Heat dissipation system and robot

Abstract

The utility model discloses a heat dissipation system and robot. Among them, the heat dissipation system includes radiator, the first side fixed connection of radiator has heat dissipation fan, and the second side abuts with chassis support, be equipped with the heat dissipation surface for contacting the device of waiting for heat dissipation of radiator, heat dissipation surface is located between heat dissipation fan and chassis support. The heat dissipation system provided by the utility model helps the device of waiting for heat dissipation from two aspects, first, heat dissipation fan can produce the wind of blowing to the device of waiting for heat dissipation when operating, thereby helping the device of waiting for heat dissipation to radiate heat, second, the heat of device of waiting for heat dissipation can be conducted to chassis support through radiator, thereby utilizing chassis support to radiate heat. Chassis support is larger than the area of radiator, that is, has greater radiating area. Above all, the heat dissipation system has higher radiating efficiency.

Description

Technical Field

[0001] This utility model relates to the field of heat dissipation, and in particular to a heat dissipation system and a robot. Background Technology

[0002] An electric motor is a device that converts electrical energy into mechanical energy. It generates heat when operating under load. Existing technologies generally use water cooling systems or semiconductor cooling to dissipate heat from the motor, which is costly. For example, the patent application number "202020760608.5" entitled "A Motor Heat Dissipation Base" describes a motor heat dissipation base, which includes a base body and a motor body. The left and right ends of the bottom of the base body's inner cavity are fixedly connected to heat-conducting copper plates. A semiconductor cooling chip is fixedly installed on the top of the heat-conducting copper plates. A metal heat sink is fixedly connected to one side of the heat-conducting copper plates. An exhaust fan is fixedly installed on the left and right ends of the bottom of the base body's inner cavity. Utility Model Content

[0003] The purpose of this invention is to provide a heat dissipation system and a robot to solve the problems of the prior art.

[0004] To achieve this objective, the present invention adopts the following technical solution:

[0005] A heat dissipation system includes a radiator; a cooling fan is fixedly connected to a first side of the radiator, and a chassis bracket is abutted against a second side of the radiator.

[0006] The radiator is provided with a heat dissipation surface for contacting the device to be cooled, and the heat dissipation surface is located between the cooling fan and the chassis bracket.

[0007] Optionally, the chassis bracket is fixedly connected to the radiator;

[0008] Optionally, a thermally conductive silicone pad is provided on the heat dissipation surface, and the thermally conductive silicone pad is located between the heat dissipation surface and the device to be cooled; one side of the thermally conductive silicone pad contacts the device to be cooled, and the other side contacts the heat dissipation surface.

[0009] Optionally, the radiator includes two rows of heat dissipation fins, which are respectively disposed on both sides of the heat dissipation surface; each row of heat dissipation fins includes multiple heat dissipation fins arranged at equal intervals, and a fin gap is left between two adjacent heat dissipation fins; the heat dissipation fins contact the device to be cooled.

[0010] Optionally, the heat dissipation system includes multiple connecting posts, and the heat dissipation fins are divided into connecting heat dissipation fins for fixed connection to the connecting posts and ordinary heat dissipation fins that are not fixedly connected to the connecting posts. The end of the connecting post facing away from the connecting heat dissipation fins is fixedly connected to the cooling fan; the thickness of the connecting heat dissipation fins is greater than that of the ordinary heat dissipation fins.

[0011] Each row of heat dissipation fins includes two connecting heat dissipation fins and at least one ordinary heat dissipation fin; in each row of heat dissipation fins, the ordinary heat dissipation fin is located between the two connecting heat dissipation fins.

[0012] Optionally, the connecting heat sink fins have threaded holes on the side facing the cooling fan, and the connecting post has a connecting post screw head at the end facing the connecting heat sink fins, and the connecting post screw head is threadedly connected to the threaded holes of the fins;

[0013] The cooling fan has a fan through hole at each of its four corners facing the heat sink, and the connecting post has a connecting post threaded hole on the side facing the cooling fan; the four fan through holes and the four connecting post threaded holes correspond one-to-one, and each fan through hole is connected to its corresponding connecting post threaded hole by a screw thread.

[0014] Optionally, the fin gap has a three-sided open groove structure, with the three sides of the fin gap opening facing the cooling fan, facing the device to be cooled, and facing away from the device to be cooled, respectively.

[0015] The fin gaps in at least one of the two rows of heat dissipation fins have a groove depth on the side closer to the heat dissipation device than on the side away from the heat dissipation device. The bottom of the groove is composed of a horizontal bottom surface and a sloping bottom surface in order from near to far from the heat dissipation device. The maximum groove depth of the sloping bottom surface is greater than the groove depth of the horizontal bottom surface, and the minimum groove depth of the sloping bottom surface is equal to the groove depth of the horizontal bottom surface.

[0016] Optionally, the heat dissipation system includes two heat sinks;

[0017] The two heat sinks are fixedly connected by integral molding, and the docking part is each of the row of heat dissipation fins. The bottom of the groove of the gap between the two rows of heat dissipation fins used for docking is formed by the bottom horizontal surface of the gap.

[0018] Optionally, the heat sink is integrally molded;

[0019] Optionally, the chassis support is made of metal or carbon fiber;

[0020] Optionally, the heat sink is made of metal or carbon fiber;

[0021] Optionally, the heat sink is made of copper alloy or aluminum alloy.

[0022] Optionally, the heat dissipation surface is the side of the heat sink facing the cooling fan, and the heat dissipation surface is an arc surface;

[0023] The heat dissipation device is a motor, which has a cylindrical structure, and part of the motor is located between the heat dissipation surface and the cooling fan;

[0024] The chassis support has a plate-like structure, and the side of the radiator facing the chassis support is flat. The side of the radiator facing the chassis support is connected to the chassis support by screw threads.

[0025] A robot includes a heat dissipation device and a heat dissipation system as described above, wherein the heat dissipation device contacts the heat dissipation system.

[0026] Compared with the prior art, the present invention has the following beneficial effects:

[0027] The heat dissipation system provided by this utility model helps dissipate heat from the device in two ways. First, the cooling fan generates airflow directed at the device during operation, thus aiding in heat dissipation. Second, the heat from the device is conducted to the chassis support via the radiator, thereby utilizing the chassis support for heat dissipation. The chassis support has a larger area than the radiator, meaning it has a larger heat dissipation area. In summary, this heat dissipation system has high heat dissipation efficiency and eliminates the need for water cooling or semiconductors, resulting in low cost. Attached Figure Description

[0028] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0029] The structures, proportions, sizes, etc., shown in the accompanying drawings of this specification are only for the purpose of assisting those skilled in the art in understanding and reading the content disclosed in the specification, and are not intended to limit the implementation conditions of this utility model. Therefore, they have no substantial technical significance. Any modifications to the structure, changes in the proportions, or adjustments to the size, without affecting the effects and purposes that this utility model can produce, should still fall within the scope of the technical content disclosed in this utility model.

[0030] Figure 1 This is a schematic diagram of the overall structure of the heat dissipation system provided in Embodiment 1 of this utility model;

[0031] Figure 2 This is a partial structural diagram of the heat dissipation system provided in Embodiment 1 of this utility model;

[0032] Figure 3This is a schematic diagram of the structure of the heat sink provided in Embodiment 1 of this utility model;

[0033] Figure 4 This is a side view of the heat sink provided in Embodiment 1 of the present invention;

[0034] Figure 5 for Figure 4 Sectional view at point AA;

[0035] Figure 6 This is a partial structural diagram of the heat dissipation system provided in Embodiment 2 of this utility model;

[0036] Figure 7 This is a partial side view of the heat dissipation system provided in Embodiment 2 of this utility model;

[0037] Figure 8 for Figure 7 Sectional view at point BB.

[0038] Illustrations: 1. Heat sink; 11. Heat dissipation surface; 12. Heat dissipation fins; 121. Ordinary heat dissipation fins; 122. Connecting heat dissipation fins; 13. Fin gap; 131. Horizontal surface at the bottom of the gap; 132. Sloping surface at the bottom of the gap; 2. Cooling fan; 3. Chassis bracket; 4. Connecting column; 5. Thermal conductive silicone pad; 6. Device to be cooled. Detailed Implementation

[0039] To make the utility model's objectives, features, and advantages more apparent and understandable, the technical solutions in the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the embodiments described below are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present utility model.

[0040] In the description of this utility model, it should be understood that the terms "upper," "lower," "top," "bottom," "inner," "outer," "front," "rear," "left," and "right," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this utility model and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. It should be noted that when a component is considered to be "connected / set" to another component, it can be connected / set to another component, or it may simultaneously have a component centrally positioned.

[0041] The technical solution of this utility model will be further described below with reference to the accompanying drawings and specific embodiments.

[0042] This utility model provides a solution that is significantly different from existing technologies, addressing the problem that existing technical solutions are too simplistic.

[0043] This embodiment provides a high-efficiency heat dissipation system. Please refer to... Figure 1-2 The heat dissipation system includes a radiator 1. A cooling fan 2 is fixedly connected to a first side of the radiator 1, and a chassis bracket 3 abuts against a second side. The radiator 1 is provided with a heat dissipation surface 11 for contacting the device 6 to be cooled, and the heat dissipation surface 11 is located between the cooling fan 2 and the chassis bracket 3.

[0044] This heat dissipation system helps the device 6 to dissipate heat in two ways. First, the cooling fan 2 generates airflow towards the device 6, thus helping to dissipate heat. Second, the heat from the device 6 can be conducted to the chassis bracket 3 through the radiator 1, thereby utilizing the chassis bracket 3 for heat dissipation. The chassis bracket 3 has a larger area than the radiator 1, meaning it has a larger heat dissipation area. In summary, the heat dissipation system provided in this embodiment has high heat dissipation efficiency. This embodiment utilizes the chassis bracket 3 as a component of the heat dissipation system, which does not affect the conventional support function of the chassis bracket 3 as a support structure for mounting components such as wheels, and also adds a heat dissipation function to the chassis bracket 3. Thus, even without using semiconductor cooling or other water cooling devices, high heat dissipation efficiency can be achieved at a low cost.

[0045] In this embodiment, the chassis bracket 3 and the radiator 1 are preferably made of materials with high thermal conductivity, such as metal or carbon fiber. Among the metal materials, copper alloy or aluminum alloy is preferred, as it is easy to process and has high thermal conductivity.

[0046] In this embodiment, a thermally conductive silicone pad 5 is provided on the heat dissipation surface 11. The thermally conductive silicone pad 5 is located between the heat dissipation surface 11 and the device to be cooled 6, with one side contacting the device to be cooled 6 and the other side contacting the heat dissipation surface 11. The heat dissipation surface 11 contacts the device to be cooled 6 through the thermally conductive silicone pad 5. The thermally conductive silicone pad 5 is elastic and has high thermal conductivity, so the thermally conductive silicone pad 5 and the device to be cooled 6, as well as the thermally conductive silicone pad 5 and the heat dissipation surface 11, can make tight contact, ensuring uniform heat conduction. The provision of the thermally conductive silicone pad 5 can avoid uneven heat conduction caused by poor contact between the device to be cooled 6 and the heat dissipation surface 11 due to processing or installation errors.

[0047] In this embodiment, the radiator 1 includes two rows of heat dissipation fins 12, which are respectively disposed on both sides of the heat dissipation surface 11. Each row of heat dissipation fins 12 includes a plurality of heat dissipation fins 12 arranged at equal intervals, and a fin gap 13 is left between two adjacent heat dissipation fins 12 for airflow. Each heat dissipation fin 12 is in contact with the device 6 to be cooled.

[0048] The heat dissipation fins 12 can further increase the heat dissipation area and improve the heat dissipation capacity. The heat sink 1 is preferably integrally formed, in which case the material of the heat dissipation fins 12 is the same as the material of other parts of the heat sink 1, preferably copper alloy or aluminum alloy.

[0049] In this embodiment, the heat dissipation system includes multiple connecting posts 4. The heat dissipation fins 12 are divided into connecting heat dissipation fins 122 for fixing the connecting posts 4 and ordinary heat dissipation fins 121 for not fixing the connecting posts 4. The thickness of the connecting heat dissipation fins 122 is greater than that of the ordinary heat dissipation fins 121. The end of the connecting post 4 opposite to the connecting heat dissipation fins 122 is fixedly connected to the cooling fan 2.

[0050] Each row of heat dissipation fins 12 includes two connecting heat dissipation fins 122 and at least one ordinary heat dissipation fin 121. In each row of heat dissipation fins 12, each ordinary heat dissipation fin 121 is located between two connecting heat dissipation fins 122.

[0051] Specifically, the side of the heat sink fins 12 facing the cooling fan 2 is all horizontal. The side of the heat sink fins 122 facing the cooling fan 2 has threaded holes, and the end of the connecting post 4 facing the heat sink fins has a connecting post screw head, which is threaded into the threaded holes of the fins. Each of the four corners of the side of the cooling fan 2 facing the radiator 1 has a fan through hole, and the side of the connecting post 4 facing the cooling fan has a connecting post threaded hole. The four fan through holes and the four connecting post threaded holes correspond one-to-one, and each fan through hole is threadedly connected to its corresponding connecting post threaded hole. Therefore, the air blown by the cooling fan 2 is completely directed at the radiator 1, maximizing heat dissipation efficiency.

[0052] Please refer to Figure 3-5 In this embodiment, the fin gap 13 has a groove structure with openings on three sides. The three sides of the fin gap 13 are the side facing the cooling fan 2, the side facing the heat dissipation device 6, and the side away from the heat dissipation device 6.

[0053] The groove depth of the fin gap 13 on the side closer to the heat dissipation device 6 is less than the groove depth on the side away from the heat dissipation device. Specifically, the bottom of the groove of the fin gap 13, in order from near to far from the heat dissipation device 6, consists of a horizontal bottom surface 131 and a sloping bottom surface 132. The maximum groove depth of the sloping bottom surface 132 is greater than the groove depth of the horizontal bottom surface 131, and the minimum groove depth of the sloping bottom surface 132 is equal to the groove depth of the horizontal bottom surface 131. For example... Figure 4 As shown in Figure D, the groove depth refers to the distance between the bottom of the fin gap 13 (i.e., the side facing away from the cooling fan 2) and its groove opening (i.e., the side facing the cooling fan 2).

[0054] The sloped surface 132 at the bottom of the fin gap allows the radiator 1 to dissipate heat better and reduces its weight, making the overall product lighter. Increasing the depth of the groove in the fin gap 13 would reduce the contact area between the radiator 1 and the device 6 to be cooled, hindering the radiator 1 from transferring heat from the device 6 to the chassis support 3. In this embodiment, a sloped surface is provided on the side of the fin gap 13 away from the heat dissipation device to increase the groove depth, which does not affect the contact area between the radiator 1 and the device 6 while improving heat dissipation efficiency.

[0055] In this embodiment, the heat dissipation device 6 is a motor with a cylindrical structure. A portion of the motor is located between the heat dissipation surface 11 and the cooling fan 2, and contacts the thermally conductive silicone pad 5. The heat dissipation surface 11 is the side of the heat sink 1 facing the cooling fan 2. Since the motor has a cylindrical structure, the heat dissipation surface 11 should correspond to its outer surface; therefore, the heat dissipation surface 11 is an arc surface. The chassis support 3 has a plate-like structure. The side of the heat sink 1 facing the chassis support 3 should correspond to the outer surface of the chassis support 3; therefore, the side of the heat sink 1 facing the chassis support 3 is a flat surface.

[0056] The radiator 1 is fixedly connected to the chassis bracket 3. Specifically, at least one radiator threaded hole is provided on the side of the radiator 1 facing the chassis bracket 3. The chassis bracket is provided with a chassis through hole corresponding to the radiator threaded hole. The screw passes through the chassis through hole and is threaded to the corresponding radiator threaded hole.

[0057] In this embodiment, since the motor drives the wheels to rotate, there are generally two motors corresponding to the two wheels. Therefore, the cooling system should include two radiators 1. Depending on the requirements, the two radiators 1 can be installed separately or integrally formed. In this embodiment, the two radiators 1 are installed separately. Figure 5 As shown, when the two radiators 1 are set separately, the fin gaps 13 included in the two rows of heat dissipation fins 12 of each radiator 1 should be provided with a bottom slope surface 132 on the side away from the heat dissipation device.

[0058] The heat dissipation system provided in this embodiment has the following advantages:

[0059] 1. By using the chassis bracket 3 as a component of the heat dissipation system, the heat dissipation efficiency is improved;

[0060] 2. The addition of cooling fan 2 and heat dissipation fins 12 improves heat dissipation efficiency;

[0061] 3. A thermally conductive silicone pad 5 is placed between the heat dissipation surface 11 and the heat dissipation device 6 to avoid poor contact and uneven heat conduction.

[0062] 4. A sloping bottom surface 132 is provided at the bottom of the heat dissipation gap 13 to further improve heat dissipation efficiency.

[0063] This embodiment also discloses a robot that includes the aforementioned heat dissipation system. Therefore, the beneficial effects of this robot are the same as those of the heat dissipation system, and will not be described again here.

[0064] Example 2

[0065] Please refer to Figure 6-8 The difference between this embodiment and the previously described embodiment one is that in this embodiment, the two heat sinks 1 are fixedly connected by an integral molding method, and the docking part of the two heat sinks 1 is a row of heat dissipation fins 12 on each side. Figure 6 As shown, the row of heat dissipation fins 12 on the left side of the radiator 1 and the row of heat dissipation fins 12 on the right side of the radiator 1 are connected in a one-to-one correspondence.

[0066] like Figure 7 As shown, the fin gaps 13 in the two rows of heat dissipation fins 12 used for docking are connected, and the bottom of the fin gap 13 groove here is no longer provided with a gap bottom slope surface 132, but is composed of a gap bottom horizontal surface 131.

[0067] In this invention, unless otherwise stated, the term "connection" can include various mechanical connection methods, such as welding, riveting, threaded connection, bonding, snap-fit ​​connection, locking connection, joining, etc.

[0068] In this article, "several" and "at least one" refer to one or more, while "multiple" and "at least two" refer to two or more. "And / or" describes the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A alone, A and B simultaneously, or B alone. The character " / " generally indicates that the preceding and following related objects have an "or" relationship.

[0069] The above embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit it. Although this utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this utility model.

Claims

1. A heat dissipation system, characterized in that, Includes a radiator; a cooling fan is fixedly connected to the first side of the radiator, and a chassis bracket is abutted against the second side; The radiator is provided with a heat dissipation surface for contacting the device to be cooled, and the heat dissipation surface is located between the cooling fan and the chassis bracket.

2. The heat dissipation system according to claim 1, characterized in that, A thermally conductive silicone pad is provided on the heat dissipation surface, and the thermally conductive silicone pad is located between the heat dissipation surface and the device to be cooled; one side of the thermally conductive silicone pad contacts the device to be cooled, and the other side contacts the heat dissipation surface; The chassis bracket is fixedly connected to the radiator.

3. The heat dissipation system according to claim 2, characterized in that, The radiator includes two rows of heat dissipation fins, which are respectively disposed on both sides of the heat dissipation surface; each row of heat dissipation fins includes multiple heat dissipation fins arranged at equal intervals, and a fin gap is left between two adjacent heat dissipation fins; the heat dissipation fins contact the device to be cooled.

4. The heat dissipation system according to claim 3, characterized in that, The heat dissipation system includes multiple connecting posts, and the heat dissipation fins are divided into connecting heat dissipation fins for fixed connection to the connecting posts and ordinary heat dissipation fins that are not fixedly connected to the connecting posts. The end of the connecting post facing away from the connecting heat dissipation fins is fixedly connected to the cooling fan. The thickness of the connecting heat dissipation fins is greater than that of the ordinary heat dissipation fins. Each row of heat dissipation fins includes two connecting heat dissipation fins and at least one ordinary heat dissipation fin; in each row of heat dissipation fins, the ordinary heat dissipation fin is located between the two connecting heat dissipation fins.

5. The heat dissipation system according to claim 4, characterized in that, The connecting heat sink fins have threaded holes on the side facing the cooling fan, and the connecting post has a connecting post screw head at the end facing the connecting heat sink fins, and the connecting post screw head is threaded into the threaded holes of the fins; The cooling fan has a fan through hole at each of its four corners facing the heat sink, and the connecting post has a connecting post threaded hole on the side facing the cooling fan; the four fan through holes and the four connecting post threaded holes correspond one-to-one, and each fan through hole is connected to its corresponding connecting post threaded hole by a screw thread.

6. The heat dissipation system according to claim 3, characterized in that, The fin gap has a three-sided open groove structure, with the three sides of the fin gap opening facing the cooling fan, facing the device to be cooled, and facing away from the device to be cooled. The fin gaps in at least one of the two rows of heat dissipation fins have a groove depth on the side closer to the heat dissipation device than on the side away from the heat dissipation device. The bottom of the groove is composed of a horizontal bottom surface and a sloping bottom surface in order from near to far from the heat dissipation device. The maximum groove depth of the sloping bottom surface is greater than the groove depth of the horizontal bottom surface, and the minimum groove depth of the sloping bottom surface is equal to the groove depth of the horizontal bottom surface.

7. The heat dissipation system according to claim 6, characterized in that, The heat dissipation system includes two heat sinks; The two heat sinks are fixedly connected by integral molding, and the docking part is each of the row of heat dissipation fins. The bottom of the groove of the gap between the two rows of heat dissipation fins used for docking is formed by the bottom horizontal surface of the gap.

8. The heat dissipation system according to claim 1, characterized in that, The chassis support is made of metal or carbon fiber, and the radiator is made of metal or carbon fiber; the radiator is integrally molded.

9. The heat dissipation system according to claim 1, characterized in that, The heat dissipation surface is the side of the heat sink facing the cooling fan, and the heat dissipation surface is an arc surface; The heat dissipation device is a motor, which has a cylindrical structure, and part of the motor is located between the heat dissipation surface and the cooling fan; The chassis support has a plate-like structure, and the side of the radiator facing the chassis support is flat. The side of the radiator facing the chassis support is connected to the chassis support by screw threads.

10. A robot, characterized in that, It includes a device to be cooled and a cooling system as described in any one of claims 1-9, wherein the device to be cooled is in contact with the cooling system.

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