An electrolysis system and its metal deposition device

By designing a space for precipitation and an anti-detachment structure on the cathode plate to maintain the formation of components, the problem of insufficient adhesion between nickel and cobalt metal plates and the cathode plate was solved, enabling stable growth and efficient production of high-quality metal plates.

CN224430754UActive Publication Date: 2026-06-30HANGZHOU SANAL ENVIRONMENTAL TECH

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
HANGZHOU SANAL ENVIRONMENTAL TECH
Filing Date
2025-06-20
Publication Date
2026-06-30

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Abstract

This utility model discloses an electrolysis system and its metal deposition apparatus, including a cathode plate for depositing a metal plate, the cathode plate having at least one metal deposition surface; a retaining member is fixedly connected to the edge of the cathode plate, adapted to restrict the deposited metal plate from separating from the metal deposition surface, the retaining member being configured as an insulator to prevent it from being encapsulated by the deposited metal; wherein, a deposition space suitable for metal deposition is formed between the retaining member and the cathode plate, the metal deposited in the deposition space is integrated with the metal plate, so that the metal plate is held together with the cathode plate under the retaining force applied by the retaining member. This electrolysis system and its metal deposition apparatus eliminate the need for the fabrication of a starter sheet in conventional processes, directly electrolyzing 5-15 mm nickel and cobalt metal plates on the cathode plate.
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Description

Technical Field

[0001] This utility model relates to the field of electrolysis technology, and more specifically, to an electrolysis system and a metal deposition device thereof. Background Technology

[0002] In the field of non-ferrous metal electrolytic smelting, electrolysis is the core method for obtaining high-purity metals. Its working principle involves placing a cathode plate and an anode plate in an electrolyte solution, with the cathode plate connected to the negative electrode and the anode plate connected to the positive electrode. Under the influence of an electric field, metal ions in the electrolyte are reduced to metal and gradually deposited on the cathode plate, ultimately forming a marketable metal plate. However, in actual production, the separation of the metal plate from the cathode plate remains a thorny problem in this field.

[0003] Taking the electrolytic production of nickel and cobalt metals as an example, the challenges encountered during the electrodeposition process on the cathode plate are particularly severe. Nickel and cobalt metals generate significant internal stress during electrodeposition. In traditional nickel-cobalt electrodeposition production, a thin metal sheet is typically produced by first electrifying a seed plate in a seed plate tank. After peeling, lifting lugs are installed on the metal sheet to create a starter sheet, which is then placed in the production tank and electrified again to grow a thicker nickel or cobalt plate. If the electrodeposition growth cycle of nickel and cobalt on the cathode plate is too long, for example, if the seed plate cycle exceeds 48-60 hours, the nickel or cobalt metal plate is very prone to detaching from the cathode plate. This detachment usually starts from the sides and bottom edge of the cathode plate. Once the edges of the metal plate begin to detach, it spreads rapidly, causing the entire metal plate to fall off the cathode plate, severely disrupting the normal operation of electrodeposition production and having a significant negative impact on production efficiency and product quality.

[0004] From a product quality perspective, traditional processes require the metal plate grown on the cathode to reach a certain thickness, typically 5-15 mm, before it can be sold as a qualified metal product after washing and peeling. However, due to the high internal stress of metal sheets such as nickel and cobalt, the risk of the metal sheet detaching from the cathode increases dramatically with increasing thickness. This makes it difficult to grow a metal plate of the required thickness on a typical cathode after energization, thus necessitating the use of a more cumbersome initial electrode production method.

[0005] Furthermore, existing electrolytic processes for metals such as nickel and cobalt involve complex processes for producing the starting electrode, significantly increasing production costs and lengthening the production process. If the adhesion problem between the metal plate and the cathode plate can be effectively solved, achieving stable growth of the metal plate on the cathode plate, it would not only significantly extend the cathode plate production cycle and improve production efficiency, but also simplify the production process and reduce production costs. Therefore, developing a technology and device to enhance the adhesion of the metal plate to the cathode plate has extremely high practical significance and economic value. Utility Model Content

[0006] The purpose of this invention is to provide a metal deposition device for an electrolysis system and an electrolysis system including the device, so as to solve the problems of insufficient adhesion between the metal plate and the cathode plate, easy detachment, and difficulty in meeting the required thickness of the metal plate in the prior art.

[0007] To achieve the above objectives, the metal deposition apparatus of the present invention includes a cathode plate for depositing a metal plate, the cathode plate having at least one metal deposition surface. A retaining member is fixedly attached to the edge of the cathode plate, the retaining member being adapted to prevent separation of the metal plate from the cathode plate, and the retaining member being configured as an insulator to prevent the deposited metal from becoming trapped.

[0008] Furthermore, a precipitation space suitable for metal precipitation is formed between the retaining member and the cathode plate. The metal precipitated in this precipitation space is integrated with the metal plate, so that the metal plate is held together with the cathode plate under the retaining force applied by the retaining member.

[0009] In some embodiments, the cathode plate has two opposing metal deposition surfaces, and the retaining member covers the edge of the cathode plate, thereby preventing the metal plates deposited on the two metal deposition surfaces from becoming one.

[0010] The deposition space can be configured as a groove with an opening facing the inside of the cathode plate. For example, the retaining member has an extension arm extending toward the inside of the cathode plate, the deposition space is formed between the extension arm and the cathode plate, and the deposition space can be formed by an inclined surface and a metal deposition surface disposed on the extension arm.

[0011] In addition, the metal precipitation surface may have a groove, which forms a precipitation space between the surface of the component facing the metal precipitation surface and the groove; or the side of the component facing the metal precipitation surface may have a groove, which forms a precipitation space between the groove and the metal precipitation surface.

[0012] In another embodiment, the retaining member has a clamping groove, an expansion groove, and an expansion bar. The clamping groove engages with the edge of the cathode plate, the expansion groove is arranged opposite to the clamping groove, and the expansion bar is interference-fitted into the expansion groove. The deformation of the retaining member causes the clamping groove to tend to contract, further enhancing the connection stability between the retaining member and the cathode plate.

[0013] The present invention also relates to an electrolysis system, which includes a metal deposition device configured to produce a metal plate with a thickness of not less than 5 mm, wherein the metal deposition device is the metal deposition device described above.

[0014] In summary, this application has at least one of the following beneficial technical effects:

[0015] The metal deposition device and electrolysis system of this invention effectively increase the adhesion of the metal plate edge to the cathode plate, preventing the metal plate from detaching from the cathode plate edge and thus preventing the entire metal plate from detaching. This solves the problem of metal plate detachment, extends the cathode cycle, increases the thickness and added value of the metal plate, and enables permanent cathode processes for nickel and cobalt, producing metal plates with the required thickness in a single step without the need for a starter sheet fabrication process. This significantly improves the efficiency and economic benefits of electrolytic production. The metal plate exhibits better adhesion during the electrodeposition process, reducing quality problems such as peeling and detachment, improving the surface quality and dimensional accuracy of the metal plate, thereby enhancing the overall quality and performance of the product and meeting the quality requirements of the high-end metal materials market.

[0016] The cathode plate of this application is suitable for the electrowinning of various metals, such as nickel and cobalt, and has broad application prospects. It can meet the diverse needs of different metal production enterprises and provide strong technical support and guarantee for the development of the electrolytic metal industry.

[0017] The electrolysis system using the cathode plate of this application can stably generate high-quality metal plates, improving the market competitiveness of the equipment and providing an innovative and practical solution for the field of electrolytic metal production, thus promoting the technological progress and development of the industry. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the provided drawings without creative effort.

[0019] Figure 1 This is a schematic diagram of the structure of the first embodiment of the metal precipitation device of this application;

[0020] Figure 2 for Figure 1 Schematic diagram of the structure of the middle BB section;

[0021] Figure 3 This is a structural schematic diagram of the first embodiment of the retaining component in this application;

[0022] Figure 4 for Figure 3 Enlarged diagram of area A in the middle;

[0023] Figure 5 This application maintains a simplified structural diagram of the first embodiment of the component;

[0024] Figure 6This is a partial structural schematic diagram of the second embodiment of the retaining component in this application;

[0025] Figure 7 This is a partial structural schematic diagram of the third embodiment of the retaining component in this application;

[0026] Figure 8 This is a structural schematic diagram of the fourth embodiment of the retaining component of this application;

[0027] Figure 9 A cross-sectional structural schematic diagram showing the assembly state of the fifth embodiment of the component in this application;

[0028] Figure 10 This is a structural schematic diagram of the sixth embodiment of the retaining component of this application;

[0029] Figure 11 A cross-sectional structural schematic diagram showing the assembly state of the sixth embodiment of the component in this application;

[0030] Figure 12 A cross-sectional structural schematic diagram showing the assembly state of the seventh embodiment of the component in this application;

[0031] Figure 13 This is a schematic diagram of the external structure of the seventh embodiment of the component in this application, showing its assembled state.

[0032] Figure 14 A cross-sectional structural schematic diagram showing the assembly state of the component in the eighth embodiment of this application;

[0033] Figure 15 This is a schematic diagram of the structure of the third embodiment of the metal precipitation device of this application;

[0034] Figure 16 This is a schematic diagram of the fourth embodiment of the metal precipitation device of this application.

[0035] Figure label:

[0036] 100. Holding component; 1. Extension arm; 10. Precipitation space; 11. Anti-detachment surface; 111. Plane; 112. Arc surface; 2. Fixing part; 20. Clamping groove; 21. Joint surface; 3. Expansion groove; 4. Precipitation surface; 200. Cathode plate; 201. Side edge; 202. Bottom edge; 203. Groove; 300. Metal plate; 400. Expansion strip. Detailed Implementation

[0037] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0038] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0039] In the description of this application, it should be understood that the terms "upper", "lower", "left", "right", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0040] The technical solutions of this application will be described in detail below with reference to the accompanying drawings and specific embodiments. Unless otherwise specified, the features in the following embodiments can be combined with each other.

[0041] Example 1

[0042] Please see Figures 1-4This embodiment provides a metal deposition apparatus, including a cathode plate 200 for depositing a metal plate and a holding member 100. The cathode plate 200 has at least one metal deposition surface 4, and in this embodiment, the cathode plate 200 has two opposing metal deposition surfaces 4. The holding member 100 is used to fixably connect to the edge of the cathode plate to electrolyze and form a metal plate 300. The holding member 100 restricts the deposited metal plate from separating from the metal deposition surface 4, and the holding member 100 is configured as an insulator to prevent it from being encapsulated by the deposited metal. The holding member 100 includes a fixing part 2 and an extension arm 1 integrally connected to the fixing part 2. The fixing part 2 is provided with a clamping groove 20 for encapsulating and clamping the edge of the cathode plate, and the extension arm 1 extends along the edge of the clamping groove 20 in a direction away from the bottom of the clamping groove 20. The extension arm 1 is configured such that when a metal plate is formed on the surface of the cathode plate 200, a deposition space 10, which can be filled with the generated metal, is formed between the extension arm 1 and the deposition surface 4 of the cathode plate. The deposition space 10 is filled with metal, and the filled metal forms an anti-detachment structure with the extension arm 1 and the cathode plate surface to restrict the metal plate 300 from detaching from the cathode plate 200 in the direction perpendicular to the cathode plate surface, thereby extending the cathode cycle. The retaining member 100 is made of engineering plastics such as PPO, ABS, and PP. In this embodiment, the retaining member 100 is made of high-strength and corrosion-resistant polypropylene material, and has an overall U-shaped structure. The size of its internal clamping groove 20 is adapted to the edge of the cathode plate 200, which can tightly wrap and clamp the edge of the cathode plate 200.

[0043] Please see Figure 1 In this embodiment, retaining members 100 are fixed on the two sides 201 of the cathode plate 200. The bottom edge 202 of the retaining member 100 is provided with a right-angle groove that partially wraps around the bottom edge 202 of the cathode plate 200, which can partially restrict the metal plate 300 from detaching from the cathode plate 200 from the bottom edge 202 direction.

[0044] Please see Figure 1 and Figure 2 The retaining member 100 covers the edge of the cathode plate 200 to prevent the metal plates deposited on the two metal deposition surfaces 4 from becoming one.

[0045] Please see Figure 2 and Figure 3 A wedge-shaped expansion groove 3 is provided on the side of the retaining member 100 facing away from the clamping groove 20. The expansion groove 3 can be dovetail-shaped, trapezoidal, or semi-circular; in this embodiment, a semi-circular structure is used. When the cathode plate is located within the clamping groove 20, the clamping force of the clamping groove 20 can be increased by expanding the expansion groove 3. The clamping groove 20 has a mating surface 21 that mates with the deposition surface 4 of the cathode plate. An extension arm 1 is integrally connected to the edges of both the upper and lower mating surfaces 21 of the clamping groove 20 to provide an anti-detachment effect when metal plates 300 are formed on both deposition surfaces 4 of the cathode plate 200.

[0046] The retaining member 100 is provided with an expansion groove 3, and an expansion strip 400 is provided within the expansion groove 3. The expansion strip 400 generates an outward expansion force through an interference fit or inclined extrusion with the inner wall of the expansion groove 3, thereby enhancing the clamping force of the clamping groove 20 on the cathode plate 200. Both precipitation surfaces 4 of the retaining member 100 on the cathode plate 200 have anti-detachment structures, which can prevent the metal plate 300 from detaching from the cathode plate 200 during the formation of the metal plate 300, thus forming a cobalt or nickel metal plate 300 with sufficient thickness. In this embodiment, the expansion strip 400 is a metal rod or a plastic rod.

[0047] Please see Figure 3 and Figure 4 The extension arm 1 has an anti-detachment surface 11 connected to the edge of the clamping groove 20. The anti-detachment surface 11 is a plane forming an acute angle with the mating surface 21 (cathode plate surface), with the included angle α being 30°~60°. In this embodiment, the anti-detachment surface 11 of the extension arm 1 forms an included angle of 45° with the cathode plate surface. When a metal plate is formed on the cathode plate surface, a deposition space 10 is formed between the extension arm 1 and the cathode plate surface. During the electrodeposition process, the deposition space 10 is filled with metal. The metal deposited in the deposition space 10 is integrated with the metal plate, so that the metal plate is held together with the cathode plate under the holding force applied by the holding member 100. The extension arm 1 can effectively restrict the metal plate from detaching from the cathode plate in the direction perpendicular to the cathode plate surface.

[0048] For an alternative solution, please refer to [link / reference]. Figure 5 In this embodiment, the retaining member 100 can be separated into two halves from the center of symmetry. In specific implementation, it can be a half structure or a two-half spliced ​​structure. The joint surface 21 of the retaining member 100 is attached to the precipitation surface of the cathode plate, and the retaining member 100 and the cathode plate are fixed together by adhesive or screw fixing.

[0049] Example 2

[0050] Please see Figure 6 This embodiment provides a second structure for the retaining member 100. The retaining member 100 in this embodiment differs structurally from that in the first embodiment in that the anti-detachment surface 11 of the extension arm 1 is improved. The retaining member 100 also has a clamping groove 20 for wrapping the edge of the cathode plate, but the anti-detachment surface 11 of the extension arm 1 is designed as an arc-shaped curved surface. The curvature of this arc-shaped curved surface is optimized to more effectively guide the flow of electrolyte, further optimizing the flow field distribution at the edge of the cathode plate and reducing edge effects. During the metal formation process, the space formed between the arc-shaped extended arm 1 and the deposition surface of the cathode plate is filled with the generated metal, thus forming a reliable anti-detachment structure.

[0051] Example 3

[0052] Please see Figure 7This embodiment provides a third structure for the retaining member 100. The retaining member 100 in this embodiment differs from those in Embodiments 1 and 2 in that the anti-detachment surface 11 adopts a hybrid curved surface structure, that is, a structure combining multiple curved surfaces. In this embodiment, a structure combining a plane 111 and an arc surface 112 is used. A plane 111 extends from the edge of the clamping groove 20, and the end of the plane 111 away from the clamping groove 20 connects to the arc surface 112. The plane 111 and the arc surface 112 form a complete anti-detachment surface 11. Other alternative structures can also be used. Ideally, the anti-detachment surface 11, combining multiple arc surfaces 112 and multiple planes 111, should satisfy the condition that the projection of the anti-detachment surface 11 has no overlapping portion on the projection plane perpendicular to the joint surface 21, thus not restricting the metal plate from separating from the retaining member 100 in the direction parallel to the joint surface 21.

[0053] In addition, the clamping groove 20 of the retaining member 100 has been reinforced, and anti-slip textures are provided on the inner wall of the clamping groove 20 to increase the friction with the edge of the cathode plate and improve the stability of clamping.

[0054] In this embodiment, the extension arm 1 adopts a composite structure. The side of it close to the clamping groove 20 is a plane with a 30° angle to the cathode plate deposition surface (i.e., the joint surface 21), and the side away from the cathode plate is a small curvature arc surface. This composite structure combines the advantages of the plane and the arc surface, which can not only accurately control the edge current density, but also optimize the flow path of the electrolyte and achieve more uniform metal generation.

[0055] Example 4

[0056] Please see Figure 8 This embodiment provides a fourth structure for the retaining member 100. The retaining member 100 in this embodiment differs from the previous embodiments in that the anti-detachment surface 11 is a concave curved surface, forming a groove structure, and a precipitation space is formed between the groove structure and the metal precipitation surface. The concave curved surface can be a single-arc surface, a multi-arc surface, or a composite curved surface composed of a plane and an arc surface.

[0057] Example 5

[0058] Please see Figure 9 This embodiment provides a fifth structure for the retaining member 100. The retaining member 100 in this embodiment differs from the previous embodiments in that the metal deposition surface of the cathode plate 200 has a groove 203, and a deposition space is formed between the surface of the retaining member 100 facing the metal deposition surface and the groove 203.

[0059] Example 6

[0060] Please see Figure 10This embodiment provides a sixth structure for the retaining member 100. The retaining member 100 in this embodiment differs from the retaining member 100 in the above embodiments in that it lacks an expansion groove 3 on the side facing away from the clamping groove 20. The retaining member 100 is integrally formed with the cathode plate via injection molding. The cathode plate is located within the clamping groove 20, and the extension arm 1 and fixing part 2 are defined by the mold cavity. During injection molding, the retaining member 100 and the cathode plate are fully fused together, forming a strong connection, ensuring that there is no relative displacement between the retaining member 100 and the cathode plate during electrodeposition.

[0061] Please see Figure 11 In this embodiment, the retaining component 100 and the cathode plate 200 are connected using a two-stage injection molding process. First, the cathode plate 200 is formed, and then injection molding is performed on the pre-reserved installation area at the edge of the cathode plate 200 to firmly bond the retaining component 100 to the cathode plate 200. After the metal plate 300 is formed, it is peeled off through bending, vibration, and gripping of the cathode plate 200.

[0062] Alternatively, the cathode plate 200 can be assembled separately from the retaining member 100 and then fixed by local injection molding. First, the retaining member 100 is initially fixed to the edge of the cathode plate 200 by a snap-fit ​​structure, and then local injection molding is performed on key parts to form a stable connection between the retaining member 100 and the cathode plate 200.

[0063] Example 7

[0064] Please see Figure 12 This embodiment provides a seventh structure for the retaining member 100. The retaining member 100 in this embodiment differs from the retaining member 100 in Embodiment Six in that it has a concave anti-detachment surface 11. Metal integrally connected to the metal plate is generated within the deposition space 10 between the anti-detachment surface 11 and the cathode plate. Electrolyte enters the deposition space from both ends of the retaining member 100 and generates metal, forming an anti-detachment structure. To better integrate the metal within the deposition space with the metal plate, the retaining member 100 can be made into a multi-segment structure with intervals (see...). Figure 13 ).

[0065] Example 8

[0066] Please see Figure 14 This embodiment provides an eighth structure for the retaining member 100. The retaining member 100 in this embodiment differs from that in embodiment seven in that the cathode plate 200 is provided with a groove 203, and a precipitation space 10 is formed between the groove 203 and the retaining member 100. When a metal plate is formed on the surface of the cathode plate 200, the metal in the precipitation space 10 forms an anti-detachment structure to prevent the metal plate from detaching.

[0067] Example 9

[0068] Please refer to 15. This embodiment provides a second method of connecting the retaining member 100 to the cathode plate 200. The difference between this embodiment and Embodiment 1 is that retaining members 100 are fixedly provided on both sides 201 and the bottom edge 202 of the cathode plate 200, increasing the difficulty of detaching the metal plate 300 from the cathode plate 200 and facilitating the production of a metal plate 300 with a suitable thickness. This embodiment can produce a metal plate 300 with a thickness of 5-15 mm.

[0069] Example 10

[0070] Please refer to 16. This embodiment provides a third way of connecting the retaining member 100 to the cathode plate 200. The difference between this embodiment and embodiment seven is that retaining members 100 are fixedly provided on both sides 201, bottom edge 202 and top edge of the cathode plate 200, which increases the difficulty of separating the metal plate 300 from the cathode plate 200 and facilitates the better generation of a metal plate 300 that meets the required thickness.

[0071] Example 11

[0072] This embodiment discloses an electrolysis system that uses any of the metal deposition devices described in the above embodiments to electrodegrade and generate metal plates. The metal deposition device is configured to produce metal plates with a thickness of not less than 5 mm, thereby generating metal plates 300 that meet the required thickness. This electrolysis system can realize the permanent cathode process for nickel and cobalt, growing metal plates of 5-15 mm in a single operation without the need for a starter sheet fabrication process.

[0073] When the electrolytic system of the metal deposition apparatus of this application is used to generate nickel metal plate 300, the cathode plate 200 with holding mechanism 100 is placed in an electrolyte containing nickel ions. By reasonably setting parameters such as current density and electrolyte circulation rate, a nickel metal plate 300 with a thickness of 5-15 mm can be generated on the surface of cathode plate 200 in one go. The surface of metal plate 300 is flat and it is firmly bonded to cathode plate 200, making it difficult to fall off.

[0074] In the electrolysis system, the cathode plate 200 was used to electrodeposit a nickel-cobalt alloy plate, and a 10 mm thick alloy plate was successfully generated in one step. The alloy plate had a uniform composition and the bonding strength with the cathode plate 200 met the requirements of industrial production, verifying the applicability and effectiveness of this invention in alloy material generation.

[0075] Using the cathode plate 200 in the electrolysis system to generate cobalt metal plate 300, by adjusting the process parameters, a cobalt metal plate 300 with a thickness of up to 12 mm can be generated in one go, and the probability of the metal plate 300 detaching from the cathode plate 200 during subsequent handling and processing is low.

[0076] This article uses specific examples to illustrate the principles and implementation methods of this utility model. The descriptions of the above embodiments are only for the purpose of helping to understand the method and core ideas of this utility model. It should be noted that for those skilled in the art, several improvements and modifications can be made to this utility model without departing from the principles of this utility model, and these improvements and modifications also fall within the protection scope of the claims of this utility model.

Claims

1. A metal deposition apparatus for an electrolysis system, comprising a cathode plate for depositing metal, said cathode plate having at least one metal deposition surface; characterized in that, The edge of the cathode plate is fixedly connected to: A retaining member adapted to limit separation of the metal plate from the cathode plate, the retaining member being configured as an insulator to prevent it from being encapsulated by deposited metal; The holding member and the cathode plate form a precipitation space suitable for metal precipitation. The metal precipitated in the precipitation space is integrated with the metal plate, so that the metal plate is held together with the cathode plate by the holding force applied by the holding member.

2. The metal deposition apparatus according to claim 1, characterized in that, The cathode plate has two metal deposition surfaces arranged opposite each other.

3. The metal deposition apparatus according to claim 2, characterized in that, The retaining member covers the edge of the cathode plate to prevent the metal plates deposited on the two metal deposition surfaces from becoming one.

4. The metal deposition apparatus according to claim 1, 2, or 3, characterized in that, The precipitation space is configured as a groove with an opening facing the inside of the cathode plate.

5. The metal deposition apparatus according to claim 4, characterized in that, The retaining member has an extension arm extending toward the inside of the cathode plate, and the precipitation space is formed between the extension arm and the cathode plate.

6. The metal deposition apparatus according to claim 5, characterized in that, The precipitation space is formed by the inclined surface and the metal precipitation surface arranged on the extension arm.

7. The metal deposition apparatus according to claim 1, 2, or 3, characterized in that, The metal precipitation surface has a groove, and a precipitation space is formed between the surface of the retaining member facing the metal precipitation surface and the groove.

8. The metal deposition apparatus according to claim 1, 2, or 3, characterized in that, The retaining member has a groove on the side facing the metal precipitation surface, and a precipitation space is formed between the groove and the metal precipitation surface.

9. The metal deposition apparatus according to claim 1, characterized in that, The retaining member has: A clamping groove that engages with the edge of the cathode plate; An expansion groove, which is arranged opposite to the clamping groove; and An expansion bar is interference-fitted into the expansion groove, and the deformation of the retaining member causes the clamping groove to tend to contract.

10. An electrolysis system comprising a metal deposition apparatus configured to produce a metal plate with a thickness of not less than 5 mm; characterized in that, The metal precipitation device is the metal precipitation device according to any one of claims 1-9.