Semiconductor adsorption platform

Abstract

This application relates to a semiconductor adsorption platform. The semiconductor adsorption platform includes a mounting base, a suction cup, and a leveling assembly disposed between the mounting base and the suction cup. The semiconductor adsorption platform also includes a tensioning assembly disposed between the mounting base and the suction cup. One end of the tensioning assembly is detachably clamped to the suction cup, and the other end is fixed to the mounting base. The tensioning assembly includes an elastic tension member that applies a tensioning force to the suction cup as it moves towards the mounting base, thereby pressing the suction cup firmly against the leveling assembly. The semiconductor adsorption platform provided by this application, through the detachable clamping connection design between the tensioning assembly and the suction cup, reduces the risk of bolt loosening and simplifies operation, significantly shortening equipment downtime and improving production efficiency. The continuous application of tensioning force by the elastic tension member ensures that the suction cup remains tightly pressed against the leveling assembly, eliminating the need for repeated adjustment of the leveling assembly after suction cup replacement, thus guaranteeing the stability of leveling accuracy.

Description

Technical Field

[0001] This application relates to the field of semiconductor testing technology, and in particular to a semiconductor adsorption platform. Background Technology

[0002] AOI (Automated Optical Inspection) is a common inspection technology in semiconductor testing. It uses optical algorithms to measure critical dimensions of wafers, such as linewidth and lineheight, film thickness, and surface roughness. AOI equipment typically uses a wafer stage to hold the wafer and place it in the inspection area of ​​the optical inspection unit for inspection. The wafer stage includes chucks to hold and fix the wafer; currently, the most common wafer stage chucks are metal chucks and microporous ceramic chucks. Because metal chucks and microporous ceramic chucks are suitable for different types of wafers, there may be situations in actual inspection where it is necessary to change the chuck.

[0003] In the industry, metal suction cups or microporous ceramic suction cups are typically designed with a finely adjustable leveling mechanism to facilitate leveling. A common leveling mechanism uses adjusting screws; specifically, three to four adjusting screws are evenly distributed at the bottom of the suction cup. The height of a specific area of ​​the suction cup is adjusted by changing the depth of the thread engagement on the screws. After leveling, the set screws on the side of the screws are tightened to fix the position. Finally, the suction cup is locked to the adjusting screws using connecting bolts, completing the entire adjustment and fixing process. When replacing the suction cup, the connecting bolts must be unscrewed, the old suction cup removed, and the new suction cup installed, repeating the above adjustment and fixing procedures. However, during the suction cup replacement process, the connecting bolts must be completely removed, posing a risk of bolts falling into the machine and affecting the convenience of disassembly and assembly. Furthermore, a secondary adjustment is required after each suction cup replacement, affecting the stability and efficiency of leveling accuracy.

[0004] Therefore, it is necessary to propose a new technical solution to overcome the shortcomings of existing technologies. Utility Model Content

[0005] Based on this, this application provides a semiconductor adsorption platform that can improve the ease of assembling and disassembling suction cups and ensure the stability of leveling accuracy.

[0006] Therefore, this application adopts the following technical solution: a semiconductor adsorption platform, including a mounting base, a suction cup, and a leveling component disposed between the mounting base and the suction cup. The semiconductor adsorption platform further includes a tensioning component disposed between the mounting base and the suction cup. One end of the tensioning component is detachably clamped to the suction cup, and the other end of the tensioning component is fixed to the mounting base. The tensioning component includes an elastic tension member, which applies a tensioning force to the suction cup as it moves toward the mounting base, so that the suction cup is pressed against the leveling component.

[0007] In some embodiments, the tensioning assembly includes a sleeve and a tension adjusting member that can move up and down relative to the sleeve. The elastic tension member is disposed in the sleeve, with one end connected to the sleeve and the other end connected to the tension adjusting member to move telescopically relative to the sleeve under the drive of the tension adjusting member.

[0008] In some embodiments, the elastic tension member is a tension spring, and the tension adjustment member is an adjusting nut threaded onto the sleeve.

[0009] In some embodiments, the sleeve has a longitudinally extending groove on its peripheral wall, the tensioning assembly includes a sliding rod that passes radially through the lower end of the tension spring and extends out of the groove at both ends, and the adjusting nut presses against the sliding rod.

[0010] In some embodiments, the adjusting nut has a set screw hole that opens radially therein, and the set screw hole is provided with a set screw for locking the adjusting nut to the sleeve.

[0011] In some embodiments, the upper end of the sleeve and the bottom surface of the suction cup are provided with a hook, and the other is provided with a hook. The sleeve and the suction cup are connected by the cooperation of the hook and the hook.

[0012] In some embodiments, the sleeve includes a separate upper section and a lower section, which are partially sleeved together. A groove is formed on the lower section, and an adjusting nut is screwed onto the lower section to drive the tension spring to extend or retract by driving the sliding rod.

[0013] In some embodiments, the leveling assembly includes a threaded leveling screw and a screw socket, and a clamp surrounding the connection between the leveling screw and the screw socket.

[0014] In some embodiments, the bottom surface of the suction cup is fixed with a wear-resistant pad for abutting against the upper end of the leveling assembly.

[0015] In some embodiments, there are multiple leveling components and multiple tensioning components, and each tensioning component and each leveling component are arranged in pairs close to each other.

[0016] The semiconductor adsorption platform provided in this application features a detachable clamping connection between the tensioning component and the suction cup. Compared to traditional technologies where connecting bolts must be completely removed, this reduces the risk of bolts falling out and prevents equipment malfunctions or increased maintenance costs caused by bolts falling into the machine. Furthermore, the clamping connection simplifies operation, allowing operators to quickly replace the suction cup without repeatedly tightening bolts, significantly reducing equipment downtime and improving production efficiency. Continuous tension is applied by the elastic tension component, ensuring the suction cup remains firmly against the leveling component. Even after replacing the suction cup, the initial leveling state of the leveling component is effectively maintained, eliminating the need for repeated adjustments and avoiding the impact of human error on leveling accuracy. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of this application or the conventional technology, the drawings used in the description of the embodiments or the conventional technology will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This is a three-dimensional assembly diagram of an embodiment of the semiconductor adsorption platform of this application.

[0019] Figure 2 This is a three-dimensional composite view of another embodiment of the semiconductor adsorption platform of this application.

[0020] Figure 3 This is a three-dimensional exploded view of an embodiment of the semiconductor adsorption platform of this application.

[0021] Figure 4 This is a three-dimensional exploded view of another implementation of the semiconductor adsorption platform of this application.

[0022] Figure 5 This is a three-dimensional assembly diagram of the tensioning components in one embodiment of the semiconductor adsorption platform of this application.

[0023] Figure 6 This is an exploded perspective view of the tensioning component in one embodiment of the semiconductor adsorption platform of this application.

[0024] Figure 7 This is a cross-sectional view of the tensioning component in one embodiment of the semiconductor adsorption platform of this application.

[0025] Figure 8 This is a three-dimensional assembly diagram of the leveling components in one embodiment of the semiconductor adsorption platform of this application.

[0026] Figure 9 This is a three-dimensional exploded view of the leveling component in one embodiment of the semiconductor adsorption platform of this application.

[0027] The component reference numerals are as follows: 100, Semiconductor adsorption platform; 1, Mounting base; 2, Suction cup; 21, Hook; 22, Wear-resistant pad; 3, Leveling assembly; 31, Leveling screw; 311, Operating section; 312, Threaded section; 313, Abutment surface; 32, Screw socket; 321, Fixing part; 322, Screw barrel section; 33, Clamp; 331, Left half clamp; 332, Right half clamp; 4, Tensioning assembly; 41, Mounting part; 411, Mounting shaft; 42, Sleeve; 421, Upper section cylinder; 4211, Hanging shaft; 4212, Fixing rod; 422, Lower section cylinder; 4221, Slide groove; 43, Tension adjusting component; 430, Set screw hole; 431, Set screw; 44, Elastic tension component; 45, Sliding rod. Detailed Implementation

[0028] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0029] It should be noted that when a component is referred to as being "fixed to" or "set on" another component, it can be directly on the other component or there may be an intermediate component. When a component is considered to be "connected to" another component, it can be directly connected to the other component or there may be an intermediate component present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this application's specification are for illustrative purposes only and do not represent the only possible implementation.

[0030] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0031] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature and the second feature are in indirect contact through an intermediate medium. Furthermore, "above," "over," and "on top" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0032] Unless otherwise defined, all technical and scientific terms used in this application have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in this application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. The term "and / or" as used in this application includes any and all combinations of one or more of the associated listed items.

[0033] Please see Figures 1 to 9 As shown, this application provides a semiconductor adsorption platform 100, including a mounting base 1, a suction cup 2, a leveling assembly 3 disposed between the mounting base 1 and the suction cup 2, and a tensioning assembly 4 disposed between the mounting base 1 and the suction cup 2. One end of the tensioning assembly 4 is detachably clamped to the suction cup 2, and the other end of the tensioning assembly 4 is fixed to the mounting base 1. The tensioning assembly 4 includes an elastic tension member 44, which applies a tensioning force to the suction cup 2 as it moves towards the mounting base 1, so that the suction cup 2 is pressed against the leveling assembly 3.

[0034] The semiconductor adsorption platform 100 provided in this application features a detachable clamping connection between the tensioning component 4 and the suction cup 2. Compared to traditional technologies where connecting bolts must be completely removed, this design reduces the risk of bolts falling off and prevents equipment malfunctions or increased maintenance costs caused by bolts falling into the machine. Furthermore, the clamping connection simplifies operation, allowing operators to quickly replace the suction cup 2 without repeatedly tightening bolts, significantly reducing equipment downtime and improving production efficiency. The elastic tension component 44 continuously applies tension, ensuring the suction cup 2 remains tightly pressed against the leveling component 3. Even after replacing the suction cup 2, the initial leveling state of the leveling component 3 is effectively maintained, eliminating the need for repeated adjustments to the stud thread engagement depth and avoiding the impact of human error on leveling accuracy.

[0035] Please see Figures 1 to 4As shown, in this embodiment, the mounting base 1 includes a generally square mounting plate with fixing structures such as mounting holes and mounting grooves for fixing the leveling component 3 and the tensioning component 4. The suction cup 2 is spaced apart from the mounting base 1. In this embodiment, the suction cup 2 is a generally circular plate and is a vacuum suction cup with a negative pressure chamber inside. A vacuum pump is connected to the negative pressure chamber to extract air, creating a negative pressure on the upper surface of the suction cup 2 to adsorb the semiconductor. The suction cup 2 can be a metal suction cup or a microporous ceramic suction cup.

[0036] The leveling component 3 and the tensioning component 4 are installed between the suction cup 2 and the mounting base 1. Both the leveling component 3 and the tensioning component 4 are connected at one end to the mounting base 1 and at the other end to the suction cup 2. In this embodiment, there are three leveling components 3, evenly distributed below the suction cup 2, to maintain the stability of the suction cup 2 through three-point support. The three leveling components 3 are independently adjustable to maintain the levelness of the suction cup 2. In this embodiment, there are also three tensioning components 4, and each tensioning component 4 is paired with each leveling component 3, close to each other. That is, the leveling components 3 provide a horizontal support reference for the suction cup 2, and the tensioning components 4 use elastic tension to evenly press the suction cup 2 against each leveling component 3. This arrangement ensures the uniformity of force on the suction cup 2, making the suction cup 2 tightly supported on the upper end of the leveling components 3, resulting in a more stable and reliable connection of the suction cup 2. Of course, in other embodiments, the number of leveling components 3 and tensioning components 4 is not limited to three, and can be other numbers; moreover, in other embodiments, the number of tensioning components 4 and leveling components 3 can also be set to different.

[0037] Please see Figure 4 As shown, a wear-resistant pad 22 is fixed to the bottom surface of the suction cup 2 to abut against the upper end of the leveling component 3. In this embodiment, the bottom surface of the suction cup 2 is provided with a receiving groove, in which the wear-resistant pad 22 is received and fixed by screws. The wear-resistant pad 22 is made of a material with higher wear resistance than the suction cup 2 to avoid the leveling component 3 directly contacting the suction cup 2, which could cause the suction cup 2 to be completely scrapped due to local wear. After a period of use, when the wear-resistant pad 22 is worn to a certain extent, the wear-resistant pad 22 can be removed and replaced with a new one.

[0038] Please refer to the following: Figure 8 and Figure 9As shown, in this embodiment, the leveling assembly 3 includes a leveling screw 31 and a screw socket 32 ​​that are threaded together, and a clamp 33 that surrounds the outside of the connection between the leveling screw 31 and the screw socket 32. Specifically, in this embodiment, the leveling screw 31 includes an operating section 311, a threaded section 312, and abutting surface 313, with the threaded section 312 and abutting surface 313 located on both sides of the operating section 311. The abutting surface 313 of the leveling screw 31 is used to directly contact the wear-resistant pad 22 on the bottom surface of the suction cup 2, and the threaded section 312 of the leveling screw 31 is used to thread into the screw socket 32. In this embodiment, the operating section 311 is a nut section, for example, a hexagonal nut, which allows a wrench to be used to rotate the leveling screw 31 to change the screwing depth of the threaded section 312 and the screw socket 32, thereby achieving height adjustment.

[0039] In this embodiment, the screw socket 32 ​​includes a fixing part 321 and a screw barrel section 322. The fixing part 321 is fixed to the mounting base 1 by bolts. The inner wall of the screw barrel section 322 is provided with a threaded hole that mates with the threaded section 312 of the leveling screw 31. In this embodiment, the clamp 33 is composed of a left half clamp 331 and a right half clamp 332 connected by bolts. Its inner wall is provided with an arc-shaped groove that matches the outer contour of the leveling screw 31 and the screw socket 32. When the leveling screw 31 is screwed into the screw socket 32 ​​to the set position, the clamping action of the clamp 33 prevents the threaded connection from loosening, ensuring the support stability between the abutting surface 313 of the leveling screw 31 and the suction cup 2.

[0040] Please refer to this carefully. Figures 5 to 7 As shown, the tensioning assembly 4 is an important component that enables convenient disassembly and disassembly of the suction cup 2 and ensures the stability of the suction cup 2's accuracy. In one embodiment, the tensioning assembly 4 includes a mounting part 41, a sleeve 42, a tension adjusting component 43, an elastic tension component 44, and a sliding rod 45. The following is a detailed description of each component and its assembly relationship.

[0041] In this embodiment, the mounting part 41 is fixedly mounted on the mounting base 1, and the mounting part 41 is connected to the lower end of the sleeve 42 via the mounting shaft 411. In this embodiment, the mounting part 41 is pivotally connected to the sleeve 42 via the mounting shaft 411. Therefore, even when there are errors in the processing and assembly of the components, the tensioning assembly 4 can still apply force to the suction cup 2 in a direction perpendicular to the suction cup 2, so as to ensure that the suction cup is subjected to uniform and reliable force.

[0042] In this embodiment, the tension adjusting member 43 can move up and down relative to the sleeve 42, one end of the elastic tension member 44 is connected to the sleeve 42, and the other end of the elastic tension member 44 is connected to the tension adjusting member 43, so that it can move telescopically relative to the sleeve 42 under the drive of the tension adjusting member 43.

[0043] Specifically, in this embodiment, the elastic tension member 44 is a tension spring, with spring hooks at its upper and lower ends and a cylindrical helical elastic body in the middle. A fixing rod 4212 extending radially through the sleeve 42 is provided near the upper part of the sleeve 42, and the fixing rod 4212 is axially fixed relative to the sleeve 42. A sliding rod 45 extending radially through the sleeve 42 is provided near the lower part of the sleeve 42, and the sliding rod 45 has a certain sliding space relative to the sleeve 42 in the axial direction. In this embodiment, by providing a longitudinally extending groove 4221 on the peripheral wall of the sleeve 42, and by extending the two ends of the sliding rod 45 into the groove 4221, it is possible to slide up and down along the groove 4221 in the longitudinal direction, i.e., along the axial direction of the sleeve 42. The elastic tension member 44 is housed in the sleeve 42, and its upper end spring hook is attached to the fixed rod 4212, while its lower end spring hook is attached to the sliding rod 45. When the sliding rod 45 moves downward, the elastic tension member 44 is elastically stretched and deformed, generating a downward force. The different lengths of the downward movement of the sliding rod 45 can provide different tensile forces.

[0044] Please continue reading. Figures 5 to 7 As shown, the movement of the sliding rod 45 is achieved by the tension adjusting component 43. In this embodiment, the tension adjusting component 43 is an adjusting nut threaded onto the sleeve 42, and the adjusting nut presses against the sliding rod 45. In this embodiment, the sleeve 42 is provided with a threaded section that engages with the adjusting nut. The adjusting nut moves up and down relative to the sleeve 42 by rotating clockwise and counterclockwise. Since the adjusting nut presses against the sliding rod 45, when the adjusting nut rotates upward, the sliding rod 45 moves upward, reducing the tension of the elastic tension component 44. When the adjusting nut rotates downward, the sliding rod 45 is compressed downward, increasing the tension of the elastic tension component 44. In other embodiments, the tension adjusting component 43 is not limited to the adjusting nut; it can be other components capable of driving the sliding rod 45 downward and locking it to the sleeve 42.

[0045] Furthermore, to ensure that the adjusting nut can be stably maintained in the adjusted position after adjustment, the adjusting nut also has a set screw hole 430 opened radially therein, and a set screw 431 is provided in the set screw hole 430 for locking the adjusting nut and the sleeve 42. After adjustment, the adjusting nut and the sleeve 42 are locked by screwing the set screw 431 into the set screw hole 430 on the side of the adjusting nut to prevent loosening.

[0046] In this embodiment, the sleeve 42 includes a separate upper section 421 and a lower section 422, which are partially fitted together. A groove 4221 is formed on the lower section 422, and an adjusting nut is screwed onto the lower section 422 to drive the tension spring to extend and retract via the drive sliding rod 45. Specifically, the sleeve 42 adopts a separate upper section 421 and lower section 422 design, with the lower part of the upper section 421 fitted inside the lower section 422. The two can be fixed by threaded connection or insertion. The groove 4221 is formed on the peripheral wall of the lower section 422, and the adjusting nut is screwed onto the external thread section provided on the lower section 422. The split design of the sleeve 42 facilitates the assembly of each component. During assembly, the upper section 421 and the lower section 422 are separated. The upper end of the tension spring is fixed to the fixing rod 4212 of the upper section 421. The sliding rod 45 is passed through the sliding groove 4221 on the lower section 422 and the lower end of the tension spring. Finally, the upper section 421 is inserted into the lower section 422 and fixed to complete the assembly.

[0047] Please see Figure 4 and Figure 5 As shown, one of the upper end of the sleeve 42 and the bottom surface of the suction cup 2 is provided with a hook 4211, and the other is provided with a hook 21. The sleeve 42 and the suction cup 2 are connected by the engagement of the hook 4211 and the hook 21. In this embodiment, the upper end of the sleeve 42 is provided with a hook 4211, and the bottom surface of the suction cup 2 is provided with a hook 21 that matches the hook 4211. In other embodiments, the hook 21 may be provided on the sleeve 42, and the hook 4211 may be formed on the bottom surface of the suction cup 2. In this embodiment, the hook 4211 is fixedly fixed to the upper section 421 along the radial direction of the upper section 421 of the sleeve 42, and the hook 21 is fixedly installed on the bottom surface of the suction cup 2. During installation, the connection is completed by inserting the mounting shaft 4211 into the hook 21; during disassembly, the tension adjustment component 43 is operated to reduce the tension of the elastic tension component 44, allowing the mounting shaft 4211 to easily detach from the hook 21. The tensioning assembly 4 and the suction cup 2 are connected by a clamping structure, avoiding the need to completely remove the bolts during disassembly, which is a common feature of traditional bolted connections. This significantly improves disassembly and assembly efficiency and eliminates the risk of parts falling off.

[0048] The assembly relationship of the various components of the semiconductor adsorption platform provided in one embodiment of this application and the disassembly and assembly process of the suction cup 2 are as follows. The lower ends of the leveling component 3 and the tensioning component 4 are fixedly connected to the mounting base 1. When the suction cup 2 needs to be installed, the leveling screw 31 of the leveling component 3 is first screwed into the screw socket 32 ​​to the initial position, and then locked by the clamp 33 to form a rigid support. Then loosen the set screw 431 on the adjusting nut, rotate the adjusting nut to put the tension spring in a slightly stretched state, and pull up the sleeve 42 so that the hook shaft 4211 of the upper section of the sleeve 42 engages with the hook 21 on the bottom surface of the suction cup 2. Since the tension spring is in a slightly stretched state, the hook shaft 4211 can easily engage with the hook 21, and the two will remain engaged after releasing. After the two are engaged, rotate the adjusting nut to the bottom so that the tension spring elongates to the set amount. When the tension reaches the set value, the suction cup 2 is pulled to the top of the leveling screw 31 of the leveling assembly 3 under the action of the elastic tension member 44. The wear-resistant pad 22 on the bottom surface of the suction cup 2 forms a surface contact with the abutting surface 313 of the leveling screw 31. At this time, tighten the set screw 431 to fix the adjusting nut, thus completing the connection of one tensioning assembly 4. Repeat the above operation to fix the remaining tensioning assemblies 4 to the suction cup 2.

[0049] To level, first loosen the clamp 33, then use a wrench to hold the operating section 311 of the leveling screw 31, and rotate the leveling screw 31 to raise or lower it to adjust the height. Once the height is adjusted, tighten the clamp 33 to fix the height position, thus completing the adjustment of one leveling component 3. Repeat the above steps to adjust the remaining leveling components 3 until the flatness meets the requirements. This solution allows leveling to be performed while the tensioning component 4 is kept taut, making the leveling operation more convenient. During equipment operation, the elastic tensioning component 44 continuously applies tension to ensure that the suction cup 2 remains in close contact with the leveling component 3, guaranteeing the stability of accuracy.

[0050] When suction cup 2 needs to be replaced, simply loosen the set screw 431 on the adjusting nut of the three tensioning components 4, rotate the adjusting nut to put the tension spring in a slightly stretched state, pull up the sleeve 42 to allow the hook shaft 4211 to slide out of the hook 21, and then remove suction cup 2. Then take a new suction cup 2 and assemble it on the tensioning component 4 according to the steps described above. When installing the new suction cup 2, repeat the above-described clamping connection and tension adjustment process. Since the initial leveling state of the leveling component 3 has been locked by the clamp 33, there is no need to readjust the leveling screw 31. It is only necessary to restore the set tension value by adjusting the tension component 43 to ensure the levelness of suction cup 2.

[0051] As described above in the specific embodiments, the semiconductor adsorption platform 100 provided in this application, through the detachable clamping connection design between the tensioning component 4 and the suction cup 2, eliminates the need for completely detached connecting parts during disassembly. Compared to the traditional method where connecting bolts must be completely removed, this reduces the risk of bolts falling off and avoids equipment malfunctions or increased maintenance costs caused by bolts falling into the machine. Furthermore, the clamping connection simplifies the operation steps, allowing operators to quickly replace the suction cup 2 without repeatedly tightening bolts, significantly reducing equipment downtime and improving production efficiency. The elastic tension member 44 continuously applies tension, ensuring that the suction cup 2 remains tightly pressed against the leveling component 3. Even after replacing the suction cup 2, the initial leveling state of the leveling component 3 can still be effectively maintained, eliminating the need to repeatedly adjust the stud thread engagement depth and avoiding the impact of human error on leveling accuracy.

[0052] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0053] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the scope of protection of this application. Therefore, the patent protection scope of this application should be determined by the appended claims.

Claims

1. A semiconductor adsorption platform comprising a mounting base (1), a chuck (2) and a leveling assembly (3) arranged between the mounting base (1) and the chuck (2), characterized in that, The semiconductor adsorption platform (100) further includes a tensioning assembly (4) disposed between the mounting base (1) and the suction cup (2). One end of the tensioning assembly (4) is detachably clamped to the suction cup (2), and the other end of the tensioning assembly (4) is fixed to the mounting base (1). The tensioning assembly (4) includes an elastic tension member (44), which applies a tensioning force to the suction cup (2) toward the mounting base (1) so that the suction cup (2) is pressed against the leveling assembly (3).

2. The semiconductor adsorption platform of claim 1, wherein, The tensioning assembly (4) includes a sleeve (42) and a tension adjusting member (43) that can move up and down relative to the sleeve (42). The elastic tension member (44) is disposed in the sleeve (42), one end of the elastic tension member (44) is connected to the sleeve (42), and the other end of the elastic tension member (44) is connected to the tension adjusting member (43) so that it can move telescopically relative to the sleeve (42) under the drive of the tension adjusting member (43).

3. The semiconductor adsorption platform of claim 2, wherein, The elastic tension member (44) is a tension spring, and the tension adjustment member (43) is an adjusting nut threaded onto the sleeve (42).

4. The semiconductor adsorption platform of claim 3, wherein, The sleeve (42) has a longitudinally extending groove (4221) on its peripheral wall. The tensioning assembly (4) includes a sliding rod (45) that passes through the lower end of the tension spring along the radial direction of the sleeve (42) and extends out of the groove (4221) at both ends. The adjusting nut presses against the sliding rod (45).

5. The semiconductor adsorption platform of claim 3, wherein, The adjusting nut has a set screw hole (430) opened radially therein, and a set screw (431) for locking the adjusting nut to the sleeve (42) is provided in the set screw hole (430).

6. The semiconductor adsorption platform of claim 2, wherein, The upper end of the sleeve (42) and the bottom surface of the suction cup (2) are provided with a hanging shaft (4211) and a hook (21) respectively. The sleeve (42) and the suction cup (2) are connected by the cooperation of the hanging shaft (4211) and the hook (21).

7. The semiconductor adsorption platform of claim 4, wherein, The sleeve (42) includes a separate upper section (421) and a lower section (422), which are partially sleeved together. The sliding groove (4221) is formed on the lower section (422), and the adjusting nut is screwed onto the lower section (422) to drive the tension spring to extend and retract by driving the sliding rod (45).

8. The semiconductor adsorption platform as described in claim 1, characterized in that, The leveling assembly (3) includes a leveling screw (31) and a screw socket (32) that are threaded together, and a clamp (33) that surrounds the outside of the connection between the leveling screw (31) and the screw socket (32).

9. The semiconductor adsorption platform as described in claim 1, characterized in that, The bottom surface of the suction cup (2) is fixed with a wear-resistant pad (22) for abutting against the upper end of the leveling assembly (3).

10. The semiconductor adsorption platform as described in claim 1, characterized in that, There are multiple leveling components (3) and tensioning components (4), and each tensioning component (4) and each leveling component (3) are arranged in pairs close to each other.

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