Wafer cassette handling mechanism and buffer device

Abstract

The utility model discloses a wafer box carrying mechanism and buffer device, and the carrying mechanism includes first linear module, second linear module and grab hand, and the output of second linear module and first linear module is connected and can move along X to under the drive of first linear module, and the output of grab hand and second linear module is connected and can move along Z to under the drive of second linear module. First linear module and second linear module all include driving part and the transmission belt that rotates under the drive of driving part, and the transmission belt includes mutually parallel first section and second section, and the both sides of first section and second section width direction are provided with guide wheel, and the side wall of guide wheel and the side of transmission belt abut and roll contact with transmission belt. The carrying mechanism can stably carry wafer box, and improves the butt joint precision of wafer box and loading machine platform and overhead travelling crane.

Description

Technical Field

[0001] This utility model relates to the field of wafer processing equipment technology, and in particular to a wafer box handling mechanism and a buffer device. Background Technology

[0002] In semiconductor manufacturing, overhead crane systems are used to move wafer cassettes containing wafers between multiple processes. However, due to the large number of wafer processing devices, relying entirely on overhead cranes for all transport would increase workload and waiting time. Therefore, a buffer device is installed between the overhead crane and the wafer processing equipment to temporarily store wafer cassettes. This buffer device interfaces with the overhead crane to provide the crane with the required wafer cassettes and receive wafer cassettes delivered by the crane. It also interfaces directly with the loader to move the wafer cassettes in and out of the loader. During this process, the stability of wafer cassette transport significantly affects the docking accuracy between the wafer cassettes and the loader and overhead crane. Utility Model Content

[0003] To overcome the above-mentioned shortcomings, the purpose of this utility model is to provide a wafer cassette handling mechanism and a buffer device. The handling mechanism can stably handle wafer cassettes and improve the docking accuracy between wafer cassettes and loader platforms and overhead cranes.

[0004] To achieve the above objectives, the technical solution adopted by this utility model is: a wafer cassette handling mechanism, including a first linear module, a second linear module, and a gripper, wherein the output end of the second linear module is connected to the first linear module and can move along the X direction under the drive of the first linear module, and the gripper is connected to the output end of the second linear module and can move along the Z direction under the drive of the second linear module;

[0005] Both the first linear module and the second linear module include a driving component and a transmission belt that rotates under the drive of the driving component. The transmission belt includes a first section and a second section that are parallel to each other. Guide wheels are provided on both sides of the first section and the second section in the width direction. The sidewalls of the guide wheels abut against the side of the transmission belt and make rolling contact with the transmission belt.

[0006] The beneficial effects of this invention are as follows: both linear modules adopt a transmission belt structure, greatly reducing maintenance and production costs. It achieves a simple structure and easy installation while meeting production requirements. For the transmission belt, which is prone to deformation and misalignment, guide pulleys are added to both sides of its width to prevent misalignment during operation. The transmission belt and guide pulleys rotate in contact, preventing wear on the transmission belt and ensuring its service life.

[0007] Furthermore, both the first linear module and the second linear module include a driving wheel and a driven wheel. The rotation shaft of the driving member is connected to the driving wheel. The transmission belt is wound around the driving wheel and the driven wheel. The guide wheel is located near the driving wheel and the driven wheel.

[0008] The guide pulleys are positioned at the drive and driven pulleys, where the drive belt is prone to wear, to prevent the drive belt from shifting during operation and rubbing against the flanges of the drive or driven pulleys, thus causing wear. Simultaneously, the guide pulleys are positioned close to the drive and driven pulleys to guide the drive belt without interfering with the movement of the second linear module or gripper driven by the drive belt.

[0009] Furthermore, the minimum distance between the guide wheels on both sides of the first or second segment in the width direction is equal to or slightly greater than the width of the transmission belt. This ensures that the transmission belt will not come into direct contact with the guide wheels when it is not deviating, but will be immediately stopped and guided by the guide wheels when it deviates.

[0010] Furthermore, the first linear module also includes a first fixed frame and a first sliding plate. The drive component of the first linear module is fixed on the first fixed frame, and the first sliding plate is fixedly connected to the first section or the second section of the transmission belt of the first linear module.

[0011] Furthermore, the first linear module also includes at least two first guide rails fixed on the first mounting bracket. The first guide rails extend along the X direction and are spaced apart along the Z direction. A first slider that slides along the first guide rails is fixed on the first slide plate.

[0012] Furthermore, a protective cover is fixed on the first mounting bracket to cover the driving wheel and driven wheel of the first linear module, and the fixed shaft of the guide wheel of the first linear module is fixedly connected to the protective cover. The protective cover protects the first driving wheel and the first driven wheel, and also provides a position for the guide wheel. The protective cover also serves as a limit; when the first sliding plate and the protective cover abut, the first sliding plate has slid to its limit position.

[0013] Furthermore, the second linear module includes a second fixing frame fixed on the first slide plate, the drive component is fixed on the second fixing frame, and a second slide plate is slidably connected to the second fixing frame and fixedly connected to the first or second section of the transmission belt of the second linear module, and the gripper is fixed on the second slide plate.

[0014] Furthermore, the second linear module also includes at least two second guide rails fixed on the second mounting bracket. The second guide rails extend along the Z direction and are spaced apart along the X direction. A second slider that slides along the second guide rails is fixed on the second slide plate.

[0015] This utility model also discloses a buffer device, including the above-mentioned transport mechanism and a plurality of placement seats located on the Y-direction side of the gripper, each of the placement seats being used to place one of the wafer cassettes, and the transport mechanism transporting the wafer cassettes between the placement seats.

[0016] Furthermore, the placement seats are arranged in at least three rows along the Z direction, and each row of placement seats is arranged in multiple rows along the X direction. Attached Figure Description

[0017] Figure 1 This is a three-dimensional structural diagram of the conveying mechanism in an embodiment of this utility model;

[0018] Figure 2 This is a three-dimensional structural diagram of the first linear module in an embodiment of this utility model;

[0019] Figure 3 This is a schematic diagram of the first drive wheel in an embodiment of the present invention;

[0020] Figure 4 This is a schematic diagram of the first driven wheel in an embodiment of the present utility model;

[0021] Figure 5 This is a three-dimensional structural diagram of the second linear module in an embodiment of this utility model;

[0022] Figure 6 This is a schematic diagram of the second drive wheel in an embodiment of the present invention;

[0023] Figure 7 This is a schematic diagram of the second driven wheel in an embodiment of the present invention;

[0024] Figure 8 This is a three-dimensional structural diagram of the cache device in an embodiment of the present invention.

[0025] In the picture:

[0026] 1. First linear module;

[0027] 11. First driving component; 12. First driving wheel; 13. First driven wheel; 14. First transmission belt; 15. First fixed frame; 16. First sliding plate; 17. First guide rail; 18. Protective cover;

[0028] 2. Second linear module;

[0029] 21. Second driving component; 22. Second driving wheel; 23. Second driven wheel; 24. Second transmission belt; 25. Second fixed frame; 26. Second sliding plate; 27. Second guide rail;

[0030] 3. Handle;

[0031] 4. Guide wheels;

[0032] 5. Placement base. Detailed Implementation

[0033] The preferred embodiments of the present invention will now be described in detail with reference to the accompanying drawings, so that the advantages and features of the present invention can be more easily understood by those skilled in the art, thereby making a clearer and more definite definition of the scope of protection of the present invention.

[0034] This utility model discloses a wafer cassette handling mechanism for moving wafer cassettes between different placement seats.

[0035] See appendix Figure 1 and attached Figure 8 As shown, the handling mechanism includes a first linear module 1, a second linear module 2, and a gripper 3. The output ends of the second linear module 2 and the first linear module 1 are connected, and the gripper 3 can move along the X-axis under the drive of the first linear module 1. The output ends of the gripper 3 and the second linear module 2 are connected, and the gripper 3 can move along the Z-axis under the drive of the second linear module 2. The first linear module 1 and the second linear module 2 form a cross-shaped moving mechanism, which can drive the gripper 3 to different positions to grip and place wafer cassettes on different placement seats 5.

[0036] The first linear module 1 and the second linear module 2 both include a driving component and a transmission belt that rotates under the drive of the driving component. The transmission belt includes a first section and a second section that are parallel to each other. Guide wheels 4 are provided on both sides of the first section and the second section in the width direction. The sidewalls of the guide wheels 4 abut against the side of the transmission belt and make rolling contact with the transmission belt.

[0037] In this embodiment, both linear modules employ a drive belt structure, significantly reducing maintenance and production costs. It achieves a simple structure and easy installation while meeting production requirements. Because wafers are easily damaged, high stability is required during wafer cassette handling. In this embodiment, guide wheels 4 are added to both sides of the drive belt, which is prone to deformation and misalignment, to prevent misalignment during operation. The drive belt and guide wheels rotate in contact, preventing wear on the drive belt and ensuring its lifespan.

[0038] See appendix Figure 2 and attached Figure 5As shown, the first linear module 1 and the second linear module 2 both include a driving wheel and a driven wheel. The rotating shaft of the driving component is connected to the driving wheel, the transmission belt is wound around the driving wheel and the driven wheel, and the guide wheel 4 is located near the driving wheel and the driven wheel.

[0039] Both the driving and driven pulleys include a roller body and flanges on both sides. The transmission belt is located between the two flanges. However, at the driving and driven pulleys, the transmission belt is prone to misalignment and contact with the flanges, causing wear. Therefore, guide pulley 4 is placed at the driving and driven pulleys where the transmission belt is prone to wear to prevent the transmission belt from misaligning during operation and rubbing against the flanges of the driving or driven pulleys, thus preventing wear. At the same time, guide pulley 4 is positioned close to the driving and driven pulleys, which, while guiding the transmission belt, does not interfere with the movement of the second linear module 2 or gripper 3 driven by the transmission belt.

[0040] The first linear module 1 has a drive component, a drive wheel, a driven wheel, and a transmission belt, which are respectively a first drive component 11, a first drive wheel 12, a first driven wheel 13, and a first transmission belt 14; the second linear module 2 has a drive component 21, a second drive wheel 22, a second driven wheel 23, and a second transmission belt 24, which are respectively a second drive component 21, a second drive wheel 22, a second driven wheel 23, and a second transmission belt 24.

[0041] See appendix Figure 3 Appendix Figure 4 Appendix Figure 6 and attached Figure 7 As shown, the two guide wheels 4 on both sides of the first and second ends form a group, which defines the position of the guide belt in the width direction of the transmission belt. The two guide wheels 4 in the group are parallel to each other, and the minimum distance between them is equal to or slightly greater than the width of the transmission belt. This ensures that the transmission belt just contacts the guide wheel 4 when it is not deviating, but when the transmission belt deviates, it will be immediately limited and guided by the guide wheel 4. "Slightly greater than" means that the difference between the minimum distance and the width of the transmission belt is less than 1mm.

[0042] See appendix Figure 2 As shown, the first linear module 1 also includes a first fixed frame 15 and a first sliding plate 16. A first driving member 11 is fixed on the first fixed frame 15. A first driving wheel 12 and a first driven wheel 13 are rotatably connected to the first fixed frame 15. The first sliding plate 16 is fixedly connected to the first section or the second section of the first transmission belt 14. When the first driving member 11 rotates clockwise or counterclockwise, both the first and second sections move along the X-direction, driving the first sliding plate 16 to move linearly back and forth along the X-direction.

[0043] Because the transmission belt is flexible, in order to further limit the movement direction of the first slider, the first linear module 1 also includes at least two first guide rails 17 fixed on the first fixed frame 15. The first guide rails 17 extend along the X direction and are spaced apart along the Z direction. The first slider that slides along the first guide rails 17 is fixed on the first slide plate 16. The multiple first guide rails 17 can improve the stability of the movement of the first slide plate 16.

[0044] For example, two first guide rails 17 are provided, one located between the first and second sections of the first transmission belt 14, and the other located on one side of the first transmission belt 14 in the Z direction. The first sliders slidably connected to the two first guide rails 17 are located at the upper and lower ends of the first slide plate 16, respectively. At this time, the first linear module 1 that drives the second linear module 2 to move has a double-rail structure, which improves the synchronization and stability of the first slide plate 16 when sliding.

[0045] The first fixed frame 15 includes two back plates spaced apart along the Z-direction and extending along the X-direction. Multiple connecting plates, spaced apart along the X-direction between the two back plates, connect the two back plates. Two first guide rails 17 are respectively fixed to the two back plates. The structure of the first fixed frame 15, while satisfying connection requirements, reduces material usage, saves costs, and lightens the overall weight of the handling mechanism. The back plates can be connected to other handling modules or fixed frames.

[0046] See appendix Figure 3 and attached Figure 4 As shown, a protective cover 18 covering the first driving wheel 12 and the first driven wheel is fixed on the first fixed frame 15. The fixed shaft of the guide wheel 4 of the first linear module 1 is fixedly connected to the protective cover 18. The guide wheel 4 includes a rotating part that is rotatably connected to the fixed shaft. The guide wheel 4 of the first linear module 1 is completely located inside the protective cover 18 and does not protrude from the protective cover 18.

[0047] The protective cover 18 protects the first driving wheel 12 and the first driven wheel, and also provides a position for the guide wheel 4. The protective cover 18 also serves as a limit; when the first sliding plate abuts against the protective cover 18, the first sliding plate has slid to its limit position.

[0048] See appendix Figure 5 As shown, the second linear module 2 includes a second fixed frame 25 fixed on the first slide plate 16, a drive component fixed on the second fixed frame 25, and a second slide plate 26 slidably connected to the second fixed frame 25 and fixedly connected to the first or second section of the transmission belt of the second linear module 2. A gripper 3 is fixed on the second slide plate 26. The second slide plate 26 serves as the output end of the second linear module 2 and can drive the gripper 3 to move along the Z direction.

[0049] To improve the stability of the sliding of the second slide plate 26 and thus ensure the stability of the wafer cassette during handling, the second linear module 2 also includes at least two second guide rails 27 fixed on the second mounting bracket 25. The second guide rails 27 extend along the Z direction and are spaced apart along the X direction. A second slider that slides along the second guide rails 27 is fixed on the second slide plate 26.

[0050] For example, there are two second guide rails 27, located on both sides of the second drive belt 24 in the X direction.

[0051] In one embodiment, see Appendix Figure 8 As shown, a buffer device includes the aforementioned transport mechanism and a plurality of placement seats 5 located on one side of the gripper 3Y. Each placement seat 5 is used to place a wafer cassette, and the transport mechanism transports the wafer cassette between the placement seats 5.

[0052] The placement seats 5 are arranged in at least three rows along the Z direction, and each row of placement seats 5 has multiple placement seats 5 arranged along the X direction. The top row of placement seats 5 is used to place wafer boxes waiting to be transported by the overhead crane, the bottom row of placement seats 5 is used to place wafer boxes that are connected to the process equipment, and the other placement positions are used to place wafer boxes in transit.

[0053] For example, three rows of placement seats 5 are provided, from top to bottom as a first layer of placement seats 5, a second layer of placement seats 5, and a third layer of placement seats 5. The first layer of placement seats 5 includes four placement seats 5, two of which are inlets and two are outlets. The second layer of placement seats 5 includes four placement seats 5, and the third layer of placement seats 5 includes two placement seats 5.

[0054] The overhead crane places the wafer cassette into the first-level placement seat 5, which serves as the inlet. The transport mechanism uses grippers 3 to pick up the wafer cassette and then moves it to a position aligned with the third-level placement seat 5 via the first linear module 1 and the second linear module 2. When there is a wafer cassette on the third-level placement seat 5, the transport mechanism first moves it to the second-level placement seat 5 to avoid occupying the first-level placement seat 5 and obstructing the overhead crane's placement of the wafer cassette. When the process equipment finishes processing the wafer cassette on the third-level placement seat 5, the transport mechanism first moves it to the second-level placement seat 5 or to the outlet placement seat 5 within the second-level placement seat 5 to prevent wafer cassettes that have completed their production tasks from occupying the inlet of the first-level placement seat 5, thus affecting production efficiency. After the wafer cassette on the outlet placement seat 5 of the first-level placement seat 5 is removed by the overhead crane, the transport mechanism moves the wafer cassette on the second-level placement seat 5 to the outlet placement seat 5 of the first-level placement seat 5 to await transport by the overhead crane. After the third-layer placement seat 5 is vacant, the handling mechanism will then move the wafer cassettes that need to be processed to the third-layer placement seat 5.

[0055] The buffer device enables the interaction between the overhead crane and the process equipment, reducing the time that the overhead crane or process equipment waits for the overhead crane, thereby improving the production efficiency of the semiconductor industry.

[0056] The above embodiments are only for illustrating the technical concept and features of this utility model. Their purpose is to enable those skilled in the art to understand the content of this utility model and implement it. They cannot be used to limit the protection scope of this utility model. All equivalent changes or modifications made in accordance with the spirit and essence of this utility model should be covered within the protection scope of this utility model.

Claims

1. A wafer cassette handling mechanism, characterized in that: It includes a first linear module, a second linear module, and a gripper. The output ends of the second linear module are connected to the first linear module and can move along the X direction under the drive of the first linear module. The gripper is connected to the output end of the second linear module and can move along the Z direction under the drive of the second linear module. Both the first linear module and the second linear module include a driving component and a transmission belt that rotates under the drive of the driving component. The transmission belt includes a first section and a second section that are parallel to each other. Guide wheels are provided on both sides of the first section and the second section in the width direction. The sidewalls of the guide wheels abut against the side of the transmission belt and make rolling contact with the transmission belt.

2. The wafer cassette handling mechanism according to claim 1, characterized in that: Both the first linear module and the second linear module include a driving wheel and a driven wheel. The rotation shaft of the driving member is connected to the driving wheel. The transmission belt is wound around the driving wheel and the driven wheel. The guide wheel is located near the driving wheel and the driven wheel.

3. The wafer cassette handling mechanism according to claim 1, characterized in that: The minimum distance between the guide wheels on both sides of the width direction of the first or second segment is equal to or slightly greater than the width of the transmission belt.

4. The wafer cassette handling mechanism according to any one of claims 1-3, characterized in that: The first linear module further includes a first fixed frame and a first sliding plate. The drive component of the first linear module is fixed on the first fixed frame, and the first sliding plate is fixedly connected to the first section or the second section of the transmission belt of the first linear module.

5. The wafer cassette handling mechanism according to claim 4, characterized in that: The first linear module further includes at least two first guide rails fixed on the first mounting bracket. The first guide rails extend along the X direction and are spaced apart along the Z direction. A first slider that slides along the first guide rails is fixed on the first slide plate.

6. The wafer cassette handling mechanism according to claim 4, characterized in that: A protective cover is fixed on the first fixed frame to cover the driving wheel and driven wheel of the first linear module, and the fixed shaft of the guide wheel of the first linear module is fixedly connected to the protective cover.

7. The wafer cassette handling mechanism according to claim 4, characterized in that: The second linear module includes a second fixed frame fixed to the first slide plate, the drive component fixed to the second fixed frame, a second slide plate slidably connected to the second fixed frame and fixedly connected to the first or second section of the transmission belt of the second linear module, and the gripper fixed to the second slide plate.

8. The wafer cassette handling mechanism according to claim 7, characterized in that: The second linear module further includes at least two second guide rails fixed on the second mounting bracket. The second guide rails extend along the Z direction and are spaced apart along the X direction. A second slider that slides along the second guide rails is fixed on the second slide plate.

9. A buffer device, characterized in that: The device includes a transport mechanism as described in any one of claims 1-8 and a plurality of placement seats located on the Y-direction side of the gripper, each of the placement seats being used to place one of the wafer cassettes, and the transport mechanism transporting the wafer cassettes between the placement seats.

10. The caching device according to claim 9, characterized in that: The placement seats are arranged in at least three rows along the Z direction, and each row of placement seats is arranged in multiple rows along the X direction.

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