A golden finger pasting glue device
By designing a gold finger adhesive application equipment that includes adhesive application and edge wrapping devices, and utilizing a combination of roller pressing and edge pressing devices, the problem of the single adhesive application mode in the existing technology is solved. This achieves tight adhesion of the adhesive tape to the surface and sides of the gold finger, adapts to the needs of different circuit board models, and improves production efficiency and equipment versatility.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- XIAMEN Z&H ELECTRONICS TECH
- Filing Date
- 2025-04-30
- Publication Date
- 2026-06-26
AI Technical Summary
Existing technology can only apply adhesive to one surface of the gold fingers, and cannot change the bonding mode of the tape, such as edge wrapping or single-sided application, and is not suitable for the needs of different circuit board models.
A gold finger adhesive application device was designed, comprising an adhesive application unit and an edge wrapping unit. It employs a roller pressing device and an edge pressing device. Through the cooperation of the first and second pressure rollers, the adhesive tape is tightly adhered. It is also equipped with an adjustable conveying device and a clamping device to adapt to different circuit board sizes and shapes.
It achieves tight adhesion of the tape to the surface and sides of the gold fingers, adapts to different types of circuit boards, improves production efficiency and equipment versatility, and reduces the trouble and cost of changing devices due to differences in circuit board size.
Smart Images

Figure CN224419030U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the technical field of circuit board adhesive application equipment, and in particular to a gold finger adhesive application equipment. Background Technology
[0002] The gold fingers of a circuit board are gold-plated conductive contacts located at the edges, typically arranged in rows of metal strips. Their surface is plated with gold to improve conductivity, corrosion resistance, and oxidation resistance, ensuring stable contact with the slot. Gold fingers are widely used in hardware such as memory modules, graphics cards, and expansion cards, responsible for transmitting electrical signals and power; they are a crucial interface for communication between the device and the motherboard. The thickness of the gold plating layer and the manufacturing process directly affect the reliability and lifespan of the connection.
[0003] High-temperature tape plays a crucial role in circuit board manufacturing. First, electronic components need to be securely fixed to the circuit board to ensure reliable circuit operation, a task effectively accomplished by high-temperature tape. Second, circuit boards must withstand high-temperature and high-pressure environments during processing; using unsuitable high-temperature tape can lead to misalignment of the board or loosening of components. Furthermore, high-temperature tape can improve production efficiency and reduce costs during circuit board manufacturing, providing strong support for the rapid development of the electronics manufacturing industry.
[0004] Chinese Patent Publication No. CN221886823U discloses a gold finger adhesive application device. The device uses a motor-driven system that includes an adhesive tape mounting structure and a winding mounting structure to deliver a continuous adhesive tape. The tape cutting structure cuts the tape after each process. Using this device to apply adhesive to the gold finger area of a PCB is significantly more efficient than manual application. It also overcomes the problems of fingerprints and sweat stains on the board surface, which can lead to oxidation and scratches.
[0005] However, the above method can only apply adhesive to one surface of the gold finger and cannot change the adhesive tape bonding mode, such as edge wrapping or single-sided bonding. Summary of the Invention
[0006] The purpose of this invention is to provide a gold finger adhesive application device to solve the above-mentioned problems.
[0007] To achieve the above objectives, this utility model discloses a gold finger adhesive application device, comprising: an adhesive application unit and an edge-wrapping unit; the adhesive application unit is used to apply adhesive tape to the surface of the gold fingers of a circuit board. The edge-wrapping unit includes a first clamping device, an edge-pressing device, and a roller pressing device; the first clamping device is used to clamp the circuit board, the edge-pressing device is used to press the tape tightly against the side edge of the circuit board, and the roller pressing device is used to press the tape tightly against the surface of the gold fingers. The roller pressing device and the edge-pressing device are disposed on at least one side of the first clamping device, and the edge-pressing device is vertically and flexibly disposed on the roller pressing device; the roller pressing device includes a first pressure roller and a first power device, the first power device driving the first pressure roller to move towards or away from the circuit board.
[0008] Preferably, the roller pressing device further includes a second pressure roller, a first connecting arm, a second connecting arm, a first spring connecting plate, a second spring connecting plate, a first mounting plate, and a column; the first pressure roller and the second pressure roller are arranged in parallel, and the second pressure roller is positioned above the first pressure roller; the column is positioned at both ends of the first mounting plate, and the first power device is fixedly connected to the first mounting plate, driving the first mounting plate to move towards or away from the circuit board. The first pressure roller is rotatably connected to both ends of the first connecting arm, and the second pressure roller is rotatably connected to both ends of the second connecting arm. The middle part of the first connecting arm is hinged to the first mounting plate, and the middle part of the second connecting arm is hinged to the first mounting plate. The end of the first connecting arm away from the first pressure roller is fixedly connected to the first spring connecting plate, and the end of the second connecting arm away from the second pressure roller is fixedly connected to the second spring connecting plate. An elastic element is provided between the first spring connecting plate and the second spring connecting plate. When the first spring connecting plate and the second spring connecting plate move towards each other, they must overcome the resistance generated by the elastic element.
[0009] Preferably, the roller pressing device further includes a shock absorption device; the shock absorption device includes a fixed plate, a buffer plate, a first guide sleeve, a first guide rod, and a buffer; the first guide sleeve is mounted on the fixed plate, the first guide rod passes through the first guide sleeve, one end of the first guide rod is connected to the first mounting plate, and the other end is connected to the buffer plate; the buffer is fixedly mounted on the fixed plate, and the first power device is mounted on the fixed plate.
[0010] Preferably, the pressing device includes a first lifting device, a first support plate, a second power device, and a pressing plate. The first lifting device is mounted on a column, the first support plate is mounted on the first lifting device, and the first lifting device drives the first support plate to rise or fall. The second power device is mounted on the first support plate, and the pressing plate is mounted on the output end of the second power device. The second power device drives the pressing plate to move towards or away from the circuit board.
[0011] Preferably, the pressing device further includes a guiding device, which includes a first guide rail, a first slider and a third connecting plate. The first guide rail is installed on the top of the first support plate, the first slider is slidably connected to the first guide rail, the third connecting plate is installed on the first slider, and the side of the third connecting plate is fixedly connected to the pressing plate.
[0012] Preferably, the pressure plate is provided with a buffer pad.
[0013] Preferably, the first clamping device includes a clamping plate structure symmetrically arranged, the clamping plate structure including a first base plate, a third power device, a pneumatic gripper, and a clamping plate; the third power device is mounted on the first base plate, the pneumatic gripper is mounted on the third power device, and the third power device drives the pneumatic gripper to move towards or away from the circuit board; the clamping plate is clamped on the pneumatic gripper.
[0014] Preferably, the device further includes a conveying device for moving the circuit board from the adhesive applicator to the edge-wrapping device. The conveying device includes a fixed conveyor line, an adjustable conveyor line, a first fixed seat, a second fixed seat, a second lead screw, a second nut, a third motor, a first mounting base, a second guide rod, and a second guide sleeve. The fixed conveyor line and the adjustable conveyor line are arranged in parallel. The fixed conveyor line is fixedly installed on the top of the first fixed seat, and the second fixed seat is located on the side of the adjustable conveyor line away from the fixed conveyor line. The first mounting base is fixedly installed at the bottom of the adjustable conveyor line. The second guide sleeve is installed on the first mounting base. One end of the second guide rod is installed on the first fixed seat, and the other end is fixedly installed on the second fixed seat. The second guide rod is slidably connected to the second guide sleeve. A second nut is also fixedly installed on several of the first mounting bases. The second lead screw is threadedly connected to the second nut. One end of the second lead screw is rotatably connected to the first fixed seat, and the other end is rotatably connected to the second fixed seat. The third motor drives the second lead screw to rotate.
[0015] Preferably, the conveying device is provided with a first position adjustment device on both sides. The first position adjustment device is used to adjust the position of the first clamping device. The first position adjustment device includes a second slide rail, a second slider, a fourth connecting plate and a stop device. The second slide rail is horizontally installed on the side of the conveying device. The second slider is slidably connected to the second slide rail. The fourth connecting plate is fixedly installed on the second slide rail. The first base plate is fixedly installed on the fourth connecting plate.
[0016] Preferably, the stopping device includes a stopping bolt, and the fourth connecting plate has a bolt hole, and the stopping bolt is threadedly connected to the bolt hole.
[0017] Preferably, at least one side of the conveying device is further provided with a second clamping device for clamping the circuit board. The second clamping device is located below the adhesive applicator and includes a second base plate, a fifth slide rail, a fifth slider, a fourth power unit, and a push plate. The second base plate is mounted on the side of the conveying device, the fifth slide rail is parallel to the second base plate, the fifth slider is slidably connected to the fifth slide rail, the fourth power unit is fixedly mounted on the second base plate, and the push plate is fixedly connected to both the fourth power unit and the fifth slider. The fourth power unit drives the push plate to move towards or away from the circuit board.
[0018] Preferably, it also includes a lifting device for supporting the circuit board; one of the lifting devices is disposed between the two clamping structures, and another is disposed below the adhesive applicator. The lifting device includes a second lifting device, a second support plate, and a first raising block. The second support plate is mounted on the second lifting device, and the first raising block is mounted on the second support plate. The second lifting device drives the second support plate to rise or fall.
[0019] Preferably, it further includes a lateral moving device and a longitudinal moving device, wherein the longitudinal moving device drives the lateral moving device to move, and the lateral moving device drives the adhesive applicator to move.
[0020] Preferably, the longitudinal moving device includes a gantry frame, a first motor, a first lead screw and nut mechanism, a fourth guide rail, a fourth slider, a first housing, and a third slider. Two gantry frames are spaced apart. A first housing is mounted on one gantry frame, and a first lead screw and nut mechanism is installed inside the first housing. The third slider is slidably connected to the first housing and fixedly connected to a nut on the first lead screw and nut mechanism. The first motor is mounted at one end of the first housing and drives the first lead screw and nut mechanism, which in turn moves the third slider along the first housing. A fourth guide rail is mounted on the other gantry frame, and the fourth slider is slidably connected to the fourth guide rail. The lateral moving device includes a second housing, a second motor, a second lead screw and nut mechanism, and a seventh slider. The second housing is fixedly connected to both the fourth and third sliders. The second lead screw and nut mechanism is installed inside the second housing. The seventh slider is slidably connected to the second housing and fixedly connected to a nut on the second lead screw and nut mechanism. The second motor is mounted at one end of the second housing and drives the second lead screw and nut mechanism. The adhesive applicator is fixedly connected to the seventh slider.
[0021] Preferably, the rolling device and the edge-pressing device are disposed on both sides of the first clamping device. A second position adjustment device is disposed at the bottom of the edge-pressing device. The second position adjustment device includes a sixth slide rail, a sixth slider, a fifth connecting plate, a second mounting base, a third lead screw, a third nut, and a fourth motor. Two sixth slide rails are disposed on both sides of the bottom of the edge-pressing device. The sixth slider is slidably connected to the sixth slide rails, and the edge-pressing device is mounted on the sixth slider. Two second mounting bases are spaced apart along the length of the sixth slide rails. The two ends of the third lead screw are rotatably connected to the second mounting bases, and the third nut is threadedly connected to the third lead screw. The third nut is mounted on the fifth connecting plate, and the fifth connecting plate is fixedly connected to the edge-pressing device. The fourth motor drives the third lead screw to rotate.
[0022] This utility model has the following beneficial effects:
[0023] 1. This utility model can be equipped with an edge-wrapping device, which can be selected to stick tape on one side of the gold finger or to wrap the edge of the gold finger with tape.
[0024] 2. This utility model is compatible with different types of circuit boards and has a wide range of applications. Attached Figure Description
[0025] Figure 1 This is a schematic diagram of the overall structure provided in a specific embodiment of the present utility model.
[0026] Figure 2 This is a partially enlarged schematic diagram of point A provided in a specific embodiment of this utility model.
[0027] Figure 3 This is a partially enlarged schematic diagram of point B provided in a specific embodiment of this utility model.
[0028] Figure 4 This is a schematic diagram of the pressing device provided in a specific embodiment of the present utility model.
[0029] Figure 5 This is a schematic diagram of the pressing device and the rolling device provided in a specific embodiment of the present utility model.
[0030] Figure 6 This is a schematic diagram of the roller pressing device provided in a specific embodiment of the present invention.
[0031] Figure 7 This is a schematic diagram of the pressing device and the rolling device from another perspective in a specific embodiment of the present invention.
[0032] Figure 8 This is a schematic diagram of the overall structure provided in a specific embodiment of the present utility model.
[0033] Figure 9 This is a partially enlarged schematic diagram of point C provided in a specific embodiment of this utility model.
[0034] Figure 10 This is a partially enlarged schematic diagram of point D provided in a specific embodiment of this utility model.
[0035] Figure 11 This is a partially enlarged schematic diagram of point E provided in a specific embodiment of this utility model.
[0036] Figure 12 This is a schematic diagram of the structure of the first clamping device provided in a specific embodiment of the present utility model.
[0037] Figure 13 This is a schematic diagram of the lifting device provided in a specific embodiment of the present utility model.
[0038] Explanation of symbols for main components:
[0039] 110. Fixed conveyor line; 120. First fixed seat; 130. Second guide rod; 140. Adjustable conveyor line; 150. First mounting seat; 160. Second guide sleeve; 170. Second fixed seat; 180. Second lead screw; 190. Third motor; 200. Pressure plate; 210. Buffer pad; 220. Third connecting plate; 230. First slider; 240. First slide rail; 250. Second power unit; 260. Lifting device; 301. Sixth slide rail; 302. Third lead screw; 303. Second mounting seat; 304. Third nut; 305. Fifth connecting plate; 310. Column; 320. First pressure roller; 321. First connecting arm; 330. Second pressure roller; 331. Second connecting arm; 332. Second spring connecting plate; 340. 1. Mounting plate; 350. Fixing plate; 351. Buffer; 360. Buffer plate; 370. First power unit; 380. First guide rod; 390. First guide sleeve; 410. Gantry frame; 420. First housing; 430. Fourth guide rail; 440. Fourth slider; 450. Second housing; 500. Adhesive application device; 610. First base plate; 620. Third power unit; 630. Pneumatic gripper; 640. Clamping plate; 650. Fourth connecting plate; 651. Stop bolt; 660. Second slider; 670. Second slide rail; 700. Second base plate; 710. Fourth power unit; 720. Push plate; 730. Fifth slider; 740. Fifth slide rail; 800. First shim block; 810. Second support plate; 820. Second lifting device. Detailed Implementation
[0040] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments.
[0041] like Figures 1-13 This utility model provides a gold finger adhesive application device, including: a conveying device, an adhesive application device 500, and an edge-wrapping device; the adhesive application device 500 and the edge-wrapping device are arranged sequentially along the conveying direction of the conveying device, and the adhesive application device 500 is used to apply adhesive tape to the surface of the gold fingers of the circuit board. The edge-wrapping device includes a first clamping device, an edge-pressing device, and a roller pressing device; the first clamping device is used to clamp the circuit board, the edge-pressing device is used to make the adhesive tape adhere tightly to the side edge of the circuit board, and the roller pressing device is used to make the adhesive tape adhere tightly to the surface of the gold fingers.
[0042] like Figure 1 , Figure 2 , Figure 8 and Figure 10 The conveying device is used to move the circuit board from the adhesive applicator 500 to the edge wrapping device. The conveying device includes a fixed conveyor line 110, an adjustable conveyor line 140, a first fixed seat 120, a second fixed seat 170, a second lead screw 180, a second nut, a third motor 190, a first mounting seat 150, a second guide rod 130, and a second guide sleeve 160. The fixed conveyor line 110 and the adjustable conveyor line 140 are arranged in parallel. The fixed conveyor line 110 is fixedly installed on the top of the first fixed seat 120, and the second fixed seat 170 is located on the side of the adjustable conveyor line 140 away from the fixed conveyor line 110.
[0043] A first mounting base 150 is fixedly mounted on the bottom of the adjustable conveyor line 140. A second guide sleeve 160 is mounted on the first mounting base 150. One end of a second guide rod 130 is mounted on a first fixed base 120, and the other end is fixedly mounted on a second fixed base 170. The second guide rod 130 and the second guide sleeve 160 are slidably connected. A second nut is also fixedly mounted on several first mounting bases 150. A second lead screw 180 is threadedly connected to the second nut. One end of the second lead screw 180 is rotatably connected to the first fixed base 120, and the other end is rotatably connected to the second fixed base 170. A third motor 190 drives the second lead screw 180 to rotate.
[0044] The width of the conveying device is flexibly adjustable. The fixed conveyor line 110 and the adjustable conveyor line 140 are arranged in parallel. A third motor 190 drives the second lead screw 180 to rotate, which in turn drives the second nut threadedly connected to the lead screw 180. Since the second nut is fixedly installed on the first mounting base 150 (the bottom of the adjustable conveyor line 140), the adjustable conveyor line 140 can move under the guidance of the second guide rod 130 and the second guide sleeve 160. This allows the conveying device to flexibly adjust the distance between the fixed conveyor line 110 and the adjustable conveyor line 140 according to different sized circuit boards, adapting to the conveying needs of circuit boards of different widths. This greatly improves the versatility and applicability of the equipment, reducing the hassle and cost of replacing the conveyor device due to differences in circuit board size.
[0045] like Figures 5-7 The rolling device and the edge-pressing device are disposed on at least one side of the first clamping device, and the edge-pressing device is vertically and flexibly mounted on the rolling device. The rolling device includes a first pressure roller 320 and a first power device 370, which drives the first pressure roller 320 to move towards or away from the circuit board. In this embodiment, the rolling device and the edge-pressing device are disposed on both sides of the first clamping device, and the first power device 370 is a cylinder.
[0046] The roller pressing device also includes a second pressure roller 330, a first connecting arm 321, a second connecting arm 332, a first spring connecting plate, a second spring connecting plate 332, a first mounting plate 340, and a column 310. The first pressure roller 320 and the second pressure roller 330 are arranged in parallel, with the second pressure roller 330 positioned above the first pressure roller 320. The column 310 is positioned at both ends of the first mounting plate 340. A first power device 370 is fixedly connected to the first mounting plate 340, and the first power device 370 drives the first mounting plate 340 to move closer to or further away from the circuit board. The first pressure roller 320 and the second pressure roller 330 can simultaneously apply pressure to the tape from both above and below, making the tape adhere more tightly to the surface of the gold fingers, effectively eliminating air between the tape and the gold fingers, reducing the generation of bubbles and wrinkles, and improving the adhesive quality.
[0047] The first pressure roller 320 is rotatably connected to both ends by a first connecting arm 321, and the second pressure roller 330 is rotatably connected to both ends by a second connecting arm 331. The middle part of the first connecting arm 321 is hinged to the first mounting plate 340, and the middle part of the second connecting arm 331 is hinged to the first mounting plate 340. A first spring connecting plate is fixedly connected to the end of the first connecting arm 321 away from the first pressure roller 320, and a second spring connecting plate 332 is fixedly connected to the end of the second connecting arm 331 away from the second pressure roller 330. An elastic element is provided between the first spring connecting plate and the second spring connecting plate 332. When the first spring connecting plate and the second spring connecting plate 332 move towards each other, they need to overcome the resistance generated by the elastic element. In this embodiment, the elastic element is a spring.
[0048] When the first power unit 370 drives the first mounting plate 340 close to the circuit board, the gold finger portion passes between the first pressure roller 320 and the second pressure roller 330. The first pressure roller 320 and the second pressure roller 330 can rotate around the hinge point via the first connecting arm 321 and the second connecting arm 331, allowing the two pressure rollers to adaptively adjust their position and pressure. At this time, the elastic element will generate corresponding deformation to provide cushioning and resistance, ensuring that the first pressure roller 320 and the second pressure roller 330 can apply appropriate pressure to the surface of the gold finger according to the actual situation, so that the tape can adhere to the surface of the gold finger.
[0049] The roller pressing device also includes a shock absorption device; the shock absorption device includes a fixed plate 350, a buffer plate 360, a first guide sleeve 390, a first guide rod 380, and a buffer 351; the first guide sleeve 390 is installed on the fixed plate 350, the first guide rod 380 passes through the first guide sleeve 390, one end of the first guide rod 380 is connected to the first mounting plate 340, and the other end is connected to the buffer plate 360; the buffer 351 is fixedly installed on the fixed plate 350, the first power device 370 is installed on the fixed plate 350, and the model of the buffer 351 is ACA1412.
[0050] In this embodiment, two sets of buffers 351 are provided, one set facing the buffer plate 360 and the other set facing the first mounting plate 340. When the first power device 370 drives the first mounting plate 340 closer to the circuit board, the buffer plate 360 will impact the buffer 351, and the buffer 351 will absorb the impact force of the buffer plate 360, reducing vibration and noise generated during equipment operation; when the first power device 370 drives the first mounting plate 340 away from the circuit board, the first mounting plate 340 will impact the buffer 351, and the buffer 351 will absorb the impact force of the first mounting plate 340, reducing vibration and noise generated during equipment operation.
[0051] The edge-pressing device includes a first lifting device 260, a first support plate, a second power device 250, and an edge-pressing plate 200. The first lifting device 260 is mounted on the column 310, and the first support plate is mounted on the first lifting device 260. The first lifting device 260 drives the first support plate to rise or fall. The second power device 250 is mounted on the first support plate, and the edge-pressing plate 200 is mounted on the output end of the second power device 250. The second power device 250 drives the edge-pressing plate 200 to move closer to or further away from the circuit board. A buffer pad 210 is provided on the edge-pressing plate 200. During use, the buffer pad 210 comes into contact with the tape.
[0052] In this embodiment, the second power device 250 is a cylinder. The first lifting device 260 includes a lifting cylinder, a guide rail, and a slider. The lifting cylinder is located at one end of the first support plate, and the guide rail and slider are located at the other end of the first support plate. The guide rail is mounted on the column 310, and the slider is connected to the first support plate. The lifting cylinder drives the first support plate to rise or fall, and the guide rail and slider play a guiding role.
[0053] like Figures 4-5 The pressing device also includes a guiding device, which includes a first guide rail, a first slider 230 and a third connecting plate 220. The first guide rail is installed on the top of the first support plate, the first slider 230 is slidably connected to the first guide rail, the third connecting plate 220 is installed on the first slider 230, and the side of the third connecting plate 220 is fixedly connected to the pressing plate 200.
[0054] The guiding device increases the stability of the pressing plate 200 during movement. The third connecting plate 220 fixes the first slider 230 and the pressing plate 200 together, so that the pressing plate 200 can be stably supported on the first guide rail by the first slider 230 when moving. This reduces the shaking or vibration caused by the weight of the pressing plate 200 itself or by external forces. Especially when a certain pressure needs to be applied during the pressing process, it can ensure the smooth operation of the pressing plate 200 and avoid problems such as reduced pressing quality or tape wrinkles caused by instability.
[0055] like Figures 11-12 The first clamping device includes a clamping plate structure symmetrically arranged. The clamping plate structure includes a first base plate 610, a third power device 620, a pneumatic gripper 630, and a clamping plate 640. The third power device 620 is mounted on the first base plate 610, and the pneumatic gripper 630 is mounted on the third power device 620. The third power device 620 drives the pneumatic gripper 630 to move towards or away from the circuit board. The clamping plate 640 is clamped on the pneumatic gripper 630.
[0056] In this embodiment, the third power unit 620 is a cylinder. Two third power units 620 drive two clamping plates 640 of a clamping structure to move closer to the circuit board, thereby clamping the circuit board. Pneumatic grippers 630 clamp the clamping plates 640, allowing for quick replacement of the clamping plates 640. Therefore, clamping plates 640 of suitable material and shape can be easily selected based on the material and surface characteristics of the circuit board. This ensures sufficient clamping force while preventing damage to the circuit board surface during clamping.
[0057] The conveying device is equipped with a first position adjustment device on both sides. The first position adjustment device is used to adjust the position of the first clamping device. The first position adjustment device includes a second slide rail 670, a second slider 660, a fourth connecting plate 650, and a stop device. The second slide rail 670 is horizontally installed on the side of the conveying device. The second slider 660 is slidably connected to the second slide rail 670. The fourth connecting plate 650 is fixedly installed on the second slide rail 670. The first base plate 610 is fixedly installed on the fourth connecting plate 650. The stop device includes a stop bolt 651. The fourth connecting plate 650 has a bolt hole, and the stop bolt 651 is threadedly connected to the bolt hole.
[0058] The second slide rail 670 is horizontally mounted on the side of the conveying device. The second slider 660 can slide on the second slide rail 670, and the first base plate 610 is connected to the second slider 660 via the fourth connecting plate 650. This allows the first clamping device to be horizontally adjusted along the second slide rail 670. In actual production, different specifications of circuit boards may require different clamping positions. This method allows the first clamping device to be flexibly adjusted to a suitable position to adapt to the processing needs of circuit boards of different sizes and types, improving the versatility and applicability of the equipment.
[0059] Once the first clamping device is adjusted to the appropriate position, it can be fixed by a stop device. The stop bolt 651 of the stop device is threadedly connected to the bolt hole on the fourth connecting plate 650. After tightening the stop bolt 651, sufficient friction is generated to prevent the second slider 660 from sliding on the second slide rail 670, thereby precisely fixing the first clamping device in the required position. This precise positioning and fixing function helps to ensure that the first clamping device remains stable during subsequent operations such as gluing and edge wrapping, ensuring the accuracy and quality of circuit board processing.
[0060] like Figures 8-9 The conveying device is further provided with a second clamping device on at least one side, which is used to clamp the circuit board. The second clamping device is located below the adhesive applicator 500 and includes a second base plate 700, a fifth slide rail 740, a fifth slider 730, a fourth power device 710, and a push plate 720. The second base plate 700 is installed on the side of the conveying device, the fifth slide rail 740 is arranged parallel to the second base plate 700, the fifth slider 730 is slidably connected to the fifth slide rail 740, the fourth power device 710 is fixedly installed on the second base plate 700, and the push plate 720 is fixedly connected to the fourth power device 710 and the fifth slider 730 respectively. The fourth power device 710 drives the push plate 720 to move towards or away from the circuit board. The fourth power device 710 is a cylinder.
[0061] The fifth slide rail 740 is parallel to the second base plate 700, and the fifth slider 730 is slidably connected to it. The push plate 720 is fixedly connected to the fifth slider 730. This allows the push plate 720, driven by the fourth power device 710, to move precisely along the slide rail towards or away from the circuit board, thereby achieving precise positioning and stable clamping of the circuit board. Regardless of changes in the size and shape of the circuit board, the position of the push plate 720 can be adjusted to accurately fix the circuit board at the designated position below the adhesive applicator 500, ensuring the accuracy and consistency of the adhesive application position and improving product quality.
[0062] When one second clamping device is provided, the push plate 720 and the other side of the conveying device clamp the circuit board together. When two second clamping devices are provided, the push plates 720 of the two second clamping devices clamp the circuit board together.
[0063] like Figure 13 A lifting device is provided between the fixed conveyor line 110 and the adjustable conveyor line 140. The lifting device is used to lift the circuit board. One lifting device is located between the two clamping structures, and another lifting device is located below the adhesive applicator 500. The lifting device includes a second lifting device 820, a second support plate 810, and a first raising block 800. The second support plate 810 is installed on the second lifting device 820, and the first raising block 800 is installed on the second support plate 810. The second lifting device 820 drives the second support plate 810 to rise or fall.
[0064] The second lifting device 820 raises or lowers the second support plate 810, allowing for flexible adjustment of the lifting height. This lifting device, positioned between the two clamping structures, ensures the circuit board is accurately positioned by adjusting the lifting height when the clamping structures hold the circuit board. This facilitates precise clamping of the circuit board by the clamping structures, improves the accuracy of circuit board positioning, and makes it easier for the edge-wrapping device to wrap the gold fingers.
[0065] The lifting device located below the adhesive applicator 500 can adjust the lifting height to position the circuit board accurately when the second clamping device clamps the circuit board. This facilitates precise clamping of the circuit board by the clamping structure, improves the accuracy of circuit board positioning, and makes it easier for the adhesive applicator 500 to apply adhesive to the gold finger surface.
[0066] like Figure 1 and Figure 8 The longitudinal moving device drives the lateral moving device to move, and the lateral moving device drives the adhesive applicator 500 to move.
[0067] The longitudinal moving device includes a gantry frame 410, a first motor, a first lead screw and nut mechanism, a fourth guide rail 430, a fourth slider 440, a first housing 420, and a third slider. Two gantry frames 410 are spaced apart. The first housing 420 is mounted on one gantry frame 410, and the first lead screw and nut mechanism is installed inside the first housing 420. The third slider is slidably connected inside the first housing 420 and fixedly connected to a nut on the first lead screw and nut mechanism. The first motor is mounted at one end of the first housing 420 and drives the first lead screw and nut mechanism, which in turn moves the third slider along the first housing 420. The fourth guide rail 430 is mounted on the other gantry frame 410, and the fourth slider 440 is slidably connected to the fourth guide rail 430. The lateral moving device includes a second housing 450, a second motor, a second lead screw and nut mechanism, and a seventh slider. The second housing 450 is fixedly connected to the fourth slider 440 and the third slider respectively. The second lead screw 180 nut mechanism is installed inside the second housing 450. The seventh slider is slidably connected inside the second housing 450 and fixedly connected to the nut of the second lead screw 180 nut mechanism. The second motor is installed at one end of the second housing 450 and drives the second lead screw 180 nut mechanism. The adhesive applicator 500 is fixedly connected to the seventh slider.
[0068] Through the coordinated operation of the longitudinal and lateral moving devices, the adhesive applicator 500 can move flexibly within a plane, adapting to the adhesive application needs of circuit boards of different sizes and shapes. Whether applying adhesive to the edge of the circuit board or to a specific location inside, the position of the adhesive applicator 500 can be adjusted, greatly improving the versatility and flexibility of the equipment.
[0069] like Figure 3 The rolling device and the edge-pressing device are located on both sides of the first clamping device. A second position adjustment device is located at the bottom of one edge-pressing device. The second position adjustment device includes a sixth slide rail 301, a sixth slider, a fifth connecting plate 305, a second mounting base 303, a third lead screw 302, a third nut 304, and a fourth motor. Two sixth slide rails 301 are located on both sides of the bottom of the edge-pressing device. The sixth slider is slidably connected to the sixth slide rail 301, and the edge-pressing device is mounted on the sixth slider. Two second mounting bases 303 are spaced apart along the length of the sixth slide rail 301. The two ends of the third lead screw 302 are rotatably connected to the second mounting base 303, and the third nut 304 is threadedly connected to the third lead screw 302. The third nut 304 is mounted on the fifth connecting plate 305, which is fixedly connected to the edge-pressing device. The fourth motor drives the third lead screw 302 to rotate.
[0070] In actual production, circuit boards come in various sizes and specifications. A fourth motor drives the third lead screw 302 to rotate, which in turn moves the third nut 304, which is threadedly connected to the lead screw 302. Since the third nut 304 is mounted on a fifth connecting plate 305 fixedly connected to the pressing device, the pressing device can move precisely along the sixth slide rail 301. This allows the pressing device to precisely adjust its position according to the width and gold finger position of different circuit boards, adapting to the pressing requirements of circuit boards of different specifications, thus improving the equipment's versatility and applicability.
[0071] The working principle is as follows:
[0072] After the circuit board is transported to the position of the second clamping device, the lifting device raises the circuit board to a certain height, and then the second clamping device clamps the circuit board. Subsequently, the adhesive applicator 500 applies adhesive tape to the surface of the gold fingers.
[0073] If the circuit board being processed does not require tape edging, it can be directly conveyed to the next process or discharged directly after the tape is applied.
[0074] If the circuit board being processed requires tape to be applied around the gold fingers, after the tape is applied, the second clamping device and the lifting device reset, allowing the circuit board to return to the conveying device. The conveying device then transports the circuit board to the edge-wrapping device. At this point, the lifting device lifts the circuit board, the first clamping device holds the circuit board, and then the edge-pressing plate 200 of the edge-pressing device moves closer to the gold fingers. This causes the buffer pad 210 on the edge-pressing plate 200 to press the tape against the side of the circuit board in the thickness direction, ensuring the tape adheres tightly to the side of the circuit board. Then, the edge-pressing device rises, exposing the first pressure roller 320 and the second pressure roller 330, which were previously hidden by the edge-pressing plate 200. Then, the first pressure roller 320 and the second pressure roller 330 are driven to move towards the circuit board, so that the circuit board passes between the first pressure roller 320 and the second pressure roller 330. The first pressure roller 320 rolls over the lower surface of the gold finger and presses the tape onto the lower surface of the gold finger, so that the tape is firmly attached to the lower surface of the gold finger. The second pressure roller 330 rolls over the upper surface of the gold finger and smooths the tape attached to the upper surface of the gold finger. This completes the edge wrapping of the gold finger.
[0075] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in the present utility model should be included within the protection scope of the present utility model.
Claims
1. A gold finger adhesive application device, characterized in that, include: Adhesive application device (500) and edge binding device; The adhesive applicator (500) is used to apply adhesive tape to the gold finger surface of the circuit board; The edge-binding device includes a first clamping device, an edge-pressing device, and a roller pressing device; the first clamping device is used to clamp the circuit board, the edge-pressing device is used to press the tape tightly against the side edge of the circuit board, and the roller pressing device is used to press the tape tightly against the surface of the gold fingers. The roller pressing device and the edge pressing device are disposed on at least one side of the first clamping device. The edge pressing device is movably disposed on the roller pressing device. The roller pressing device includes a first pressure roller (320) and a first power device (370). The first power device (370) drives the first pressure roller (320) to move toward or away from the circuit board.
2. The gold finger adhesive application device according to claim 1, characterized in that: The roller pressing device further includes a second pressure roller (330), a first connecting arm (321), a second connecting arm (331), a first spring connecting plate, a second spring connecting plate (332), a first mounting plate (340), and a column (310); the first pressure roller (320) and the second pressure roller (330) are arranged in parallel, and the second pressure roller (330) is located above the first pressure roller (320); the column (310) is located at both ends of the first mounting plate (340), the first power device (370) is fixedly connected to the first mounting plate (340), and the first power device (370) drives the first mounting plate (340) to move towards or away from the circuit board; The first pressure roller (320) is rotatably connected to the two ends of the first connecting arm (321), and the second pressure roller (330) is rotatably connected to the two ends of the second connecting arm (331). The middle part of the first connecting arm (321) is hinged to the first mounting plate (340), and the middle part of the second connecting arm (331) is hinged to the first mounting plate (340). The end of the first connecting arm (321) away from the first pressure roller (320) is fixedly connected to the first spring connecting plate, and the end of the second connecting arm (331) away from the second pressure roller (330) is fixedly connected to the second spring connecting plate (332). An elastic element is provided between the first spring connecting plate and the second spring connecting plate (332). When the first spring connecting plate and the second spring connecting plate (332) move toward each other, they need to overcome the resistance generated by the elastic element.
3. The gold finger adhesive application device according to claim 2, characterized in that: The roller pressing device further includes a shock absorption device; the shock absorption device includes a fixed plate (350), a buffer plate (360), a first guide sleeve (390), a first guide rod (380), and a buffer (351); the first guide sleeve (390) is installed on the fixed plate (350), the first guide rod (380) passes through the first guide sleeve (390), one end of the first guide rod (380) is connected to the first mounting plate (340), and the other end is connected to the buffer plate (360); the buffer (351) is fixedly installed on the fixed plate (350), and the first power device (370) is installed on the fixed plate (350).
4. The gold finger adhesive application device according to claim 3, characterized in that: The pressing device includes a first lifting device (260), a first support plate, a second power device (250), and a pressing plate (200). The first lifting device (260) is mounted on the column (310), the first support plate is mounted on the first lifting device (260), the first lifting device (260) drives the first support plate to rise or fall, the second power device (250) is mounted on the first support plate, and the pressing plate (200) is mounted on the output end of the second power device (250). The second power device (250) drives the pressing plate (200) to move towards or away from the circuit board.
5. The gold finger adhesive application device according to claim 4, characterized in that: The pressing device further includes a guiding device, which includes a first guide rail, a first slider (230) and a third connecting plate (220). The first guide rail is installed on the top of the first support plate, the first slider (230) is slidably connected to the first guide rail, and the third connecting plate (220) is installed on the first slider (230). The side of the third connecting plate (220) is fixedly connected to the pressing plate (200).
6. The gold finger adhesive application device according to claim 5, characterized in that: A buffer pad (210) is provided on the pressure plate (200).
7. The gold finger adhesive application device according to claim 1, characterized in that: The first clamping device includes a clamping plate structure symmetrically arranged, the clamping plate structure including a first base plate (610), a third power device (620), a pneumatic gripper (630) and a clamping plate (640); the third power device (620) is mounted on the first base plate (610), the pneumatic gripper (630) is mounted on the third power device (620), the third power device (620) drives the pneumatic gripper (630) to move towards or away from the circuit board; the clamping plate (640) is clamped on the pneumatic gripper (630).
8. The gold finger adhesive application device according to claim 7, characterized in that: It also includes a conveying device for moving the circuit board from the adhesive applicator (500) to the edge-wrapping device. The conveying device includes a fixed conveyor line (110), an adjustable conveyor line (140), a first fixed seat (120), a second fixed seat (170), a second lead screw (180), a second nut, a third motor (190), a first mounting seat (150), a second guide rod (130), and a second guide sleeve (160). The fixed conveyor line (110) and the adjustable conveyor line (140) are arranged in parallel. The fixed conveyor line (110) is fixedly installed on the top of the first fixed seat (120), and the second fixed seat (170) is located on the side of the adjustable conveyor line (140) away from the fixed conveyor line (110). The first mounting base (150) is fixedly installed at the bottom of the adjustable conveyor line (140), the second guide sleeve (160) is installed on the first mounting base (150), one end of the second guide rod (130) is installed on the first fixed base (120), and the other end is fixedly installed on the second fixed base (170). The second guide rod (130) is slidably connected to the second guide sleeve (160). A second nut is fixedly installed on several of the first mounting seats (150), the second lead screw (180) is threadedly connected to the second nut, one end of the second lead screw (180) is rotatably connected to the first fixed seat (120), and the other end is rotatably connected to the second fixed seat (170), and the third motor (190) drives the second lead screw (180) to rotate.
9. The gold finger adhesive application device according to claim 8, characterized in that: The conveying device is provided with a first position adjustment device on both sides. The first position adjustment device is used to adjust the position of the first clamping device. The first position adjustment device includes a second slide rail (670), a second slider (660), a fourth connecting plate (650), and a stop device. The second slide rail (670) is horizontally installed on the side of the conveying device. The second slider (660) is slidably connected to the second slide rail (670). The fourth connecting plate (650) is fixedly installed on the second slide rail (670). The first base plate (610) is fixedly installed on the fourth connecting plate (650).
10. The gold finger adhesive application device according to claim 9, characterized in that: The stopping device includes a stopping bolt (651), and the fourth connecting plate (650) has a bolt hole, and the stopping bolt (651) is threadedly connected to the bolt hole.
11. The gold finger adhesive application device according to claim 8, characterized in that: The conveying device is further provided with a second clamping device on at least one side, the second clamping device being used to clamp the circuit board; the second clamping device is located below the adhesive applicator (500), the second clamping device including a second base plate (700), a fifth slide rail (740), a fifth slider (730), a fourth power device (710) and a push plate (720). The second base plate (700) is installed on the side of the conveying device. The fifth slide rail (740) is arranged parallel to the second base plate (700). The fifth slider (730) is slidably connected to the fifth slide rail (740). The fourth power device (710) is fixedly installed on the second base plate (700). The push plate (720) is fixedly connected to the fourth power device (710) and the fifth slider (730) respectively. The fourth power device (710) drives the push plate (720) to move towards or away from the circuit board.
12. The gold finger adhesive application device according to claim 7, characterized in that: It also includes a lifting device for supporting the circuit board; one of the lifting devices is disposed between the two clamping structures, and another of the lifting devices is disposed below the adhesive applicator (500). The lifting device includes a second lifting device (820), a second support plate (810), and a first raising block (800). The second support plate (810) is mounted on the second lifting device (820), and the first raising block (800) is mounted on the second support plate (810). The second lifting device (820) drives the second support plate (810) to rise or fall.
13. The gold finger adhesive application device according to claim 1, characterized in that: It also includes a lateral moving device and a longitudinal moving device, wherein the longitudinal moving device drives the lateral moving device to move, and the lateral moving device drives the adhesive applicator (500) to move.
14. The gold finger adhesive application device according to claim 13, characterized in that: The longitudinal moving device includes a gantry (410), a first motor, a first lead screw and nut mechanism, a fourth guide rail (430), a fourth slider (440), a first housing (420), and a third slider; Two gantry frames (410) are spaced apart. A first housing (420) is installed on one of the gantry frames (410). A first screw and nut mechanism is installed inside the first housing (420). The third slider is slidably connected inside the first housing (420) and fixedly connected to the nut on the first screw and nut mechanism. A first motor is installed at one end of the first housing (420). The first motor drives the first screw and nut mechanism. The first screw and nut mechanism drives the third slider to move along the first housing (420). A fourth guide rail (430) is installed on another gantry frame (410), and the fourth slider (440) is slidably connected to the fourth guide rail (430); The lateral movement device includes a second housing (450), a second motor, a second lead screw (180) nut mechanism, and a seventh slider; The second housing (450) is fixedly connected to the fourth slider (440) and the third slider respectively. The second lead screw (180) nut mechanism is installed inside the second housing (450). The seventh slider is slidably connected inside the second housing (450) and fixedly connected to the nut of the second lead screw (180) nut mechanism. The second motor is installed at one end of the second housing (450) and drives the second lead screw (180) nut mechanism. The adhesive applicator (500) is fixedly connected to the seventh slider.
15. The gold finger adhesive application device according to claim 1, characterized in that: The roller pressing device and the edge pressing device are arranged on both sides of the first clamping device. A second position adjustment device is provided at the bottom of the edge pressing device. The second position adjustment device includes a sixth slide rail (301), a sixth slider, a fifth connecting plate (305), a second mounting base (303), a third lead screw (302), a third nut (304), and a fourth motor. The two sixth slide rails (301) are arranged on both sides of the bottom of the edge pressing device. The sixth slider is slidably connected to the sixth slide rail (301). The edge pressing device is installed on the sixth slider. Two second mounting seats (303) are spaced apart along the length of the sixth slide rail (301). The two ends of the third lead screw (302) are rotatably connected to the second mounting seats (303). The third nut (304) is threadedly connected to the third lead screw (302). The third nut (304) is mounted on the fifth connecting plate (305). The fifth connecting plate (305) is fixedly connected to the pressing device. The fourth motor drives the third lead screw (302) to rotate.