A double-pitch PCB layout structure based on an aluminum substrate

Abstract

The utility model relates to the technical field of circuit board especially is involved in a kind of double-spliced PCB layout structure based on aluminium substrate, it includes: aluminium substrate, insulation treatment is carried out on aluminium substrate and is covered with copper, to form copper-clad layer, first area and second area are provided on copper-clad layer, first area is used to place high-power device and forms electrical connection;PCB board, PCB board is set to the second area of copper-clad layer and is used to place small power component, PCB board is electrically connected with the first area and the second area of copper-clad layer respectively by the mode of soldering tin, forms electrical conduction.This application passes through the adoption of double-spliced layout, small power component can avoid direct contact with aluminium substrate, to reduce the overall thermal conductivity, so that the temperature of element on PCB board is significantly lower than direct placement on aluminium substrate, to increase the life of element.

Description

Technical Field

[0001] This utility model relates to the technical field of circuit boards, and in particular to a dual-panel PCB layout structure based on an aluminum substrate. Background Technology

[0002] In high-power, high-current applications such as BMS, aluminum substrates are widely used because they can provide rapid heat dissipation for power devices such as MOSFETs and IGBTs. However, aluminum substrates only have a cost advantage when the components are laid out on one side. If a double-sided component layout is used, the manufacturing cost will be several times higher than that of traditional PCBs. In addition, too many components will increase the layout area, making the aluminum substrate too large and difficult to assemble. At the same time, when small-power components such as control and signal components are placed on the aluminum substrate together with high-power devices, heat conduction is more significant, which can easily cause small-power components to have excessively high temperatures, affecting their lifespan. This problem urgently needs to be solved. Utility Model Content

[0003] To address the shortcomings of the prior art, this application provides a dual-panel PCB layout structure based on an aluminum substrate.

[0004] The above-mentioned inventive objective of this application is achieved through the following technical solutions:

[0005] A dual-panel PCB layout structure based on an aluminum substrate, comprising:

[0006] An aluminum substrate is insulated and copper is deposited on it to form a copper layer. A first region and a second region are provided on the copper layer. The first region is used to place high-power devices and form an electrical connection.

[0007] The PCB board is located in the second area of ​​the copper-clad layer and is used to place low-power components. The PCB board is electrically connected to the first and second areas of the copper-clad layer by soldering to form electrical conduction.

[0008] Preferably, the PCB board has a plurality of contact slots on one side and a plurality of vernier holes on the other side. The first area of ​​the copper cladding layer is electrically connected to the contact slots by soldering, and the second area of ​​the copper cladding layer is electrically connected to the vernier holes by soldering.

[0009] Preferably, some of the continuous vernier holes are foolproof mounting holes. The aluminum substrate in the second area is provided with a number of positioning marks corresponding to the foolproof mounting holes. When the PCB board is placed in the second area, the positioning marks correspond one-to-one with the foolproof mounting holes and are used to detect whether the PCB board is correctly placed in the second area.

[0010] Preferably, the aluminum substrate has a number of positioning holes in the second region, and the bottom of the PCB board has a number of positioning blocks corresponding to each positioning hole. The positioning holes and positioning blocks correspond one-to-one and are plugged in.

[0011] Preferably, a heat sink is provided on the aluminum substrate, which is used to cover high-power devices and low-power components in the first and second regions.

[0012] Preferably, the heat sink is made of aluminum alloy or graphene.

[0013] Preferably, the aluminum substrate and the heat sink are detachably and fixedly connected by a threaded connection.

[0014] Compared with the prior art, the beneficial effects of this utility model are as follows: By dividing the copper-clad layer of the aluminum substrate into a first region and a second region, the heat dissipation and cost advantages of the aluminum substrate in single-sided component layout are utilized. High-power devices are placed only in the first region, allowing them to conduct heat through the aluminum substrate during operation. Then, low-power components such as control and signal components are placed on the PCB board, and the PCB board is placed as an independent component module in the second region. Electrical connection with the first and second regions of the copper-clad layer is achieved through soldering, completing the double-panel PCB layout. This allows for electrical connection between components while avoiding the high manufacturing costs associated with placing all components on the aluminum substrate. Furthermore, the PCB board as an independent component module enables double-sided layout of multiple components without occupying additional space on the aluminum substrate, thus reducing the required board area. By adopting the double-panel layout, low-power components can avoid direct contact with the aluminum substrate, thereby reducing the overall thermal conductivity and making the component temperature on the PCB board significantly lower than that directly placed on the aluminum substrate, thus increasing the component lifespan. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the dual-panel PCB layout structure based on an aluminum substrate in this application.

[0016] Figure 2 This is a schematic diagram of the aluminum substrate being insulated and coated with copper in this application.

[0017] Figure 3 This is an exploded structural diagram of the dual-panel PCB layout structure based on an aluminum substrate in this application;

[0018] Figure 4 This is a partial structural diagram of the bottom of the dual-panel PCB layout structure in this application;

[0019] Figure 5 This is another exploded view of the dual-panel PCB layout structure in this application.

[0020] Reference numerals: 1. Aluminum substrate; 2. PCB board; 3. Insulating layer; 4. Copper cladding layer; 5. First area; 6. Second area; 7. Contact groove; 8. Vernier hole; 81. Foolproof mounting hole; 82. Positioning mark; 9. Positioning hole; 10. Positioning block; 11. Heat sink. Detailed Implementation

[0021] The following description, in conjunction with the accompanying drawings, illustrates exemplary embodiments of this application, including various details to aid understanding. These should be considered merely exemplary. Therefore, those skilled in the art will recognize that various changes and modifications can be made to the embodiments described herein without departing from the scope and spirit of this application. Similarly, for clarity and brevity, descriptions of well-known functions and structures are omitted in the following description.

[0022] It should be noted that the terms "first," "second," etc., used in this utility model are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of this disclosure described herein can be implemented in orders other than those illustrated or described herein. The implementation methods described in the following exemplary embodiments do not represent all implementation methods consistent with this disclosure.

[0023] Furthermore, the term "and / or" in this article is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, or B existing alone. Additionally, the character " / " in this article, unless otherwise specified, generally indicates that the preceding and following related objects have an "or" relationship.

[0024] The following is a reference appendix. Figure 1 To be continued Figure 5 This application describes a dual-panel PCB layout structure based on an aluminum substrate.

[0025] Reference Figures 1 to 5The dual-panel PCB layout structure based on an aluminum substrate includes an aluminum substrate 1 and a PCB board 2. The aluminum substrate 1 is insulated and copper-clad to form an insulating layer 3 and a copper-clad layer 4. The copper-clad layer 4 has a first region 5 and a second region 6. The first region 5 is used to place high-power devices and form an electrical connection. The PCB board 2 is located in the second region 6 of the copper-clad layer 4 and is used to place low-power components. The PCB board 2 is electrically connected to the first region 5 and the second region 6 of the copper-clad layer 4 by soldering to form an electrical connection. The copper cladding on the aluminum substrate 1 meets the heat dissipation and conductivity requirements of high-power devices, while transferring low-power components to the PCB board 2, making the PCB board 2 an independent device module. Together with the aluminum substrate 1, it forms a dual-panel PCB layout, avoiding the complex process of double-sided layout of the aluminum substrate 1, retaining the cost advantage of single-sided layout of the aluminum substrate 1, and reducing heat conduction between high-power devices and low-power components, thus extending the service life of the components.

[0026] It should be noted that PCB board 2 can be a traditional double-sided PCB, which is usually made of FR-4 substrate, i.e. epoxy board. Its thermal conductivity is much lower than that of aluminum substrate, and its heat conduction ability is weak. In addition, traditional double-sided PCB can realize the layout of a large number of low-power components. After the double-sided PCB is pre-made into independent device modules, it can form a double-row PCB layout with aluminum substrate 1, which can avoid the need to carry out double-sided layout through aluminum substrate 1 alone.

[0027] Specifically, a plurality of contact grooves 7 are provided on one side of the PCB board 2 and a plurality of vernier holes 8 are provided on the other side. The first region 5 of the copper clad layer 4 is electrically connected to the contact grooves 7 by soldering, and the second region 6 of the copper clad layer 4 is electrically connected to the vernier holes 8 by soldering. By setting the contact grooves 7 and the vernier holes 8, the PCB board 2 and the first region 5 and the second region 6 of the copper clad layer 4 are electrically connected respectively, ensuring a clear connection path and improving the stability of the electrical connection between the PCB board 2 and the aluminum substrate 1.

[0028] It should be noted that the inner walls of the contact groove 7 and the vernier hole 8 are plated with a conductive layer (not shown in the figure), which is usually treated by nickel plating, copper plating, etc., so that the contact groove 7 and the vernier hole 8 can be electrically connected to the PCB board 2 and the copper layer 4 through soldering. This is common knowledge to those skilled in the art and will not be elaborated here.

[0029] Furthermore, some of the continuous vernier holes 8 are foolproof mounting holes. The aluminum substrate 1 is provided with several positioning marks corresponding to the foolproof mounting holes in the second area 6. When the PCB board 2 is placed in the second area 6, the positioning marks correspond one-to-one with the foolproof mounting holes and are used to detect whether the PCB board 2 is correctly placed in the second area 6. By setting some of the vernier holes 8 as foolproof mounting holes and setting corresponding positioning marks on the aluminum substrate 1, the misalignment problem during the installation of the PCB board 2 can be effectively reduced, the assembly accuracy and efficiency can be improved, and the risk of functional failure caused by installation errors can be reduced.

[0030] It should be noted that the number, corresponding position, and positioning method of the aforementioned foolproof mounting holes 81 and positioning marks 82 can be adjusted by technicians according to their needs, and are not limited here. As an example, in this embodiment, such as Figure 5 As shown, eight vernier holes 8 are provided on one side of the PCB board 2. Among them, the fourth, fifth, and sixth vernier holes 8, arranged from the leftmost position, are anti-foolproof mounting holes 81. The second area 6 of the copper layer 4 on the aluminum substrate 1 is provided with eight contacts. Among them, the fourth, fifth, and sixth contacts, arranged from the leftmost position, are positioning marks 82. The remaining contacts are used to electrically connect with the corresponding vernier holes 8 by soldering. When positioning, the positioning can be completed by aligning the anti-foolproof mounting holes 81 (the fourth, fifth, and sixth vernier holes 8) on the PCB board 2 with the positioning marks 82 (the fourth, fifth, and sixth contacts) in sequence, which also facilitates the soldering and positioning of the remaining contacts.

[0031] Preferably, the aluminum substrate 1 has a plurality of positioning holes 9 in the second region 6, and the bottom of the PCB board 2 is provided with a plurality of positioning blocks 10 corresponding to each positioning hole 9. The positioning holes 9 and the positioning blocks 10 are one-to-one and are inserted into each other. Through the insertion and cooperation of the positioning holes 9 and the positioning blocks 10, the positioning of the PCB board 2 and the aluminum substrate 1 can be realized, which facilitates the quick alignment of the PCB board 2 during installation, improves the ease of assembly, and ensures the accuracy of subsequent soldering and other processes.

[0032] In addition, a heat sink 11 is provided on the aluminum substrate 1. The heat sink 11 is used to cover the high-power devices and low-power components in the first region 5 and the second region 6. By providing the heat sink 11, the heat dissipation area can be expanded, the heat dissipation of the components can be accelerated, the heat dissipation capacity of the overall structure can be further enhanced, and the components can be protected at the same time.

[0033] Specifically, the heat sink 11 can be made of aluminum alloy or graphene. Both aluminum alloy and graphene have high thermal conductivity, which can quickly conduct and dissipate the heat generated by the components, ensuring stable and reliable heat dissipation, and are suitable for circuit board heat dissipation conditions.

[0034] Furthermore, the aluminum substrate 1 and the heat sink 11 are detachably fixedly connected by a threaded connection. The detachable threaded structure enables the heat sink 11 to be fixed and disassembled, which facilitates the installation, maintenance and replacement of the heat sink 11.

[0035] The implementation principle of a dual-panel PCB layout structure based on an aluminum substrate in this application embodiment is as follows: By dividing the copper-clad layer 4 of the aluminum substrate 1 into a first region 5 and a second region 6, and utilizing the heat dissipation and cost advantages of the aluminum substrate 1 in single-sided component layout, high-power devices are placed only in the first region 5, allowing the high-power devices to conduct heat fully through the aluminum substrate 1 during operation. Then, low-power components such as control and signal components are placed on the PCB board 2, and the PCB board 2 is placed as an independent component module in the second region 6. Initial fixation is achieved by first matching the anti-foolproof mounting holes on the PCB board 2 with the positioning marks, and by the insertion and cooperation of the positioning holes 9 and the positioning blocks 10. Then, soldering is performed at the contact slots 7 and the vernier holes 8. Tin is used to complete the electrical connection between PCB 2 and the first area 5 and the second area 6 of copper cladding layer 4, completing the double-panel PCB layout. This allows for electrical connection between various components while avoiding the high manufacturing costs associated with placing all components on aluminum substrate 1. Furthermore, PCB 2, as an independent component module, can achieve double-sided layout of multiple components without occupying additional space on aluminum substrate 1, thus reducing the required board area of ​​aluminum substrate 1. By adopting the double-panel layout, low-power components can avoid direct contact with aluminum substrate 1, thereby reducing the overall thermal conductivity and making the component temperature on PCB 2 significantly lower than that of components placed directly on aluminum substrate 1, thereby increasing component lifespan.

[0036] The specific embodiments described above do not constitute a limitation on the scope of protection of this application. Those skilled in the art should understand that various modifications, combinations, sub-combinations, and substitutions can be made according to design requirements and other factors. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this application should be included within the scope of protection of this application.

Claims

1. An aluminum-based substrate-based dual-in-line PCB layout structure, characterized by, include: An aluminum substrate (1) is insulated and copper is deposited on the aluminum substrate (1) to form a copper-clad layer (4). A first region (5) and a second region (6) are provided on the copper-clad layer (4). The first region (5) is used to place high-power devices and form an electrical connection. PCB board (2) is disposed in the second region (6) of copper clad layer (4) and is used for placing low power components. PCB board (2) is electrically connected to the first region (5) and the second region (6) of copper clad layer (4) by soldering to form electrical conduction.

2. The two-part PCB layout structure based on an aluminum substrate according to claim 1, wherein, The PCB board (2) has several contact slots (7) on one side and several vernier holes (8) on the other side. The first area (5) of the copper cladding layer (4) is electrically connected to the contact slots (7) by soldering, and the second area (6) of the copper cladding layer (4) is electrically connected to the vernier holes (8) by soldering.

3. The dual-panel PCB layout structure based on an aluminum substrate as described in claim 2, characterized in that, Some of the continuous vernier holes (8) are foolproof mounting holes (81). The aluminum substrate (1) is located in the second area (6) and has several positioning marks (82) corresponding to the foolproof mounting holes (81). When the PCB board (2) is placed in the second area (6), the positioning marks (82) correspond one-to-one with the foolproof mounting holes (81) and are used to detect whether the PCB board (2) is correctly placed in the second area (6).

4. The two-part PCB layout structure based on aluminum substrate according to claim 1, wherein, The aluminum substrate (1) has several positioning holes (9) in the second region (6), and the bottom of the PCB board (2) has several positioning blocks (10) corresponding to each positioning hole (9). The positioning holes (9) and positioning blocks (10) correspond one to one and are inserted into each other.

5. The two-part PCB layout structure based on aluminum substrate as claimed in claim 1, wherein, A heat sink (11) is provided on the aluminum substrate (1), and the heat sink (11) is used to cover the high-power devices and low-power components in the first region (5) and the second region (6).

6. An aluminum substrate based two-up PCB layout structure as claimed in claim 5, wherein, The heat sink (11) is made of aluminum alloy or graphene.

7. An aluminum substrate based two-up PCB layout structure as claimed in claim 5, wherein, The aluminum substrate (1) and the heat sink (11) are detachably fixed by means of threaded connection.

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