A micro-compressible metamaterial structure

Abstract

This invention relates to a micro-compressible deformable metal structure. The micro-compressible deformable metal structure includes a compressible deformable metal structure layer, which comprises a compressible deformable metal structure layer body. The compressible deformable metal structure layer body includes multiple arched bodies and hollowed-out sections. Each arched body includes an arched body and extension sections located at both ends of its bottom. The hollowed-out sections are located within the compressible deformable metal structure layer body. This invention, for the first time, constructs an ordered and compressible pure metal heat conduction pathway within a micro-compressible deformable metal structure. The ordered array of micron- and nanon-scale compressible metal structure units solves the phonon scattering problem in the heat conduction pathway while avoiding the "high thermal resistance wall" phenomenon. The compressible deformable metal structure can be used as a good thermal interface material, exhibiting excellent heat transfer and compressibility.

Description

Technical Field

[0001] This utility model relates to the field of metal structure technology, and specifically to a micro-compressible deformable metal structure. Background Technology

[0002] Compressible metals are metals that can undergo elastic or plastic deformation under pressure. Due to their unique physical and mechanical properties, compressible metals are widely used in aerospace, automotive manufacturing, medical equipment, and other fields. For example, in the aerospace industry, compressible aluminum foam is used in aircraft landing gear buffer layers and satellite protective structures to achieve shock absorption and energy dissipation. Furthermore, compressible metals are also frequently used as metal gaskets to meet requirements for thermal conductivity, electrical conductivity, and electromagnetic shielding.

[0003] Currently, compressible metals at the micron and nanoscale are mainly porous metallic materials, such as aluminum foam. The metallic thermal conductivity of aluminum foam makes it a highly efficient heat dissipation material. Aluminum foam can be used not only as a thermal interface material but also in compact heat exchangers for electronic devices (such as computer chips and power modules). However, porous metallic materials like aluminum foam cannot form ordered compressible metallic structural units, and cannot be used to fabricate compressible metallic structures with a single characteristic structure.

[0004] Processes for fabricating metal structures at the micrometer / nanometer scale include photolithography, nanoimprinting, and 3D printing. However, 3D printing of spiral or hollow metal structures inevitably requires support materials, which affects the overall compressibility of the material. While photolithography can easily achieve micrometer / nanometer precision, its verticality makes it difficult to fabricate metal structures with compressibility in the vertical direction. Utility Model Content

[0005] To address at least some of the problems mentioned above in the prior art, this invention provides a miniature compressible metal structure. This miniature compressible metal structure can serve as a heat conduction pathway, i.e., it can be used as a thermal interface material.

[0006] In this invention, a miniature compressible deformable metal structure serves as a highly efficient heat conduction pathway. While addressing the phonon scattering problem in this pathway, the orderly connection between the core units of the compressible deformable metal structure layer avoids the "high thermal resistance wall" phenomenon. Simultaneously, the metal layer of this miniature compressible deformable metal structure increases the effective contact area between the thermal interface material and the interface. Furthermore, this miniature compressible deformable metal structure can be directly fabricated on the surface of a heat source (e.g., a chip surface) using a sputtering process, significantly reducing the contact thermal resistance between the miniature compressible deformable metal structure and the heat source, thus giving it excellent thermal conductivity, reaching 194 W•m⁻¹K⁻¹, far exceeding that of existing miniature compressible deformable metal structures. This compressible deformable metal structure exhibits good compressibility, with a compression capacity reaching 35%, meeting the application requirements of thermal interface materials.

[0007] This utility model provides a miniature compressible metal structure, comprising:

[0008] Compressible deformable metal structural layer, comprising:

[0009] A compressible deformable metal structural layer body, the compressible deformable metal structural layer body comprising a plurality of arched bodies, each arched body comprising an arched body body and extension sections located at both ends of the bottom of the arched body body; and

[0010] Hollowed-out, the hollowed-out portion being located within the compressible deformable metal structural layer body. Arch-shaped body.

[0011] Furthermore, the arched body includes:

[0012] An arc-shaped body, comprising an arc-shaped body body with an arc-shaped cross-section and extension sections located at both ends of the bottom of the arc-shaped body body; or

[0013] A trapezoidal body includes a trapezoidal body with a trapezoidal cross-section and extensions located at both ends of the bottom of the trapezoidal body.

[0014] Further, the arcuate body includes a first arcuate body and a second arcuate body, the first arcuate body opening downwards and the second arcuate body opening upwards; the top of the arcuate body includes a horizontal straight segment and arcuate segments located at both ends of the horizontal straight segment; and / or

[0015] The trapezoidal body includes a first trapezoidal body and a second trapezoidal body, wherein the first trapezoidal body opens downward and the second trapezoidal body opens upward.

[0016] Furthermore, the compressible deformable metal structure layer body includes multiple compressible deformable metal structure layer body units, and each compressible deformable metal structure layer body unit includes multiple arched bodies arranged in an alternating θ-angle arrangement; the θ includes θ1, θ2, θ3...θ n0° < θ < 180° ; and / or

[0017] Furthermore, in the staggered arrangement, the multiple arched bodies intersect at least once.

[0018] Furthermore, the size of the horizontal straight line segment depends on the degree of overexposure and overdevelopment; the more severe the overexposure and overdevelopment, the smaller the size of the center edge.

[0019] Furthermore, the size of the extension segment depends on the second photolithography mask ( ). Figure 10 The size of the light-transmitting area can be adjusted on both sides according to the actual situation.

[0020] Furthermore, the integration of various compressible deformable metal structure layer body units can be achieved by modifying the mask and performing partitioned processing.

[0021] Furthermore, the multiple compressible deformable metal structure layer body units are separated from each other; and / or

[0022] Multiple compressible deformable metal structural layer body units are interconnected; and / or

[0023] Multiple compressible deformable metal structure layer body units are stacked on top of each other to form a compressible deformable metal structure layer body unit array.

[0024] Furthermore, when multiple compressible deformable metal structure layer body units are interconnected, multiple extension segments are interconnected.

[0025] Furthermore, when multiple compressible deformable metal structure layer body units are stacked together, the multiple extension segments overlap and stack with each other; and / or

[0026] The multiple extension segments are stacked interleaved with each other; and / or

[0027] Multiple horizontal straight line segments overlap and stack with each other; and / or

[0028] The multiple horizontal straight line segments are stacked interlaced with each other; and / or

[0029] Multiple extension segments overlap and stack with the horizontal straight segment; and / or

[0030] The multiple extended segments and the horizontal straight segments are stacked and interleaved with each other.

[0031] Furthermore, the micro-compressible deformable metal structure is placed on a carrier, and the carrier is also provided with an isolation layer, which is a PI (polyimide) layer, so as to facilitate the separation of the metal structure from the carrier after subsequent process steps.

[0032] Furthermore, the carrier includes a substrate or a heat source, etc. The substrate can be any substrate, as long as metal is sputtered onto the substrate, the compressible metal structure can be prepared.

[0033] Furthermore, the substrate includes either a Si substrate or a Cu substrate.

[0034] Furthermore, the heat source includes a chip or the like. The micro-compressible metal structure can be fabricated by sputtering metal onto the surface of the heat source.

[0035] Furthermore, it also includes

[0036] Metal layer, the metal layer including a first metal layer disposed on top of the compressible deformable metal structure layer, and / or

[0037] The metal layer includes a second metal layer disposed at the bottom of the compressible deformable metal structure layer.

[0038] Furthermore, the metal layer and the compressible metal structure layer are connected by electroplating or sputtering processes. In practical applications, the metal layer may be omitted; in the case of a metal layer, the compressible metal structure layer serves as an intermediate interlayer.

[0039] Further, the thickness of the metal layer is 0.5-500 μm; preferably, the thickness of the metal layer is 30 μm.

[0040] Furthermore, the metal layer and the compressible metal structure layer are metal layers and micro-compressible metal structure layers compatible with sputtering and electroplating processes. The metal layer and the compressible metal structure layer are formed through sputtering and electroplating processes.

[0041] Further, the metal layer includes any one of a silver layer, a copper layer, a gold layer, an aluminum layer, a nickel layer, or a tin layer. Preferably, the metal layer includes any one of a silver layer or a copper layer.

[0042] Further, the micro-compressible deformable metal structure layer includes any one of a micro-compressible deformable silver structure layer, a micro-compressible deformable copper structure layer, a micro-compressible deformable gold structure layer, a micro-compressible deformable aluminum structure layer, a micro-compressible deformable nickel structure layer, or a micro-compressible deformable tin structure layer. Preferably, the micro-compressible deformable metal structure layer includes any one of a micro-compressible deformable silver structure layer or a micro-compressible deformable copper structure layer.

[0043] Furthermore, the carrier is also provided with a bonding layer. The bonding layer includes a Cr layer to increase the bonding force between the second metal layer and the carrier.

[0044] Furthermore, the bonding layer is connected to the second metal layer by a sputtering process.

[0045] Furthermore, the hollow space is filled with a filler to form a filled compressible deformable metal structure.

[0046] Furthermore, the filler is elastic.

[0047] Furthermore, the filler includes, but is not limited to, PDMS (polydimethylsiloxane) filler and PDMS / Al2O3 / AlN thermally conductive gel filler.

[0048] Furthermore, the preparation process of the PDMS filler includes: immersing the sample (a perforated micro-compressible deformable metal structure) in a mixed solution of PDMS and a curing agent; allowing the mixed solution to enter the perforations through vacuuming; and then curing the solution to obtain a filled compressible deformable metal structure filled with PDMS filler; the mass ratio of PDMS to curing agent is (8-15):(1-3); and the vacuum degree during vacuuming is -0.1 to -0.3 MPa.

[0049] More preferably, the mass ratio of PDMS to curing agent is 10:1; and the vacuum degree during the vacuuming is -0.1 MPa.

[0050] Further, the preparation process of the PDMS / Al2O3 / AlN thermally conductive gel filler includes: immersing the sample in a mixed solution of PDMS / Al2O3 / AlN thermally conductive gel and curing agent; allowing the mixed solution to enter the hollowed-out area through vacuuming; and then curing the solution to obtain a filled compressible deformable metal structure filled with PDMS / Al2O3 / AlN thermally conductive gel filler; the mass ratio of PDMS / Al2O3 / AlN thermally conductive gel to curing agent is (8-15):(1-3); and the vacuum degree during vacuuming is -0.1~-0.3 MPa.

[0051] More preferably, the mass ratio of the PDMS / Al2O3 / AlN thermally conductive gel to the curing agent is 10:1; and the vacuum degree during the vacuuming is -0.1 MPa.

[0052] Further, the curing agent is a silicone rubber curing agent; in the curing process, the curing temperature is 70-90℃ and the curing time is 30-50 min. Preferably, in the curing process, the curing temperature is 80℃ and the curing time is 45 min.

[0053] Furthermore, the cutout includes a first cutout and a second cutout, the first cutout being located at the bottom of the arch, and the second cutout being located around the arch and the extension.

[0054] Furthermore, the height H of the arch is the sum of the first hollow height h2 and the thickness h1 of the arch;

[0055] The first hollow height h2 is 0.4-150μm; the arch thickness h1 is 0.4-300μm; the arch height H is 0.8-450μm; the arch length L is 0.1-600μm; and the arch thickness W is 0.1-550μm.

[0056] More preferably, the first hollow height h2 is 20 μm; the arch thickness h1 is 10 μm; the arch height H is 30 μm; the arch length L is 80 μm; and the arch thickness W is 15 μm.

[0057] Furthermore, the planar dimensions of the compressible deformable metal structure layer body unit depend on the drawing of the mask; the length L of the arch depends on the mask in the secondary photolithography. Figure 10 The size of the light-transmitting area of ​​the ) depends on L'; the thickness W of the arch depends on the size of the light-transmitting area of ​​the second photomask in the secondary photolithography (i.e., depends on W').

[0058] Furthermore, the thermal diffusivity of the micro-compressible deformable metal structure is 50-60 mm. 2 The thermal conductivity is 170-195 W·m⁻¹K⁻¹. Preferably, the thermal diffusivity of the micro-compressible deformable metal structure is 56.174 mm². 2 / s, with a thermal conductivity of 194 W·m⁻¹K⁻¹.

[0059] This invention has at least the following beneficial effects: 1) This invention is the first to construct an ordered and compressible pure metal heat conduction path inside a micro compressible deformable metal structure. The ordered array of micron- and nano-scale compressible metal structural units solves the phonon scattering problem in the heat conduction path while avoiding the "high thermal resistance wall" phenomenon; 2) As an efficient heat conduction path, the compressible deformable metal structure of this invention has excellent interfacial heat transfer capability; 3) The compressible deformable metal structure of this invention has good compressibility in the vertical direction; 4) This invention also has high thermal conductivity to balance the mismatch of the coefficient of thermal expansion (CTE) under temperature changes, and can be used as a good thermal interface material. Attached Figure Description

[0060] To further illustrate the above and other advantages and features of the various embodiments of the present invention, a more specific description of the various embodiments of the present invention will be presented with reference to the accompanying drawings. It is understood that these drawings depict only typical embodiments of the present invention and are therefore not intended to limit its scope. In the drawings, identical or corresponding parts will be indicated by identical or similar reference numerals for clarity.

[0061] Figure 1 The diagram shows peeling images of the compressible deformable metal structure layer in some embodiments of the present invention;

[0062] Figure 2 A top view of a compressible deformable metal structure layer is shown in some embodiments of the present invention;

[0063] Figure 3 3D diagrams of compressible deformable metal structural layers in some embodiments of the present invention are shown;

[0064] Figure 4 Cross-sectional views of compressible metal structures in some embodiments of the present invention are shown;

[0065] Figure 5 3D perspective views of compressible metal structures in some embodiments of the present invention are shown;

[0066] Figure 6 The following are schematic diagrams of the compressible metal structure in some embodiments of the present invention;

[0067] Figure 7 Microscopic images of the first photoresist are shown in some embodiments of the present invention;

[0068] Figure 8 Microscopic images of the second photoresist are shown in some embodiments of the present invention;

[0069] Figure 9 A schematic diagram of a mask (white for light transmission, black for light blocking) in some embodiments of the present invention is shown;

[0070] Figure 10 A schematic diagram of mask plate two (white for light transmission, black for light blocking) in some embodiments of this utility model is shown;

[0071] Figure 11 A schematic diagram of mask plate three (white for light transmission, black for light blocking) in some embodiments of this utility model is shown;

[0072] Figure 12 This invention provides schematic cross-sectional views of isotropic wet etching in some embodiments of the present invention.

[0073] Figure 13This invention provides cross-sectional schematic diagrams of nanoimprint soft templates in some embodiments of the present invention.

[0074] Figure 14 This invention provides cross-sectional schematic diagrams of ultraviolet nanoimprinting in some embodiments.

[0075] Figure 15 This invention provides schematic cross-sectional views of plasma-etched surfaces in some embodiments.

[0076] Figure 16 This diagram illustrates a compressible deformable metal structure after multiple compressible deformable metal structure layer body units are interconnected in some embodiments of this utility model.

[0077] Figure 17 This diagram illustrates a compressible deformable metal structure after multiple compressible deformable metal structure layer body units are stacked together in some embodiments of the present invention.

[0078] Figure 18 The diagram shows a schematic (a), a side view (b), and a schematic (c) of the structure of a single arc-shaped body in some embodiments of the present invention.

[0079] Figure 19 The diagram shows a structural schematic (a), side view (b), and top view (c) of a single second arc-shaped body in some embodiments of the present invention;

[0080] Figure 20 The diagram shows a structural schematic (a), a side view (b), and a top view (c) of a single first arc-shaped body in some embodiments of the present invention;

[0081] Figure 21 The diagram shows a structural schematic (a), side view (b), and top view (c) of a single second trapezoid in some embodiments of the present invention;

[0082] Figure 22 The diagram shows a structural schematic (a), a side view (b), and a top view (c) of a single first trapezoidal body in some embodiments of the present invention.

[0083] Figure 23 The front view (a), side view (b), top view (c), and oblique view (d) of the compressible deformable metal structure layer body unit in some embodiments of the present invention are shown.

[0084] Figure 24 The front view (a), side view (b), top view (c), and oblique view (d) of the compressible deformable metal structure layer body unit in some embodiments of the present invention are shown.

[0085] Figure 25The front view (a), side view (b), top view (c), and oblique view (d) of the compressible deformable metal structure layer body unit in some embodiments of the present invention are shown.

[0086] Figure 26 The front view (a), side view (b), top view (c), and oblique view (d) of the compressible deformable metal structure layer body unit in some embodiments of the present invention are shown.

[0087] Figure 27 The front view (a), side view (b), top view (c), and oblique view (d) of the compressible deformable metal structure layer body unit in some embodiments of the present invention are shown.

[0088] Figure 28 The front view (a), side view (b), top view (c), and oblique view (d) of the compressible deformable metal structure layer body unit in some embodiments of the present invention are shown.

[0089] Figure 29 The front view (a), side view (b), top view (c), and oblique view (d) of the compressible deformable metal structure layer body unit in some embodiments of the present invention are shown.

[0090] Figure 30 The following views are shown: front view (a), side view (b), top view (upper structure perspective) (c), oblique view (d), and oblique view (upper structure perspective) (e) of the compressible metal structure in some embodiments of the present invention.

[0091] Figure 31 The following views are shown: front view (a), side view (b), top view (upper structure perspective) (c), oblique view (d), and oblique view (upper structure perspective) (e) of the compressible metal structure in some embodiments of the present invention.

[0092] Figure 32 The following views are shown: front view (a), side view (b), top view (upper structure perspective) (c), oblique view (d), and oblique view (upper structure perspective) (e) of the compressible metal structure in some embodiments of the present invention.

[0093] Figure 33 The following views are shown: front view (a), side view (b), top view (upper structure perspective) (c), oblique view (d), and oblique view (upper structure perspective) (e) of the compressible metal structure in some embodiments of the present invention.

[0094] Figure 34The following views are shown: front view (a), side view (b), top view (upper structure perspective) (c), oblique view (d), and oblique view (upper structure perspective) (e) of the compressible metal structure in some embodiments of the present invention.

[0095] Figure 35 The following views are shown: front view (a), side view (b), top view (upper structure perspective) (c), oblique view (d), and oblique view (upper structure perspective) (e) of the compressible metal structure in some embodiments of the present invention.

[0096] Figure 36 The following views are shown: front view (a), side view (b), top view (upper structure perspective) (c), oblique view (d), and oblique view (upper structure perspective) (e) of the compressible metal structure in some embodiments of the present invention.

[0097] Figure 37 The following views are shown: front view (a), side view (b), top view (upper structure perspective) (c), oblique view (d), and oblique view (upper structure perspective) (e) of the compressible metal structure in some embodiments of the present invention.

[0098] Figure 38 The following views are shown: front view (a), side view (b), top view (upper structure perspective) (c), oblique view (d), and oblique view (upper structure perspective) (e) of the compressible metal structure in some embodiments of the present invention.

[0099] Figure 39 The following views are shown: front view (a), side view (b), top view (upper structure perspective) (c), oblique view (d), and oblique view (upper structure perspective) (e) of the compressible metal structure in some embodiments of the present invention.

[0100] Figure 40 The following views are shown: front view (a), side view (b), top view (upper structure perspective) (c), oblique view (d), and oblique view (upper structure perspective) (e) of the compressible metal structure in some embodiments of the present invention.

[0101] Figure 41 The following views are shown: front view (a), side view (b), top view (upper structure perspective) (c), oblique view (d), and oblique view (upper structure perspective) (e) of the compressible metal structure in some embodiments of the present invention.

[0102] Figure 42The following views are shown: front view (a), side view (b), top view (upper structure perspective) (c), oblique view (d), and oblique view (upper structure perspective) (e) of the compressible metal structure in some embodiments of the present invention.

[0103] Figure 43 The following views are shown: front view (a), side view (b), top view (upper structure perspective) (c), oblique view (d), and oblique view (upper structure perspective) (e) of the compressible metal structure in some embodiments of the present invention.

[0104] Figure 44 The following views are shown: front view (a), side view (b), top view (upper structure perspective) (c), oblique view (d), and oblique view (upper structure perspective) (e) of the compressible metal structure in some embodiments of the present invention.

[0105] Figure 45 The following views are shown: front view (a), side view (b), top view (upper structure perspective) (c), oblique view (d), and oblique view (upper structure perspective) (e) of the compressible metal structure in some embodiments of the present invention.

[0106] Figure 46 The diagram shows the compressibility performance of the compressible deformable metal structure in some embodiments of this invention;

[0107] Figure label:

[0108] 1-Compressible deformable metal structure, 101-Compressible deformable metal structure layer, 1011-Compressible deformable metal structure layer body, 1011-1-Compressible deformable metal structure layer body unit, 1012-Arc-shaped body, 1012-1-First arc-shaped body, 1012-2-Second arc-shaped body, 1012-3-Horizontal straight line segment, 1012-4-Arc-shaped segment, 1012-5-Arc-shaped body body, 1013-Trapezoidal body, 1013-1-First trapezoidal body, 1013-2-Second trapezoidal body, 1013-3-Trapezoidal body body, 1014-Extension segment, 1015-Koiler, 102-First metal layer, 103-Second metal layer, 104-Si substrate, 2-Photoresist, 3-Nano Imprint Soft Template, 4-Nano Imprint Adhesive. Detailed Implementation

[0109] It should be noted that the components in the accompanying drawings may be shown exaggerated for illustrative purposes and may not be to scale.

[0110] In this utility model, the various embodiments are merely intended to illustrate the solution of this utility model and should not be construed as limiting.

[0111] In this utility model, unless otherwise specified, the quantifiers “one” and “one” do not exclude scenarios involving multiple elements.

[0112] It should also be noted that in the embodiments of this utility model, only a portion of the parts or components may be shown for clarity and simplicity. However, those skilled in the art will understand that, under the teachings of this utility model, the required parts or components can be added according to the specific scenario.

[0113] It should also be noted that within the scope of this utility model, the terms "same", "equal", and "equal to" do not mean that the two values ​​are absolutely equal, but allow for a certain reasonable error. In other words, the terms also cover "substantially the same", "substantially equal", and "substantially equal to".

[0114] It should also be noted that in the description of this utility model, the terms "center," "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this utility model and for simplifying the description, and do not explicitly or implicitly suggest that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0115] Furthermore, the embodiments of this utility model describe the process steps in a specific order. However, this is only for the convenience of distinguishing each step, and is not a limitation on the order of each step. In different embodiments of this utility model, the order of each step can be adjusted according to the process.

[0116] In this invention, the term "arch-shaped body" refers to various structures that can provide arch-like support, including but not limited to: arc-shaped bodies (such as circular bodies, elliptical bodies, and arc-shaped bodies with arbitrary curvature), trapezoidal bodies, sawtooth bodies, square bodies, rectangular bodies, and irregular shapes. Here, the cross-sectional shape of the arch-shaped body is defined as follows: arc-shaped (such as circular, elliptical, and arc-shaped bodies with arbitrary curvature), trapezoidal, sawtooth, square, rectangular, and irregular shapes.

[0117] In this invention, "hollowing out" simply refers to the hollow part, and this hollow part is not necessarily closed. For example, the bottom of the hollow part can be open.

[0118] In the following embodiments, the carrier is a 4-inch Si substrate 104 with a thickness of 500 μm; the compressible metal structure layer 101 is a compressible Cu structure layer; the metal layer is a Cu layer; the bonding layer is a Cr layer; the nanoimprint adhesive 4 is mr-UVCur21; the PDMS / Al2O3 / AlN thermal conductive gel is HTG-D800 two-component thermal conductive gel purchased from Shenzhen Hongfucheng New Materials Co., Ltd.; and the curing agent is Dow Corning SYLGARD 186 silicone rubber curing agent.

[0119] The following embodiment provides a micro-compressible deformable metal structure 1, which is a filled compressible deformable metal structure. The compressible deformable metal structure 1 includes a compressible deformable metal structure layer 101 and is placed on a carrier (i.e., the compressible deformable metal structure 1 is prepared on the carrier). Figure 1 A peeling diagram of the compressible deformable metal structure layer 101 is shown. Figure 2 A top view of the compressible metal structure layer 101 is shown. Figure 3 A 3D diagram of the compressible deformable metal structure layer 101 is shown. As can be seen, the compressible deformable metal structure layer 101 is a raised structure. The compressible deformable metal structure layer 101 includes a compressible deformable metal structure layer body 1011. The compressible deformable metal structure layer body 1011 includes an arched body and a hollow 1015. The arched body includes an arched body and extension segments 1014 located at both ends of the bottom of the arched body. The hollow 1015 includes a first hollow and a second hollow. The first hollow is located at the bottom of the arched body, and the second hollow is located at the arched body and the extension segments (around the arched body and the extension segments). The arched body includes an arc-shaped body 1012 or a trapezoidal body 1013. The arc-shaped body 1012 includes an arc-shaped body 1012-5 with an arc cross-section and extension segments 1014 located at both ends of the bottom of the arc-shaped body 1012-5. The trapezoidal body 1013 includes a trapezoidal body 1013-3 with a trapezoidal cross-section and extension segments 1014 located at both ends of the bottom of the trapezoidal body 1013-3. The hollow 1015 is filled with a filler (not shown) to form a filled compressible deformable metal structure. The substrate is a carrier of the compressible metal structure 1. The arc-shaped body 1012 includes a first arc-shaped body 1012-1 and a second arc-shaped body 1012-2. The first arc-shaped body 1012-1 opens downward and the second arc-shaped body 1012-2 opens upward. The top of the arc-shaped body 1012 includes a horizontal straight segment 1012-3 and arc-shaped segments 1012-4 located at both ends of the horizontal straight segment 1012-3. The trapezoidal body 1013 includes a first trapezoidal body 1013-1 and a second trapezoidal body 1013-2. The first trapezoidal body 1013-1 opens downward and the second trapezoidal body 1013-2 opens upward. Figure 19A schematic diagram (a), a side view (b), and a top view (c) of a single second arc-shaped body 1012-2 are shown. Figure 20 A schematic diagram (a), a side view (b), and a top view (c) of a single first arc-shaped body 1012-1 are shown. Figure 21 A structural schematic diagram (a), side view (b), and top view (c) of a single second trapezoid 1013-2 are shown. Figure 22 A structural schematic diagram (a), side view (b), and top view (c) of a single first trapezoid 1013-1 are shown. Figure 18 A schematic diagram (a), a side view (b), and a schematic diagram (c) of the structure of a single arc-shaped body 1012 are shown. It can be seen that the height H of the arc-shaped body 1012 is the sum of the first cutout height h2 and the thickness h1 of the arc-shaped body 1012. In some embodiments, the first cutout height h2 is 20 μm; the thickness h1 of the arc-shaped body 1012 is 10 μm; the height H of the arc-shaped body 1012 is 30 μm; the length L of the arc-shaped body 1012 is 80 μm; the thickness W of the arc-shaped body 1012 is 15 μm; and the thickness of the metal layer is 30 μm. The planar dimensions of the compressible deformable metal structure layer body unit 1011-1 depend on the drawing of the mask; the length L of the arc-shaped body 1012 depends on the mask in the secondary lithography process (…). Figure 10 The size of the light-transmitting area of ​​the 1012 depends on the length L' of the light-transmitting area in the second photomask during the secondary photolithography; the thickness W of the arc-shaped body 1012 depends on the length L' of the light-transmitting area in the second photomask during the secondary photolithography. Figure 10 The size of the light-transmitting area depends on the width W' of the light-transmitting area in the second photolithography mask.

[0120] The compressible deformable metal structure layer body 1011 includes multiple compressible deformable metal structure layer body units 1011-1, and each compressible deformable metal structure layer body unit 1011-1 includes multiple arc-shaped bodies 1012 arranged in an alternating manner at an angle of θ; θ includes θ1, θ2, θ3...θ n 0° < θ < 180° . Figure 23 The front view (a), side view (b), top view (c), and oblique view (d) of the compressible deformable metal structure layer body unit 1011-1 (when the compressible deformable metal structure layer body unit 1011-1 includes two arc-shaped bodies 1012 arranged alternately at an angle of θ, θ includes θ1, θ2, θ3, and θ4, where θ1, θ2, θ3, and θ4 = 90°) are shown. Figure 24The front view (a), side view (b), top view (c), and oblique view (d) of the compressible deformable metal structure layer body unit 1011-1 (when the compressible deformable metal structure layer body unit 1011-1 includes three arc-shaped bodies 1012 arranged in an alternating angle of θ, θ includes θ1, θ2, θ3, θ4, θ5, and θ6, where θ1, θ2, θ3, θ4, θ5, and θ6 = 60°) are shown. Figure 25 The front view (a), side view (b), top view (c), and oblique view (d) of the compressible deformable metal structure layer body unit 1011-1 (when the compressible deformable metal structure layer body unit 1011-1 includes three arc-shaped bodies 1012 arranged alternately at an angle of θ, θ includes θ1, θ2, θ3, θ4, θ5, and θ6, where θ1 and θ2 = 30°; θ3 and θ4 = 60°; and θ5 and θ6 = 90°) are shown. Figure 26 The front view (a), side view (b), top view (c), and oblique view (d) of the compressible deformable metal structure layer body unit 1011-1 (when the compressible deformable metal structure layer body unit 1011-1 includes three arc-shaped bodies 1012 arranged alternately at an angle of θ, θ includes θ1, θ2, θ3, θ4, θ5, θ6, θ7, and θ8, where θ1, θ2, θ3, θ4, θ5, θ6, θ7, and θ8 = 45°) are shown.

[0121] Multiple compressible deformable metal structure layer body units 1011-1 are separated from each other; and / or multiple compressible deformable metal structure layer body units 1011-1 are interconnected; and / or multiple compressible deformable metal structure layer body units 1011-1 are stacked to form an array of compressible deformable metal structure layer body units 1011-1, ultimately resulting in a compressible deformable metal structure 1. Figure 16 A schematic diagram of a compressible deformable metal structure 1 is shown, after multiple compressible deformable metal structure layer body units 1011-1 are interconnected. Figure 17 A schematic diagram of a compressible deformable metal structure 1 is shown, comprising multiple compressible deformable metal structure layer body units 1011-1 stacked together. When the multiple compressible deformable metal structure layer body units 1011-1 are interconnected, the multiple extension segments 1014 are interconnected. Figures 31-38 A schematic diagram of various connection methods between multiple compressible deformable metal structural layer body units 1011-1 is shown. Figures 38-45 A schematic diagram showing multiple compressible deformable metal structural layer body units 1011-1 stacked together is shown. Figure 38 The front view (a), side view (b), top view (upper structure perspective) (c), oblique view (d), and oblique view (upper structure perspective) (e) of the compressible deformable metal structure 1 (when multiple extension segments 1014 overlap and are stacked together) are shown. Figure 39The front view (a), side view (b), top view (upper structure perspective) (c), oblique view (d), and oblique view (upper structure perspective) (e) of the compressible deformable metal structure 1 (when multiple extension segments 1014 are stacked interlocked) are shown. Figure 40 The front view (a), side view (b), top view (upper structure perspective) (c), oblique view (d), and oblique view (upper structure perspective) (e) of the compressible deformable metal structure 1 (multiple horizontal straight line segments 1012-3 overlapping and stacked with each other) are shown. Figure 41 The front view (a), side view (b), top view (upper structure perspective) (c), oblique view (d), and oblique view (upper structure perspective) (e) of the compressible deformable metal structure 1 (multiple horizontal straight line segments 1012-3 stacked interlaced with each other) are shown. Figure 42 The front view (a), side view (b), top view (upper structure perspective) (c), oblique view (d), and oblique view (upper structure perspective) (e) of the compressible deformable metal structure 1 (when the extension segment 1014 and the horizontal straight segment 1012-3 overlap and stack each other) are shown. Figure 43 The front view (a), side view (b), top view (upper structure perspective) (c), oblique view (d), and oblique view (upper structure perspective) (e) of the compressible deformable metal structure 1 (with the extension segment 1014 and the horizontal straight segment 1012-3 stacked interlockingly).

[0122] The thermal diffusivity of the compressible metal structure 1 is 56.174 mm. 2 / s, with a thermal conductivity of 194 W·m⁻¹K⁻¹. Various compressible deformable metal structure layer body units 1011-1 can be integrated through mask modification and partitioned processing.

[0123] In some embodiments, the multiple arcuate bodies 1012 intersect at least one point. Figure 27 The front view (a), side view (b), top view (c), and oblique view (d) of the compressible deformable metal structure layer body unit 1011-1 (when multiple arc-shaped bodies 1012 intersect and have two intersection points) are shown. Figure 28 The front view (a), side view (b), top view (c), and oblique view (d) of the compressible deformable metal structure layer body unit 1011-1 (when multiple arc-shaped bodies 1012 intersect and have three intersection points) are shown. Figure 29 The front view (a), side view (b), top view (c), and oblique view (d) of the compressible deformable metal structure layer body unit 1011-1 (with four intersection points after multiple arc-shaped bodies 1012 are intersected) are shown.

[0124] In some embodiments, the carrier is further provided with an isolation layer, which is a PI layer, so as to facilitate the separation of the metal structure from the carrier after subsequent process steps are completed.

[0125] In some embodiments, the compressible metal structure 1 further includes metal layers: the metal layers include a first metal layer 102 disposed on top of the compressible metal structure layer 101, and / or the metal layer includes a second metal layer 103 disposed at the bottom of the compressible metal structure layer 101. When the metal layers include the first metal layer 102 and the second metal layer 103 disposed on the top and bottom of the compressible metal structure layer 101 respectively, a sandwich-structured compressible metal structure 1 is formed. Figure 4 A cross-sectional view of the compressible metal structure 1 is shown. Figure 6 A schematic diagram of the compressible deformable metal structure 1 is shown, wherein the metal layer and the compressible deformable metal structure layer 101 are connected by electroplating or sputtering processes. When the metal layer includes a second metal layer 103 disposed at the bottom of the compressible deformable metal structure layer 101, the 3D view of the formed compressible deformable metal structure 1 is as follows. Figure 5 As shown.

[0126] In some embodiments, the first hollow height h2 of the compressible deformable metal structure 1 is 20 μm; the thickness h1 of the arc-shaped body 1012 is 10 μm; the height H of the arc-shaped body 1012 is 30 μm; the length L of the arc-shaped body 1012 is 80 μm; the thickness W of the arc-shaped body 1012 is 15 μm; and the thickness of the metal layer is 30 μm. The sample is cut to a planar size of 8.59 mm × 9.53 mm, with a cavity height of 20 μm, meaning the maximum compressible distance is 20 μm. The sample is compressed using a push-pull force tester at a compression rate of 1 μm / s. Figure 46 As can be seen, with the increase of pressure, the compression of the compressible deformable metal structure 1 continues to rise. Under a force of 1.51 N, the compression reaches a maximum value of 7 μm, and the compression reaches 35%, indicating that the present invention has good compressibility.

[0127] This invention relates to a miniature compressible deformable metal structure 1 (e.g., fabricated using micro / nano fabrication techniques). Figure 16 and Figure 17This micro compressible metal structure 1, used as a thermal interface material, is mainly applied in the field of heat dissipation. The micro compressible metal structure 1 mainly includes a compressible metal structure layer 101, a first metal layer 102 and a second metal layer 103 disposed at the top and bottom of the compressible metal structure layer 101. The fabrication of the compressible metal structure layer 101 is independent of the upper and lower first metal layers 102 and 103. In practical applications, the fabrication of the upper and lower first metal layers 102 and 103 can be selected according to requirements. If the lower second metal layer 103 is not needed, the bottom of the compressible metal structure layer 101 can be directly fabricated on the carrier, and the top of the compressible metal structure layer 101 can also be detached from the upper first metal layer 102 and directly bonded and connected to other structures.

[0128] The following illustrates the method for preparing the micro-compressible deformable metal structure of this invention:

[0129] (I) Taking a compressible deformable metal structure layer 101 with a height H of 30 μm and a compressible deformable metal structure layer body unit 1011-1 including two arc-shaped bodies 1012 arranged alternately at an angle θ, where θ includes θ1, θ2, θ3, and θ4, and θ1, θ2, θ3, and θ4 = 90° as an example, the method for preparing a micro-compressible deformable metal structure 1 containing the first arc-shaped body 1012-1 is described in detail:

[0130] (1) Sputtering metal once (preparing the second metal layer 103)

[0131] If the second metal layer 103 is not required, steps (2)-(13) can be performed directly.

[0132] If the prepared structure needs to be stripped, a PI layer needs to be sprayed onto the carrier before sputtering metal. The step-by-step PI layer spraying includes a rotation speed of 500 rpm for 10 s and a rotation speed of 3000 rpm for 30 s.

[0133] The preparation of the second metal layer 103 and the bonding layer (not shown) includes: sputtering metal (Cr / Cu) onto a carrier at a sputtering power of 300 kV, wherein the Cr layer serves as the bonding layer to increase the adhesion between the second metal layer and the carrier. Before the first electroplating, the sample is treated with a PLASMA surface treatment process for 5 s. After treatment, the sample is immersed in 5% dilute sulfuric acid for 10 s for acid pickling and activation. After pickling, it is electroplated in a sulfate copper plating solution for 2.5 h at a current of 800 mA. After the first electroplating, the thickness of the second metal layer 103 is 30 μm.

[0134] (2) One-time sizing

[0135] A stepped spin coating process was performed using AZ 4903 photoresist. The process included a spin speed of 500 rpm for 10 seconds and a spin speed of 1300 rpm for 30 seconds. After the spin coating, a pre-baking process was performed using a stepped baking process. The parameters for the stepped baking process were: heating at a rate of 3 ℃ / min to 65 ℃ and holding for 1 minute; heating at a rate of 3 ℃ / min to 95 ℃ and holding for 30 minutes, followed by natural cooling. The thickness of the photoresist after the first pre-baking was 20 μm.

[0136] (3) One-time photolithography

[0137] Overexposure was performed using a contact exposure machine with the following parameters: voltage 6.0 V, contact exposure separation 200, and proximity exposure time 140 s; an example of a mask is shown below. Figure 9 As shown, after overexposure, an overdevelopment operation of AZ-400K developer was performed for 3.5 minutes to obtain the first photoresist. The first photoresist is a truncated pyramid structure photoresist (the bottom side length of the truncated pyramid is 50μm, which is the length d of the 1015 cutout). Figure 7 The first photoresist microscopic image is shown, which shows that the photoresist 2 in the black light-blocking area of ​​the mask formed a distinct truncated pyramid structure after overexposure and development. The top square has a side length of 25 μm, the bottom square has a width of 80 μm and a thickness of 15 μm.

[0138] (4) Post-baking

[0139] The photoresist 2 is subjected to a step-by-step baking process to obtain a second photoresist, which transforms the truncated square photoresist into a truncated ball photoresist. The step-by-step baking parameters are: first, baking at 80°C for 30 min, and then baking at 110°C for 6 min. Figure 8 The image shows a microscope image of the second photoresist. It can be seen that after excessive post-baking, the top of photoresist 2 changed from a square shape to a circle with a diameter of 12.52 μm.

[0140] (5) Secondary sputtering

[0141] Three layers of metal (Cu) were sputtered at a sputtering power of 200 kV;

[0142] (6) Secondary sizing

[0143] AZ4903 photoresist was used for secondary spin coating. The parameters for secondary spin coating were the same as in step (2). After the secondary spin coating was completed, the photoresist was used for secondary pre-baking. The temperature was increased to 50 ℃ and held for 60 min after 30 min; the temperature was increased to 60 ℃ and held for 30 min after 60 min; the temperature was increased to 68 ℃ and held for 60 min after 60 min.

[0144] (7) Secondary photolithography

[0145] Secondary photolithography was performed using a contact exposure machine. The secondary photolithography parameters were: voltage 6.0 V, contact exposure separation depth 200, and adhesion exposure time 160 s. After exposure, development was performed using AZ-400K developer for 3.5 minutes. An example of mask two is shown below. Figure 10 As shown, mask two has been patterned and exposed at the location of the photoresist on the ball table;

[0146] (8) Secondary electroplating to form a compressible deformable metal structural layer body unit 1011-1

[0147] A second electroplating process was performed in a copper sulfate plating solution. Before the second electroplating, the sample was treated with PLASMA surface treatment for 5 seconds. After treatment, the sample was immersed in 5% dilute sulfuric acid for 10 seconds for acid pickling and activation. After pickling, electroplating was performed at a current density of 500 mA for 1.5 hours.

[0148] (9) Three-stage glue application

[0149] AZ4903 photoresist was used for spin coating, and the parameters for the three spin coatings and the three pre-bakings were the same as in step (6);

[0150] (10) CMP polishing

[0151] The upper surface of the compressible metal structure layer body unit 1011-1 was polished using a CMP polisher. The polishing slurry used was SiO2 with a particle size of 100 nm, and the polishing speed was 50 rpm for 4 hours.

[0152] (11) Top treatment

[0153] Case 1: To prepare the first metal layer 102, first sputter the metal, then electroplate it in a copper sulfate copper plating solution. The sputtering parameters are the same as in step (5), the electroplating parameters are the same as in step (1), and after electroplating, continue with steps (12) and (13);

[0154] Scenario 2: If you want to continue stacking the compressible deformable metal structure layer body unit 1011-1 on top, then after CMP grinding, you can use the whole as a base;

[0155] Case 3: Do not prepare the first metal layer 102, and do not continue to stack the compressible deformable metal structure layer body unit 1011-1 on top. If the preparation is completed, steps (12) and (13) can be executed. If it is welded or bonded to the heat dissipation system, steps (12) and (13) can be executed after welding and bonding.

[0156] (12) Remove photoresist

[0157] The sample was placed in a 5% NaOH solution and sonicated for 1 min to remove the photoresist 2. The sonication power was 0.3 W / cm². If the PI layer was removed in step (1), the overall structure will be peeled off from the carrier (e.g., Figure 1 (As shown);

[0158] (13) Filler (PDMS filler)

[0159] The sample was immersed in a PDMS solution, and the PDMS was filled into the hollow 1015 of the middle layer structure by vacuuming. After filling, the PDMS was cured in an oven at 80°C for 45 min to form a PDMS filler. The filling process includes immersing the sample in a mixed solution of PDMS and curing agent (mass ratio of 10:1), and then using vacuuming to allow the mixed solution to enter the hollow and then curing to obtain a filled compressible deformable metal structure.

[0160] (II) Taking the compressible deformable metal structure layer 101 with a height H of 7.5 μm, and the compressible deformable metal structure layer body unit 1011-1 including two arc-shaped bodies 1012 arranged alternately at an angle θ, where θ includes θ1, θ2, θ3, and θ4, and θ1, θ2, θ3, and θ4 = 90° as an example, the fabrication method of the micro-compressible deformable metal structure 1 containing the second arc-shaped body 1012-2 is described in detail:

[0161] S1 Preparation of Nanoimprint Hard Template

[0162] AZ 4903 photoresist was used for pre-spinning on the Si wafer. The pre-spinning and pre-baking parameters were the same as (i)-(2). After pre-baking, a contact lithography machine was used for pre-lithography. The pre-lithography parameters were: voltage 6.0 V, contact exposure separation amount 200, and close-contact exposure 160 s. After exposure, AZ-400K developer was used for 3.5 min of development. An example of a mask is shown below. Figure 9 As shown in the figure. Then, isotropic wet etching was performed on the exposed substrate portion using HF-HNO3-CH3COOH as the etchant, with HF:HNO3:CH3COOH = 1:1:2. The etching temperature was 25 ℃, the etching time was 2 min, and the etching depth was 5 μm. The cross-sectional view after wet etching is shown in the figure. Figure 12 After soaking in a 5% NaOH solution for 1 min, the photoresist 2 was removed, and the nanoimprint hard template was successfully prepared.

[0163] S2 Preparation of nanoimprint soft template 3

[0164] First, the nanoimprint hard mold plate is pretreated by ultrasonically cleaning it with acetone, isopropanol, and deionized water for 5 minutes each. For anti-sticking treatment, a fluorinated silane (such as perfluorooctyltrichlorosilane) is introduced into a vacuum chamber, and a monolayer is deposited (30 minutes). Then, 10 ml of intermediate polymer stamp (IPS) is dropped onto the hard mold plate. After rotating the hard mold plate to cover the entire plate with IPS, a hot-pressing process is performed. The hot-pressing parameters are: temperature 155°C, pressure 4 MPa, and holding time 5 min. After hot pressing, the cured IPS is allowed to cool to room temperature before demolding to obtain the soft mold. The nanoimprint soft mold is illustrated in the image below. Figure 13 ;

[0165] S3 First sputtering (preparing the second metal layer 103)

[0166] The sputtering steps on the carrier are the same as (I)-(1);

[0167] S4 One-time glue application

[0168] A single step spin coating was performed using nanoimprint adhesive 4. The step spin coating process included a rotation speed of 500 rpm for 10 seconds and a rotation speed of 3000 rpm for 50 seconds, with a spin coating thickness of 5 μm.

[0169] S5 uses a nanoimprinting soft template for nanoimprinting.

[0170] After one spin coating, a nanoimprinting template was pressed onto the uncured photoresist 2, and ultraviolet nanoimprinting was performed using a nanoimprinting machine. The ultraviolet nanoimprinting parameters were: light intensity 0.115 W / cm². 2 The imprinting pressure was 150 kPa, and the curing time was 150 seconds. After curing, the nano-imprinted soft template was peeled off. Figure 14 A schematic diagram of the cross-section after ultraviolet nanoimprinting is shown;

[0171] S6 Plasma Etching

[0172] The nanoimprint embossing agent 4 was thinned using plasma etching to expose the underlying copper metal. The etching parameters were: argon flow rate of 5 L / min, oxygen flow rate of 25 sccm, temperature of 87℃, and etching time of 1 min. A schematic diagram of the plasma-etched layer is shown below. Figure 15 As shown;

[0173] S7 secondary sputtering

[0174] The steps are the same as (I)-(5);

[0175] S8 Secondary Spraying

[0176] The steps are the same as (I)-(6);

[0177] S9 single-stage photolithography

[0178] The steps are the same as (I)-(7), except that the example of mask three is different from (I)-(7). Figure 11 As shown, the location of the patterned light-transmitting area of ​​mask three coincides with the light-transmitting area of ​​mask one;

[0179] S10 electroplating is performed once to form a compressible deformable metal structural layer body unit 1011-1

[0180] The steps are the same as (I)-(8), except that the electroplating time is 25 min;

[0181] S11 Triple Spinning

[0182] The steps are the same as (I)-(6);

[0183] S12CMP polishing

[0184] The steps are the same as (I)-(10), except that the polishing time is 8 hours;

[0185] S13 Top Treatment

[0186] The steps are the same as (I)-(11);

[0187] S14 Photoresist Remover

[0188] The steps are the same as (I)-(12);

[0189] S15 filler (PDMS filler)

[0190] The steps are the same as (I)-(13).

[0191] (III) Taking a compressible deformable metal structure layer 101 with a height H of 30 μm, and a compressible deformable metal structure layer body unit 1011-1 including two trapezoidal bodies 1013 arranged at an angle θ, where θ includes θ1, θ2, θ3, and θ4, and θ1, θ2, θ3, and θ4 = 90° as an example, the preparation method of the micro-compressible deformable metal structure 1 containing the first trapezoidal body 1013-1 differs from the preparation method of the micro-compressible deformable metal structure containing the first arc-shaped body described above only in that: excessive post-baking is not performed before the secondary sputtering of metal. The remaining steps are the same as the preparation method of the micro-compressible deformable metal structure 1 containing the first arc-shaped body 1012-1 described above.

[0192] (iv) Taking a compressible deformable metal structure layer 101 with a height H of 30 μm, and a compressible deformable metal structure layer body unit 1011-1 including two trapezoidal bodies 1013 arranged at an angle θ, where θ includes θ1, θ2, θ3, and θ4, and θ1, θ2, θ3, and θ4 = 90° as an example, the fabrication method of the micro-compressible deformable metal structure 1 containing the first trapezoidal body 1013-1 differs from the above-mentioned fabrication method of the micro-compressible deformable metal structure 1 containing the first trapezoidal body 1013-1 only in that: in the secondary photolithography, the mask used is mask three, as shown in the example below. Figure 11 As shown, no excessive post-baking was performed before the secondary sputtering of the metal. The remaining steps are the same as the preparation method of the micro compressible metal structure 1 containing the first trapezoid 1013-1 described above.

[0193] In some embodiments, the first hollow height h2 of the compressible deformable metal structure 1 is 20 μm; the thickness h1 of the arc-shaped body 1012 is 10 μm; the height H of the arc-shaped body 1012 is 30 μm; the length L of the arc-shaped body 1012 is 80 μm; the thickness W of the arc-shaped body 1012 is 15 μm; and the thickness of the metal layer is 30 μm. The sample is cut to a planar size of 8.59 mm × 9.53 mm, with a cavity height of 20 μm, meaning the maximum compressible distance is 20 μm. The sample is compressed using a push-pull force tester at a compression rate of 1 μm / s. Figure 46 As can be seen, with the increase of pressure, the compression of the compressible deformable metal structure 1 continues to rise. Under a force of 1.51 N, the compression reaches a maximum value of 7 μm, and the compression reaches 35%, indicating that the present invention has good compressibility.

[0194] In the above embodiments, the carrier includes a substrate or a heat source, etc. The substrate can be any substrate, as long as metal is sputtered on the substrate, the compressible deformable metal structure can be prepared, such as Si substrate and Cu substrate, etc. The heat source includes a chip, etc., and the micro compressible deformable metal structure can be prepared after sputtering a metal layer on the surface of the substrate or heat source. The metal layer and the compressible deformable metal structure layer are metal layers compatible with sputtering electroplating processes, and are not limited to copper layers, that is, not limited to Cu layers and compressible deformable Cu structure layers, but also include silver layers, copper layers, gold layers, aluminum layers, nickel layers, tin layers, etc. The filler includes, but is not limited to, PDMS filler and PDMS / Al2O3 / AlN thermally conductive gel filler.

[0195] The present invention relates to a miniature compressible deformable metal structure 1 (such as...). Figure 16 and Figure 17This micro compressible metal structure 1, used as a thermal interface material, is mainly applied in the field of heat dissipation. The micro compressible metal structure 1 mainly includes a compressible metal structure layer 101, a first metal layer 102 and a second metal layer 103 disposed at the top and bottom of the compressible metal structure layer 101. The fabrication of the compressible metal structure layer 101 is independent of the upper and lower first metal layers 102 and 103. In practical applications, the fabrication of the upper and lower first metal layers 102 and 103 can be selected according to requirements. If the lower second metal layer 103 is not needed, the bottom of the compressible metal structure layer 101 can be directly fabricated on the carrier, and the top of the compressible metal structure layer 101 can also be detached from the upper first metal layer 102 and directly bonded and connected to other structures.

[0196] This novel compressible metal structure possesses excellent compressibility in the vertical direction and also exhibits high thermal conductivity. Therefore, it not only possesses high thermal conductivity but also vertical compressibility to balance CTE mismatch under temperature changes, making it suitable as a high-performance thermal interface material. During heat transfer, the metal skeleton structure of the compressible metal structure layer 101 can directly transfer heat from the second metal layer 103 to the upper structure through pure metal pathways. The main function of the second metal layer 103 is to initially disperse heat from hot spots and transfer it to the middle structure. The main function of the first metal layer 102 is to further transfer the heat transferred from the compressible metal structure layer 101 to the heat dissipation system, such as a water-cooled radiator. The cross-structure design of the compressible metal structure layer 101 is crucial to its heat transfer performance. The more compressible metal structure layer body units 1011-1 (of the same size) in the compressible metal structure layer 101, the more heat transfer pathways it forms, and the stronger its heat transfer capacity.

[0197] While some embodiments of this invention have been described in this application, those skilled in the art will understand that these embodiments are merely illustrative. Numerous variations, alternatives, and improvements will arise in those skilled in the art under the teachings of this invention without departing from its scope. The appended claims are intended to define the scope of this invention and thereby cover the methods and structures within the scope of the claims themselves and their equivalents.

Claims

1. A miniature compressible metal structure, characterized in that, include: Compressible deformable metal structural layer, comprising: A compressible deformable metal structural layer body, the compressible deformable metal structural layer body comprising a plurality of arched bodies, each arched body comprising an arched body body and extension sections located at both ends of the bottom of the arched body body; and The perforation is provided in the body of the compressible deformable metal structure layer.

2. The micro-compressible deformable metal structure according to claim 1, characterized in that, The arched body includes: An arc-shaped body, comprising an arc-shaped body body with an arc-shaped cross-section and extension sections located at both ends of the bottom of the arc-shaped body body; or A trapezoidal body includes a trapezoidal body with a trapezoidal cross-section and extensions located at both ends of the bottom of the trapezoidal body.

3. The micro-compressible deformable metal structure according to claim 2, characterized in that, The arc-shaped body includes a first arc-shaped body and a second arc-shaped body, wherein the first arc-shaped body opens downward and the second arc-shaped body opens upward; The top of the arc-shaped body includes a horizontal straight segment and arc-shaped segments located at both ends of the horizontal straight segment; and / or The trapezoidal body includes a first trapezoidal body and a second trapezoidal body, wherein the first trapezoidal body opens downward and the second trapezoidal body opens upward.

4. The micro-compressible deformable metal structure according to claim 1, characterized in that, The compressible deformable metal structure layer body includes multiple compressible deformable metal structure layer body units, and each compressible deformable metal structure layer body unit includes multiple arched bodies arranged in an alternating pattern at an angle of θ; the θ includes θ1, θ2, θ3...θ n 0° < θ < 180° and / or In the staggered arrangement, the multiple arched bodies intersect at least once.

5. The micro-compressible deformable metal structure according to claim 4, characterized in that, The multiple compressible deformable metal structural layer body units are separated from each other; and / or Multiple compressible deformable metal structural layer body units are interconnected; and / or Multiple compressible deformable metal structure layer body units are stacked on top of each other.

6. The micro-compressible deformable metal structure according to claim 1, characterized in that, The micro-compressible deformable metal structure is placed on a carrier, and the carrier is also provided with an isolation layer, which is a PI layer.

7. The micro-compressible deformable metal structure according to claim 1, characterized in that, Also includes Metal layer, the metal layer including a first metal layer disposed on top of the compressible deformable metal structure layer, and / or The metal layer includes a second metal layer disposed at the bottom of the compressible deformable metal structure layer.

8. The micro-compressible deformable metal structure according to claim 7, characterized in that, The metal layer is connected to the compressible metal structure layer by an electroplating process or a sputtering process.

9. The micro-compressible deformable metal structure according to claim 7, characterized in that, The metal layer and the micro-compressible deformable metal structure layer are compatible with sputtering or electroplating processes.

10. The micro-compressible deformable metal structure according to claim 1, characterized in that, The hollowed-out space is filled with filler to form a filled compressible metal structure.

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