formed at the opening of the U-shaped end of the support block.

7. The temperature detection mounting structure according to claim 5, characterized in that: The support block is provided in two sets, both sets of support blocks are strip-shaped block structures, respectively set on both sides of the sensor, and two overflow grooves are formed between the two ends of the two sets of support blocks.

8. The temperature detection mounting structure according to claim 1, characterized in that: The flexible connector is a flexible printed circuit board, and the PCB board is provided with a board end connector. The flexible connector is electrically connected to the PCB board through the board end connector.

9. A temperature detection mounting structure according to claim 1, characterized in that: The support block is welded or bonded to the semiconductor element using pressure-sensitive adhesive.

10. An inverter, characterized in that, Includes a temperature detection mounting structure as described in any one of claims 1-9.

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