A heat dissipation structure for a thermal sublimation printhead integrating a heat pipe and liquid cooling

By integrating heat pipes and liquid cooling structures into the thermal sublimation printhead, the problem that traditional heat dissipation methods cannot meet the requirements of high power density and high load conditions is solved, achieving efficient heat dissipation and improving the stability and adaptability of the printhead.

CN224426918UActive Publication Date: 2026-06-30HUNAN DINGYIYUAN TECH DEV CO LTD +1

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
HUNAN DINGYIYUAN TECH DEV CO LTD
Filing Date
2025-07-07
Publication Date
2026-06-30

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Abstract

This utility model relates to a heat dissipation structure for a thermal sublimation printhead integrating a heat pipe and liquid cooling, belonging to the field of printing equipment. It includes a thermally conductive printhead mounting plate body and a heat pipe. The printhead mounting plate body is elongated, with the printhead positioned along its length and mounted on one side. The heat pipe is an annular tube, wrapped around the periphery of the printhead mounting plate body along its length. The evaporation section of the heat pipe is in contact with the printhead. A coolant channel is provided inside the printhead mounting plate body, with the condensation section of the heat pipe close to the coolant channel. An inlet and outlet connector communicating with the coolant channel are respectively provided on one side of the printhead mounting plate body. Advantages: By embedding the heat pipe in the printhead mounting plate body and incorporating a coolant channel, active cooling of the heat pipe's condensation section is achieved, thereby improving the overall heat dissipation performance of the printhead and ensuring the stability and reliability of the printing process.
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Description

Technical Field

[0001] This utility model relates to the field of printing equipment, and in particular to a heat dissipation structure for a thermal sublimation printhead that integrates a heat pipe and liquid cooling. Background Technology

[0002] With the widespread application of thermal sublimation printing technology in high-resolution, high-speed, and high-volume continuous printing scenarios (such as industrial barcode label printing, receipt / invoice printing, medical film imaging, and photorealistic images), the thermal print head (TPH), as a core heat-generating component, has seen its operating temperature and heat dissipation efficiency become key bottlenecks restricting printing performance, stability, and lifespan. The working principle of a thermal sublimation print head is to heat a ribbon (typically containing yellow, magenta, cyan, and black) to sublimate it into a gaseous state, which then directly penetrates into the fibers of the printing medium (such as paper or fabric). In this process, the color molecules of the ribbon change directly from a solid to a gaseous state at high temperatures and penetrate into the micropores of the medium, forming a high-quality image with continuous tones. To meet the demands of high-resolution and high-speed printing, the print head integrates extremely high-density micro-heating points. In high-frequency, continuous, and high-volume printing modes, these dense hot spots generate enormous and highly concentrated heat energy. If heat dissipation is not timely, it can lead to problems such as deteriorated print quality, limited printing speed, thermal damage to components, and decreased equipment stability.

[0003] Traditional thermal sublimation printhead cooling primarily relies on air convection (heat sink + fan) or passive heat conduction with a small amount of metal. However, facing the demands of current and future higher power density and high-load operating conditions, traditional air cooling methods have significant shortcomings. Therefore, it is necessary to break through the performance limits of existing thermal sublimation printing technology to meet stringent requirements such as ultra-high printing speed, extremely long continuous working time, small equipment space, and ultra-quiet operation.

[0004] Therefore, there is an urgent need for a heat dissipation structure that integrates heat pipes and liquid cooling for sublimation printheads with higher heat dissipation efficiency, greater spatial adaptability, and more precise temperature control. Utility Model Content

[0005] The technical problem to be solved by this utility model is to provide a heat dissipation structure for a thermal sublimation printhead that integrates a heat pipe and liquid cooling, effectively overcoming the defects of the prior art.

[0006] The technical solution of this utility model to solve the above-mentioned technical problems is as follows:

[0007] A heat dissipation structure integrating a heat pipe and liquid cooling for a thermal sublimation printhead includes a thermally conductive printhead mounting plate body and a heat pipe. The printhead mounting plate body is elongated, and the printhead is disposed along the length of the printhead mounting plate body and mounted on one side of the printhead mounting plate body. The heat pipe is an annular tube and is embedded around the periphery of the printhead mounting plate body along the length of the printhead mounting plate body. The evaporation section of the heat pipe is in contact with the printhead. A coolant flow channel is provided inside the printhead mounting plate body, and the condensation section of the heat pipe is close to the coolant flow channel. An inlet connector and an outlet connector communicating with the coolant flow channel are respectively provided on one side of the printhead mounting plate body.

[0008] Based on the above technical solution, the present invention can be further improved as follows.

[0009] Furthermore, the aforementioned heat pipes are provided in multiple parallel configurations and are spaced apart between the two sides of the main body of the printhead mounting plate.

[0010] Furthermore, the main body of the aforementioned printhead mounting plate is made of aluminum alloy or copper alloy metal.

[0011] Furthermore, the periphery of the above-mentioned printhead mounting plate body is provided with annular heat pipe grooves that correspond one-to-one with and fit into the above-mentioned heat pipes.

[0012] Furthermore, the printhead mounting plate body is provided with a plurality of printhead mounting holes that penetrate both sides of it along its length, and bolts for connecting the printhead are provided through the printhead mounting holes.

[0013] Furthermore, the main body of the printhead mounting plate is a cuboid base, with a rectangular limiting part vertically provided at the long edge of one side. The printhead is positioned in the mounting area defined by the limiting part and one side of the printhead mounting plate main body along its length.

[0014] Furthermore, an electrical interface for installing temperature sensing elements is provided on one side of the main body of the printhead mounting plate along its length.

[0015] Furthermore, the aforementioned coolant flow channel is located inside the main body of the printhead mounting plate near its other side and extends between the two ends of the main body of the printhead mounting plate. The two ends of one side of the main body of the printhead mounting plate are respectively provided with the aforementioned inlet connector and outlet connector, and the section of the heat pipe near the other side of the main body of the printhead mounting plate is designated as a condensation section.

[0016] Furthermore, the coolant flow channels are provided in two sets, one set is close to the other side of the printhead mounting plate body, and the other set is close to one side of the printhead mounting plate body, and the two sets of coolant flow channels are interconnected.

[0017] Furthermore, the aforementioned coolant flow channel can be one of a straight, serpentine, or spiral shape.

[0018] The beneficial effects of this utility model are: by embedding a heat pipe in the main body of the printhead mounting plate and building a coolant flow channel, active cooling of the heat pipe condensation section is achieved, thereby improving the overall heat dissipation performance of the printhead and ensuring the stability and reliability of the printing process. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the heat dissipation structure of the thermal sublimation printhead integrated with the heat pipe and liquid cooling, and the installation structure of the printhead.

[0020] Figure 2 This is a schematic diagram of the heat dissipation structure of the thermal sublimation printhead integrated with the heat pipe and liquid cooling of the present invention.

[0021] Figure 3 This is a cross-sectional view of the heat dissipation structure of the thermal sublimation printhead integrated with the heat pipe and liquid cooling of the present invention.

[0022] Figure 4 This is a schematic diagram of the serpentine coolant flow channel in the heat dissipation structure of the thermal sublimation printhead integrated heat pipe and liquid cooling of this utility model.

[0023] The attached diagram lists the components represented by each number as follows:

[0024] 1. Printhead mounting plate body; 2. Heat pipe; 3. Coolant flow channel; 11. Inlet connector; 12. Outlet connector; 13. Heat pipe groove; 14. Printhead mounting hole; 15. Limiting part; 16. Electrical interface. Detailed Implementation

[0025] The principles and features of this utility model are described below with reference to the accompanying drawings. The examples given are only for explaining this utility model and are not intended to limit the scope of this utility model.

[0026] Example

[0027] like Figure 1 , 2As shown in Figure 3, the heat dissipation structure of the thermal sublimation printhead integrated with heat pipe and liquid cooling in this embodiment includes a thermally conductive printhead mounting plate body 1 and a heat pipe 2. The printhead mounting plate body 1 is elongated, and the printhead is arranged along the length direction of the printhead mounting plate body and installed on one side of the printhead mounting plate body 1. The heat pipe 2 is an annular tube and is embedded around the printhead mounting plate body 1 along the length direction of the printhead mounting plate body 1. The evaporation section of the heat pipe 2 is attached to the printhead (the dotted line A in the figure refers to this part). The printhead mounting plate body 1 is provided with a coolant channel 3 inside, and the condensation section of the heat pipe 2 is close to the coolant channel 3. The printhead mounting plate body 1 is provided with an inlet connector 11 and an outlet connector 12 on one side, which are connected to the coolant channel 3.

[0028] In this embodiment of the heat dissipation structure integrating a heat pipe and liquid cooling in the thermal sublimation printhead, the heat pipe 2 is mounted around the periphery of the printhead mounting plate body 1 (around the length of the printhead mounting plate body 1) in a circumferential embedding manner. The printhead is mounted on one side of the printhead mounting plate body 1 along its length. This design allows one section (evaporation section) of the heat pipe 2 to be as close as possible to and in contact with the printhead. The embedded design of the heat pipe 2 enables rapid heat conduction from the printhead, avoiding localized overheating. At the same time, the coolant flow channel 3 inside the printhead mounting plate body 1 is used to introduce coolant, providing efficient and active cooling to the condensation section of the heat pipe 2. Compared with traditional printhead cooling technologies, this design has the following technical advantages:

[0029] 1) The structure is compact, integrating the heat pipe 2 and coolant flow channel 3 into the periphery and interior of the printhead mounting plate body 1, saving space and facilitating modular installation.

[0030] 2) The embedded design of heat pipe 2 enables rapid heat conduction to the printhead, avoiding local overheating.

[0031] 3) Coolant flow channel 3 directly cools the condensing section of heat pipe 2, greatly improving the overall heat dissipation efficiency.

[0032] In a preferred embodiment, the heat pipes 2 are provided in multiple parallel sections and are spaced apart between the two sides of the printhead mounting plate body 1.

[0033] In the above implementation scheme, the number of heat pipes 2 can be flexibly configured according to the actual printing power to adapt to various printing scenarios and ensure good heat dissipation.

[0034] Preferably, the main body 1 of the printhead mounting plate is made of aluminum alloy or copper alloy metal, which has better thermal conductivity.

[0035] In a preferred embodiment, the outer periphery of the printhead mounting plate body 1 is provided with annular heat pipe grooves 13 that correspond one-to-one with and fit into the heat pipes 2.

[0036] In the above implementation scheme, the shape and size of the heat pipe groove 13 are matched with the heat pipe 2, so as to achieve good and stable embedding of the heat pipe 2 on the outer periphery of the printhead mounting plate body 1, making the assembly structure of the two relatively compact.

[0037] In this embodiment, the heat pipe groove 13 is exposed at both ends on the other side of the printhead mounting plate body 1, and the middle area on the other side is shielded by a shielding surface designed integrally with the printhead mounting plate body 1.

[0038] In this embodiment, the printhead mounting plate body 1 is provided with a plurality of printhead mounting holes 14 penetrating both sides along its length, and bolts for connecting to the printhead are inserted through the printhead mounting holes 14. By using bolts through the printhead mounting holes 14, a stable assembly with the printhead is achieved, resulting in a stable and compact structure.

[0039] Preferably, the printhead mounting plate body 1 is a cuboid base, with a rectangular limiting part 15 vertically provided at the long edge of one of its length-direction sides. The printhead is positioned within the mounting area defined by the limiting part 15 and the length-direction side of the printhead mounting plate body 1. This limiting part 15 design creates a mounting area for assembling the printhead on one side of the printhead mounting plate body 1, allowing for precise positioning of the printhead during assembly.

[0040] In a preferred embodiment, the printhead mounting plate body 1 is provided with an electrical interface 16 for mounting a temperature measuring element on one side along its length.

[0041] In the above implementation scheme, the electrical interface 16 is designed to facilitate the installation of temperature sensing elements, enabling real-time monitoring of the temperature of the printhead mounting plate body 1 and achieving intelligent temperature control. This design supports the integration of intelligent temperature control systems, improving the stability and safety of the printing process.

[0042] In a preferred embodiment, the coolant channel 3 is located inside the printhead mounting plate body 1 near its other side and extends between the two ends of the printhead mounting plate body 1. The two ends of one side of the printhead mounting plate body 1 are respectively provided with the inlet connector 11 and the outlet connector 12, and the section of the heat pipe 2 near the other side of the printhead mounting plate body 1 is designated as a condensation section.

[0043] In the above implementation scheme, the coolant channel 3 extends between the two ends of the printhead mounting plate body 1, and its cooling area is large, which can achieve a better cooling effect on the condensation section of the heat pipe 2.

[0044] Preferably, the coolant flow channels 3 are provided in two sets, one set near the other side of the printhead mounting plate body 1, and the other set near one side of the printhead mounting plate body 1, with the two sets of coolant flow channels 3 interconnected. One set of coolant flow channels 3 is close to the condensation section of the heat pipe 2, achieving better cooling effect on the condensation section. The design of the other set of coolant flow channels 3 allows for a larger cooling range and better cooling effect.

[0045] In this embodiment, the coolant flow channel 3 adopts various shapes, specifically, straight channels, serpentine channels (such as...). Figure 4 (As shown), a spiral shape. In this embodiment, the projected area of ​​the coolant flow channel 3 covers more than 90% of the heat pipe groove 13.

[0046] In the description of this utility model, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.

[0047] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this utility model, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0048] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0049] In this utility model, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0050] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0051] Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of the present invention.

Claims

1. A heat pipe and liquid cooling heat dissipation structure integrated with a thermal dye sublimation printhead, characterized in that: The device includes a heat-conducting printhead mounting plate body (1) and a heat pipe (2). The printhead mounting plate body (1) is elongated. The printhead is set along the length of the printhead mounting plate body (1) and mounted on one side of the printhead mounting plate body (1). The heat pipe (2) is an annular tube and is embedded around the printhead mounting plate body (1) along the length of the printhead mounting plate body (1). The evaporation section of the heat pipe (2) is attached to the printhead. The printhead mounting plate body (1) has a coolant channel (3) inside. The condensation section of the heat pipe (2) is close to the coolant channel (3). The printhead mounting plate body (1) has an inlet connector (11) and an outlet connector (12) on one side that communicate with the coolant channel (3).

2. The integrated heat pipe and liquid cooling heat sink structure for a thermal dye sublimation printhead according to claim 1, wherein: The heat pipes (2) are provided in multiple parallel sections and are spaced apart between the two sides of the printhead mounting plate body (1).

3. The integrated heat pipe and liquid cooling heat sink structure for a thermal dye sublimation printhead according to claim 2, wherein: The main body (1) of the printhead mounting plate is made of aluminum alloy or copper alloy metal.

4. The integrated heat pipe and liquid cooling heat sink structure for a thermal dye sublimation printhead of claim 1, wherein: The outer periphery of the printhead mounting plate body (1) is provided with annular heat pipe grooves (13) that correspond one-to-one with and fit into the heat pipes (2).

5. The integrated heat pipe and liquid cooling heat sink structure for a thermal dye sublimation printhead according to claim 4, wherein: The main body (1) of the printhead mounting plate is provided with a plurality of printhead mounting holes (14) that penetrate through both sides of the plate along its length. The printhead mounting holes (14) are provided with bolts that are connected to the printhead.

6. The integrated heat pipe and liquid cooling heat sink structure for a thermal dye sublimation printhead according to claim 5, wherein: The printhead mounting plate body (1) is a cuboid base, and a rectangular limiting part (15) is provided vertically at the long edge of one side. The printhead is set in the mounting area defined by the limiting part (15) and the side of the printhead mounting plate body (1) along the length direction.

7. The integrated heat pipe and liquid cooling heat sink structure for a thermal dye sublimation printhead according to claim 1, wherein: The printhead mounting plate body (1) has an electrical interface (16) for installing temperature measuring elements on one side along its length.

8. A heat pipe and liquid cooling heat dissipation structure integrated into a dye-sublimation printhead according to any one of claims 1 to 7, characterized in that: The coolant channel (3) is located inside the printhead mounting plate body (1) near its other side and extends between the two ends of the printhead mounting plate body (1). The inlet connector (11) and outlet connector (12) are respectively provided at both ends of one side of the printhead mounting plate body (1). The section of the heat pipe (2) near the other side of the printhead mounting plate body (1) is designated as a condensation section.

9. The integrated heat pipe and liquid cooling heat sink structure for a thermal dye sublimation printhead according to claim 8, wherein: The coolant flow channel (3) is provided in two sets, one set is close to the other side of the printhead mounting plate body (1), and the other set is close to one side of the printhead mounting plate body (1). The two sets of coolant flow channels (3) are connected to each other.

10. The integrated heat pipe and liquid cooling heat sink structure for a thermal dye sublimation printhead of claim 8, wherein: The coolant flow channel (3) is one of the following: straight, serpentine, or spiral.